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WO2008120526A1 - Dispositif de refusion - Google Patents

Dispositif de refusion Download PDF

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Publication number
WO2008120526A1
WO2008120526A1 PCT/JP2008/053889 JP2008053889W WO2008120526A1 WO 2008120526 A1 WO2008120526 A1 WO 2008120526A1 JP 2008053889 W JP2008053889 W JP 2008053889W WO 2008120526 A1 WO2008120526 A1 WO 2008120526A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
gas
heating device
zones
reflow
Prior art date
Application number
PCT/JP2008/053889
Other languages
English (en)
Japanese (ja)
Inventor
Masaki Iijima
Fumihiro Yamashita
Original Assignee
Tamura Corporation
Tamura Fa System Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corporation, Tamura Fa System Corporation filed Critical Tamura Corporation
Publication of WO2008120526A1 publication Critical patent/WO2008120526A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Definitions

  • the present invention relates to a reflow apparatus applied to reflow or adhesive curing.
  • Solder is supplied to the electronic component or printed wiring board in advance, and the substrate is transported to the reflow furnace by a conveyor, and soldered, or the electronic component is fixed on the substrate with a thermosetting adhesive.
  • Reflow equipment is used for this purpose.
  • desired soldering can be performed by controlling the surface temperature of an object to be heated, for example, a substrate, according to a desired temperature profile.
  • Figure 6 shows an outline of the temperature profile.
  • the horizontal axis is time, and the vertical axis is the surface temperature of a printed wiring board on which an object to be heated, such as an electronic component, is mounted.
  • the first section is the heating section R 1 where the temperature rises due to heating, the next section is the preheating (preheating) section R 2 where the temperature is almost constant, and the next section is the main heating section R 3
  • the last section is the cooling section R4.
  • the temperature raising portion R 1 is a period in which the substrate is heated from room temperature to a preheating portion R 2 (for example, 1550 ° C. to 1700 ° C.).
  • the preheating portion R2 is a period for performing isothermal heating, activating the flux, removing the oxide film on the surface of the electrode and solder powder, and eliminating the heating unevenness of the printed wiring board.
  • This heating section R 3 (for example, 2 20 ° C to 2 40 ° C at peak temperature) However, it is a period of melting and joining. In this heating part R3, the temperature must be raised to a temperature exceeding the melting temperature of the solder. Even if the main heating part R 3 has passed the preheating part R 2, since there is uneven temperature rise, heating to a temperature exceeding the solder melting temperature is required.
  • curve 1 shows the temperature profile of lead-free solder.
  • the temperature profile for eutectic solder is shown by curve 2.
  • the set temperature in the preheating part R2 is considered to be higher than that of eutectic solder.
  • curve 3 in FIG. 6 shows a profile when a thermosetting adhesive for fixing an electronic component to a printed wiring board is cured.
  • the adhesive has a lower set temperature and does not require complicated temperature control.
  • the temperature is controlled so that the profile is either curve 1 or curve 2 depending on the type of solder used (lead-free solder and eutectic solder) and the type of printed wiring board. If the reflow device is used for the adhesive curing process, the profile of curve 3 is used. In the case of a reflow device, increasing the set temperature can be done in a relatively short time, but since it has a heat insulating structure, it takes time to lower the temperature.
  • Japanese Patent Application Laid-Open No. 11-1 4 5 6 the temperature of a specific zone can be set in a short time by turning off the heating heater and sending outside air or inert gas to the specific zone. It is described that it is reduced.
  • Japanese Patent Application Laid-Open No. 6-170 5 2 4 discloses that high warm air in a furnace is forcibly discharged and cold air is supplied into the furnace to forcibly cool it. Are listed.
  • the preheating part R 2 in the temperature profile It is necessary to lower the temperature of the responsible zone, and it is important how the temperature of the zone can be lowered within a short time.
  • those described in Japanese Patent Application Laid-Open Nos. 11-1 14 5 6 1 1 and 6 1 700 5 24 are different from the preheating unit R 2 in the main heating unit R 3. It does not reduce the temperature of the furnace in a specific zone, so the configuration is complicated, the time required to lower the temperature is long, and the amount of gas used for cooling is large. There was a problem such as.
  • an object of the present invention is to rapidly reduce the temperature of the zone that handles the preheating portion among a plurality of zones arranged in-line, thereby reducing the type of solder without complicating the configuration.
