WO2009060585A1 - 露光装置及び露光方法、並びにデバイス製造方法 - Google Patents
露光装置及び露光方法、並びにデバイス製造方法 Download PDFInfo
- Publication number
- WO2009060585A1 WO2009060585A1 PCT/JP2008/003160 JP2008003160W WO2009060585A1 WO 2009060585 A1 WO2009060585 A1 WO 2009060585A1 JP 2008003160 W JP2008003160 W JP 2008003160W WO 2009060585 A1 WO2009060585 A1 WO 2009060585A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- state
- region
- exposure
- axis direction
- wafer stages
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 abstract 4
- 238000007654 immersion Methods 0.000 abstract 3
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009539947A JP4986185B2 (ja) | 2007-11-07 | 2008-11-04 | 露光装置及び露光方法、並びにデバイス製造方法 |
CN200880011784.0A CN101675500B (zh) | 2007-11-07 | 2008-11-04 | 曝光装置、曝光方法以及元件制造方法 |
HK10104656.5A HK1137077A1 (en) | 2007-11-07 | 2010-05-13 | Exposure apparatus, exposure method and device manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007289203 | 2007-11-07 | ||
JP2007-289203 | 2007-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009060585A1 true WO2009060585A1 (ja) | 2009-05-14 |
Family
ID=40625493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/003160 WO2009060585A1 (ja) | 2007-11-07 | 2008-11-04 | 露光装置及び露光方法、並びにデバイス製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8797508B2 (ja) |
JP (1) | JP4986185B2 (ja) |
KR (1) | KR101470671B1 (ja) |
CN (1) | CN101675500B (ja) |
HK (1) | HK1137077A1 (ja) |
TW (1) | TWI435183B (ja) |
WO (1) | WO2009060585A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011061199A (ja) * | 2009-09-11 | 2011-03-24 | Asml Netherlands Bv | シャッター部材、リソグラフィ装置及びデバイス製造方法 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8760629B2 (en) | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
US8902402B2 (en) | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8599359B2 (en) | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
US8488109B2 (en) | 2009-08-25 | 2013-07-16 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110096312A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110096306A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110102761A1 (en) * | 2009-09-28 | 2011-05-05 | Nikon Corporation | Stage apparatus, exposure apparatus, and device fabricating method |
US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
US20110128523A1 (en) * | 2009-11-19 | 2011-06-02 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US8488106B2 (en) * | 2009-12-28 | 2013-07-16 | Nikon Corporation | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method |
US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
JP6362312B2 (ja) * | 2013-09-09 | 2018-07-25 | キヤノン株式会社 | 露光装置、それを用いたデバイスの製造方法 |
CN111290221B (zh) | 2015-02-23 | 2023-07-28 | 株式会社尼康 | 测量装置、光刻系统、曝光装置、测量方法、曝光方法以及元件制造方法 |
KR102688211B1 (ko) | 2015-02-23 | 2024-07-24 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법 |
CN111948912A (zh) | 2015-02-23 | 2020-11-17 | 株式会社尼康 | 基板处理系统及基板处理方法、以及组件制造方法 |
KR20240058311A (ko) * | 2022-10-26 | 2024-05-03 | 삼성전자주식회사 | 기판 처리 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332656A (ja) * | 2005-05-24 | 2006-12-07 | Asml Netherlands Bv | 2ステージ・リソグラフィ装置及びデバイス製造方法 |
WO2007018127A1 (ja) * | 2005-08-05 | 2007-02-15 | Nikon Corporation | ステージ装置及び露光装置 |
WO2007055237A1 (ja) * | 2005-11-09 | 2007-05-18 | Nikon Corporation | 露光装置及び露光方法、並びにデバイス製造方法 |
JP2007281308A (ja) * | 2006-04-10 | 2007-10-25 | Canon Inc | 液浸露光装置 |
JP2008130745A (ja) * | 2006-11-20 | 2008-06-05 | Canon Inc | 液浸露光装置 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4780617A (en) * | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
KR100300618B1 (ko) * | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
