WO2008139995A1 - 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール - Google Patents
導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール Download PDFInfo
- Publication number
- WO2008139995A1 WO2008139995A1 PCT/JP2008/058488 JP2008058488W WO2008139995A1 WO 2008139995 A1 WO2008139995 A1 WO 2008139995A1 JP 2008058488 W JP2008058488 W JP 2008058488W WO 2008139995 A1 WO2008139995 A1 WO 2008139995A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductor
- connecting conductor
- solar cell
- cell module
- metal foil
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title abstract 8
- 239000011888 foil Substances 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 6
- 239000012790 adhesive layer Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Photovoltaic Devices (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880013878.1A CN101669258B (zh) | 2007-05-09 | 2008-05-07 | 导电体的连接方法、导电体连接用部件、连接结构及太阳能电池模块 |
EP08752380A EP2146404A1 (en) | 2007-05-09 | 2008-05-07 | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
JP2009514130A JP4894920B2 (ja) | 2007-05-09 | 2008-05-07 | 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール |
KR1020117012768A KR101248636B1 (ko) | 2007-05-09 | 2008-05-07 | 도전체의 접속 방법, 도전체 접속용 부재, 접속 구조 및 태양 전지 모듈 |
US12/615,244 US10032952B2 (en) | 2007-05-09 | 2009-11-09 | Connecting structure and solar cell module |
US13/835,018 US9660131B2 (en) | 2007-05-09 | 2013-03-15 | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007124438 | 2007-05-09 | ||
JP2007-124438 | 2007-05-09 | ||
JP2007241230 | 2007-09-18 | ||
JP2007-241230 | 2007-09-18 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/615,244 Continuation US10032952B2 (en) | 2007-05-09 | 2009-11-09 | Connecting structure and solar cell module |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008139995A1 true WO2008139995A1 (ja) | 2008-11-20 |
Family
ID=40002195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058488 WO2008139995A1 (ja) | 2007-05-09 | 2008-05-07 | 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール |
Country Status (7)
Country | Link |
---|---|
US (2) | US10032952B2 (ja) |
EP (1) | EP2146404A1 (ja) |
JP (2) | JP4894920B2 (ja) |
KR (2) | KR101081706B1 (ja) |
CN (2) | CN105826418B (ja) |
TW (1) | TWI449186B (ja) |
WO (1) | WO2008139995A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110017261A1 (en) * | 2008-02-21 | 2011-01-27 | Sanyo Electric Co., Ltd. | Solar cell module |
JP2011151246A (ja) * | 2010-01-22 | 2011-08-04 | Hitachi Chem Co Ltd | 太陽電池モジュールの製造方法 |
WO2012165348A1 (ja) * | 2011-05-27 | 2012-12-06 | 新日鐵住金株式会社 | 太陽電池用インターコネクタ及び太陽電池モジュール |
WO2014041650A1 (ja) * | 2012-09-13 | 2014-03-20 | 三洋電機株式会社 | 太陽電池モジュール |
JP2015226899A (ja) * | 2014-05-09 | 2015-12-17 | 積水化学工業株式会社 | マイクロカプセル及び熱硬化性接着剤組成物 |
US9390829B2 (en) | 2010-01-25 | 2016-07-12 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
JP6073681B2 (ja) * | 2010-10-21 | 2017-02-01 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子 |
JP2017163161A (ja) * | 2017-06-07 | 2017-09-14 | 日立化成株式会社 | 太陽電池及び太陽電池モジュール |
WO2022030634A1 (ja) * | 2020-08-07 | 2022-02-10 | 昭和電工マテリアルズ株式会社 | 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材 |
Families Citing this family (31)
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US20100108118A1 (en) * | 2008-06-02 | 2010-05-06 | Daniel Luch | Photovoltaic power farm structure and installation |
US9865758B2 (en) | 2006-04-13 | 2018-01-09 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US9236512B2 (en) | 2006-04-13 | 2016-01-12 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US8729385B2 (en) | 2006-04-13 | 2014-05-20 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US8884155B2 (en) | 2006-04-13 | 2014-11-11 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
JP2015018814A (ja) * | 2010-01-25 | 2015-01-29 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池 |
EP2530734A4 (en) * | 2010-01-26 | 2015-11-18 | SOLAR CELL MODULE AND MANUFACTURING METHOD THEREFOR | |
