WO2008136596A1

WO2008136596A1 - An inorganic board and preparation method thereof

Info

Publication number: WO2008136596A1
Application number: PCT/KR2008/002477
Authority: WO
Inventors: Gil Ho Kang; Kwang Min Kim; Beom Goo Son; Yong Gyu Lee
Original assignee: Lg Chem, Ltd.
Priority date: 2007-05-04
Filing date: 2008-05-01
Publication date: 2008-11-13
Also published as: CN101674931A; KR20080098186A; KR101238119B1

Abstract

The present invention relates to an inorganic board comprising a core layer containing a high viscosity inorganic material and an embossing pattern layer formed integrally with the core layer and containing a low viscosity inorganic material, and a method for manufacturing the same. According to the present invention, it is possible to provide an inorganic board having substantially excellent durability by imparting embossing and colors to a surface of a product itself through an embossing pattern layer formed integrally with a core layer. Further, the present invention has a merit in that productivity and economic efficiency of the manufacturing process can be substantially improved by manufacturing an inorganic board through a continuous process without an additional secondary process.

Description

AN INORGANIC BOARD AND PREPARATION METHOD

THEREOF

Technical Field

[1] The present invention relates to an inorganic board with excellent durability comprising an embossing pattern layer formed integrally with a product itself, and a method for continuously manufacturing an inorganic board having an embossing pattern layer formed integrally therewith without an additional secondary process. Background Art

[2] As a conventional surface decorating method of inorganic boards for decoration, a method for directly forming patterns on an inorganic substrate and applying paint such as transparent resin and the like thereto, a method for bonding a decorative sheet having predetermined patterns formed thereon to an inorganic substrate and applying paint thereto, and a method for transferring patterns to an inorganic substrate using transfer paper and the like have been used. However, an additional secondary process of forming a decorative layer is required in any of the foregoing methods in addition to a primary process of manufacturing an inorganic board to be used as a substrate. Therefore, the foregoing methods have a demerit of low economical efficiency since the manufacturing cost is increased due to complicated production process and long process time.

[3] Further, in order to manufacture an inorganic board according to the conventional methods, a secondary means such as a decorative sheet and the like adheres to a primarily manufactured inorganic substrate using an adhesive and the like. In such a case, since the decorative layer (decorative sheet) formed separately from the substrate is easily separated from the substrate, there is a problem of low durability.

[4] Japanese Laid-open Patent Publication No. 2000-280433 discloses an inorganic decoration board, in which a surface protection layer, a decorative sheet, an adhesive layer, and an inorganic substrate are sequentially formed, wherein the inorganic substrate is a gypsum board comprising a core material having reinforcing fibers and gypsum and a covering material laminated on both surfaces of the core material. Further, Japanese Laid-open Patent Publication No. 1996-197518 discloses an inorganic interior/exterior board in which a surface layer material is laminated and pressed on one or both surfaces of a board-shaped molded body in a state where the board- shaped molded body is not hardened when curing or heat hardening the board- shaped molded body formed of an inorganic material comprising cement, aggregate, synthetic resin or aggregate, thermosetting resin. [5] However, the methods disclosed in the foregoing documents, in which all separately fabricated decorative layers adhere to an inorganic board as a substrate by a means such as adhesive and the like, have demerits in that problems of the board such as low durability and economic efficiency still exist and there is a limit in manufacturing of a decorative layer with various colors and excellent cubic effect. Disclosure of Invention Technical Problem

[6] The present invention is directed to an inorganic board comprising a core layer containing a high viscosity inorganic material; and an embossing pattern layer formed integrally with the core layer and containing a low viscosity inorganic material. Technical Solution

[7] According to the present invention, it is possible to provide an inorganic board having considerably excellent durability by imparting embossing and color to a surface of a product itself through an embossing pattern layer formed integrally with a core layer.