US6208407B1 (en) * | 1997-12-22 | 2001-03-27 | Asm Lithography B.V. | Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement |
KR100841147B1 (ko) * | 1998-03-11 | 2008-06-24 | 가부시키가이샤 니콘 | 레이저 장치, 자외광 조사 장치 및 방법, 물체의 패턴 검출장치 및 방법 |
US6771350B2 (en) * | 2000-02-25 | 2004-08-03 | Nikon Corporation | Exposure apparatus and exposure method capable of controlling illumination distribution |
US6611316B2 (en) * | 2001-02-27 | 2003-08-26 | Asml Holding N.V. | Method and system for dual reticle image exposure |
JP2002280283A (ja) * | 2001-03-16 | 2002-09-27 | Canon Inc | 基板処理装置 |
TW529172B (en) * | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
TWI293475B (en) * | 2001-11-30 | 2008-02-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1532489A2 (en) * | 2002-08-23 | 2005-05-25 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
EP1420298B1 (en) | 2002-11-12 | 2013-02-20 | ASML Netherlands B.V. | Lithographic apparatus |
KR100585476B1 (ko) * | 2002-11-12 | 2006-06-07 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조방법 |
EP1598855B1 (en) * | 2003-02-26 | 2015-04-22 | Nikon Corporation | Exposure apparatus and method, and method of producing apparatus |
EP2613192B1 (en) | 2003-04-11 | 2015-10-28 | Nikon Corporation | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
KR101265454B1 (ko) * | 2003-06-19 | 2013-05-16 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조방법 |
JP4444920B2 (ja) * | 2003-09-19 | 2010-03-31 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
WO2005059617A2 (en) | 2003-12-15 | 2005-06-30 | Carl Zeiss Smt Ag | Projection objective having a high aperture and a planar end surface |
JP5102492B2 (ja) | 2003-12-19 | 2012-12-19 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 結晶素子を有するマイクロリソグラフィー投影用対物レンズ |
US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
JP2005317916A (ja) * | 2004-03-30 | 2005-11-10 | Canon Inc | 露光装置及びデバイス製造方法 |
KR101364347B1 (ko) | 2004-10-15 | 2014-02-18 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
US20060092399A1 (en) * | 2004-10-29 | 2006-05-04 | Asml Netherlands B.V. | Lithographic apparatus, a control system for controlling a lithographic apparatus, and a device manufacturing method |
US7161659B2 (en) * | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7515281B2 (en) * | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP5195417B2 (ja) | 2006-02-21 | 2013-05-08 | 株式会社ニコン | パターン形成装置、露光装置、露光方法及びデバイス製造方法 |
EP3267258A1 (en) * | 2006-02-21 | 2018-01-10 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
US7310132B2 (en) * | 2006-03-17 | 2007-12-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7483120B2 (en) * | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
KR101419196B1 (ko) * | 2006-09-29 | 2014-07-15 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
JP2008124219A (ja) | 2006-11-10 | 2008-05-29 | Canon Inc | 液浸露光装置 |
JP2008124194A (ja) * | 2006-11-10 | 2008-05-29 | Canon Inc | 液浸露光方法および液浸露光装置 |
US20080158531A1 (en) * | 2006-11-15 | 2008-07-03 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8040490B2 (en) * | 2006-12-01 | 2011-10-18 | Nikon Corporation | Liquid immersion exposure apparatus, exposure method, and method for producing device |
JP2009218564A (ja) * | 2008-02-12 | 2009-09-24 | Canon Inc | 露光装置及びデバイス製造方法 |
-
2008
- 2008-11-04 KR KR1020097025768A patent/KR101470671B1/ko not_active Expired - Fee Related
- 2008-11-04 JP JP2009539947A patent/JP4986185B2/ja not_active Expired - Fee Related
- 2008-11-04 WO PCT/JP2008/003160 patent/WO2009060585A1/ja active Application Filing
- 2008-11-04 CN CN200880011784.0A patent/CN101675500B/zh not_active Expired - Fee Related
- 2008-11-06 US US12/265,831 patent/US8797508B2/en not_active Expired - Fee Related
- 2008-11-07 TW TW097142980A patent/TWI435183B/zh not_active IP Right Cessation
