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WO2008123269A1 - Unité électronique équipée d'un condensateur - Google Patents

Unité électronique équipée d'un condensateur Download PDF

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Publication number
WO2008123269A1
WO2008123269A1 PCT/JP2008/055631 JP2008055631W WO2008123269A1 WO 2008123269 A1 WO2008123269 A1 WO 2008123269A1 JP 2008055631 W JP2008055631 W JP 2008055631W WO 2008123269 A1 WO2008123269 A1 WO 2008123269A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor
housing
reflector
heat
electronic component
Prior art date
Application number
PCT/JP2008/055631
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Hamatani
Original Assignee
Toyota Jidosha Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidosha Kabushiki Kaisha filed Critical Toyota Jidosha Kabushiki Kaisha
Priority to CN2008800085303A priority Critical patent/CN101636803B/zh
Priority to US12/528,009 priority patent/US8102653B2/en
Priority to DE112008000691T priority patent/DE112008000691B4/de
Publication of WO2008123269A1 publication Critical patent/WO2008123269A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/14—Protection against electric or thermal overload
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Definitions

  • the present invention relates to an electric unit including a capacitor, and more particularly, to an electric unit that houses a capacitor and an electronic component different from the capacitor in a housing.
  • Electric vehicles and hybrid vehicles using a motor as a drive source have been put into practical use.
  • the motor is supplied with the battery power boosted or converted.
  • Electronic components for supplying power to a motor (for example, a semiconductor element constituting an inverter) are usually housed in a casing and protected from the outside.
  • a housing that houses electronic components for supplying electric power to a motor.
  • a technique for reducing the size of such a housing is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-312925.
  • An electric device disclosed in Japanese Patent Application Laid-Open No. 2004-312925 includes an inverter circuit, a case in which an upper part is opened and an inverter circuit is stored in a lower part, a capacitor connected to the inverter circuit, and a housing in which the capacitor is stored. Including.
  • the housing that stores the capacitor is connected to the outer peripheral surface of the upper part of the case that stores the inverter circuit.
  • An inverter control board is provided between the inverter and the capacitor.
  • the opening in the upper part of the case that stores the inverter can be closed by the housing that stores the capacitor. Therefore, the capacitor, the inverter circuit, and the inverter control board can be protected from the outside without providing a member only for closing the opening of the case. In this way, it is possible to reduce the space for the member only for closing the opening of the case, and thus the size of the electric device can be reduced.
  • the electric device disclosed in Japanese Patent Application Laid-Open No. 2004-312925 is not included.
  • the effect of heat rays from the inverter circuit etc. on the capacitor is not considered.
  • the inverter circuit and the circuit mounted on the inverter control board generate heat when energized and radiate heat rays. If the discharged heat rays are absorbed by the capacitor and the temperature of the capacitor rises, the function of the capacitor may be degraded. In particular, as the case becomes smaller, the distance between the inverter circuit and the capacitor tends to be further shortened, and the influence of the heat rays from the inverter circuit and the like on the temperature rise of the capacitor tends to become even greater. Disclosure of the invention
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electric unit that houses a capacitor and an electronic component different from the capacitor in a housing, and the temperature of the capacitor It is to provide an electric unit that can suppress the rise.
  • An electric unit according to the present invention is provided between a capacitor, a housing that houses the capacitor, an electronic component that is housed in the housing and generates a function and generates heat when energized, and the electronic component and the capacitor. And a reflector that reflects the heat radiated from the electronic component.
  • the capacitor and the electronic component are accommodated in the housing.
  • This electronic component generates heat when energized.
  • a reflector that reflects the heat (heat rays) radiated from the electronic component is provided between the electronic component and the capacitor. Therefore, even when the electronic component generates heat and emits heat rays, the heat rays emitted in the direction of the capacitor are suppressed from being directly absorbed by the capacitor.