  • An object of the present invention is to provide a reflow apparatus capable of performing switching at high speed and efficiently. Disclosure of the invention
  • the present invention is configured such that the reflow furnace is sequentially divided into a plurality of zones along the conveyance path of the heated object to be conveyed, and is conveyed by controlling the temperature of the plurality of zones.
  • the reflow device that controls the temperature of the heated object with a desired profile
  • the change in the set temperature is large.
  • One or more zones introduces a gas that introduces a lower temperature gas than the gas in the zone.
  • This is a reflow apparatus in which a low temperature gas is introduced into the zone through a gas introduction unit to reduce the temperature of one or a plurality of zones in a short time.
  • the profile during reflow consists of a heating section, preheating section, main heating section, and cooling section, and is set in a zone that handles heating of the heating section, preheating section, and main heating section.
  • One or more zones with large temperature changes are introduced with a lower temperature gas than the gas in the zone.
  • the gas in one or a plurality of zones that are responsible for heating the preheating section is circulated in the cooling section provided outside the reflow furnace.
  • FIG. 1 is a schematic diagram showing an outline of a reflow apparatus according to an embodiment of the present invention.
  • FIG. 2 is a sectional view showing an example of the configuration of one zone in one embodiment of the present invention.
  • FIG. 3 is a schematic diagram for explaining a method of performing cooling by supplying N 2 in one embodiment of the present invention.
  • FIG. 4A and FIG. 4B are schematic diagrams for explaining the arrangement of the inlets and holes provided in the embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing an example of the set temperature of each zone.
  • FIG. 6 is a graph showing an example of a temperature profile during reflow.
  • FIG. 1 shows a schematic configuration excluding an outer plate of a reflow apparatus according to an embodiment of the present invention.
  • An object to be heated on which electronic components for surface mounting are mounted on both sides of the printed wiring board, is placed on the conveyor and is carried into the reflow apparatus from the carry-in port 11.
  • the transport conveyor moves at the specified speed in the direction of the arrow (see Fig. 1
  • the object to be heated is transported from the left to the right.
  • a reflow furnace for example, is divided into 9 zones Z 1 to Z 9 along the transfer path from the carry-in entrance 1 1 to the carry-out exit 1 2, and these zones Z 1 to Z 9 are arranged in-line. ing.
  • a flux recovery system 1 3 a is provided on the carry-in side, and flux collection systems 1 3 b and 1 3 c are provided on the carry-out side.
  • Seven zones Z1 to Z7 from the inlet side are heating zones, and two zones Z8 and Z9 on the outlet side are cooling zones.
  • the number of zones is an example, and other numbers of zones may be provided.
  • the plurality of zones Z 1 to Z 9 described above controls the temperature of the object to be heated according to the temperature profile during reflow.
  • the zones Z 1 and Z 2 are mainly responsible for the temperature control of the temperature riser R 1 in Fig. 6.
  • the temperature control of the preheating section R 2 is mainly handled by the zones Z 3, Z 4 and Z 5.
  • Zones Z 6 and Z 7 are responsible for temperature control of this heating section R 3.
  • Zone 8 and zone 9 are responsible for temperature control of cooling section R4.
  • Each of the heating zones Z1 to Z7 has an upper heating device and a lower heating device each including a blower. For example, hot air is blown to the object to be heated conveyed from the upper heating device 15 in the zone Z 1, and hot air is blown to the object to be heated conveyed from the lower heating device 35.
  • ambient temperature ambient gas nitrogen: N 2
  • the temperature in the furnaces of zones Z 3, Z 4 and Z 5 is lowered in a short time by supplying them into the lower heating devices of zones Z 3, Z 4 and Z 5 that are in charge of control.
  • Z The amount of N 2 introduced may be controlled so that more N 2 is introduced in zones closer to 6.
  • the introduction amount (flow rate) of zones Z 3, Z 4, and Z 5 is controlled as (1: 2: 4).
  • N 2 may be supplied only to the zone Z 6 that is adjacent to the zone Z 6 that is in charge of this heating section.
  • the atmosphere gas N 2 is always circulated and cooled in connection with the upper heating devices of the zones Z 4 and Z 5, including during reflow and switching of the solder type. is doing.
  • the constant circulation cooling is performed to simplify the configuration. If the heating is stopped when switching from lead-free solder to eutectic solder, the temperature of zones Z 4 and Z 5 can be lowered in a short time by the action of cooled N 2 .