-
2010
- 2010-05-13 HK HK10104656.5A patent/HK1137077A1/xx not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332656A (ja) * | 2005-05-24 | 2006-12-07 | Asml Netherlands Bv | 2ステージ・リソグラフィ装置及びデバイス製造方法 |
WO2007018127A1 (ja) * | 2005-08-05 | 2007-02-15 | Nikon Corporation | ステージ装置及び露光装置 |
WO2007055237A1 (ja) * | 2005-11-09 | 2007-05-18 | Nikon Corporation | 露光装置及び露光方法、並びにデバイス製造方法 |
JP2007281308A (ja) * | 2006-04-10 | 2007-10-25 | Canon Inc | 液浸露光装置 |
JP2008130745A (ja) * | 2006-11-20 | 2008-06-05 | Canon Inc | 液浸露光装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011061199A (ja) * | 2009-09-11 | 2011-03-24 | Asml Netherlands Bv | シャッター部材、リソグラフィ装置及びデバイス製造方法 |
US8599356B2 (en) | 2009-09-11 | 2013-12-03 | Asml Netherlands B.V. | Shutter member, a lithographic apparatus and device manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
KR101470671B1 (ko) | 2014-12-08 |
TW200935184A (en) | 2009-08-16 |
CN101675500B (zh) | 2011-05-18 |
JP4986185B2 (ja) | 2012-07-25 |
HK1137077A1 (en) | 2010-07-16 |
US8797508B2 (en) | 2014-08-05 |
KR20100085833A (ko) | 2010-07-29 |
US20090225288A1 (en) | 2009-09-10 |
CN101675500A (zh) | 2010-03-17 |
JPWO2009060585A1 (ja) | 2011-03-17 |
TWI435183B (zh) | 2014-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009060585A1 (ja) | 露光装置及び露光方法、並びにデバイス製造方法 | |
EP2284866A3 (en) | Exposure apparatus, exposure method and device manufacturing method | |
EP1783821A4 (en) | EXPOSURE SYSTEM AND METHOD FOR PRODUCING THE DEVICE | |
WO2005111722A3 (en) | Apparatus and method for providing fluid for immersion lithography | |
TW201203318A (en) | Exposure method, exposure device, and device manufacturing method | |
PH12013500600B1 (en) | Polarizing photochromic devices and methods of making the same | |
TW200508806A (en) | Polyamide acid-containing composition for forming anti-reflective film | |
WO2005001572A3 (en) | Lithographic apparatus and device manufacturing method | |
TW200741818A (en) | Exposure apparatus and device manufacturing method | |
GR1006447B (el) | Μεθοδος συγκολλησης | |
WO2009104899A3 (en) | Method of etching asymmetric wafer, solar cell including the asymmetrically etched wafer, and method of manufacturing the same | |
WO2005024520A3 (en) | Phototool coating | |
WO2006084641A3 (en) | Immersion liquid, exposure apparatus, and exposure process | |
WO2005009632A3 (en) | Methods for forming tunable molecular gradients on substrates | |
TW200717039A (en) | Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method | |
TW200619866A (en) | Aligner, exposing method, and device manufacturing method | |
SG132679A1 (en) | Exposure apparatus, exposure method, and device fabricating method | |
WO2006028951A3 (en) | Controlling critical dimensions of structures formed on a wafer in semiconductor processing | |
WO2005010949A3 (en) | Solution to thermal budget | |
TW200705117A (en) | Measuring apparatus, exposure apparatus, and device manufacturing method | |
WO2008077012A3 (en) | Multi-step photomask etching with chlorine for uniformity control | |
WO2009142947A3 (en) | Helium descumming | |
TW560622U (en) | Display device, device provided with at least one flexible substrate, and method of mutually coupling layers | |
TW200732854A (en) | Exposure apparatus and method, and method for manufacturing device | |
KR20150137943A (ko) | 플렉시블 디스플레이장치의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880011784.0 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08847013 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20097025768 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009539947 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08847013 Country of ref document: EP Kind code of ref document: A1 |