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WO2008114997A1 - Apparatus of measuring pressure of chuck plate, correcting position of chuck plate and method thereof - Google Patents

Apparatus of measuring pressure of chuck plate, correcting position of chuck plate and method thereof Download PDF

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Publication number
WO2008114997A1
WO2008114997A1 PCT/KR2008/001535 KR2008001535W WO2008114997A1 WO 2008114997 A1 WO2008114997 A1 WO 2008114997A1 KR 2008001535 W KR2008001535 W KR 2008001535W WO 2008114997 A1 WO2008114997 A1 WO 2008114997A1
Authority
WO
WIPO (PCT)
Prior art keywords
chuck plate
chuck
sensing information
linear encoders
optical sensor
Prior art date
Application number
PCT/KR2008/001535
Other languages
French (fr)
Inventor
Sung-Jin Kim
Original Assignee
Semics Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080024218A external-priority patent/KR100995591B1/en
Application filed by Semics Inc. filed Critical Semics Inc.
Publication of WO2008114997A1 publication Critical patent/WO2008114997A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Definitions

  • the present invention relates to a wafer prober, and more particularly, to an apparatus and method of measuring an external pressure exerted on a chuck plate of a wafer prober and an apparatus and method of correcting a position of the chuck plate by using the measured external pressure.
  • a wafer prober is an apparatus for connecting chips on a wafer to a tester.
  • the tester is connected to the chips on the wafer through the wafer prober to provide an electrical signal to the chips and checks a result from the electrical signal to determine the matter or the defectiveness of each of the chips.
  • a wafer W on which a number of chips are formed is loaded on a chuck plate 108 by a wafer transfer device 104, the chuck plate 108 is moved by a chuck transfer device 106 so that the chips on the wafer W are aligned and contacted with probes included in a probe card 110 in X, Y, and Z directions.
  • a tester T provides a test signal to the chips through a tester connection terminal and the probes according to a predetermined program, and the chips provide output signals according to the test i signal to the tester T so that the tester T can perform an electrical characteristics test on each chip.
  • the chuck plate 108 may perform a characteristics test at high, normal, and low temperatures on the wafer W by heating or cooling the wafer W.
  • the present invention provides an apparatus and method of measuring an external pressure exerted on a chuck plate of a wafer prober measuring the external pressure exerted on the chuck plate of the wafer prober.
  • the present invention also provides an apparatus and method of correcting a position of the chuck plate changed due to the external pressure exerted on the chuck plate.
  • an apparatus for measuring an external pressure exerted on a chuck plate including: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; and a controller detecting a load exerted on a portion or a distribute load exerted on the entire surface of chuck plate according to the sensing information output from a plurality of the linear encoders.
  • an apparatus for correcting a position of a chuck plate including: X, Y, and Z-axes motors transferring the chuck plate in X, Y, and Z-axes! a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; a memory storing load determination information on a load exerted on a portion or a distributed load exerted on the entire surface of the chuck plate and X, Y, and Z-axes correction values corresponding to the sensing information output from a plurality of the linear encoders; and a controller reading load determination information and X, Y, and Z-axes correction values corresponding to the sensing information when the sensing information is input from a plurality of the linear encoders and correcting a position of the chuck plate by driving the
  • the position of the chuck plate can be precisely adjusted.
  • FIG. 1 is a view illustrating a construction of a conventional wafer prober according to an embodiment of the present invention.
  • FIG. 2 is a view illustrating a structure of a chuck transfer device of the wafer prober according to the embodiment of the present invention.
  • FIG. 3 is a view illustrating a detailed structure of a first linear encoder according to the embodiment of the present invention.
  • FIG. 4 is a schematic block diagram illustrating the wafer prober according to the embodiment of the present invention.
  • FIG. 5 is a flowchart of a method of measuring an external pressure exerted on the chuck plate of the wafer prober and controlling a position of the chuck plate according to the measured external pressure according to the embodiment of the present invention.
  • FIGS. 6 and 7 are views illustrating operations of the chuck plate according to the embodiment of the present invention.