  • the temperature can be lowered in a short time.
  • an inert gas other than N 2 may be used as the atmospheric gas.
  • N 2 for cooling is introduced from the lower heating device, but the upper and lower heating devices move back and forth with respect to the gas flow, so the cooling effect of introducing N 2 for cooling is not Also spread to the upper heating device.
  • the cooling effect of the circulating cooling method in the upper heating device also affects the lower heating device.
  • zone Z 5 An example of the heating apparatus will be described with reference to FIG.
  • the configuration of zone Z 5 is shown in FIG.
  • an object to be heated W with electronic components for surface mounting mounted on both sides of the printed wiring board is placed on the conveyor 4 1.
  • the partial heating device 15 and the lower heating device 35 heat the heated object W by jetting hot air to the heated object W. Infrared rays may be irradiated with hot air.
  • the upper heating device 15 includes a main heating source 16, a sub heating source 17, a blower, for example, an axial blower 18, a heat storage member 19, a hot air circulation duct 20, an opening 21, and the like. Hot air (heated atmospheric gas such as N 2 ) is blown through the opening 21 to the article W to be heated.
  • the main heating source 16 and the auxiliary heating source 17 are composed of, for example, an electric heater.
  • the heat storage member 19 is made of, for example, aluminum, and has a large number of holes. Hot air passes through the holes and is blown to the object W to be heated.
  • Hot air is circulated by an axial blower 18. That is, (Main heating source 1 6 ⁇ Heat storage member 1 9 ⁇ Opening 2 1 ⁇ Substance to be heated W ⁇ Hot air circulation duct 2 0 ⁇ Sub heating source 1 7 ⁇ Hot air circulation duct 2 0 ⁇ Axial flow production 1 8 ⁇ Hot air circulates through the path of the main heating source 1 6).
  • the radiator box 42 has a structure in which a large number of fins are provided on the peripheral surface of a gas circulating pipe and a cooling fan is provided.
  • the hot air taken out from the hole 2 2 a is cooled by the radiator box 4 2 and taken into the upper heating device 15 in the zone Z 5 from the hole 2 2 b.
  • An outlet (hole 2 2 a) force S is provided at a location where the pressure generated by the ventilation of the axial flow blower 1 8 is high, and an introduction port (hole 2 2 b) is provided at a location where the pressure is low. Gas circulates in the path including the lever box 42. At the bottom of the radiator box 4 2, a container 4 4 for collecting the flux is provided. The radiator box 4 2 cools the hot air even when the main heating source 16 and the auxiliary heating source 17 are operating. In this operating state, the main heating source 16 and the sub-heating source 17 are operated so that the temperature of the zone Z 5 becomes the set temperature.
  • the temperature of the zone Z 5 can be quickly reduced by the cooling action of the radiator box 42. Can be lowered. Further, the radiator box 42 can also serve as a flux recovery device for the upper heating device 15. A method similar to the circulating cooling method in zone Z 5 is also applied to adjacent zone Z 4. The circulation cooling method may be applied to the lower heating device 35.
  • an outside air introduction valve 23 is provided on the upper part of the upper heating device 15.
  • An electric ball valve can be used as the outside air introduction valve 2 3.
  • the outside air introduction valve 23 is turned on when switching from solder reflow to adhesive curing, and outside air is introduced.
  • the temperature in the case of curing is lower than that of soldering and does not require N 2 , so outside air is introduced when the power supply to the heating source is stopped and the supply of N 2 is stopped.
  • zone Z 5 the outside air introduction valve is provided at one location of the upper heating device 15 and one location of the lower heating device 35.
  • each of the other zones Z 1 to Z 4 is provided with one outdoor air introduction valve in each of the upper and lower sides.
  • zones Z 6 and Z 7 there are two outdoor air introduction valves at the top and bottom. A total of 18 outdoor air inlets are provided, and when the air is introduced, these outdoor air inlets are connected all at once.
  • the lower heating device 35 has the same configuration as the upper heating device 15 described above, and the description of the corresponding parts is omitted.
  • the holes 3 6 a and 3 6 b provided in the lower part of the lower heating device 3 5 are holes for collecting the flux. However, the collection container is connected through a hose. Also, lower heating device
  • a cooling N 2 inlet 3 7 is provided at the bottom of 3 5.
