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WO2008123362A1 - Composition polymérisable et corps moulé - Google Patents

Composition polymérisable et corps moulé Download PDF

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Publication number
WO2008123362A1
WO2008123362A1 PCT/JP2008/055902 JP2008055902W WO2008123362A1 WO 2008123362 A1 WO2008123362 A1 WO 2008123362A1 JP 2008055902 W JP2008055902 W JP 2008055902W WO 2008123362 A1 WO2008123362 A1 WO 2008123362A1
Authority
WO
WIPO (PCT)
Prior art keywords
soft magnetic
polymerizable composition
magnetic body
shape
molded body
Prior art date
Application number
PCT/JP2008/055902
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Yoshiwara
Original Assignee
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to JP2009509167A priority Critical patent/JPWO2008123362A1/ja
Publication of WO2008123362A1 publication Critical patent/WO2008123362A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Soft Magnetic Materials (AREA)

Abstract

L'invention porte sur une composition polymérisable contenant un corps magnétique doux, dans laquelle un corps magnétique doux ayant une anisotropie de forme est dispersé de façon uniforme. Cette composition polymérisable contenant un corps magnétique doux permet de produire un corps moulé ayant une excellente résistance à la contamination et d'excellentes caractéristiques magnétiques, en particulier une excellente perméabilité magnétique, avec un rendement élevé. De façon précise, l'invention porte sur une composition polymérisable contenant un corps magnétique doux à anisotropie de forme et un monomère polymérisable en masse qui a une ou plusieurs liaisons insaturées réactives par molécule. De préférence, le corps magnétique doux a une forme dans laquelle le rapport entre la longueur du grand axe (X) et la longueur du petit axe (Y), à savoir (X/Y), n'est pas inférieur à 2 mais pas supérieur à 10 000.
PCT/JP2008/055902 2007-03-27 2008-03-27 Composition polymérisable et corps moulé WO2008123362A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509167A JPWO2008123362A1 (ja) 2007-03-27 2008-03-27 重合性組成物及び成形体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-082622 2007-03-27
JP2007082622 2007-03-27

Publications (1)

Publication Number Publication Date
WO2008123362A1 true WO2008123362A1 (fr) 2008-10-16

Family

ID=39830851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055902 WO2008123362A1 (fr) 2007-03-27 2008-03-27 Composition polymérisable et corps moulé

Country Status (2)

Country Link
JP (1) JPWO2008123362A1 (fr)
WO (1) WO2008123362A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168484A (ja) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
JP2011023662A (ja) * 2009-07-17 2011-02-03 Alps Electric Co Ltd Ｒｆｉｄ用磁性部材
JP2013036010A (ja) * 2011-08-11 2013-02-21 Nippon Zeon Co Ltd 架橋樹脂成形体の製造方法
JP2015199939A (ja) * 2014-03-31 2015-11-12 三井化学株式会社 樹脂組成物およびその用途
US20170330662A1 (en) * 2015-06-04 2017-11-16 Poco Holding Co., Ltd. Novel high-density magnetic composite material for inductor
EP3306629A4 (fr) * 2015-06-04 2019-01-23 Poco Holding Co., Ltd. Procédé de fabrication d'une bobine d'inductance à haute densité, moulée en un seul bloc
EP3648304A3 (fr) * 2018-10-31 2020-07-01 Hamilton Sundstrand Corporation Noyau de stator comprenant du carbure de cobalt et son procédé de fabrication
EP3699935A1 (fr) * 2019-02-22 2020-08-26 LG Electronics Inc. Feuille de protection magnétique et son procédé de préparation
EP3007187B1 (fr) * 2013-05-27 2021-01-06 Nitto Denko Corporation Composition de résine à aimantation temporaire, film adhésif à aimantation temporaire, carte de circuit sur laquelle est stratifié le film à aimantation temporaire et dispositif de détection de position
WO2023201045A1 (fr) * 2022-04-14 2023-10-19 Raytheon Company Composition à faible constante diélectrique et à faible perte diélectrique pour impression par jet d'aérosol

