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WO2008123253A1 - 複合体の製造方法 - Google Patents

複合体の製造方法 Download PDF

Info

Publication number
WO2008123253A1
WO2008123253A1 PCT/JP2008/055586 JP2008055586W WO2008123253A1 WO 2008123253 A1 WO2008123253 A1 WO 2008123253A1 JP 2008055586 W JP2008055586 W JP 2008055586W WO 2008123253 A1 WO2008123253 A1 WO 2008123253A1
Authority
WO
WIPO (PCT)
Prior art keywords
base material
inorganic base
composite body
aqueous solution
resin layer
Prior art date
Application number
PCT/JP2008/055586
Other languages
English (en)
French (fr)
Inventor
Toshihiko Jimbo
Takamasa Miyamoto
Junji Kodemura
Original Assignee
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to JP2009509118A priority Critical patent/JPWO2008123253A1/ja
Publication of WO2008123253A1 publication Critical patent/WO2008123253A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

　本発明は、無機基材と樹脂層とが非常に強くしかも均一に密着しており、優れた電気特性を有し微細配線化が可能な回路基板に好適な複合体の製造方法を提供することを目的としている。本発明の複合体の製造方法は、無機基材の表面を、濃度が０．０１重量％以上でかつ光路長が５０ｍｍのときの全光線透過率が５０％以上である、シランカップリング剤含有水溶液で表面処理する工程、および該無機基材の表面処理された表面上に、樹脂層を形成する工程によりなる。
PCT/JP2008/055586 2007-03-26 2008-03-25 複合体の製造方法 WO2008123253A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509118A JPWO2008123253A1 (ja) 2007-03-26 2008-03-25 複合体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007080295 2007-03-26
JP2007-080295 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123253A1 true WO2008123253A1 (ja) 2008-10-16

Family

ID=39830746

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055586 WO2008123253A1 (ja) 2007-03-26 2008-03-25 複合体の製造方法

Country Status (2)

Country Link
JP (1) JPWO2008123253A1 (ja)
WO (1) WO2008123253A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009107845A1 (ja) * 2008-02-28 2009-09-03 日本ゼオン株式会社 金属－硬化樹脂積層体
WO2011010738A1 (ja) * 2009-07-24 2011-01-27 Taga Yasunori 接合構造体の製造方法および接合構造体
JP2011023381A (ja) * 2009-07-13 2011-02-03 Nippon Zeon Co Ltd 積層モジュール
JP2013041942A (ja) * 2011-08-12 2013-02-28 Fujifilm Corp 積層体の製造方法
JP2015207669A (ja) * 2014-04-21 2015-11-19 住友ベークライト株式会社 金属ベース基板、金属ベース回路基板および電子装置
JP2018018930A (ja) * 2016-07-27 2018-02-01 株式会社トーキン 固体電解コンデンサおよびその製造方法
WO2019142570A1 (ja) * 2018-01-17 2019-07-25 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
JP7015972B1 (ja) * 2021-04-09 2022-02-03 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板
WO2022215288A1 (ja) * 2021-04-09 2022-10-13 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002536468A (ja) * 1999-02-05 2002-10-29 マテリア インコーポレイテッド 表面へのポリマー接着を増強するためのメタセシス活性接着剤及び方法
JP2003283098A (ja) * 2002-03-26 2003-10-03 Matsushita Electric Works Ltd プリント配線板製造用積層材料、積層板、樹脂付き銅箔、プリント配線板及び多層プリント配線板
JP2004149901A (ja) * 2002-11-01 2004-05-27 Asahi Schwebel Co Ltd 化学処理銅箔及びその製造方法
JP2004149782A (ja) * 2002-10-09 2004-05-27 Mitsubishi Chemicals Corp 熱可塑性樹脂組成物及びそれを用いてなる成形体
JP2004244609A (ja) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002536468A (ja) * 1999-02-05 2002-10-29 マテリア インコーポレイテッド 表面へのポリマー接着を増強するためのメタセシス活性接着剤及び方法
JP2003283098A (ja) * 2002-03-26 2003-10-03 Matsushita Electric Works Ltd プリント配線板製造用積層材料、積層板、樹脂付き銅箔、プリント配線板及び多層プリント配線板
JP2004244609A (ja) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法
JP2004149782A (ja) * 2002-10-09 2004-05-27 Mitsubishi Chemicals Corp 熱可塑性樹脂組成物及びそれを用いてなる成形体
JP2004149901A (ja) * 2002-11-01 2004-05-27 Asahi Schwebel Co Ltd 化学処理銅箔及びその製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009107845A1 (ja) * 2008-02-28 2009-09-03 日本ゼオン株式会社 金属－硬化樹脂積層体
JP2011023381A (ja) * 2009-07-13 2011-02-03 Nippon Zeon Co Ltd 積層モジュール
WO2011010738A1 (ja) * 2009-07-24 2011-01-27 Taga Yasunori 接合構造体の製造方法および接合構造体
US9108393B2 (en) 2009-07-24 2015-08-18 Yasunori Taga Joined structure manufacturing method and joined structure
JP2013041942A (ja) * 2011-08-12 2013-02-28 Fujifilm Corp 積層体の製造方法
JP2015207669A (ja) * 2014-04-21 2015-11-19 住友ベークライト株式会社 金属ベース基板、金属ベース回路基板および電子装置
JP2018018930A (ja) * 2016-07-27 2018-02-01 株式会社トーキン 固体電解コンデンサおよびその製造方法
WO2019142570A1 (ja) * 2018-01-17 2019-07-25 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
JP7015972B1 (ja) * 2021-04-09 2022-02-03 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板
WO2022215288A1 (ja) * 2021-04-09 2022-10-13 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板

Also Published As

Publication number Publication date
JPWO2008123253A1 (ja) 2010-07-15

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