  • the atmosphere gas in the reflow furnace is led out from the lower heating device 35 to the flux recovery unit provided outside the reflow furnace, and the atmosphere gas is cooled by the flux recovery unit, and the flux contained in the atmosphere gas
  • the components may be condensed and recovered and introduced again into the reflow furnace.
  • the flux recovery unit is not shown in the figure, for example, when atmospheric gas passes, oxygen is added and the organic component of the flux in the atmospheric gas is converted into carbon dioxide (C 0 2 ), water (H 2 0) by the catalyst. ), Etc., and a radiator section that cools the atmospheric gas and condenses and collects flux components in the atmospheric gas.
  • N 2 is supplied to the lower heating devices of the zones Z 3, Z 4, and Z 5 that are responsible for the preheating portion from below through the cooling N 2 inlet.
  • N 2 from N 2 generator 4 5 is separated into sub-supply for cooling the main supply by a branch unit 4 6.
  • N 2 is generated by vaporizing ultra-low temperature liquefied nitrogen. Main supply and temperature control are performed even during transition.
  • the sub supply path is branched into three, and electronically controllable valves V 3, V 4 and V 5 and manual flow control volumes L 3, L 4 and L 5 are provided for each branch.
  • the valves V 3, V 4 and V 5 By switching the valves V 3, V 4 and V 5, the conduction and shut-off of the cooling N 2 to the zones Z 3, Z 4 and Z 5 are controlled.
  • the flow rate of N 2 introduced can be adjusted by the flow rate adjusting volumes L 3, L 4 and L 5. For example, the flow rate of N 2 is increased in the zone closer to zone Z 6 that is in charge of this heating unit.
  • a regulator, a pressure sensor, etc. are arranged in the N 2 supply path to each zone.
  • N 2 for cooling from the lower enters the upper heating device 1 5, further comprising a Lü letterbox 4 2 Since it is cooled by the circulation path described above, the temperature of these zones can be lowered in a short time.
  • FIG. 4A shows the top surface of the reflow device
  • FIG. 4B shows the bottom surface of the reflow device.
  • Main N 2 inlets a 1 to a 7 are formed on the upper surface of each zone, and main N 2 inlets b 1 to b 7 are formed on the lower surface.
  • the main N 2 inlet is schematically represented by a white circle in Fig. 4A and Fig. 4B.
  • Holes c 41 and c 42 for connecting to the radiator box 4 2 are formed on the upper surface of the zone Z 4 and holes c 51 and c 52 for connecting to other radiator boxes are formed on the upper surface of the zone Z 5 Yes.
  • the holes for connecting to the Raje Turbo are schematically represented by triangles in Fig. 4A and Fig. 4B.
  • an inlet d 3 for cooling N 2 is formed on the lower surface of the zone Z 3.
  • Cooling N 2 inlets d 4 and d 5 are formed on the lower surface of zone Z 4 and the lower surface of zone Z 5, respectively.
  • the inlet for cooling N 2 is schematically represented by a black circle in FIGS. 4A and 4B.
  • outside air inlets e 1 to e 5 that are conducted when the temperature is lowered for curing are formed on the upper surfaces of the zones Z 1 to Z 5.
  • Two outside air introduction ports e 61 and e 62 are formed on the upper surface of the zone Z 6, and two outside air introduction ports e 71 and e 72 are formed on the upper surface of the zone Z 7.
  • Outside air inlets f 1 to f 72 are formed in the same manner on the lower surface, and a total of 18 outside air inlets are formed.
  • the arrangement of the inlet and outlet shown in FIG. 4A and FIG. 4B is an example, and the installation location may be another location.
  • the gas or air outlet is provided at a location where the pressure is increased by the operation of the blower, and the gas or air inlet is provided at a location where the pressure is reduced by the operation of the blower.
  • an introduction port or a discharge port may be provided on the side surface of the heating device.
  • the heater temperature (upper) represents the set temperature of the heater that constitutes the main heating source and sub-heating source of the upper heating device
  • the heater temperature (lower) represents the main heating source of the lower heating device.
  • the set temperature of the heater that constitutes the auxiliary heating source The set temperatures for lead-free solder, eutectic solder and curing are shown. In the case of lead-free solder, eutectic solder and hardening, the airflow of the axial blower of the upper heating device and the airflow of the axial flow blower of the upper heating device are set to medium (M id) in each zone.
  • the transport speed is set to 0.9 (m / min).