  • a material having a high thermal reflectance and a high thermal conductivity is used as the material of the reflector.
  • the reflector is connected to the housing in contact with the capacitor.
  • the material of the reflecting plate has a high thermal reflectance and a high thermal conductivity. Furthermore, the reflector is connected to the housing in a state where it is in contact with the capacitor. Therefore, the heat rays radiated from the electronic component are reflected by the reflector and the heat of the capacitor Can be positively transmitted to the housing via the reflector. Therefore, the temperature rise of the capacitor can be further suppressed.
  • the reflecting plate is connected to the casing by a fastening member having high thermal conductivity.
  • the reflector is connected to the housing by the fastening member having high thermal conductivity. Therefore, the heat of the capacitor transmitted to the reflecting plate can be transmitted to the housing via the coupling member.
  • the material of the reflector is aluminum.
  • the capacitor is in contact with the housing.
  • the capacitor abuts on the casing, so that the heat of the capacitor is directly transmitted to the casing. Therefore, the temperature rise of the capacitor can be further suppressed.
  • the housing includes a wall surface provided with a coolant channel on the outside.
  • the wall surface of the casing is cooled by the refrigerant flow path, more heat released from the electronic component into the casing is transmitted to the casing. As a result, the temperature rise inside the housing is suppressed, so that the temperature rise of the capacitor can be suppressed.
  • the electronic component is a semiconductor element that contacts the inside of the wall surface. According to the present invention, since the heat of the semiconductor element is transmitted to the refrigerant flow path via the wall surface, the amount of heat released from the semiconductor element into the housing can be reduced. As a result, the temperature rise inside the housing is further suppressed, and the temperature rise of the capacitor can be further suppressed.
  • the electrical unit is provided with a semiconductor element that contacts the inside of the wall surface.
  • the electronic component is an electronic component that is mounted on a substrate provided inside the housing from the semiconductor element and controls the semiconductor element.
  • the heat rays radiated from the electronic component for controlling the semiconductor element provided inside the housing from the semiconductor element can be reflected by the reflector.
  • FIG. 1 is a circuit diagram for driving a motor of a hybrid vehicle equipped with a PCU according to this embodiment.
  • FIGS. 2 and 3 are diagrams showing a PCU according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a PCU according to an embodiment of the present invention. .
  • FIG. 5 is a diagram showing a heat flow in the PCU according to the embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a PCU according to a first modification of the embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a PCU according to a second modification of the embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of a PCU according to a third modification of the embodiment of the present invention.
  • a motor drive circuit for a hybrid vehicle equipped with a power control unit (hereinafter also referred to as a PCU (Power Control Unit)) 500 according to this embodiment will be described with reference to FIG.
  • the vehicle on which PCU 500 is mounted is not limited to a hybrid vehicle, and may be an electric vehicle. Further, the power control unit according to the present invention is not limited to being mounted on a vehicle.
  • This motor drive circuit includes a boost converter 100, a capacitor 200, inverter IPMs 300A and 300B, and motor generators 40OA and 400B.
  • Boost converter 100 includes a boosting IPM 110 and a reactor 120.
  • the boosting I P M 1 1 0 has two I G B T (Insulated Gate Bipolar Transistors) and each of the I G B T so that current flows from the emitter side to the collector side.
  • I G B T Insulated Gate Bipolar Transistors
  • Boost converter 100 is supplied from a running battery by turning on / off (turning off Z energization) the gates of each I GBT of boost IPM1 10 based on a command signal from an ECU (Electronic Control Unit) (not shown) The boosted DC voltage is boosted and supplied to the capacitor 200.
  • Boost converter 100 steps down the DC voltage generated by motor generators 400A and 400.B for driving the vehicle during regenerative braking of the hybrid vehicle and converted by inverters IPM300A and 300B. Supply to the battery for running.
  • Boost converter 100 and each IGBT need only use well-known technology, and therefore, detailed description thereof will not be repeated here.
  • Capacitor 200 smoothes the voltage of the DC power supplied from boost converter 100, and supplies the smoothed DC power to inverter PMs 300A and 300B. Capacitor 200 generates heat when energized.