  • an apparatus for measuring an external pressure exerted on a chuck plate includes: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; and a controller detecting a load exerted on a portion or a distribute load exerted on the entire surface of chuck plate according to the sensing information output from a plurality of the linear encoders.
  • a wafer is loaded on an upper surface of the chuck plate 200 of the wafer prober.
  • first and second linear encoders 202 and 204 are disposed.
  • the first and second linear encoders 202 and 204 are disposed between the two positions that face each other among the edges of the chuck plates 200 and a chuck frame 216, respectively.
  • Each of the first and second linear encoders 202 and 204 senses a change in a distance between its position among the edges of the chuck plate 200 and the chuck frame 216 and generates sensing data by sensing the change and provides the generated sensing data to a controller.
  • the change in the distance is proportional to an external pressure exerted on the chuck plate 200, so that the external pressure can be detected by using the change in the distance.
  • the first linear encoder 202 includes a pattern support member 300, a pattern printed matter 302, an optical sensor 304, an optical sensor support member 306, and a sensing signal processing module 308.
  • the pattern support member 300 has a shape of a long staff in a vertical direction, and the pattern printed matter 302 on which patterns including black and white lines that have predetermined thicknesses and are disposed in alternate positions are printed, is attached to a side surface of the pattern support member 300.
  • the patterns may be directly printed on the pattern support member 300.
  • a lower end portion of the pattern support member 300 is fixed to the chuck frame 216.
  • the optical sensor support member 306 has a shape of a long staff.
  • a side surface of the optical sensor support member 306 is disposed so as to enable a light emitting surface and a light receiving surface of the optical sensor 304 to face the pattern printed matter 302 and support the optical sensor 304, and the other side surface of the optical sensor support member 306 is secured to the chuck plate 300.
  • the pattern support member 300 is fixed to the chuck frame 216, and the optical sensor support member 306 is fixed to the chuck plate 200.
  • the optical sensor 304 when the chuck plate 200 is pushed downward due to disturbance or the like, the optical sensor 304 is moved downward and simultaneously reads the pattern downward to generate a sensing signal.
  • the optical sensor 304 moves upward and simultaneously reads the pattern upward and generates a sensing signal .
  • the sensing signal processing module 308 converts the sensing signal provided from the optical sensor 304 into a digital signal, detects a change direction of the sensing signal and the number of lines of the pattern to detect a movement direction and a movement distance of the chuck plate 200, and generates and provides sensing information on the movement direction and the movement distance to the controller of a wafer prober.
  • the operations of the first linear encoder 202 are described.
  • the optical sensor 304 of the first linear encoder 202 is moved to a first position corresponding to a pushed distance corresponding to the external pressure from the initial position and simultaneously generates a sensing signal reading the pattern changed in the downward direction and provides the generated sensing signal to the sensing signal processing module 308.
  • the sensing signal processing module 308 detects a movement direction and a movement distance from the sensing signal, generates sensing information on the movement direction and the movement distance, and provides the generated sensing information to the controller of the wafer prober.
  • the optical sensor 304 of the first linear encoder 202 is moved to a second position corresponding to a distance risen by reaction against the external pressure at the initial position, generates a sensing signal reading the pattern changed in the upward direction, and provides the generated sensing signal to the sensing signal processing module 308.
  • the sensing signal processing module 308 detects a movement direction and a movement distance from the sensing signal, generates sensing information on the movement direction and the movement distance, and provides the generated sensing information to the controller of the wafer prober.
  • both of the optical sensors of the first and second linear encoders 202 and 204 are moved to a third position corresponding to the pushed distance corresponding to the external pressure and simultaneously generate sensing signals reading the pattern changed in the downward direction and provide the generated sensing signals to the sensing signal processing modules, respectively.
  • Each of the sensing signal processing modules detects a movement direction and a movement distance from the sensing signal, generates sensing information on the movement direction and the movement distance, and provides the generated sensing information to the controller of the wafer prober.