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035973A (ja) * 1999-07-19 2001-02-09 Tokin Corp 半導体装置封止材料
JP2002110863A (ja) * 2000-09-28 2002-04-12 Kankyo Denji Gijutsu Kenkyusho:Kk 半導体デバイス用パッケージ
JP2003218249A (ja) * 2002-01-18 2003-07-31 Mitsui Chemicals Inc 半導体中空パッケージ
JP2004244609A (ja) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法
WO2005014690A1 (fr) * 2003-08-07 2005-02-17 Zeon Corporation Composition polymerisable et corps forme constitue de cette composition
WO2005017033A1 (fr) * 2003-08-13 2005-02-24 Zeon Corporation Composition de resine reticulable et corps forme en resine realise a partir de cette composition
WO2005016991A1 (fr) * 2003-08-13 2005-02-24 Zeon Corporation Compositions polymerisables et articles moules ainsi produits
JP2007031695A (ja) * 2005-06-20 2007-02-08 Achilles Corp 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035973A (ja) * 1999-07-19 2001-02-09 Tokin Corp 半導体装置封止材料
JP2002110863A (ja) * 2000-09-28 2002-04-12 Kankyo Denji Gijutsu Kenkyusho:Kk 半導体デバイス用パッケージ
JP2003218249A (ja) * 2002-01-18 2003-07-31 Mitsui Chemicals Inc 半導体中空パッケージ
JP2004244609A (ja) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法
WO2005014690A1 (fr) * 2003-08-07 2005-02-17 Zeon Corporation Composition polymerisable et corps forme constitue de cette composition
WO2005017033A1 (fr) * 2003-08-13 2005-02-24 Zeon Corporation Composition de resine reticulable et corps forme en resine realise a partir de cette composition
WO2005016991A1 (fr) * 2003-08-13 2005-02-24 Zeon Corporation Compositions polymerisables et articles moules ainsi produits
JP2007031695A (ja) * 2005-06-20 2007-02-08 Achilles Corp 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168484A (ja) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
JP2011023662A (ja) * 2009-07-17 2011-02-03 Alps Electric Co Ltd Ｒｆｉｄ用磁性部材
JP2013036010A (ja) * 2011-08-11 2013-02-21 Nippon Zeon Co Ltd 架橋樹脂成形体の製造方法
EP3007187B1 (fr) * 2013-05-27 2021-01-06 Nitto Denko Corporation Composition de résine à aimantation temporaire, film adhésif à aimantation temporaire, carte de circuit sur laquelle est stratifié le film à aimantation temporaire et dispositif de détection de position
JP2015199939A (ja) * 2014-03-31 2015-11-12 三井化学株式会社 樹脂組成物およびその用途
US20170330662A1 (en) * 2015-06-04 2017-11-16 Poco Holding Co., Ltd. Novel high-density magnetic composite material for inductor
EP3306629A4 (fr) * 2015-06-04 2019-01-23 Poco Holding Co., Ltd. Procédé de fabrication d'une bobine d'inductance à haute densité, moulée en un seul bloc
EP3648304A3 (fr) * 2018-10-31 2020-07-01 Hamilton Sundstrand Corporation Noyau de stator comprenant du carbure de cobalt et son procédé de fabrication
EP3699935A1 (fr) * 2019-02-22 2020-08-26 LG Electronics Inc. Feuille de protection magnétique et son procédé de préparation
US10999959B2 (en) 2019-02-22 2021-05-04 Lg Electronics Inc. Magnetic shielding sheet and method of preparation thereof
WO2023201045A1 (fr) * 2022-04-14 2023-10-19 Raytheon Company Composition à faible constante diélectrique et à faible perte diélectrique pour impression par jet d'aérosol

Also Published As

Publication number Publication date
JPWO2008123362A1 (ja) 2010-07-15

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