  • Inverter I PM300 A, 300 B has 6 I GBTs (Insulated Gate Bipolar Transistor) and 6 diodes connected in parallel to each I GBT so that current flows from the IGBT emitter to the collector. including.
  • the inverter ⁇ ⁇ 300 ⁇ and 300 ⁇ turn on / off (energized / shut off) the gate of each IG ⁇ ⁇ ⁇ on the basis of the command signal from the ECU. And supply to the motor generator 400 ⁇ , 400 400.
  • I GBTs Insulated Gate Bipolar Transistor
  • the I GBTs that make up the booster I PM1 10 and inverter I PM300 A, 300 B generate heat when the gate is turned on / off (energized / shut off).
  • the step-up I PM 110 and the inverter I PM 300 A, 300 B are also referred to as I PM 530 provided as one module.
  • the step-up I PM 110 and the inverter I PM 300 A, 3008 are not necessarily limited to being provided as one module.
  • the amount of heat generated by I PM5 30 is greater than the amount of heat generated by capacitor 200.
  • a PCU 500 according to the present embodiment will be described with reference to FIGS. Figure 2 As shown in FIG. 5, the PCU 500 is hermetically sealed by an aluminum case 510 and a bottom plate 520.
  • Case 510 is a substantially rectangular parallelepiped housing that is open at the bottom.
  • the case 5 10 is fixed with bolts (not shown) so that the lower outer peripheral surface and the bottom plate 520 come into contact with each other.
  • IPM 530, control board 540, and capacitor 200 are accommodated in the space inside PCU 500 formed by case 510. and bottom plate 520.
  • the I PM 530 is provided in contact with the upper surface of the bottom plate 520. IPM 530 may be provided so as to contact the upper surface of bottom plate 520 with a heat sink (not shown) interposed therebetween.
  • the control board 540 is a rectangular plate on which a control circuit including electronic components such as a gate driver and a transformer is mounted, and is provided above the IPM 530.
  • the control board 540 is electrically connected to the I PM 530 through a connection line 532.
  • a control circuit mounted on the control board 540 generates a control signal for controlling on / off of each 1 GBT of 1? 1 ⁇ 1530 based on a command signal from the ECU, and transmits the control signal to the IPM 530.
  • the control circuit mounted on the control board 540 generates heat when energized.
  • the electronic component mounted on the control board 540 is not limited to the control circuit of the IPM 530 as long as the electronic component generates heat when energized.
  • the capacitor 200 is accommodated in a substantially rectangular parallelepiped housing 210.
  • a seat surface portion 212 through which the fixing bolt 214 passes is provided on the outside of the side surface of the housing 210.
  • the fixing bolt 214 is fastened to a protruding portion 5 1 2 (see FIG. 4) that protrudes downward from the inside of the upper surface of the case 510.
  • the fixing bolt 214 is made of a metal having high thermal conductivity (for example, aluminum).
  • FIG. 3 is a view of capacitor 200 and case 5 10 as seen from the direction of arrow A in FIG. As shown in FIG. 3, the inside of the housing 210 of the capacitor 200 is filled with a resin potting material 230 in which a capacitor element body (not shown) is embedded.
  • a substantially rectangular reflecting plate 220 is embedded below the potting material 230 from the capacitor element body. As a result, the reflector 220 abuts on the capacitor 200 and is provided between the control circuit mounted on the control board 540 and the capacitor element body.
  • the reflection plate 220 is provided on the entire lower surface of the capacitor 200.
  • the material of the reflector 220 is made of aluminum having high heat reflectivity and high heat conductivity. Note that the material of the reflector 220 is not particularly limited to aluminum as long as the material has a high thermal reflectance and a high thermal conductivity. At the four corners of the reflecting plate 220, end portions 222 projecting outside the potting material 230 are provided.
  • FIG. 4 is a cross-sectional view of PCU 500 taken along the plane indicated by the alternate long and short dash line in FIG.
  • the fixing bolt 214 is provided on the protruding portion 5 12 that protrudes downward from the inside of the upper surface of the case 5 10 with the seat surface portion 21 2 of the housing 210 and the end portion 222 of the reflector 220 interposed therebetween. It is concluded. As a result, the seat surface portion 212 of the housing 210 comes into contact with the case 510. The head of the fixing bolt 214 comes into contact with the reflector 220, and the shaft portion of the fixing bolt 214 comes into contact with the case 510.
  • a coolant passage 522 provided with cooling fins 524 is provided. Coolant (hereinafter also referred to as L L C (Long Life Coolant)) flows through the coolant passage 5 2 2.