  • the sensing information on the movement direction and the movement distance is used as the basis for determining a direction in which the external pressure is exerted and a distance that occurs due to the external pressure.
  • the first and second linear encoders 202 and 204 output values corresponding to the external pressure exerted on the chuck plate 200.
  • the first and second linear encoders 202 and 204 are disposed at the positions that face each other among the edges of the chuck plate 200, a load exerted on the chuck plate 200 can be detected.
  • four linear encoders may be provided to respective four positions at which the edges of the chuck plates cross.
  • the position on which the external pressure is exerted may be estimated.
  • a support member 210 that is cut to have a sloped surface is mounted, and under the support member 210, a Z-axis transfer unit 212 having a sloped surface corresponding to the sloped surface of the support member 210 is disposed. Between the support member 210 and the Z-axis transfer unit 212, a rolling bearing 214 for reducing friction is disposed.
  • the Z-axis transfer unit 212 is moved in a transverse direction.
  • the chuck plate 200 is moved in a longitudinal (Z- axis) direction.
  • the chuck frame 216 is transferred in the X or Y-axis by an X or Y- axis motor that is not shown, and accordingly, X or Y-axis transfer of the chuck plate 200 is performed.
  • a block diagram of the chuck plate and the chuck transfer unit of the wafer prober is described with reference to FIG. 4.
  • the wafer prober includes a controller 400, a memory unit 402, the Z- axis motor 206, an X-axis motor 404, an Y-axis motor 406, a Z-axis rotary encoder 408, an X-axis linear encoder 410, an Y-axis linear encoder 412, the first linear encoder 202, and the second linear encoder 204.
  • the controller 400 controls operations of the Z-axis motor 206, the X- axis motor 404, and the Y-axis motor 406 to transfer the chuck plate 200. Particularly, by using motor movement information provided from the Z-axis rotaty encoder 408, the X-axis linear encoder 410, the Y- axis linear encoder 412, the controller 400 detects a position of the chuck plate 200 according to the operations of the Z-axis motor 206, the X-axis motor 404, and the Y-axis motor 406, and performs precise position control on the chuck plate 200 by using the detected position information.
  • the controller 400 corrects the position of the chuck plate 200 according to the values output from the first linear encoder 202 and the second linear encoder 204.
  • the memory unit 402 stores various types of information including a processing program of the controller 400. Particularly, the memory unit 402 includes a table in which load determination information corresponding to sensing information output from the first linear encoder 202 and the second linear encoder 204 and position correction values for the chuck plate 200 are mapped.
  • the table includes the load determination information used to determine deflection due to the load on a portion or the load on the entire surface through the sensing information output from the linear encoders and the correction values used to restore the deflection by pushing the chuck plate against the direction of the load on the portion or the load on the entire surface.
  • the controller 400 of the wafer prober checks whether or not sensing information is provided from the first or second linear encoder 202 or 204 (step 500).
  • the controller 400 reads load determination information corresponding to the sensing information provided from the first or second linear encoder 202 or 204 and X, Y, and Z-axes correction values from the table included in the memory unit 402 (operation 502).
  • the controller 400 transmits a message including position automatic control according to the determined load so that a display that is not shown displays the message.
  • the controller 400 drives the Z-axis motor 206, the X-axis motor 404, and the Y-axis motor 406 according to the read X, Y, and Z-axes correction values to correct the position of the chuck plate 200 (operation 504). Examples of the position correction according to the present invention are described with reference to FIGS. 6 and 7.
  • FIG. 6 illustrates a case where a load is exerted on a portion of the chuck plate 200.
  • a left portion of the chuck plate 200 is lowered by the load, and a position of the chuck plate 200 is pushed to the right by the load.
  • the controller 400 horizontally moves the chuck plate 200 in the direction of the load, that is, to the left so as to enable the chuck plate 200 to be disposed at a desired position.
  • FIG. 7 illustrates a case where a distributed load is exerted on the entire surface of the chuck plate 200.
  • the chuck plate 200 is lowered in the Z-axis by the load exerted on the entire surface of the chuck plate 200.