Advantageous Effects

[8] According to the present invention, it is possible to provide an inorganic board having substantially excellent durability by imparting embossing and colors to a surface of a product itself through an embossing pattern layer formed integrally with a core layer. Further, the present invention has a merit in that productivity and economic efficiency of the manufacturing process can be substantially improved by manufacturing an inorganic board through a continuous process without an additional secondary process. Brief Description of the Drawings

[9] Fig. 1 is a sectional view of an inorganic board according to one embodiment of the present invention.

[10] Fig. 2 is a sectional view of an inorganic board according to another embodiment of the present invention.

[11] Fig. 3 is a sectional view illustrating a state where an embossed plate is coated with an embossing pattern layer raw material in a manufacturing process according to one embodiment of the present invention.

[12] Fig. 4 is a sectional view illustrating a state where an embossed plate is sequentially coated with an embossing pattern layer raw material and then a core layer raw material in a manufacturing process according to one embodiment of the present invention.

[13] Fig. 5 is a sectional view illustrating a state where an embossing pattern layer raw material, a reinforcing fiber, a core layer raw material, and a reinforcing fiber are sequentially formed on an embossed plate in a manufacturing process according to one embodiment of the present invention.

[14] Fig. 6 is a view illustrating a manufacturing process of an inorganic board according to one embodiment of the present invention. Best Mode for Carrying Out the Invention

[15] Hereinafter, an inorganic board of the present invention will be described in detail with reference to the accompanying drawings.

[16] Fig. 1 is a sectional view illustrating an inorganic board according to one embodiment of the present invention. As illustrated in Fig. 1, an inorganic board 1 of the present invention comprises a core layer 3 and an embossing pattern layer 2 formed integrally with the core layer 3. Here, the core layer 3 included in the inorganic board 1 contains a high viscosity inorganic material. Viscosity of the inorganic material is properly selected considering moldability during manufacturing and durability after manufacturing. For instance, the viscosity of the inorganic material is preferably 500 to 5,000 poises, and more preferably 1,000 to 3,000 poises. It is apprehended that moldability is lowered in the manufacturing process if the viscosity of the inorganic material is less than 500 poises, whereas defects such as bubbling and the like may be generated in a product if the viscosity of the inorganic material is greater than 5,000 poises.

[17] Types of the high viscosity inorganic material used in the present invention are not particularly limited if the inorganic material has the viscosity within the above- mentioned range. For instance, all general materials of the art, including gypsum, cement, Mg-based inorganic material such as MgO and the like, are preferably used, and the Mg-based inorganic material such as MgO is more preferably used.

[18] A core layer 3 of the present invention may further contain a reinforcing fiber in addition to the high viscosity inorganic material. The core layer 3 contains such a reinforcing fiber to further improve toughness, flexural properties, flexibility, flexible strength and the like of the core layer 3. Types of the reinforcing fibers that may be used in the present invention are not particularly limited. For example, general reinforcing fibers of the art, including organic fibers such as pulp fibers, vinylon fibers, acrylic fibers, and polypropylene fibers; and inorganic fibers such as glass fibers, rockwool, sepiolite, and mineral fibers may be used. In the present invention, the foregoing fibers can be used solely or in the form of a mixture of at least two thereof. In the present invention, the content of a reinforcing fiber contained in the core layer 3 is not particularly limited, but may be properly selected according to desired physical properties.

[19] The inorganic board 1 of the present invention comprises the embossing pattern layer