  • L L C Long Life Coolant
  • the LLC absorbs heat transferred from the IPM 530 or the case 510 from the cooling fins 524 or the like. That is, the heat of the IPM 530 and the case 510 is released to the LLC flowing through the coolant passage 522.
  • the LLC is circulated between a radiator (not shown) and a coolant passage 522 by an electric water pump (not shown). The LLC heat is released to the outside air via a radiator (not shown). The heat flow inside the PCU 500 according to the present embodiment based on the above structure will be described. .
  • a capacitor 200 Inside PCU500 is a capacitor 200, I PM530 and control board 5 4 0 is accommodated.
  • the control circuit mounted on the IPM 5 3 0 and the control board 5 4 0 generates heat when energized.
  • a reflector 2 2 0 made of aluminum having a high thermal reflectance.
  • the outer peripheral surface below the case 5 10 is a bottom plate on which the coolant passage 5 2 2 is provided.
  • the case 5 10 is cooled by the bottom plate 5 20.
  • the end 2 2 2 of the reflecting plate 2 2 0 passes through the fixing bolt 2 1 4 made of a metal having a high thermal conductivity to the protruding portion 5 1 2 of the case 5 10 which is cooled in this way.
  • a reflector plate 220 having high thermal conductivity is embedded in the potting material 230 so as to come into contact with the capacitor 200. Therefore, as shown by the arrow C in FIG. 5, the heat of the capacitor 2 0 0 is positively applied to the case 5 1 0 via the fixing bolt 2 1 4 from the reflector 2 2 0 in contact with the capacitor 2 0 0. Can be communicated to. Thereby, the temperature rise of the capacitor 200 can be further suppressed.
  • the seat surface portion 2 1 2 provided on the housing 2 10 of the capacitor 2 0 0 directly contacts the protruding portion 5 1 2 of the case 5 1 0. Therefore, as indicated by an arrow D in FIG. 5, the heat of the capacitor 2 0 0 is directly transferred to the case 5 1 0 via the seat surface portion 2 1 2. Therefore, the temperature rise of the capacitor 200 can be further suppressed. Further, since the IPM 5 3 0 contacts the bottom plate 5 2 0, most of the heat generated by the IPM 5 3 0 is transferred to the LLC flowing through the coolant passage 5 2 2 provided inside the bottom plate 5 2 0. Is done. As a result, the amount of heat released from IPM 53 0 into PCU 500 is reduced.
  • the case 5 10 is cooled by the bottom plate 5 20, so that the heat released from the IPM 5 30 into the PCU 5 0 0 is more transferred to the case 5 10.
  • the reflection plate made of aluminum having a high thermal reflectance is provided between the capacitor and the control circuit that controls the IPM and IPM. For this reason, the heat rays radiated from the IPM and the control circuit are reflected by the reflecting plate and suppressed from being directly absorbed by the capacitor. As a result, an increase in the temperature of the capacitor can be suppressed, so that a decrease in the function of the capacitor can be suppressed.
  • the reflector 2 20 embedded in the potting material 2 3 0 has been described.
  • a reflector 1 2 2 0 that is not embedded in the potting material 2 3 0 and covers the entire lower surface of the capacitor 2 0 0 is provided.
  • the potting material 2 3 0 does not exist below the reflector 1 2 2 0, it is possible to further suppress the absorption of heat rays directly into the capacitor element body as compared with the reflector 2 2 0. You can.
  • the reflecting plate 1 2 2 0 can be easily provided on the lower surface of the capacitor 2 0 0.
  • the reflecting plate 2 20 provided with the end 2 2 2 connected to the case 5 10 via the fixing bolt 2 1 4 has been described.
  • FIG. 7 it is connected to the case 5 1 0 via the fixing bolt 2 1 4 and the side surface of the case 5 1 0
  • a reflection plate 2 220 having an end 2 2 2 2 extended so as to contact the inside may be provided.
  • the reflector 2 2 2 0 is placed on the side surface of the case 5 1 0 closer to the bottom plate 5 2 0 (cooling liquid passage 5 2 2) than the protrusion 5 1 2 provided on the upper surface of the case 5 10. Since the contact is made, the heat of the capacitor 20 0 can be more positively transmitted to the case 5 10. As a result, the temperature rise of the capacitor 200 can be further suppressed.
  • the capacitor 2 0 0 in which the outer surface of the upper surface of the housing 2 10 is not in contact with the inner surface of the upper surface of the case 5 1.
  • this implementation As a third modification of the example, as shown in FIG. 8, between the housing 2 1 0 and the upper surface of the case 5 1 0 is filled with a resin potting material 2 4 0 having higher thermal conductivity than air. May be.
  • the amount of heat transferred from the housing 2 10 to the case 5 10 is larger than when the housing 2 10 and the upper surface of the case 5 10 are air. Therefore, the temperature rise of the capacitor 200 can be further suppressed. :..

