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WO2008136504A1 - Ｉｉｉ族窒化物半導体発光素子の製造方法 - Google Patents

Ｉｉｉ族窒化物半導体発光素子の製造方法 Download PDF

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Publication number
WO2008136504A1
WO2008136504A1 PCT/JP2008/058374 JP2008058374W WO2008136504A1 WO 2008136504 A1 WO2008136504 A1 WO 2008136504A1 JP 2008058374 W JP2008058374 W JP 2008058374W WO 2008136504 A1 WO2008136504 A1 WO 2008136504A1
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WIPO (PCT)
Prior art keywords
group iii
nitride semiconductor
iii nitride
emitting device
semiconductor light
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PCT/JP2008/058374
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English (en)
French (fr)
Inventor
Hisayuki Miki
Yasumasa Sasaki
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Showa Denko K.K.
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Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to JP2009513023A priority Critical patent/JP5471440B2/ja
Priority to US12/302,123 priority patent/US7749785B2/en
Publication of WO2008136504A1 publication Critical patent/WO2008136504A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02458—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Led Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

　本発明は、基板上に、ＩＩＩ族窒化物半導体を含む複数の積層膜を形成する積層工程を含むＩＩＩ族窒化物半導体発光素子の製造方法であって、前記基板として、単結晶のＩＩＩ族窒化物半導体を含む下地層が形成されてなる基板を用い、前記下地層を備えた基板と、ＩＩＩ族金属またはＩＩＩ族金属含有合金からなるターゲットとを、スパッタチャンバ内に配置し、前記下地層上に積層膜をスパッタ法で形成することを特徴とするＩＩＩ族窒化物半導体発光素子の製造方法を提供する。
PCT/JP2008/058374 2007-05-02 2008-05-01 Ｉｉｉ族窒化物半導体発光素子の製造方法 WO2008136504A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009513023A JP5471440B2 (ja) 2007-05-02 2008-05-01 Ｉｉｉ族窒化物半導体発光素子の製造方法
US12/302,123 US7749785B2 (en) 2007-05-02 2008-05-01 Manufacturing method of group III nitride semiconductor light-emitting device

Applications Claiming Priority (2)

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JP2007121541 2007-05-02
JP2007-121541 2007-05-02

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WO2008136504A1 true WO2008136504A1 (ja) 2008-11-13

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US (1) US7749785B2 (ja)
JP (1) JP5471440B2 (ja)
TW (1) TWI377703B (ja)
WO (1) WO2008136504A1 (ja)

Cited By (5)

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Publication number Priority date Publication date Assignee Title
JP2009135197A (ja) * 2007-11-29 2009-06-18 Showa Denko Kk Ｉｉｉ族窒化物半導体の製造方法、ｉｉｉ族窒化物半導体発光素子の製造方法、及びｉｉｉ族窒化物半導体発光素子、並びにランプ
JP2014154591A (ja) * 2013-02-05 2014-08-25 Asahi Kasei Corp ＧａＮ薄膜の製造方法及びＧａＮ薄膜
JP2016194155A (ja) * 2015-03-31 2016-11-17 エスピーティーエス テクノロジーズ リミティド 材料を堆積させる方法及び装置
JP2020115555A (ja) * 2020-03-25 2020-07-30 日機装株式会社 窒化物半導体素子
WO2023058507A1 (ja) * 2021-10-06 2023-04-13 東京エレクトロン株式会社 スパッタ装置及び成膜方法

