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WO2008117697A1 - 半導体製造装置、装置動作パラメータの管理方法、およびプログラム - Google Patents

半導体製造装置、装置動作パラメータの管理方法、およびプログラム Download PDF

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Publication number
WO2008117697A1
WO2008117697A1 PCT/JP2008/054928 JP2008054928W WO2008117697A1 WO 2008117697 A1 WO2008117697 A1 WO 2008117697A1 JP 2008054928 W JP2008054928 W JP 2008054928W WO 2008117697 A1 WO2008117697 A1 WO 2008117697A1
Authority
WO
WIPO (PCT)
Prior art keywords
information
recipe
process parameter
section
recipes
Prior art date
Application number
PCT/JP2008/054928
Other languages
English (en)
French (fr)
Inventor
Noriaki Kanaya
Koki Asakawa
Kiyohito Iijima
Masayuki Hirose
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US12/519,847 priority Critical patent/US20100087944A1/en
Publication of WO2008117697A1 publication Critical patent/WO2008117697A1/ja

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

【課題】従来の群管理システムにおいては、プロセスパラメータの変更が影響し得る１以上のレシピを容易に知ることができない、という課題があった。 【解決手段】２以上の制御装置が保持しているプロセスに関する情報である２以上のレシピを、前記２以上の制御装置に各々対応付けて格納しているレシピ格納部と、レシピに含まれるプロセスパラメータについての情報であるプロセスパラメータ情報を受け付ける受付部と、前記プロセスパラメータ情報を用いて、前記レシピ格納部からレシピを検索し、当該検索したレシピについての情報であるレシピ情報を取得するレシピ情報取得部と、前記レシピ情報取得部が取得したレシピ情報を出力する出力部を具備するプロセス情報管理装置により、プロセスパラメータの変更が影響し得る１以上のレシピを容易に知ることができる。
PCT/JP2008/054928 2007-03-24 2008-03-18 半導体製造装置、装置動作パラメータの管理方法、およびプログラム WO2008117697A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/519,847 US20100087944A1 (en) 2007-03-24 2008-03-18 Semiconductor manufacturing apparatus, method of managing apparatus operation parameters, and program

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007078013A JP4697896B2 (ja) 2007-03-24 2007-03-24 半導体製造装置、装置動作パラメータの管理方法、およびプログラム
JP2007-078013 2007-03-24

Publications (1)

Publication Number Publication Date
WO2008117697A1 true WO2008117697A1 (ja) 2008-10-02

Family

ID=39788433

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054928 WO2008117697A1 (ja) 2007-03-24 2008-03-18 半導体製造装置、装置動作パラメータの管理方法、およびプログラム

Country Status (5)

Country Link
US (1) US20100087944A1 (ja)
JP (1) JP4697896B2 (ja)
KR (1) KR101027727B1 (ja)
TW (1) TWI423002B (ja)
WO (1) WO2008117697A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5575507B2 (ja) 2010-03-02 2014-08-20 株式会社日立国際電気 基板処理装置、基板搬送方法、半導体装置の製造方法および基板処理装置のメンテナンス方法
JP2018067626A (ja) * 2016-10-19 2018-04-26 東京エレクトロン株式会社 半導体システム及びデータ編集支援方法
US10783290B2 (en) * 2017-09-28 2020-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. IC manufacturing recipe similarity evaluation methods and systems
JP2021101264A (ja) * 2019-12-24 2021-07-08 東芝テック株式会社 保守端末及び情報処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005532761A (ja) * 2002-07-11 2005-10-27 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 多重送信チャンネル無線通信システムの改良またはそれに関する改良
JP2006013282A (ja) * 2004-06-29 2006-01-12 Hitachi High-Technologies Corp 半導体製造検査装置の遠隔保守システムおよび遠隔保守方法
JP2006013224A (ja) * 2004-06-28 2006-01-12 Seiko Epson Corp 半導体装置製造情報提供システム及びそれに用いるサーバ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4545252B2 (ja) * 1999-09-01 2010-09-15 東京エレクトロン株式会社 半導体製造装置
US7096189B1 (en) * 2001-01-12 2006-08-22 Cisco Technology, Inc. Methods and system for processing changes to existing purchase orders in an object-oriented order processing system
US6965895B2 (en) * 2001-07-16 2005-11-15 Applied Materials, Inc. Method and apparatus for analyzing manufacturing data
US6907308B1 (en) * 2002-08-02 2005-06-14 Advanced Micro Devices, Inc. Remote wafer flow and recipe editor for simiconductor processing control
US6735493B1 (en) * 2002-10-21 2004-05-11 Taiwan Semiconductor Manufacturing Co., Ltd. Recipe management system
US20050256779A1 (en) * 2004-05-14 2005-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for enabling a customer to monitor and alter an order in a semiconductor manufacturing environment
US7065427B1 (en) * 2004-11-01 2006-06-20 Advanced Micro Devices, Inc. Optical monitoring and control of two layers of liquid immersion media
JP2006163843A (ja) * 2004-12-07 2006-06-22 Ricoh Co Ltd 部品管理方法及び部品管理プログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005532761A (ja) * 2002-07-11 2005-10-27 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 多重送信チャンネル無線通信システムの改良またはそれに関する改良
JP2006013224A (ja) * 2004-06-28 2006-01-12 Seiko Epson Corp 半導体装置製造情報提供システム及びそれに用いるサーバ
JP2006013282A (ja) * 2004-06-29 2006-01-12 Hitachi High-Technologies Corp 半導体製造検査装置の遠隔保守システムおよび遠隔保守方法

Also Published As

Publication number Publication date
JP2008243866A (ja) 2008-10-09
US20100087944A1 (en) 2010-04-08
TWI423002B (zh) 2014-01-11
KR20090049599A (ko) 2009-05-18
TW200903206A (en) 2009-01-16
KR101027727B1 (ko) 2011-04-12
JP4697896B2 (ja) 2011-06-08

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