  • the controller 400 vertically moves the chuck plate 200 so as to enable the chuck plate 200 to be disposed at a desired position.
  • the position of the chuck plate can be precisely adjusted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Provided are an apparatus and method of measuring an external pressure exerted on a chuck plate and an apparatus and method of correcting a position of the chuck plate by using the measured external pressure. The apparatus for measuring an external pressure exerted on a chuck plate, includes: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state! and a controller detecting a load exerted on a portion or a distribute load exerted on the entire surface of chuck plate according to the sensing information output from a plurality of the linear encoders.

Description

[DESCRIPTION] [Invention Title]
APPARATUS OF MEASURING PRESSURE OF CHUCK PLATE, CORRECTING POSITION OF CHUCK PLATE AND METHOD THEREOF [Technical Field]
The present invention relates to a wafer prober, and more particularly, to an apparatus and method of measuring an external pressure exerted on a chuck plate of a wafer prober and an apparatus and method of correcting a position of the chuck plate by using the measured external pressure. [Background Art]
A wafer prober is an apparatus for connecting chips on a wafer to a tester. The tester is connected to the chips on the wafer through the wafer prober to provide an electrical signal to the chips and checks a result from the electrical signal to determine the matter or the defectiveness of each of the chips.
Operations of the wafer probe will be described with reference to FIG. 1. When a wafer W on which a number of chips are formed is loaded on a chuck plate 108 by a wafer transfer device 104, the chuck plate 108 is moved by a chuck transfer device 106 so that the chips on the wafer W are aligned and contacted with probes included in a probe card 110 in X, Y, and Z directions. When the probes are contacted to respective pads of the chips, a tester T provides a test signal to the chips through a tester connection terminal and the probes according to a predetermined program, and the chips provide output signals according to the test i signal to the tester T so that the tester T can perform an electrical characteristics test on each chip.
Particularly, the chuck plate 108 may perform a characteristics test at high, normal, and low temperatures on the wafer W by heating or cooling the wafer W.
As described above, in order to precisely align the small pads formed on the wafer W with the probes of the probe card 110, position control for the chuck plate 108 has to be very precisely performed. However, a practical position of the chuck plate 108 is changed due to an external pressure exerted between the wafer W and the probe card 110. Here, the external pressure is unpredictably produced by stiffness of the apparatus, an elastic change of a probe, or the like. As described above, in spite of that the practical position of the chuck plate 108 is changed due to disturbance, the chuck transfer device 106 that transfers the chuck plate 108 controls a position of the chuck plate 108 by using only output values of linear encoders provided for X and Y-axes motors and a Z~axis rotary encoder. Therefore, position correction of the chuck plate 108 in consideration of disturbance is not implemented. [Disclosure]
[Technical Problem]
The present invention provides an apparatus and method of measuring an external pressure exerted on a chuck plate of a wafer prober measuring the external pressure exerted on the chuck plate of the wafer prober. The present invention also provides an apparatus and method of correcting a position of the chuck plate changed due to the external pressure exerted on the chuck plate. [Technical Solution]
According to an aspect of the present invention, there is provided an apparatus for measuring an external pressure exerted on a chuck plate, including: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; and a controller detecting a load exerted on a portion or a distribute load exerted on the entire surface of chuck plate according to the sensing information output from a plurality of the linear encoders.
According to another aspect of the present invention, there is provided an apparatus for correcting a position of a chuck plate, including: X, Y, and Z-axes motors transferring the chuck plate in X, Y, and Z-axes! a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; a memory storing load determination information on a load exerted on a portion or a distributed load exerted on the entire surface of the chuck plate and X, Y, and Z-axes correction values corresponding to the sensing information output from a plurality of the linear encoders; and a controller reading load determination information and X, Y, and Z-axes correction values corresponding to the sensing information when the sensing information is input from a plurality of the linear encoders and correcting a position of the chuck plate by driving the X, Y, and Z-axes motors according to the read X, Y, and Z-axes correction values.