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JP5049659B2 (ja) * 2007-06-11 2012-10-17 昭和電工株式会社 Ｉｉｉ族窒化物半導体の製造方法、ｉｉｉ族窒化物半導体発光素子の製造方法、及びｉｉｉ族窒化物半導体発光素子、並びにランプ
JP5262206B2 (ja) 2008-03-12 2013-08-14 豊田合成株式会社 Ｉｉｉ族窒化物半導体層の製造方法及びｉｉｉ族窒化物半導体発光素子の製造方法
CN102576729A (zh) * 2009-12-16 2012-07-11 国家半导体公司 用于基于氮化镓或其它氮化物的功率装置的含有锗的低欧姆触点
DE102009060750B4 (de) * 2009-12-30 2025-04-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
DE102010056409A1 (de) * 2010-12-26 2012-06-28 Azzurro Semiconductors Ag Gruppe-III-Nitrid basierte Schichtenfolge, Halbleiterbauelement, umfassend eine Gruppe-III-Nitrid basierte Schichtenfolge und Verfahren zur Herstellung
US8835301B2 (en) 2011-02-28 2014-09-16 Stats Chippac, Ltd. Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer
JP5023230B1 (ja) * 2011-05-16 2012-09-12 株式会社東芝 窒化物半導体素子、窒化物半導体ウェーハ及び窒化物半導体層の製造方法
JP5911727B2 (ja) * 2011-05-16 2016-04-27 株式会社東芝 窒化物半導体素子、窒化物半導体ウェーハ及び窒化物半導体層の製造方法
US8525194B2 (en) 2011-05-16 2013-09-03 Kabushiki Kaisha Toshiba Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
DE102011114670A1 (de) * 2011-09-30 2013-04-04 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
DE102011114671A1 (de) 2011-09-30 2013-04-04 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
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DE102012102148A1 (de) 2012-03-14 2013-09-19 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
JP6272850B2 (ja) * 2012-07-02 2018-01-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 物理的気相成長法による窒化アルミニウムの緩衝及び活性層
JP5734935B2 (ja) * 2012-09-20 2015-06-17 株式会社東芝 半導体装置及びその製造方法
US9048387B2 (en) * 2013-08-09 2015-06-02 Qingdao Jason Electric Co., Ltd. Light-emitting device with improved light extraction efficiency
US9443728B2 (en) * 2013-08-16 2016-09-13 Applied Materials, Inc. Accelerated relaxation of strain-relaxed epitaxial buffers by use of integrated or stand-alone thermal processing
CN108027448B (zh) 2015-10-09 2022-02-11 深圳帧观德芯科技有限公司 半导体x射线检测器的封装方法
US9570295B1 (en) 2016-01-29 2017-02-14 International Business Machines Corporation Protective capping layer for spalled gallium nitride
CN113053731B (zh) * 2021-03-05 2024-05-17 中国科学院苏州纳米技术与纳米仿生研究所 镓金属薄膜的制作方法以及氮化镓衬底的保护方法
WO2024054772A2 (en) * 2022-09-06 2024-03-14 The Regents Of The University Of California Method for the synthesis of gallium nitride with n2 near room temperature

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009135197A (ja) * 2007-11-29 2009-06-18 Showa Denko Kk Ｉｉｉ族窒化物半導体の製造方法、ｉｉｉ族窒化物半導体発光素子の製造方法、及びｉｉｉ族窒化物半導体発光素子、並びにランプ
US8765507B2 (en) 2007-11-29 2014-07-01 Toyoda Gosei Co., Ltd. Method for manufacturing group III nitride semiconductor, method for manufacturing group III nitride semiconductor light-emitting device, group III nitride semiconductor light-emitting device, and lamp
JP2014154591A (ja) * 2013-02-05 2014-08-25 Asahi Kasei Corp ＧａＮ薄膜の製造方法及びＧａＮ薄膜
JP2016194155A (ja) * 2015-03-31 2016-11-17 エスピーティーエス テクノロジーズ リミティド 材料を堆積させる方法及び装置
JP2021073378A (ja) * 2015-03-31 2021-05-13 エスピーティーエス テクノロジーズ リミティド Ｐｖｄ装置
JP7141197B2 (ja) 2015-03-31 2022-09-22 エスピーティーエス テクノロジーズ リミティド 材料を堆積させる方法及び装置
JP7236477B2 (ja) 2015-03-31 2023-03-09 エスピーティーエス テクノロジーズ リミティド Ｐｖｄ装置
US11875980B2 (en) 2015-03-31 2024-01-16 Spts Technologies Limited Method and apparatus for depositing a material
JP2020115555A (ja) * 2020-03-25 2020-07-30 日機装株式会社 窒化物半導体素子
JP7089544B2 (ja) 2020-03-25 2022-06-22 日機装株式会社 窒化物半導体素子
WO2023058507A1 (ja) * 2021-10-06 2023-04-13 東京エレクトロン株式会社 スパッタ装置及び成膜方法

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JP5471440B2 (ja) 2014-04-16
TWI377703B (en) 2012-11-21
TW200913316A (en) 2009-03-16
US20090142870A1 (en) 2009-06-04
JPWO2008136504A1 (ja) 2010-07-29
US7749785B2 (en) 2010-07-06

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