WO2008108357A1 - Photosensitive composition, solder resist and photosensitive dry film - Google Patents
Photosensitive composition, solder resist and photosensitive dry film Download PDFInfo
- Publication number
- WO2008108357A1 WO2008108357A1 PCT/JP2008/053827 JP2008053827W WO2008108357A1 WO 2008108357 A1 WO2008108357 A1 WO 2008108357A1 JP 2008053827 W JP2008053827 W JP 2008053827W WO 2008108357 A1 WO2008108357 A1 WO 2008108357A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensitive composition
- photosensitive
- dry film
- solder resist
- compound
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Disclosed is a photosensitive composition containing a halogen-free flame retardant and having excellent resolution and storage stability. A cured product of such a photosensitive composition is excellent in flame retardancy, heat resistance, flexibility and electrical insulation. Specifically disclosed is a photosensitive composition containing a compound (A) having a skeleton derived from an epoxy compound and containing a carboxyl group and a radically polymerizable group, a urethane acrylate (B), a polymerizable compound (C) other than the compounds (A) and (B) which has a radically polymerizable group, a filler (D) containing a phosphorus atom and a photopolymerization initiator (E).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009502584A JP5051217B2 (en) | 2007-03-05 | 2008-03-04 | Photosensitive composition, solder resist and photosensitive dry film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007054433 | 2007-03-05 | ||
JP2007-054433 | 2007-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008108357A1 true WO2008108357A1 (en) | 2008-09-12 |
Family
ID=39738235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/053827 WO2008108357A1 (en) | 2007-03-05 | 2008-03-04 | Photosensitive composition, solder resist and photosensitive dry film |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5051217B2 (en) |
TW (1) | TWI443454B (en) |
WO (1) | WO2008108357A1 (en) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010078949A (en) * | 2008-09-26 | 2010-04-08 | Goo Chemical Co Ltd | Alkali developable curable composition and cured product of the same |
JP2010169810A (en) * | 2009-01-21 | 2010-08-05 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using the same |
JP2010204590A (en) * | 2009-03-06 | 2010-09-16 | Nippon Steel Chem Co Ltd | Photosensitive resin composition and circuit wiring board using the same |
JP2010250020A (en) * | 2009-04-14 | 2010-11-04 | Nitto Denko Corp | Photosensitive adhesive composition and electronic component-sealing material obtained using the same |
WO2011062053A1 (en) * | 2009-11-17 | 2011-05-26 | 株式会社タムラ製作所 | Flame-retardant solder resist composition and flexible wiring board which is obtained using same |
WO2011093448A1 (en) * | 2010-02-01 | 2011-08-04 | 富士フイルム株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
WO2011125604A1 (en) * | 2010-03-31 | 2011-10-13 | 太陽ホールディングス株式会社 | Curable resin composition, dry film using same, and printed wiring board |
JP2011257687A (en) * | 2010-06-11 | 2011-12-22 | Toagosei Co Ltd | Photosensitive resin composition, solder resist and photosensitive dry film |
JP2012008221A (en) * | 2010-06-22 | 2012-01-12 | Hitachi Chem Co Ltd | Light waveguide clad resin composition, light waveguide clad resin film and light waveguide using the same |
JP2012088360A (en) * | 2010-10-15 | 2012-05-10 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using the same |
CN102520585A (en) * | 2010-08-20 | 2012-06-27 | 株式会社田村制作所 | Alkali soluble transparent resin composition |
WO2012117915A1 (en) * | 2011-03-03 | 2012-09-07 | 株式会社カネカ | Novel insulating film and printed wiring board provided with insulating film |
WO2013008631A1 (en) * | 2011-07-11 | 2013-01-17 | 富士フイルム株式会社 | Photosensitive composition |
JP2013029556A (en) * | 2011-07-26 | 2013-02-07 | Fujifilm Corp | Photosensitive composition |
JP2013033282A (en) * | 2012-10-26 | 2013-02-14 | Taiyo Holdings Co Ltd | Curable resin composition, and dry film and printed wiring board using the same |
JP2013057956A (en) * | 2012-10-26 | 2013-03-28 | Taiyo Holdings Co Ltd | Curable resin composition, and dry film and printed wiring board using the same |
CN103403619A (en) * | 2011-03-25 | 2013-11-20 | 富士胶片株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate |
US8734406B2 (en) | 2009-11-24 | 2014-05-27 | Regents Of The University Of Minnesota | Methods and systems for chemical ablation |
JP2014178708A (en) * | 2014-06-03 | 2014-09-25 | Taiyo Holdings Co Ltd | Photocurable resin composition, dry film and cured product of the same, and printed wiring board using the dry film or the cured product |
US8926586B2 (en) | 2007-02-27 | 2015-01-06 | Regents Of The University Of Minnesota | Thermochemical ablation of bodily tissue |
US8979831B2 (en) | 2008-07-31 | 2015-03-17 | Regents Of The University Of Minnesota | Thermochemical ablation system using heat from delivery of electrophiles |
JP2021154641A (en) * | 2020-03-27 | 2021-10-07 | 味の素株式会社 | Resin sheet |
WO2021256333A1 (en) * | 2020-06-19 | 2021-12-23 | Canon Kabushiki Kaisha | Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000128957A (en) * | 1998-10-28 | 2000-05-09 | Nicca Chemical Co Ltd | Solder photoresist ink composition |