  • the heater temperature (upper) and heater temperature (lower) of zones Z3, Z4, and Z5, which handle the preheated part are set to 190 ° C.
  • the heater temperature (top) and heater temperature (bottom) of zones Z 3, Z 4 and Z 5 are set to 160 ° C.
  • the heating zones Z 1 to Z 7 are set to 1550 ° C.
  • the desired temperature (reflow) profile for lead-free solder can be obtained with the settings shown in Fig. 5, and the desired temperature (reflow) profile can be obtained for eutectic solder.
  • the desired temperature profile for the case can be obtained.
  • the heater temperature is set to 150 ° C
  • the object to be heated for example, If the heater temperature is set to 160 ° C, the temperature of the object to be heated will be approximately 140 ° C.
  • the heater temperature is set to 190 ° C
  • the temperature of the object to be heated is approximately 170 ° C to 180 ° C
  • the heater temperature is set to 245 ° C
  • the temperature of the heated object is approximately 230 ° C.
  • these temperature changes can be performed in a short time. For example, 30 minutes can be reduced to 15 to 20 minutes.
  • the temperature of the zone having a large change in set temperature for example, the temperature of the zone that handles the preheating portion.
  • the present invention is not limited to the above-described embodiments, and various modifications based on the technical idea of the present invention are possible.
  • the cooling according to the present invention may be applied only to a zone serving as a terminal portion of the preheating portion adjacent to the main heating portion.
  • the present invention can also be applied to temperature profile switching other than switching between lead-free solder and eutectic solder.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Selon l'invention, une entrée pour N2 pour refroidissement est disposée au-dessous de dispositifs de chauffage inférieurs. Du N2 est distribué, à partir du dessous, aux dispositifs de chauffage inférieurs respectifs de zones (Z3-Z5) pour réaliser un préchauffage. Le N2 distribué à partir d'un dispositif de génération de N2 (45) est divisé par une section de ramification (46) en une alimentation principale et une sous-alimentation pour refroidissement. Le chemin de sous-alimentation se ramifie en trois chemins, et chacun des chemins ramifiés a une soupape (V3-V5) et un volume de régulation de débit (L3-L5). La conduction et l'interruption du N2 pour refroidissement par rapport aux zones (Z3-Z5) sont commandées par la commutation des soupapes (V3-V5). Lors du passage d'une brasure sans plomb à une brasure eutectique, du N2 est introduit dans les dispositifs de chauffage inférieurs des zones (Z3-Z5) pour abaisser rapidement la température de ces zones.
PCT/JP2008/053889 2007-03-29 2008-02-27 Dispositif de refusion WO2008120526A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089231A JP2008246515A (ja) 2007-03-29 2007-03-29 リフロー装置
JP2007-089231 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120526A1 true WO2008120526A1 (fr) 2008-10-09

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WO (1) WO2008120526A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012007804B4 (de) 2012-02-24 2022-06-02 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren zum technologisch optimierten Ausführen von bleifreien Lötverbindungen
JP6336707B2 (ja) * 2013-02-14 2018-06-06 株式会社タムラ製作所 リフロー装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134264U (ja) * 1991-05-28 1992-12-14 株式会社タムラ製作所 エアリフロー装置
JPH1071464A (ja) * 1996-08-28 1998-03-17 Tamura Seisakusho Co Ltd リフロー装置
JP2001198671A (ja) * 1999-11-12 2001-07-24 Tamura Seisakusho Co Ltd リフロー装置
JP2004197975A (ja) * 2002-12-16 2004-07-15 Tamura Seisakusho Co Ltd 加熱炉装置
JP2005014074A (ja) * 2003-06-27 2005-01-20 Tamura Seisakusho Co Ltd リフロー装置
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134264U (ja) * 1991-05-28 1992-12-14 株式会社タムラ製作所 エアリフロー装置
JPH1071464A (ja) * 1996-08-28 1998-03-17 Tamura Seisakusho Co Ltd リフロー装置
JP2001198671A (ja) * 1999-11-12 2001-07-24 Tamura Seisakusho Co Ltd リフロー装置
JP2004197975A (ja) * 2002-12-16 2004-07-15 Tamura Seisakusho Co Ltd 加熱炉装置
JP2005014074A (ja) * 2003-06-27 2005-01-20 Tamura Seisakusho Co Ltd リフロー装置
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置

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