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WO2008138177A1 - Système d'éclairage del avec effet de radiation à haute efficacité - Google Patents

Système d'éclairage del avec effet de radiation à haute efficacité Download PDF

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Publication number
WO2008138177A1
WO2008138177A1 PCT/CN2007/001722 CN2007001722W WO2008138177A1 WO 2008138177 A1 WO2008138177 A1 WO 2008138177A1 CN 2007001722 W CN2007001722 W CN 2007001722W WO 2008138177 A1 WO2008138177 A1 WO 2008138177A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
cavity
heat sink
open
heat
Prior art date
Application number
PCT/CN2007/001722
Other languages
English (en)
Chinese (zh)
Inventor
Jie Shi
Original Assignee
Jie Shi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jie Shi filed Critical Jie Shi
Publication of WO2008138177A1 publication Critical patent/WO2008138177A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/406—Lighting for industrial, commercial, recreational or military use for theatres, stages or film studios
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention discloses a three-cavity structure design method for an LED lamp with high heat dissipation and a lamp with a three-cavity structure design method for efficiently dissipating an LED lamp, in particular, an array type high-power LED lamp.
  • LEDs have the advantages of low energy consumption, low heat generation and long service life, making them ideal for replacing traditional light sources. Considering the insufficient brightness of the single-chip LED, the LED lamp generally adopts the LED array structure, which causes the problem that the LED lamp is difficult to dissipate heat.
  • a heat dissipation scheme for an LED lamp in which the heat dissipation is to absorb the heat of the base connected to the LED through the connecting post in the lamp body, and then still dissipate heat in the lamp body, since it is Multiple indirect heat dissipation and heat dissipation in the enclosed lamp body, the effect is not good.
  • a heat pipe lamp heat dissipation scheme is disclosed.
  • the heat dissipation in the solution is to absorb the heat of the light-emitting device through one end of the super-heat pipe, and transfer the heat to the lamp body heat-dissipating member in contact with the air at the other end. Because it is still multiple indirect heat dissipation, the effect is still not good.
  • a heat dissipation scheme for an LED lamp in which the heat dissipation of the LED is transmitted through the light source panel to the thermally conductive insulating film and the thermal conductive insulating tape and then transmitted to the heat dissipation housing. Indirect heat dissipation, the effect is still not good.
  • a heat dissipation scheme for an LED spotlight is disclosed. In this solution, the heat dissipation is transmitted to the heat-dissipating casing of the air contact by the heat absorbed by the air or the filler in the lamp body, and is still indirectly dissipated. , still not working well.
  • an LED lamp heat dissipation scheme in which the heat dissipation is the heat of the LED (mainly the heat of the LED base portion) transmitted to the heat dissipation plate through the circuit board and the conductive heat transfer adhesive layer. , still indirect heat dissipation, still not effective.
  • the purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and to provide a high-efficiency heat-dissipating LED lamp with high heat dissipation effect, low energy consumption, long service life, and low light energy attenuation.
  • the object of the present invention is to achieve an efficient heat-dissipating LED lamp, comprising a lamp body and a PCB mounting plate mounted on the lamp body, a PCB circuit board (2), an LED light source and a lens, and the special feature is set on the lamp body.
  • the open heat-dissipating cavity is a space formed by a plurality of staggered grid-shaped heat-conducting ribs on the upper part of the open heat-dissipating body (6), and the LED heat-dissipating body on the lower surface of the open heat-dissipating body (6) 4) and LED receiving hole (5)
  • the LED lighting cavity is composed of open heat sink (6), LED light and lens (7), LED substrate (8), lamp cover plate (9), and lower cover plate (10)
  • the LED light source and the lens (7) are connected to the LED substrate (8), and the LED substrate (8) is closely attached to the LED receiving hole (5) on the lower surface of the open heat sink (6), and the LED wire passes through the opening.
  • the thermal contact is a thermal adhesive contact.
  • the upper cover (1), the open heat sink (6), and the lower cover (10) are all exposed to the air.
  • the LED electrical cavity (I) and the LED lighting cavity ( ⁇ ) of the LED lamp used for outdoor lighting must be sealed inside the cavity, and the waterproofing requirement of IP65 or above, the LED electrical cavity of the indoor lighting LED lamp (I), LED lighting cavity (m), the internal cavity of the cavity meets IP20 requirements.
  • the LED light source and the chip of the lens (7) are directly packaged in the open heat sink (6), and directly form heat conduction with the bottom surface of the open heat sink (6).
  • the invention has the advantages of reasonable and compact structure, easy production and manufacture, good heat dissipation effect and the like.
  • the three-cavity structure design of the LED lamp with high efficiency heat dissipation mainly includes three functional parts: LED electrical cavity part; open heat dissipation cavity part; LED illumination cavity part.
  • the three functional parts of the lamp body are connected in sequence.
  • the LED electrical cavity part is composed of an upper cover (1), a PCB, a circuit board and corresponding electronic components (2), and a PCB mounting plate (3);
  • the open heat dissipation cavity portion is an open heat sink (6) a space formed by a plurality of staggered grid-shaped heat conducting ribs in the upper portion, and a LED wire perforation on the lower surface of the open heat sink (6)
  • LED lighting cavity part consists of open heat sink (6), LED light source and lens (7), LED substrate (8), lamp cover board (9), lower cover ( 10) Five parts.
  • the LED light source and the lens (7) are connected to the LED substrate (8), and the LED substrate (8) is closely attached to the LED receiving hole (5) on the lower surface of the open heat sink, and the LED wire passes through the open heat sink.
  • the LED wire perforation (4) and the corresponding hole on the PCB mounting plate (3) are then electrically connected to the PCB circuit board (2); the LED substrate (8) is in thermal contact with the bottom surface of the open heat sink (6), and the LED light source is And the lens (7) heat is transferred into the open heat sink (6), the open heat sink (6) is exposed to the air, and the outside natural wind passes through the open heat sink (6) and a plurality of staggered grid-like heat conduction