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Une PCU (500) a un intérieur scellé par un boîtier en aluminium (510) et une plaque de fond (520). Un IPM (530), un substrat de commande (540) et un condensateur (200) sont contenus dans l'espace à l'intérieur de la PCU (500). L'IPM (530) est disposé pour affleurer la surface supérieure de la plaque de fond (520). Le substrat de commande (540) est une plaque rectangulaire sur laquelle est monté un circuit de commande ayant des pièces électroniques, telles qu'un circuit de commande de portes et un transformateur. Le substrat de commande est disposé dans la partie supérieure de l'IPM (530). Le condensateur (200) est contenu dans un boîtier (210) essentiellement rectangulaire. Une plaque de réflexion (220) formée par un matériau en aluminium ayant une réflectivité thermique élevée et une conductivité thermique élevée est disposée sur toute la surface inférieure du condensateur (200).
PCT/JP2008/055631 2007-03-19 2008-03-18 Unité électronique équipée d'un condensateur WO2008123269A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800085303A CN101636803B (zh) 2007-03-19 2008-03-18 具有电容器的电气单元
US12/528,009 US8102653B2 (en) 2007-03-19 2008-03-18 Electric unit having capacitor
DE112008000691T DE112008000691B4 (de) 2007-03-19 2008-03-18 Elektrisches Gerät mit Kondensator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-070644 2007-03-19
JP2007070644A JP4702311B2 (ja) 2007-03-19 2007-03-19 コンデンサを備えた電気ユニット

Publications (1)

Publication Number Publication Date
WO2008123269A1 true WO2008123269A1 (fr) 2008-10-16

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ID=39830759

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055631 WO2008123269A1 (fr) 2007-03-19 2008-03-18 Unité électronique équipée d'un condensateur

Country Status (5)

Country Link
US (1) US8102653B2 (fr)
JP (1) JP4702311B2 (fr)
CN (1) CN101636803B (fr)
DE (1) DE112008000691B4 (fr)
WO (1) WO2008123269A1 (fr)

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JP6421601B2 (ja) * 2015-01-08 2018-11-14 株式会社オートネットワーク技術研究所 キャパシタモジュール
JP6398849B2 (ja) * 2015-04-06 2018-10-03 株式会社デンソー 電子制御装置
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Also Published As

Publication number Publication date
CN101636803B (zh) 2012-01-04
US20100014252A1 (en) 2010-01-21
DE112008000691T5 (de) 2010-04-29
DE112008000691B4 (de) 2012-03-15
JP4702311B2 (ja) 2011-06-15
JP2008235441A (ja) 2008-10-02
DE112008000691T8 (de) 2010-10-14
US8102653B2 (en) 2012-01-24
CN101636803A (zh) 2010-01-27

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