[Advantageous Effects]
Accordingly, by measuring an external pressure exerted on the chuck plate of the wafer prober and correcting a position of the chuck plate according to the measured external pressure, the position of the chuck plate can be precisely adjusted.
[Description of Drawings]
FIG. 1 is a view illustrating a construction of a conventional wafer prober according to an embodiment of the present invention. FIG. 2 is a view illustrating a structure of a chuck transfer device of the wafer prober according to the embodiment of the present invention.
FIG. 3 is a view illustrating a detailed structure of a first linear encoder according to the embodiment of the present invention. FIG. 4 is a schematic block diagram illustrating the wafer prober according to the embodiment of the present invention. FIG. 5 is a flowchart of a method of measuring an external pressure exerted on the chuck plate of the wafer prober and controlling a position of the chuck plate according to the measured external pressure according to the embodiment of the present invention.
FIGS. 6 and 7 are views illustrating operations of the chuck plate according to the embodiment of the present invention.
[Best Mode] According to an aspect of the present invention, an apparatus for measuring an external pressure exerted on a chuck plate, includes: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; and a controller detecting a load exerted on a portion or a distribute load exerted on the entire surface of chuck plate according to the sensing information output from a plurality of the linear encoders. [Mode for Invention]
Structures of a chuck plate and a chuck transfer device of a wafer prober according to an embodiment of the present invention will be described in detail with reference to FIG.2.
A wafer is loaded on an upper surface of the chuck plate 200 of the wafer prober.
At two positions that face each other among edges of the chuck plate 200, for example, at the left and the right of the chuck plate 200, first and second linear encoders 202 and 204 are disposed.
The first and second linear encoders 202 and 204 are disposed between the two positions that face each other among the edges of the chuck plates 200 and a chuck frame 216, respectively. Each of the first and second linear encoders 202 and 204 senses a change in a distance between its position among the edges of the chuck plate 200 and the chuck frame 216 and generates sensing data by sensing the change and provides the generated sensing data to a controller. Particularly, the change in the distance is proportional to an external pressure exerted on the chuck plate 200, so that the external pressure can be detected by using the change in the distance.
Here, constructions and operations of the first and second linear encoders 202 and 204 are described with reference to FIG. 3 in detail. Since the constructions and the operations of the first and second linear encoders 202 and 204 are the same, only the constructions and operations of the first linear encoder 202 are described. The first linear encoder 202 includes a pattern support member 300, a pattern printed matter 302, an optical sensor 304, an optical sensor support member 306, and a sensing signal processing module 308. The pattern support member 300 has a shape of a long staff in a vertical direction, and the pattern printed matter 302 on which patterns including black and white lines that have predetermined thicknesses and are disposed in alternate positions are printed, is attached to a side surface of the pattern support member 300. Otherwise, the patterns may be directly printed on the pattern support member 300. A lower end portion of the pattern support member 300 is fixed to the chuck frame 216. The optical sensor support member 306 has a shape of a long staff. A side surface of the optical sensor support member 306 is disposed so as to enable a light emitting surface and a light receiving surface of the optical sensor 304 to face the pattern printed matter 302 and support the optical sensor 304, and the other side surface of the optical sensor support member 306 is secured to the chuck plate 300. The pattern support member 300 is fixed to the chuck frame 216, and the optical sensor support member 306 is fixed to the chuck plate 200. Accordingly, when the chuck plate 200 is pushed downward due to disturbance or the like, the optical sensor 304 is moved downward and simultaneously reads the pattern downward to generate a sensing signal. When the chuck plate 200 is pushed upward, the optical sensor 304 moves upward and simultaneously reads the pattern upward and generates a sensing signal .
