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WO2008108357A1 - Photosensitive composition, solder resist and photosensitive dry film - Google Patents

Photosensitive composition, solder resist and photosensitive dry film Download PDF

Info

Publication number
WO2008108357A1
WO2008108357A1 PCT/JP2008/053827 JP2008053827W WO2008108357A1 WO 2008108357 A1 WO2008108357 A1 WO 2008108357A1 JP 2008053827 W JP2008053827 W JP 2008053827W WO 2008108357 A1 WO2008108357 A1 WO 2008108357A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive composition
photosensitive
dry film
solder resist
compound
Prior art date
Application number
PCT/JP2008/053827
Other languages
French (fr)
Japanese (ja)
Inventor
Makoto Hirakawa
Masao Takei
Original Assignee
Toagosei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co., Ltd. filed Critical Toagosei Co., Ltd.
Priority to JP2009502584A priority Critical patent/JP5051217B2/en
Publication of WO2008108357A1 publication Critical patent/WO2008108357A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

Disclosed is a photosensitive composition containing a halogen-free flame retardant and having excellent resolution and storage stability. A cured product of such a photosensitive composition is excellent in flame retardancy, heat resistance, flexibility and electrical insulation. Specifically disclosed is a photosensitive composition containing a compound (A) having a skeleton derived from an epoxy compound and containing a carboxyl group and a radically polymerizable group, a urethane acrylate (B), a polymerizable compound (C) other than the compounds (A) and (B) which has a radically polymerizable group, a filler (D) containing a phosphorus atom and a photopolymerization initiator (E).
PCT/JP2008/053827 2007-03-05 2008-03-04 Photosensitive composition, solder resist and photosensitive dry film WO2008108357A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009502584A JP5051217B2 (en) 2007-03-05 2008-03-04 Photosensitive composition, solder resist and photosensitive dry film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007054433 2007-03-05
JP2007-054433 2007-03-05

Publications (1)

Publication Number Publication Date
WO2008108357A1 true WO2008108357A1 (en) 2008-09-12

Family

ID=39738235

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053827 WO2008108357A1 (en) 2007-03-05 2008-03-04 Photosensitive composition, solder resist and photosensitive dry film

Country Status (3)

Country Link
JP (1) JP5051217B2 (en)
TW (1) TWI443454B (en)
WO (1) WO2008108357A1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010078949A (en) * 2008-09-26 2010-04-08 Goo Chemical Co Ltd Alkali developable curable composition and cured product of the same
JP2010169810A (en) * 2009-01-21 2010-08-05 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
JP2010204590A (en) * 2009-03-06 2010-09-16 Nippon Steel Chem Co Ltd Photosensitive resin composition and circuit wiring board using the same
JP2010250020A (en) * 2009-04-14 2010-11-04 Nitto Denko Corp Photosensitive adhesive composition and electronic component-sealing material obtained using the same
WO2011062053A1 (en) * 2009-11-17 2011-05-26 株式会社タムラ製作所 Flame-retardant solder resist composition and flexible wiring board which is obtained using same
WO2011093448A1 (en) * 2010-02-01 2011-08-04 富士フイルム株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
WO2011125604A1 (en) * 2010-03-31 2011-10-13 太陽ホールディングス株式会社 Curable resin composition, dry film using same, and printed wiring board
JP2011257687A (en) * 2010-06-11 2011-12-22 Toagosei Co Ltd Photosensitive resin composition, solder resist and photosensitive dry film
JP2012008221A (en) * 2010-06-22 2012-01-12 Hitachi Chem Co Ltd Light waveguide clad resin composition, light waveguide clad resin film and light waveguide using the same
JP2012088360A (en) * 2010-10-15 2012-05-10 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
CN102520585A (en) * 2010-08-20 2012-06-27 株式会社田村制作所 Alkali soluble transparent resin composition
WO2012117915A1 (en) * 2011-03-03 2012-09-07 株式会社カネカ Novel insulating film and printed wiring board provided with insulating film
WO2013008631A1 (en) * 2011-07-11 2013-01-17 富士フイルム株式会社 Photosensitive composition
JP2013029556A (en) * 2011-07-26 2013-02-07 Fujifilm Corp Photosensitive composition
JP2013033282A (en) * 2012-10-26 2013-02-14 Taiyo Holdings Co Ltd Curable resin composition, and dry film and printed wiring board using the same
JP2013057956A (en) * 2012-10-26 2013-03-28 Taiyo Holdings Co Ltd Curable resin composition, and dry film and printed wiring board using the same
CN103403619A (en) * 2011-03-25 2013-11-20 富士胶片株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate
US8734406B2 (en) 2009-11-24 2014-05-27 Regents Of The University Of Minnesota Methods and systems for chemical ablation
JP2014178708A (en) * 2014-06-03 2014-09-25 Taiyo Holdings Co Ltd Photocurable resin composition, dry film and cured product of the same, and printed wiring board using the dry film or the cured product
US8926586B2 (en) 2007-02-27 2015-01-06 Regents Of The University Of Minnesota Thermochemical ablation of bodily tissue
US8979831B2 (en) 2008-07-31 2015-03-17 Regents Of The University Of Minnesota Thermochemical ablation system using heat from delivery of electrophiles
JP2021154641A (en) * 2020-03-27 2021-10-07 味の素株式会社 Resin sheet
WO2021256333A1 (en) * 2020-06-19 2021-12-23 Canon Kabushiki Kaisha Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000128957A (en) * 1998-10-28 2000-05-09 Nicca Chemical Co Ltd Solder photoresist ink composition
JP2002105340A (en) * 2000-09-29 2002-04-10 Toyobo Co Ltd Active energy ray-curable liquid resin composition
JP2002265567A (en) * 2001-03-06 2002-09-18 Showa Highpolymer Co Ltd Photosensitive flame-retardant resin and its composition
JP2003177515A (en) * 2001-12-12 2003-06-27 Kanegafuchi Chem Ind Co Ltd Flame-retardant photosensitive cover lay film
JP2003301013A (en) * 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd Radiation-curable flame-retardant resin composition and its use
JP2004012810A (en) * 2002-06-06 2004-01-15 Showa Denko Kk Curable flame-retardant composition, its cured body and its producing method
JP2004062057A (en) * 2002-07-31 2004-02-26 Showa Denko Kk Photosensitive thermosetting resin composition and its hardened product
JP2005173577A (en) * 2003-11-17 2005-06-30 Showa Denko Kk Flame retardant photosensitive composition and its cured object
JP2006011395A (en) * 2004-05-26 2006-01-12 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
JP2006084857A (en) * 2004-09-16 2006-03-30 Hitachi Chem Co Ltd Photosensitive resin composition, solder resist forming method and printed wiring board
JP2006220804A (en) * 2005-02-09 2006-08-24 Nichigo Morton Co Ltd Photosensitive resin composition and photosensitive resin laminate using it
JP2006316234A (en) * 2005-04-13 2006-11-24 Shin Etsu Chem Co Ltd Flame retardant adhesive composition, adhesive sheet using the same, cover lay film and flexible copper clad laminate
WO2007015423A1 (en) * 2005-08-03 2007-02-08 Toagosei Co., Ltd. Photosensitive resin composition, composition for solder resist, and photosensitive dry film