  • the gap between the ribs realizes the convection of the hot air in the open heat dissipation chamber and the cold air outside, which will quickly
  • the heat generated by the LED light source (7) is maximally dissipated, thereby achieving an efficient heat dissipation effect.
  • the LED lamp designed by using the three-cavity structure design method realizes spatial isolation between the LED electrical cavity portion and the LED illumination cavity portion, so that the working environments of the two cavity bodies do not affect each other, and the LED electrical cavity
  • the heat generated by the body part and the LED illumination cavity part does not form a superposition, so the cooling effect is realized by the reasonable arrangement of the space structure, further prolonging the service life of the LED lamp and maintaining the constant luminous effect.
  • the PCB mounting plate, the upper cover, the open heat sink, the LED substrate, and the lower cover are made of a heat conductive material, and the heat conductive material is an aluminum alloy or a copper alloy or other heat conductive metal alloy.
  • the PCB circuit board (2) is separately provided; the circuit can be directly printed on the upper surface of the open heat sink (6) by a thick film process; or the PCB circuit board (2) and the thick film process are not used. It is a working voltage that directly supplies the LED light source and the lens (7) by using a battery pack, a battery or other power supply device.
  • the LED substrate and the LED heat dissipation hole on the lower surface of the open heat sink are closely adhered by a thermal conductive adhesive or other heat conductive material; or the open heat sink
  • the LED receiving hole (5) on the lower surface can also be omitted, and the LED light source and lens are
  • the upper cover, the open heat sink, and the lower cover are all exposed to the air.
  • the LED electrical cavity portion and the LED illumination cavity portion of the LED lamp when used for outdoor lighting, must be sealed inside the cavity, and it is required to meet the waterproof requirement of IP65 or higher; When the LED electrical cavity portion of the LED lamp and the LED illumination cavity portion are required to meet the requirements of IP20, Yes.
  • the LED light source and the lens may be provided with other devices for managing light.
  • Figure 1 is a schematic view of the structure of the present invention
  • FIG. 2 is a schematic view showing the structure of a cross section of the LED street lamp of the present invention.
  • Figure 3 is a schematic view showing the principle of the exploded structure of the components in Figure 2;
  • Figure 4 is a schematic view showing the structure of a cross section of an LED tunnel lamp of the present invention.
  • Figure 5 is a schematic cross-sectional view showing the structure of the LED spotlight of the present invention.
  • FIG. 6 is a schematic structural view showing the structure of a LED floodlight of the present invention.
  • FIG. 7 is a schematic view showing the structure of a cross-sectional structure of an LED wall washer according to the present invention.
  • Figure 8 is a schematic view showing the structure of the LED embedded lamp of the present invention.
  • Figure 9 is a schematic view showing the structure of the LED chandelier of the present invention.
  • Figure 10 is a schematic cross-sectional view showing the structure of the LED ceiling lamp of the present invention.
  • Figure 11 is a schematic view showing the structure of the LED cup lamp of the present invention.
  • Fig. 12 is a schematic view showing the structure of a cross section of an LED automobile headlight according to the present invention.
  • 1 is the upper cover
  • 2 is the PCB circuit board
  • 3 is the PCB mounting board
  • 4 is the LED wire perforation
  • 5 is the LED receiving hole
  • 6 is the open heat sink
  • 7 is the LED light source and lens
  • 8 is The LED substrate
  • 9 is a lamp cover plate
  • 10 is a lower cover plate
  • 11 is a wind deflector.
  • Embodiment 1 as shown in Fig. 2 and Fig. 3.
  • the LED street lamp has a long strip shape, and the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) are attached to the LED substrate (8) through the LED substrate (8).
  • Embodiment 2 is as shown in FIG. LED tunnel light, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6) Inside the lower surface LED receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize the circuit connection with the PCB circuit board and the corresponding electronic component (2), LED light source (7) The vast majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a portion of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp (II) Directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-like heat-conducting ribs on the open heat sink (6) to realize the cold air in the open heat-dissipating cavity
  • Embodiment 3 is as shown in FIG. LED spotlights, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6) Inside the lower surface LED receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), LED light source (7) The vast majority of the heat generated is directly conducted into the lower surface of the open heat sink (6) until open heat dissipation
  • the upper part of the body (6) has a plurality of staggered grid-shaped heat conducting ribs.
  • the open heat radiating cavity part ( ⁇ ) of the lamp Since the open heat radiating cavity part ( ⁇ ) of the lamp is directly exposed to the outside air, the outside natural wind passes through the upper part of the open heat sink (6).
  • the gap between the plurality of grid-like heat-conducting ribs causes the convection of the hot air in the open heat-dissipating cavity and the cold air outside, and quickly turns the LED light source
  • Embodiment 4 is as shown in FIG. 6.
  • LED flood light the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source (7) is attached to the open heat sink through the LED substrate (8) ( 6)
  • the LED light source (7) wire passes through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), and the LED light source (7) generates Most of the heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp
  • Embodiment 5 is as shown in FIG. LED wall washer, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) along the length direction of the lamp; each LED light source and lens (7) is attached to the open type through the LED substrate (8)
  • the LED light receiving hole (5), the LED light source and the lens (7) lead through the LED wire through hole (4) and the PCB circuit board and the corresponding electronic components (2) to achieve circuit connection, LED light source (7)