The sensing signal processing module 308 converts the sensing signal provided from the optical sensor 304 into a digital signal, detects a change direction of the sensing signal and the number of lines of the pattern to detect a movement direction and a movement distance of the chuck plate 200, and generates and provides sensing information on the movement direction and the movement distance to the controller of a wafer prober. The operations of the first linear encoder 202 are described. When the wafer prober is initially installed, in a state where the optical sensor 304 which is disposed to have a predetermined interval from the chuck plate 200 has a predetermined interval from the chuck frame 216, the optical sensor 304 faces the pattern printed matter 302 at an initial position. In the aforementioned initial state, when the chuck plate 200 on the first linear encoder 202 is pushed by an external pressure, the optical sensor 304 of the first linear encoder 202 is moved to a first position corresponding to a pushed distance corresponding to the external pressure from the initial position and simultaneously generates a sensing signal reading the pattern changed in the downward direction and provides the generated sensing signal to the sensing signal processing module 308. The sensing signal processing module 308 detects a movement direction and a movement distance from the sensing signal, generates sensing information on the movement direction and the movement distance, and provides the generated sensing information to the controller of the wafer prober. In addition, in the initial state, when a portion that is symmetrical to the chuck plate 200 on the first linear encoder 202, that is, the chuck plate 200 on the second linear encoder 204 illustrated in FIG. 2 is pushed by an external pressure, the optical sensor 304 of the first linear encoder 202 is moved to a second position corresponding to a distance risen by reaction against the external pressure at the initial position, generates a sensing signal reading the pattern changed in the upward direction, and provides the generated sensing signal to the sensing signal processing module 308. The sensing signal processing module 308 detects a movement direction and a movement distance from the sensing signal, generates sensing information on the movement direction and the movement distance, and provides the generated sensing information to the controller of the wafer prober. In addition, in the initial state, when the entire surface of the chuck plate 200 is pushed by an external pressure, both of the optical sensors of the first and second linear encoders 202 and 204 are moved to a third position corresponding to the pushed distance corresponding to the external pressure and simultaneously generate sensing signals reading the pattern changed in the downward direction and provide the generated sensing signals to the sensing signal processing modules, respectively. Each of the sensing signal processing modules detects a movement direction and a movement distance from the sensing signal, generates sensing information on the movement direction and the movement distance, and provides the generated sensing information to the controller of the wafer prober.
Here, the sensing information on the movement direction and the movement distance is used as the basis for determining a direction in which the external pressure is exerted and a distance that occurs due to the external pressure.
As described above, the first and second linear encoders 202 and 204 output values corresponding to the external pressure exerted on the chuck plate 200. Particularly, since the first and second linear encoders 202 and 204 are disposed at the positions that face each other among the edges of the chuck plate 200, a load exerted on the chuck plate 200 can be detected. In order to precisely detect a position of the load exerted on the chuck plate 200, four linear encoders may be provided to respective four positions at which the edges of the chuck plates cross. In addition, without additional linear encoders, by using practical positions input in current X and Y-axes and relative positions of the probes, the position on which the external pressure is exerted may be estimated.
Returning to FIG. 2, to a lower surface of the chuck plate 200, a support member 210 that is cut to have a sloped surface is mounted, and under the support member 210, a Z-axis transfer unit 212 having a sloped surface corresponding to the sloped surface of the support member 210 is disposed. Between the support member 210 and the Z-axis transfer unit 212, a rolling bearing 214 for reducing friction is disposed.
By a ball screw 208 which is disposed at a lower surface of the Z-axis transfer unit 212 and rotated by a Z-axis motor 206, the Z-axis transfer unit 212 is moved in a transverse direction. In addition, according to movement in the transverse direction of the Z-axis transfer unit 212, the chuck plate 200 is moved in a longitudinal (Z- axis) direction.
The chuck frame 216 is transferred in the X or Y-axis by an X or Y- axis motor that is not shown, and accordingly, X or Y-axis transfer of the chuck plate 200 is performed. A block diagram of the chuck plate and the chuck transfer unit of the wafer prober is described with reference to FIG. 4. The wafer prober includes a controller 400, a memory unit 402, the Z- axis motor 206, an X-axis motor 404, an Y-axis motor 406, a Z-axis rotary encoder 408, an X-axis linear encoder 410, an Y-axis linear encoder 412, the first linear encoder 202, and the second linear encoder 204.