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000128957A (en) * 1998-10-28 2000-05-09 Nicca Chemical Co Ltd Solder photoresist ink composition
JP2002105340A (en) * 2000-09-29 2002-04-10 Toyobo Co Ltd Active energy ray-curable liquid resin composition
JP2002265567A (en) * 2001-03-06 2002-09-18 Showa Highpolymer Co Ltd Photosensitive flame-retardant resin and its composition
JP2003177515A (en) * 2001-12-12 2003-06-27 Kanegafuchi Chem Ind Co Ltd Flame-retardant photosensitive cover lay film
JP2003301013A (en) * 2002-04-10 2003-10-21 Nippon Kayaku Co Ltd Radiation-curable flame-retardant resin composition and its use
JP2004012810A (en) * 2002-06-06 2004-01-15 Showa Denko Kk Curable flame-retardant composition, its cured body and its producing method
JP2004062057A (en) * 2002-07-31 2004-02-26 Showa Denko Kk Photosensitive thermosetting resin composition and its hardened product
JP2005173577A (en) * 2003-11-17 2005-06-30 Showa Denko Kk Flame retardant photosensitive composition and its cured object
JP2006011395A (en) * 2004-05-26 2006-01-12 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
JP2006084857A (en) * 2004-09-16 2006-03-30 Hitachi Chem Co Ltd Photosensitive resin composition, solder resist forming method and printed wiring board
JP2006220804A (en) * 2005-02-09 2006-08-24 Nichigo Morton Co Ltd Photosensitive resin composition and photosensitive resin laminate using it
JP2006316234A (en) * 2005-04-13 2006-11-24 Shin Etsu Chem Co Ltd Flame retardant adhesive composition, adhesive sheet using the same, cover lay film and flexible copper clad laminate
WO2007015423A1 (en) * 2005-08-03 2007-02-08 Toagosei Co., Ltd. Photosensitive resin composition, composition for solder resist, and photosensitive dry film