2 formed integrally with the core layer 3 thereon. The term used in the present invention, "the embossing pattern layer 2 formed integrally with the core layer 3", means that the embossing pattern layer does not exist as a separate layer on the core layer using a secondary means such as a decorative sheet and the like, but exists in a state where the embossing pattern layer is formed integrally with a surface of a product itself. Preferably, an inorganic material contained in such an embossing pattern layer 2 has a low viscosity, specifically a viscosity of 10 to 500 poises, and more preferably a viscosity of 50 to 300 poises. If the viscosity of the inorganic material is less than 10 poises, it is apprehended that the excessively low viscosity make it difficult to form desired patterns. If viscosity of the inorganic material is greater than 500 poises, it is apprehended that desired patterns are also hard to be obtained since the inorganic material is not evenly filled in concave portions of an embossed plate in the manufacturing process to be described later. Specific types of the aforementioned inorganic material are not particularly limited if the inorganic material has the viscosity within the above-mentioned range. For instance, general materials of the art, including gypsum, cement, Mg-based inorganic material such as MgO, and the like, may be used in the same manner as in the core layer. Although not particularly limited, it is desirable to form the embossing pattern layer 2 using the same material as the core layer 3 in order to easily form the integrated embossing pattern layer 2 in the present invention.

[20] The embossing pattern layer 2 of the present invention can further contain a coloring material such as pigment or dye. Various colors together with embossing patterns can be provided to the inorganic board 1 by containing such a coloring material in the embossing pattern layer 2. Types and content of the coloring material that may be used in the present invention are not particularly limited, and general one of the art may be properly selected in accordance with a desired pattern effect.

[21] Fig 2 is a sectional view of an inorganic board according to another embodiment of the present invention. That is, an inorganic board 1 of the present invention may further comprise a fiber reinforcing layer 4 formed between the embossing pattern layer 2 and the core layer 3. Such a fiber reinforcing layer 4 can additionally improve bonding strength of the embossing pattern layer 2 and the core layer 3 and the entire durability of the inorganic board 1 through a composite effect. Although a material of the fiber reinforcing layer 4 is not particularly limited, it is preferable to comprise a inorganic material and a reinforcing fiber. Here, specific types of the inorganic material and the reinforcing fiber are the same as the aforementioned ones. Preferably, the reinforcing fiber is contained in the fiber reinforcing layer 4 in an amount of 0.1 to 5 parts by weight, relative to 100 parts by weight of the inorganic material. If the content of the reinforcing fiber is deviated from the above-mentioned range, it is apprehended that the reinforcing effect due to the composite effect becomes insignificant or economic efficiency is lowered. In the present invention, a proper amount of the above-mentioned coloring material may be contained in the fiber reinforcing layer in order to impart a more excellent external appearance effect.

[22] The inorganic board 1 of the present invention may further comprise a fiber reinforcing layer 5 formed on a lower portion of the core layer 3, whereby durability of the inorganic board 1 is additionally improved. A method for forming such a fiber reinforcing layer 5 is not particularly limited. For instance, the fiber reinforcing layer 5 may be formed in the same manner as the fiber reinforcing layer 4 formed on a lower portion of the embossing pattern layer 2.

[23] The inorganic board 1 of the present invention may further comprise a surface treatment layer (not shown) formed on an upper portion of the embossing pattern layer 2. The surface treatment layer prevents wear of the embossing pattern layer 2 and additionally improves durability of the inorganic board 1. Such a surface treatment layer may be formed using well-known curable resin, such as ionizing radiation curing resin and thermosetting resin (including room temperature curable resin and two-component reactive resin). Additionally, all methods used for forming the surface treatment layer in this art may be adopted.

[24] Examples of thermosetting resins that may be used include unsaturated polyester resins, epoxy resins, polyurethane resins, and the like. More specifically, it is preferable to use a hydroxyl group-containing polyol component such as acryl polyol, polyester polyol, polyether polyol and epoxy polyol, as a principal material; and a two- component curable urethane-based resin comprising isocyanate compounds such as tolylene diisocyanate and hexamethylene diisocyanate as a hardener.

[25] Further, examples of the ionizing radiation curing resins include polymerizable unsaturated bonds such as acroyl groups, (meth)acroyl groups or acroyloxy groups in molecules, polyfunctional free polymers having at least two epoxy groups or thiol groups, oligomers, monomers, and mixtures of two or more thereof. Furthermore, the ionizing radiation means electromagnetic waves or charged particle beams having energy quantum capable of polymerizing or cross-linking molecules, and ultraviolet rays or electromagnetic waves are generally used as the ionizing radiation. The ionizing radiation curing obtains fast curing rate and superior workability, easily adjusts physical properties of resins such as flexibility and hardness and the like, and can form a surface treatment layer with excellent contamination resistance, friction resistance and solvent resistance.