  • Most of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity of the lamp
  • the body part (II) is directly exposed to the outside air, and the outside natural wind passes through the gap between the plurality of staggered grid-shaped heat conducting ribs on the open heat sink (6).
  • Embodiment 6 is as shown in FIG. LED embedded lamp, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6) In the lower surface LED receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to connect with the PCB circuit board and the corresponding electronic component (2), LED light source (7) The vast majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a portion of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp ( ⁇ ) Directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-like heat-conducting ribs on the open heat sink (6) to realize the hot air in the open heat-dissipating cavity and the outside.
  • Embodiment 7 as shown in FIG. LED chandelier, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) along the longitudinal direction of the luminaire; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6)
  • the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), LED light source (7)
  • the majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp ( ⁇ ) Directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-like heat-conducting ribs on the open heat sink (6) to realize the hot air in the open heat-dissipating cavity and the outside.
  • Air Air
  • Embodiment 8 is as shown in FIG. LED ceiling lamp, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) respectively along the longitudinal and lateral directions (the lamp is elongated) or around the center of the circle (the lamp is circular); each LED light source And the lens (7) is attached to the lower surface LED receiving hole (5) of the floating heat sink (6) through the LED substrate (8), and the LED light source and the lens (7) wire pass through the LED wire through hole (4) and the PCB
  • the circuit board and the corresponding electronic component (2) realize the circuit connection, and most of the heat generated by the LED light source (7) is directly transmitted into the lower surface of the open heat sink (6) until the upper part of the open heat sink (6) is staggered.
  • the grid-like heat-conducting ribs of the luminaire because the open heat-dissipating cavity part (II) of the luminaire is directly exposed to the outside air, the outside natural wind passes through the open heat-dissipating body (6), and a plurality of staggered grid-like heat conduction
  • the air between the ribs realizes the convection of the hot air in the open heat dissipation cavity and the cold air outside, and quickly dissipates the heat generated by the LED light source (7) to the maximum extent, thereby achieving an efficient heat dissipation effect.
  • Embodiment 9 as shown in FIG. LED cup lamp, its open heat sink (6) is arranged on the lower surface of a single or a plurality of LED light sources and lenses (7) around the center of the circle; each LED light source and lens (7) is attached to the open type through the LED substrate (8)
  • the LED light receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), the LED light source (7)
  • the majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity of the lamp
  • the body part ( ⁇ ) is directly exposed to the outside air, and the outside natural wind passes through the gap between the plurality of staggered grid-shaped heat conducting ribs on the open heat sink (6) to realize the hot air and the outside of the open heat
  • Embodiment 10 is as shown in FIG. LED car headlights, the open heat sink (6) is arranged on the lower surface of a single or a plurality of LED light sources and lenses (7) around the center; each LED light source and lens (7) is attached to the open through the LED substrate (8) In the lower surface of the LED (6) receiving hole (5), the LED light source and the lens (7) lead through the LED wire perforation (4) and the PCB circuit board and the corresponding electronic components (2) to achieve circuit connection, Most of the heat generated by the LED light source (7) is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, since the lamp is open The heat dissipating cavity portion ( ⁇ ) is directly exposed to the outside air, and the external natural wind is opened through the gap between the air guiding plate (11) and the open heat radiating body (6), and a plurality of staggered grid-like heat conducting ribs The hot air in the heat dis
  • the LED light source (7) is in contact with the open heat sink (6) via the LED base plate (8), and in other examples the LED light source can be brought into direct contact with the open heat sink (6).
  • the PCB circuit board (2) carrying the circuit is separately provided.
  • the circuit can be directly printed on the upper surface of the open heat sink (6) by a thick film process, so that the PCB circuit board and corresponding The heat generated by the electronic component (2) is conducted in the same manner to a plurality of staggered grid-like heat conducting ribs of the open heat sink (6), and then the air is self-convolating to achieve efficient heat dissipation.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'objet de la présente invention concerne un système d'éclairage DEL avec effet de radiation à haute efficacité constitué d'un corps de lampe et d'une plaque de montage PCB (3), d'une plaque circuit PCB (2), de sources de lumière DEL et d'une lentille (7) montés sur le corps de lampe. Une cavité électrique DEL (I), une cavité de radiation à ouverture (II) et une cavité d'éclairage DEL (III) sont reliées de manière séquentielle de manière à former une entité. La cavité électrique DEL (I) est composée d'une plaque de revêtement supérieure (1), de la plaque circuit PCB (2) et de la plaque de montage PCB (3). La cavité de radiation à ouverture (II) est un espace formé par une pluralité de nervures de conduction de la chaleur sous forme d'une grille disposée sur la partie supérieure d'un radiateur d'ouverture (6). La surface inférieure du radiateur d'ouverture (6) est munie de trous débouchants pour les amorces DEL (4) et les trous de placement DEL (5). La cavité d'éclairage DEL (III) est constituée du radiateur d'ouverture (6), des sources de lumière DEL et des lentilles (7), des plaques de base DEL (8), d'une plaque de revêtement de lampe (9) et d'une plaque de revêtement inférieure (10).
PCT/CN2007/001722 2007-05-16 2007-05-28 Système d'éclairage del avec effet de radiation à haute efficacité WO2008138177A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200710022390.2 2007-05-16
CNA2007100223902A CN101307891A (zh) 2007-05-16 2007-05-16 高效散热的led灯具