WO2011152319A1 (ja) * | 2010-05-31 | 2011-12-08 | 三洋電機株式会社 | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
US8802479B2 (en) | 2010-06-03 | 2014-08-12 | NuvoSun, Inc. | Solar cell interconnection method using a flat metallic mesh |
JP5558940B2 (ja) * | 2010-06-30 | 2014-07-23 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP2012124375A (ja) * | 2010-12-09 | 2012-06-28 | Sony Chemical & Information Device Corp | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
KR101694553B1 (ko) * | 2011-01-05 | 2017-01-09 | 엘지전자 주식회사 | 태양 전지 모듈 |
JP5176159B1 (ja) * | 2011-07-19 | 2013-04-03 | 日立化成株式会社 | n型拡散層形成組成物、n型拡散層の製造方法、及び太陽電池素子の製造方法 |
KR101282943B1 (ko) * | 2011-09-29 | 2013-07-08 | 엘지전자 주식회사 | 태양전지 모듈 |
US9490376B2 (en) * | 2011-09-29 | 2016-11-08 | Lg Electronics Inc. | Solar cell module |
CN102509747A (zh) * | 2011-11-08 | 2012-06-20 | 江西赛维Ldk太阳能高科技有限公司 | 一种太阳能电池片的连接方法及带有导电粘合剂的汇流带 |
CN104094413B (zh) | 2011-12-07 | 2016-11-09 | 纳沃萨恩公司 | 光伏电池和形成光伏电池的方法 |
CN102888196B (zh) * | 2012-09-13 | 2015-02-18 | 烟台德邦科技有限公司 | 一种导电胶膜及其制备方法 |
WO2014149715A1 (en) * | 2013-03-22 | 2014-09-25 | 3M Innovative Properties Company | Solar cells and modules including conductive tapes and methods of making and using same |
WO2014157455A1 (ja) | 2013-03-28 | 2014-10-02 | 東芝ホクト電子株式会社 | 発光装置、その製造方法、および発光装置使用装置 |
US9818903B2 (en) * | 2014-04-30 | 2017-11-14 | Sunpower Corporation | Bonds for solar cell metallization |
JP6621029B2 (ja) * | 2014-09-29 | 2019-12-18 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
KR101603318B1 (ko) * | 2014-11-13 | 2016-03-14 | 남광현 | 기능성 필름, 이를 포함하는 연성회로기판, 및 기판에 대한 기능성 필름 접지 방법 |
US11581446B2 (en) * | 2015-10-08 | 2023-02-14 | The Boeing Company | Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier |
EP3392916A1 (de) * | 2017-04-19 | 2018-10-24 | Heraeus Deutschland GmbH & Co. KG | Alterungsresistente aluminiumverbinder für solarzellen |
KR102120662B1 (ko) * | 2018-06-08 | 2020-06-11 | 대산전자(주) | 버스바용 클래드와 버스바용 클래드 제조 방법 |
US11850839B2 (en) * | 2018-08-08 | 2023-12-26 | Autonetworks Technologies, Ltd. | Fixing structure of wiring member |
JPWO2022138619A1 (ja) * | 2020-12-21 | 2022-06-30 | ||
CN113037210A (zh) * | 2021-03-05 | 2021-06-25 | 浙江晶科能源有限公司 | 电池串结构和光伏组件及其制造方法 |
US20240322262A1 (en) * | 2023-03-26 | 2024-09-26 | Samsung Sdi Co., Ltd. | Battery pack |
CN117238997B (zh) * | 2023-11-10 | 2024-04-09 | 天合光能股份有限公司 | 导电连接件和电池片组件 |
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JP6073681B2 (ja) * | 2010-10-21 | 2017-02-01 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子 |
WO2012165348A1 (ja) * | 2011-05-27 | 2012-12-06 | 新日鐵住金株式会社 | 太陽電池用インターコネクタ及び太陽電池モジュール |
WO2014041650A1 (ja) * | 2012-09-13 | 2014-03-20 | 三洋電機株式会社 | 太陽電池モジュール |
JPWO2014041650A1 (ja) * | 2012-09-13 | 2016-08-12 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
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JP2015226899A (ja) * | 2014-05-09 | 2015-12-17 | 積水化学工業株式会社 | マイクロカプセル及び熱硬化性接着剤組成物 |
JP2017163161A (ja) * | 2017-06-07 | 2017-09-14 | 日立化成株式会社 | 太陽電池及び太陽電池モジュール |
WO2022030634A1 (ja) * | 2020-08-07 | 2022-02-10 | 昭和電工マテリアルズ株式会社 | 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材 |
Also Published As
Publication number | Publication date |
---|---|
KR20110082604A (ko) | 2011-07-19 |
US10032952B2 (en) | 2018-07-24 |
US20130220540A1 (en) | 2013-08-29 |
CN105826418A (zh) | 2016-08-03 |
KR101081706B1 (ko) | 2011-11-09 |
CN101669258B (zh) | 2016-04-13 |
TWI449186B (zh) | 2014-08-11 |
US20100108141A1 (en) | 2010-05-06 |
US9660131B2 (en) | 2017-05-23 |
CN101669258A (zh) | 2010-03-10 |
JP2012009884A (ja) | 2012-01-12 |
JPWO2008139995A1 (ja) | 2010-08-05 |
CN105826418B (zh) | 2017-05-17 |
KR20090098871A (ko) | 2009-09-17 |
JP4894920B2 (ja) | 2012-03-14 |
KR101248636B1 (ko) | 2013-04-01 |
JP5527292B2 (ja) | 2014-06-18 |
EP2146404A1 (en) | 2010-01-20 |
TW200919750A (en) | 2009-05-01 |
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