[26] In the present invention, a method for forming a surface treatment layer is not particularly limited, but the surface treatment layer may be formed using the foregoing respective materials by an ordinary method of the art.

[27] The present invention is also directed to a method of manufacturing an inorganic board, which comprises a first step of applying an embossing pattern layer raw material including a low viscosity inorganic material to an embossed plate having embossing patterns formed thereon; and a second step of applying a core layer raw material including a high viscosity inorganic material to the embossing pattern layer raw material applied to the embossed plate.

[28] According to the present invention, an embossing pattern layer with superior durability can be formed on a product itself through a continuous process without an additional secondary process by a process of using an embossed plate having desired patterns formed thereon, a low viscosity inorganic material (embossing pattern layer raw material) and a high viscosity inorganic material (core layer raw material), whereby it is possible to improve productivity and economic efficiency in the inorganic board manufacturing process.

[29] Hereinafter, a manufacturing process of an inorganic board of the present invention will be described more specifically with reference to the accompanying drawings.

[30] As illustrated in Fig. 3, in the first step of the present invention, an embossed plate 6 having various patterns formed thereon is coated with an embossing pattern layer raw material 2- 1 containing a low viscosity inorganic material such as gypsum, cement or MgO as a principal material and containing a coloring material if necessary. Accordingly, valleys of the embossed plate 6 are uniformly filled with the raw material 2- 1 having a low viscosity, and then, the raw material 2- 1 is cured, thereby forming an embossing pattern layer of the inorganic board. The first step of the present invention may further comprise a brushing or rolling process carried out to enable the raw material 2- 1 to be uniformly filled in the valleys of the embossed plate 6 and remove bubbles formed on a surface of the embossed plate after coating the embossed plate with the embossing pattern layer raw material 2-1.

[31] As illustrated in Fig. 4, in the second step of the present invention, a coating layer raw material 3-1 is applied to a proper thickness to the embossing pattern layer raw material 2-1 applied to the embossed plate 6. Here, the coating layer raw material 3-1 comprises the above-mentioned high viscosity inorganic material as a main component, and properly comprises a reinforcing fiber and the like if necessary.

[32] After performing the foregoing steps, according to the present invention, an inorganic board can be manufactured by removing the embossed plate 6 after curing the embossing pattern layer raw material 2-1 and the core layer raw material 3-1 formed on the embossed plate 6 by a well-known method of the art.

[33] In the manufacturing method of an inorganic board of the present invention, a process of applying a reinforcing fiber 4-1 to the embossing pattern layer raw material 2-1 formed in the first step may be additionally performed as illustrated in Fig. 5. After performing such a process, an inorganic board reinforced with a fiber reinforcing layer through a composite effect of the reinforcing fiber 4- 1 and the inorganic material can be manufactured by applying a core layer raw material 3-1 to the reinforcing fiber 4-1 and subsequently being subjected to a curing process and an embossed plate removing process.

[34] In the manufacturing method of an inorganic board of the present invention, a process of applying a reinforcing fiber 5-1 to the core layer raw material 3-1 formed in the second step can also be additionally performed.

[35] After performing the respective foregoing steps, an inorganic board can be manufactured by removing the embossed plate after curing the raw materials through a well-known method of the art. In the present invention, a brushing or rolling process may be performed at a proper time during the coating process of the respective raw materials. Accordingly, the valleys of the embossed plate may be filled with an embossing pattern layer raw material with a low viscosity, and surface bubbles that may be generated during the process may be removed. In the present invention, after manufacturing the inorganic board through such processes, a general process such as a spray coating process for imparting an additional surface decoration effect may be further carried out, and a process using the above-mentioned embossed plate may be repeatedly carried out if necessary. In the present invention, a process of forming a surface treatment layer after manufacturing the inorganic board may be additionally performed, wherein the surface treatment layer may be formed by ordinary methods using the respective above-mentioned materials.