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8926586B2 (en) 2007-02-27 2015-01-06 Regents Of The University Of Minnesota Thermochemical ablation of bodily tissue
US9848934B2 (en) 2007-02-27 2017-12-26 Regents Of The University Of Minnesota Thermochemical ablation of bodily tissue
US8979831B2 (en) 2008-07-31 2015-03-17 Regents Of The University Of Minnesota Thermochemical ablation system using heat from delivery of electrophiles
JP2010078949A (en) * 2008-09-26 2010-04-08 Goo Chemical Co Ltd Alkali developable curable composition and cured product of the same
JP2010169810A (en) * 2009-01-21 2010-08-05 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
JP2010204590A (en) * 2009-03-06 2010-09-16 Nippon Steel Chem Co Ltd Photosensitive resin composition and circuit wiring board using the same
JP2010250020A (en) * 2009-04-14 2010-11-04 Nitto Denko Corp Photosensitive adhesive composition and electronic component-sealing material obtained using the same
WO2011062053A1 (en) * 2009-11-17 2011-05-26 株式会社タムラ製作所 Flame-retardant solder resist composition and flexible wiring board which is obtained using same
JP5613172B2 (en) * 2009-11-17 2014-10-22 株式会社タムラ製作所 Flame retardant solder resist composition and flexible wiring board obtained using the same
US9907601B2 (en) 2009-11-24 2018-03-06 Regents Of The University Of Minnesota Methods and systems for chemical ablation
US8734406B2 (en) 2009-11-24 2014-05-27 Regents Of The University Of Minnesota Methods and systems for chemical ablation
JP2011175254A (en) * 2010-02-01 2011-09-08 Fujifilm Corp Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
WO2011093448A1 (en) * 2010-02-01 2011-08-04 富士フイルム株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
CN102741751A (en) * 2010-02-01 2012-10-17 富士胶片株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
CN102741751B (en) * 2010-02-01 2014-07-16 富士胶片株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
JP2011213828A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Curable resin composition and dry film and printed wiring board using the same
WO2011125604A1 (en) * 2010-03-31 2011-10-13 太陽ホールディングス株式会社 Curable resin composition, dry film using same, and printed wiring board
CN102822284A (en) * 2010-03-31 2012-12-12 太阳控股株式会社 Curable resin composition, dry film using same, and printed wiring board
JP2011257687A (en) * 2010-06-11 2011-12-22 Toagosei Co Ltd Photosensitive resin composition, solder resist and photosensitive dry film
JP2012008221A (en) * 2010-06-22 2012-01-12 Hitachi Chem Co Ltd Light waveguide clad resin composition, light waveguide clad resin film and light waveguide using the same
CN102520585A (en) * 2010-08-20 2012-06-27 株式会社田村制作所 Alkali soluble transparent resin composition
JP2012088360A (en) * 2010-10-15 2012-05-10 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
JP6006716B2 (en) * 2011-03-03 2016-10-12 株式会社カネカ Novel insulating film and printed wiring board with insulating film
KR20140009329A (en) * 2011-03-03 2014-01-22 가부시키가이샤 가네카 Novel insulating film and printed wiring board provided with insulating film
KR101899338B1 (en) * 2011-03-03 2018-09-17 가부시키가이샤 가네카 Novel insulating film and printed wiring board provided with insulating film
JPWO2012117915A1 (en) * 2011-03-03 2014-07-07 株式会社カネカ Novel insulating film and printed wiring board with insulating film
US8883894B2 (en) 2011-03-03 2014-11-11 Kaneka Corporation Insulating film and printed wiring board provided with insulating film
WO2012117915A1 (en) * 2011-03-03 2012-09-07 株式会社カネカ Novel insulating film and printed wiring board provided with insulating film
CN103403619A (en) * 2011-03-25 2013-11-20 富士胶片株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate
JP2013020047A (en) * 2011-07-11 2013-01-31 Fujifilm Corp Photosensitive composition
WO2013008631A1 (en) * 2011-07-11 2013-01-17 富士フイルム株式会社 Photosensitive composition
JP2013029556A (en) * 2011-07-26 2013-02-07 Fujifilm Corp Photosensitive composition
JP2013057956A (en) * 2012-10-26 2013-03-28 Taiyo Holdings Co Ltd Curable resin composition, and dry film and printed wiring board using the same
JP2013033282A (en) * 2012-10-26 2013-02-14 Taiyo Holdings Co Ltd Curable resin composition, and dry film and printed wiring board using the same
JP2014178708A (en) * 2014-06-03 2014-09-25 Taiyo Holdings Co Ltd Photocurable resin composition, dry film and cured product of the same, and printed wiring board using the dry film or the cured product
JP2021154641A (en) * 2020-03-27 2021-10-07 味の素株式会社 Resin sheet
JP7459611B2 (en) 2020-03-27 2024-04-02 味の素株式会社 Resin Sheet
WO2021256333A1 (en) * 2020-06-19 2021-12-23 Canon Kabushiki Kaisha Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same
US11835858B2 (en) 2020-06-19 2023-12-05 Canon Kabushiki Kaisha Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same
US12189289B2 (en) 2020-06-19 2025-01-07 Canon Kabushiki Kaisha Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

Also Published As

Publication number Publication date
JPWO2008108357A1 (en) 2010-06-17
TW200844655A (en) 2008-11-16
JP5051217B2 (en) 2012-10-17
TWI443454B (en) 2014-07-01

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