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WO2008139643A1 - Exposure method and exposure apparatus - Google Patents

Exposure method and exposure apparatus Download PDF

Info

Publication number
WO2008139643A1
WO2008139643A1 PCT/JP2007/065712 JP2007065712W WO2008139643A1 WO 2008139643 A1 WO2008139643 A1 WO 2008139643A1 JP 2007065712 W JP2007065712 W JP 2007065712W WO 2008139643 A1 WO2008139643 A1 WO 2008139643A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pattern
photomask
supporting member
exposure
Prior art date
Application number
PCT/JP2007/065712
Other languages
French (fr)
Japanese (ja)
Inventor
Ken Miyake
Toshihiro Takagi
Original Assignee
Sanei Giken Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co., Ltd. filed Critical Sanei Giken Co., Ltd.
Priority to KR1020097025058A priority Critical patent/KR101118854B1/en
Priority to JP2007555408A priority patent/JP4176819B1/en
Priority to CN2007800529259A priority patent/CN101663619B/en
Publication of WO2008139643A1 publication Critical patent/WO2008139643A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A substrate (1) is fixed and supported by a main surface of a rectangular substrate supporting member (11). A photomask (2) whereupon a pattern is drawn is arranged at a position covering a photosensitive layer of the substrate (1). The pattern is transferred onto the substrate by irradiating the photosensitive layer of the substrate (1) with light through the photomask (2). At the time of exposure, the photomask (2) and the substrate (1) are uniformly brought into contact with each other, and the substrate supporting member (11) and the substrate (1) are deformed in desired bent shapes. The substrate supporting member (11) is bent with the substrate (1) while having the bending quantity separately controlled, by having at the center a first axis extending in a direction same as that of a first pair of facing side end sections or a second axis extending in a direction same as that of a second pair of facing side end sections. Thus, the dimensions of the pattern are substantially changed and the pattern is transferred onto the substrate (1).
PCT/JP2007/065712 2007-05-10 2007-08-10 Exposure method and exposure apparatus WO2008139643A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097025058A KR101118854B1 (en) 2007-05-10 2007-08-10 Exposure method and exposure apparatus
JP2007555408A JP4176819B1 (en) 2007-05-10 2007-08-10 Exposure method and exposure apparatus
CN2007800529259A CN101663619B (en) 2007-05-10 2007-08-10 Exposure method and exposure apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-125805 2007-05-10
JP2007125805 2007-05-10

Publications (1)

Publication Number Publication Date
WO2008139643A1 true WO2008139643A1 (en) 2008-11-20

Family

ID=40001872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065712 WO2008139643A1 (en) 2007-05-10 2007-08-10 Exposure method and exposure apparatus

Country Status (5)

Country Link
JP (1) JP4176819B1 (en)
KR (1) KR101118854B1 (en)
CN (1) CN101663619B (en)
TW (1) TWI430048B (en)
WO (1) WO2008139643A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102834A (en) * 2009-11-10 2011-05-26 Toppan Printing Co Ltd Substrate exposure apparatus
US8883380B2 (en) 2010-11-10 2014-11-11 V Technology Co., Ltd. Film exposure method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101260221B1 (en) * 2011-12-01 2013-05-06 주식회사 엘지화학 Mask
KR20140080772A (en) * 2012-12-18 2014-07-01 주식회사 원익아이피에스 Aligning apparatus and Aligning method using the same
CN103616803B (en) * 2013-11-25 2015-09-09 中国科学院长春光学精密机械与物理研究所 Grating scale vacuum copy exposure equipment
CN104749894B (en) * 2013-12-30 2017-08-29 上海微电子装备有限公司 It is a kind of to improve the mask platform of the vertical gravity-bending of mask
JP6308877B2 (en) * 2014-06-06 2018-04-11 キヤノントッキ株式会社 Deposition equipment
WO2016017414A1 (en) * 2014-08-01 2016-02-04 株式会社村田製作所 Direct exposure apparatus
KR102357577B1 (en) * 2014-08-28 2022-01-28 가부시키가이샤 오크세이사쿠쇼 Projection exposure apparatus, projection exposure method, photomask for the projection exposure apparatus, and the method for manufacturing substrate
CN108467008B (en) * 2018-03-12 2020-10-23 中国科学院光电技术研究所 A high-precision preparation method of micro-nano structures on flexible film substrates
DE102020204941A1 (en) * 2020-04-20 2020-10-29 Robert Bosch Gesellschaft mit beschränkter Haftung Method and device for producing a substrate provided with a hardenable potting compound
WO2022083111A1 (en) * 2020-10-19 2022-04-28 北京航空航天大学杭州创新研究院 Device for retaining substrate and mask plate in-situ during high-density patterning processing

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (en) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd Bonding method for wafer and mask
JPH0272362A (en) * 1988-09-07 1990-03-12 Hitachi Ltd Exposure method and aligner
JPH07115055A (en) * 1993-10-15 1995-05-02 Dainippon Screen Mfg Co Ltd Substrate aligner
JPH07245259A (en) * 1994-03-03 1995-09-19 Topcon Corp Exposure device
JPH11312635A (en) * 1998-04-28 1999-11-09 Ushio Inc Contact exposure method
JP2002091010A (en) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd Contact aligner
JP2002367895A (en) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd Method and apparatus for exposing photoresist as well as substrate
WO2006137396A1 (en) * 2005-06-21 2006-12-28 Sanei Giken Co., Ltd. Exposing method and device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710847B1 (en) * 1998-11-06 2004-03-23 Nikon Corporation Exposure method and exposure apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (en) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd Bonding method for wafer and mask
JPH0272362A (en) * 1988-09-07 1990-03-12 Hitachi Ltd Exposure method and aligner
JPH07115055A (en) * 1993-10-15 1995-05-02 Dainippon Screen Mfg Co Ltd Substrate aligner
JPH07245259A (en) * 1994-03-03 1995-09-19 Topcon Corp Exposure device
JPH11312635A (en) * 1998-04-28 1999-11-09 Ushio Inc Contact exposure method
JP2002091010A (en) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd Contact aligner
JP2002367895A (en) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd Method and apparatus for exposing photoresist as well as substrate
WO2006137396A1 (en) * 2005-06-21 2006-12-28 Sanei Giken Co., Ltd. Exposing method and device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102834A (en) * 2009-11-10 2011-05-26 Toppan Printing Co Ltd Substrate exposure apparatus
US8883380B2 (en) 2010-11-10 2014-11-11 V Technology Co., Ltd. Film exposure method

Also Published As

Publication number Publication date
KR101118854B1 (en) 2012-03-22
JP4176819B1 (en) 2008-11-05
JPWO2008139643A1 (en) 2010-07-29
CN101663619B (en) 2012-03-07
TW200912551A (en) 2009-03-16
CN101663619A (en) 2010-03-03
KR20100025520A (en) 2010-03-09
TWI430048B (en) 2014-03-11

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