Publications (1)

Publication Number Publication Date
WO2008138177A1 true WO2008138177A1 (fr) 2008-11-20

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PCT/CN2007/001722 WO2008138177A1 (fr) 2007-05-16 2007-05-28 Système d'éclairage del avec effet de radiation à haute efficacité
PCT/CN2008/000957 WO2008138231A1 (fr) 2007-05-16 2008-05-16 Lampe à del à dissipation de chaleur hautement efficace

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/000957 WO2008138231A1 (fr) 2007-05-16 2008-05-16 Lampe à del à dissipation de chaleur hautement efficace

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CN (1) CN101307891A (fr)
WO (2) WO2008138177A1 (fr)

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EP2365151A1 (fr) * 2010-03-09 2011-09-14 RIDI Leuchten GmbH Lampe
US8899786B1 (en) * 2012-05-04 2014-12-02 Cooper Technologies Company Method and apparatus for light square assembly
CN105822959A (zh) * 2016-05-24 2016-08-03 合肥皆达信息科技有限公司 一种可隐藏式led壁灯
CN114606103A (zh) * 2022-03-16 2022-06-10 德默特生物科技(珠海)有限公司 一种杂合式光生物反应器

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CN101907239A (zh) * 2010-08-17 2010-12-08 史杰 Led智能调控环形灯管
WO2013044601A1 (fr) * 2011-09-30 2013-04-04 Yang Dongzuo Affichage matriciel à points à del et affichage matriciel à points combiné
US8985796B2 (en) 2011-11-18 2015-03-24 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight system of display device with printed circuit board separate from and mounted to LED substrate with support pillars
CN102384412B (zh) * 2011-11-18 2014-06-18 深圳市华星光电技术有限公司 背光系统
CN103423614A (zh) * 2012-05-17 2013-12-04 黄慧娟 一种高效散热的led灯具
CN103196051B (zh) * 2013-03-15 2014-11-26 于德海 一种高效散热的led模组与led显示屏
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