[36] The aforementioned manufacturing processes of an inorganic board of the present invention are carried out as a continuous process in which no additional secondary process for forming an embossing pattern layer is necessary. Fig. 6 is a schematic view illustrating a manufacturing process of an inorganic board of the present invention. As illustrated in Fig. 6, an embossed plate 6 is transferred by means of a belt and coated with a raw material fed from an embossing pattern layer raw material feeder 21. Thereafter, a brushing process by a brush 11 is conducted, and then, the embossed plate is coated with a reinforcing fiber such as glass fiber by means of a reinforcing fiber feeding roller 31. A high viscosity inorganic material and a reinforcing fiber are successively supplied by a core layer raw material feeder 22 and a reinforcing fiber feeding roller 31, and then, cured after being compressed be means of well-known means such as rollers 32. Thereafter, an inorganic board of the present invention is manufactured by being cut to a proper size through a cutter 50 and removing the embossed plate.

[37] In the present invention as described above, since an inorganic board having an embossing pattern layer integrally formed thereon can be continuously produced without an additional secondary process, whereby productivity and economic efficiency in manufacturing of an inorganic board can be improved remarkably. [38] [39]

Claims

[I] An inorganic board, comprising: a core layer containing a high viscosity inorganic material; and an embossing pattern layer formed integrally with the core layer and containing a low viscosity inorganic material. [2] The inorganic board as claimed in claim 1, wherein the inorganic material contained in the core layer has a viscosity of 500 to 5,000 poises. [3] The inorganic board as claimed in claim 1, wherein the core layer further comprises a reinforcing fiber. [4] The inorganic board as claimed in claim 1, wherein the inorganic material contained in the embossing pattern layer has a viscosity of 10 to 500 poises. [5] The inorganic board as claimed in claim 1, wherein the inorganic material comprises gypsum, cement, or Mg-based inorganic material. [6] The inorganic board as claimed in claim 1, wherein the embossing pattern layer further comprises pigment or dye. [7] The inorganic board as claimed in claim 1, further comprising a fiber reinforcing layer formed between the embossing pattern layer and the core layer. [8] The inorganic board as claimed in claim 1, further comprising a fiber reinforcing layer formed at a lower portion of the core layer. [9] The inorganic board as claimed in claim 7 or 8, wherein the fiber reinforcing layer comprises an inorganic material and a reinforcing fiber. [10] The inorganic board as claimed in claim 9, wherein the reinforcing fiber comprises at least one selected from the group consisting of pulp fiber, vinylon fiber, acrylic fiber, polypropylene fiber, glass fiber, rockwool, sepiolite, and mineral fiber.

[I I] The inorganic board as claimed in claim 9, wherein the reinforcing fiber is comprised in an amount of 0.1 to 5 parts by weight, relative to 100 parts by weight of the inorganic material.

[12] The inorganic board as claimed in claim 1, further comprising a surface treatment layer formed on an upper portion of the embossing pattern layer.

[13] A method of manufacturing an inorganic board, comprising: a first step of applying an embossing pattern layer raw material including a low viscosity inorganic material on an embossed plate having embossing patterns formed thereon; and a second step of applying a core layer raw material including a high viscosity inorganic material to the embossing pattern layer raw material applied to the embossed plate. [14] The method as claimed in claim 13, wherein the first step further comprises a process of laminating a reinforcing fiber on the embossing pattern layer raw material. [15] The method as claimed in claim 13, wherein the second step further comprises a process of laminating a reinforcing fiber on the core layer raw material. [16] The method as claimed in claim 13, further comprising a step of curing the raw materials and removing the embossed plate after the second step.