The controller 400 controls operations of the Z-axis motor 206, the X- axis motor 404, and the Y-axis motor 406 to transfer the chuck plate 200. Particularly, by using motor movement information provided from the Z-axis rotaty encoder 408, the X-axis linear encoder 410, the Y- axis linear encoder 412, the controller 400 detects a position of the chuck plate 200 according to the operations of the Z-axis motor 206, the X-axis motor 404, and the Y-axis motor 406, and performs precise position control on the chuck plate 200 by using the detected position information.
In addition, the controller 400 corrects the position of the chuck plate 200 according to the values output from the first linear encoder 202 and the second linear encoder 204. The memory unit 402 stores various types of information including a processing program of the controller 400. Particularly, the memory unit 402 includes a table in which load determination information corresponding to sensing information output from the first linear encoder 202 and the second linear encoder 204 and position correction values for the chuck plate 200 are mapped.
As illustrated in Table 1, the table includes the load determination information used to determine deflection due to the load on a portion or the load on the entire surface through the sensing information output from the linear encoders and the correction values used to restore the deflection by pushing the chuck plate against the direction of the load on the portion or the load on the entire surface. [Table 1]
Figure imgf000012_0001
Here, a method of detecting a change in a position of the chuck plate due to an external pressure exerted on the chuck plate 200 of the wafer prober and correcting the changed position according to the embodiment of the present invention that can be applied to the wafer prober is described with reference to FIG. 5.
The controller 400 of the wafer prober checks whether or not sensing information is provided from the first or second linear encoder 202 or 204 (step 500). When the sensing information is provided from the first or second linear encoder 202 or 204, the controller 400 reads load determination information corresponding to the sensing information provided from the first or second linear encoder 202 or 204 and X, Y, and Z-axes correction values from the table included in the memory unit 402 (operation 502).
When the load determination information is read, the controller 400 transmits a message including position automatic control according to the determined load so that a display that is not shown displays the message. In addition, when the X, Y, and Z-axes correction values are read, the controller 400 drives the Z-axis motor 206, the X-axis motor 404, and the Y-axis motor 406 according to the read X, Y, and Z-axes correction values to correct the position of the chuck plate 200 (operation 504). Examples of the position correction according to the present invention are described with reference to FIGS. 6 and 7.
FIG. 6 illustrates a case where a load is exerted on a portion of the chuck plate 200. A left portion of the chuck plate 200 is lowered by the load, and a position of the chuck plate 200 is pushed to the right by the load. In this case, the controller 400 horizontally moves the chuck plate 200 in the direction of the load, that is, to the left so as to enable the chuck plate 200 to be disposed at a desired position. FIG. 7 illustrates a case where a distributed load is exerted on the entire surface of the chuck plate 200. The chuck plate 200 is lowered in the Z-axis by the load exerted on the entire surface of the chuck plate 200. In this case, the controller 400 vertically moves the chuck plate 200 so as to enable the chuck plate 200 to be disposed at a desired position.
[Industrial Applicability]
Accordingly, by measuring an external pressure exerted on the chuck plate of the wafer prober and correcting a position of the chuck plate according to the measured external pressure, the position of the chuck plate can be precisely adjusted.

Claims

[CLAIMS] [Claim 1]
An apparatus for measuring an external pressure exerted on a chuck plate, comprising: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state! and a controller detecting a load exerted on a portion or a distribute load exerted on the entire surface of chuck plate according to the sensing information output from a plurality of the linear encoders.
[Claim 2]
The apparatus of claim 1, wherein each of the linear encoders comprises: a first support member which has a shape of a staff fixed to a side surface of the chuck frame and has a side surface on which a pattern for detecting the movement distance is printed; an optical sensor which faces the surface on which the pattern is printed and generates a sensing signal reading the pattern according to upward or downward movement of the optical sensor with respect to the initial position; a second support member which has a shape of a staff and is fixed between the optical sensor and the chuck plate; and a sensing signal processing module which generates a movement distance and a movement direction from the sensing signal generated by the optical sensor, generates the sensing information, and provides the generated sensing information to the controller.
[Claim 3]
An apparatus for correcting a position of a chuck plate, comprising: X, Y, and Z-axes motors transferring the chuck plate in X, Y, and Z- axes; a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, and generate sensing information on a vertical distance and a movement direction from the chuck frame with respect to an initial state; a memory storing load determination information on a load exerted on a portion or a distributed load exerted on the entire surface of the chuck plate and X, Y, and Z-axes correction values corresponding to the sensing information output from a plurality of the linear encoders! and a controller reading load determination information and X, Y, and Z- axes correction values corresponding to the sensing information when the sensing information is input from a plurality of the linear encoders and correcting a position of the chuck plate by driving the X, Y, and Z-axes motors according to the read X, Y, and Z-axes correction values.
[Claim 4]
The apparatus of claim 3, wherein each of the linear encoders comprises: a first support member which has a shape of a staff fixed to a side surface of the chuck frame and has a side surface on which a pattern for detecting the movement distance is printed; an optical sensor which faces the surface on which the pattern is printed and generates a sensing signal reading the pattern according to upward or downward movement of the optical sensor with respect to the initial position; a second support member which has a shape of a staff and is fixed between the optical sensor and the chuck plate; and a sensing signal processing module which generates a movement distance and a movement direction from the sensing signal generated by the optical sensor, generates the sensing information, and provides the generated sensing information to the controller.
[Claim 5]
A method of measuring an external pressure exerted on a chuck plate comprising: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, generating sensing information on a vertical distance between each of the edges of the chuck plate and the chuck frame and a movement direction with respect to an initial state; and a memory which stores load determination information on a load exerted on a portion or a distributed load exerted on the entire surface of the chuck plate corresponding to the sensing information output from the linear encoders, reading determination information corresponding to the sensing information output from a plurality of the linear encoders and detecting a load exerted on a portion or a distributed load exerted on the entire surface of the chuck plate.
[Claim 6]
A method of correcting a position of a chuck plate comprising: a plurality of linear encoders which are disposed between positions that face each other among edges of the chuck plate and a chuck frame, respectively, generating sensing information on a vertical distance between each of the edges of the chuck plate and the chuck frame and a movement direction with respect to an initial state; and when the sensing information is input from a plurality of the linear encoders, from a memory storing load determination information on a load exerted on a portion or a distributed load exerted on the entire surface of the chuck plate and X, Y, and Z-axes correction values, reading load determination information and X, Y, and Z-axes correction values corresponding to the sensing information, and correcting a position of the chuck plate by driving the X, Y, and Z-axes motors according to the read X, Y, and Z-axes correction values.
PCT/KR2008/001535 2007-03-20 2008-03-19 Apparatus of measuring pressure of chuck plate, correcting position of chuck plate and method thereof WO2008114997A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2007-0027130 2007-03-20
KR20070027130 2007-03-20
KR10-2008-0024218 2008-03-17
KR1020080024218A KR100995591B1 (en) 2007-03-20 2008-03-17 External pressure measuring device with respect to chuck plate and positioning device of chuck plate according to the external pressure and method thereof

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980086871A (en) * 1997-05-08 1998-12-05 히가시 데츠로 Probe Device and Probe Method
KR20010112467A (en) * 1999-04-27 2001-12-20 시마무라 테루오 Stage device and exposure device
WO2003040734A2 (en) * 2001-11-02 2003-05-15 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
KR20050039509A (en) * 2004-04-17 2005-04-29 (주)지오니스 An analysis system probing a wafer having a measure of self-operating an array

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980086871A (en) * 1997-05-08 1998-12-05 히가시 데츠로 Probe Device and Probe Method
KR20010112467A (en) * 1999-04-27 2001-12-20 시마무라 테루오 Stage device and exposure device
WO2003040734A2 (en) * 2001-11-02 2003-05-15 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
KR20050039509A (en) * 2004-04-17 2005-04-29 (주)지오니스 An analysis system probing a wafer having a measure of self-operating an array

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