JP2002105340A (en) * | 2000-09-29 | 2002-04-10 | Toyobo Co Ltd | Active energy ray-curable liquid resin composition |
JP2002265567A (en) * | 2001-03-06 | 2002-09-18 | Showa Highpolymer Co Ltd | Photosensitive flame-retardant resin and its composition |
JP2003177515A (en) * | 2001-12-12 | 2003-06-27 | Kanegafuchi Chem Ind Co Ltd | Flame-retardant photosensitive cover lay film |
JP2003301013A (en) * | 2002-04-10 | 2003-10-21 | Nippon Kayaku Co Ltd | Radiation-curable flame-retardant resin composition and its use |
JP2004012810A (en) * | 2002-06-06 | 2004-01-15 | Showa Denko Kk | Curable flame-retardant composition, its cured body and its producing method |
JP2004062057A (en) * | 2002-07-31 | 2004-02-26 | Showa Denko Kk | Photosensitive thermosetting resin composition and its hardened product |
JP2005173577A (en) * | 2003-11-17 | 2005-06-30 | Showa Denko Kk | Flame retardant photosensitive composition and its cured object |
JP2006011395A (en) * | 2004-05-26 | 2006-01-12 | Showa Denko Kk | Photosensitive resin composition, and cured product and use thereof |
JP2006084857A (en) * | 2004-09-16 | 2006-03-30 | Hitachi Chem Co Ltd | Photosensitive resin composition, solder resist forming method and printed wiring board |
JP2006220804A (en) * | 2005-02-09 | 2006-08-24 | Nichigo Morton Co Ltd | Photosensitive resin composition and photosensitive resin laminate using it |
JP2006316234A (en) * | 2005-04-13 | 2006-11-24 | Shin Etsu Chem Co Ltd | Flame retardant adhesive composition, adhesive sheet using the same, cover lay film and flexible copper clad laminate |
WO2007015423A1 (en) * | 2005-08-03 | 2007-02-08 | Toagosei Co., Ltd. | Photosensitive resin composition, composition for solder resist, and photosensitive dry film |
-
2008
- 2008-03-04 WO PCT/JP2008/053827 patent/WO2008108357A1/en active Application Filing
- 2008-03-04 JP JP2009502584A patent/JP5051217B2/en active Active
- 2008-03-05 TW TW97107664A patent/TWI443454B/en not_active IP Right Cessation
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000128957A (en) * | 1998-10-28 | 2000-05-09 | Nicca Chemical Co Ltd | Solder photoresist ink composition |
JP2002105340A (en) * | 2000-09-29 | 2002-04-10 | Toyobo Co Ltd | Active energy ray-curable liquid resin composition |
JP2002265567A (en) * | 2001-03-06 | 2002-09-18 | Showa Highpolymer Co Ltd | Photosensitive flame-retardant resin and its composition |
JP2003177515A (en) * | 2001-12-12 | 2003-06-27 | Kanegafuchi Chem Ind Co Ltd | Flame-retardant photosensitive cover lay film |
JP2003301013A (en) * | 2002-04-10 | 2003-10-21 | Nippon Kayaku Co Ltd | Radiation-curable flame-retardant resin composition and its use |
JP2004012810A (en) * | 2002-06-06 | 2004-01-15 | Showa Denko Kk | Curable flame-retardant composition, its cured body and its producing method |
JP2004062057A (en) * | 2002-07-31 | 2004-02-26 | Showa Denko Kk | Photosensitive thermosetting resin composition and its hardened product |
JP2005173577A (en) * | 2003-11-17 | 2005-06-30 | Showa Denko Kk | Flame retardant photosensitive composition and its cured object |
JP2006011395A (en) * | 2004-05-26 | 2006-01-12 | Showa Denko Kk | Photosensitive resin composition, and cured product and use thereof |
JP2006084857A (en) * | 2004-09-16 | 2006-03-30 | Hitachi Chem Co Ltd | Photosensitive resin composition, solder resist forming method and printed wiring board |
JP2006220804A (en) * | 2005-02-09 | 2006-08-24 | Nichigo Morton Co Ltd | Photosensitive resin composition and photosensitive resin laminate using it |
JP2006316234A (en) * | 2005-04-13 | 2006-11-24 | Shin Etsu Chem Co Ltd | Flame retardant adhesive composition, adhesive sheet using the same, cover lay film and flexible copper clad laminate |
WO2007015423A1 (en) * | 2005-08-03 | 2007-02-08 | Toagosei Co., Ltd. | Photosensitive resin composition, composition for solder resist, and photosensitive dry film |
Cited By (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8926586B2 (en) | 2007-02-27 | 2015-01-06 | Regents Of The University Of Minnesota | Thermochemical ablation of bodily tissue |
US9848934B2 (en) | 2007-02-27 | 2017-12-26 | Regents Of The University Of Minnesota | Thermochemical ablation of bodily tissue |
US8979831B2 (en) | 2008-07-31 | 2015-03-17 | Regents Of The University Of Minnesota | Thermochemical ablation system using heat from delivery of electrophiles |
JP2010078949A (en) * | 2008-09-26 | 2010-04-08 | Goo Chemical Co Ltd | Alkali developable curable composition and cured product of the same |
JP2010169810A (en) * | 2009-01-21 | 2010-08-05 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using the same |
JP2010204590A (en) * | 2009-03-06 | 2010-09-16 | Nippon Steel Chem Co Ltd | Photosensitive resin composition and circuit wiring board using the same |
JP2010250020A (en) * | 2009-04-14 | 2010-11-04 | Nitto Denko Corp | Photosensitive adhesive composition and electronic component-sealing material obtained using the same |
WO2011062053A1 (en) * | 2009-11-17 | 2011-05-26 | 株式会社タムラ製作所 | Flame-retardant solder resist composition and flexible wiring board which is obtained using same |
JP5613172B2 (en) * | 2009-11-17 | 2014-10-22 | 株式会社タムラ製作所 | Flame retardant solder resist composition and flexible wiring board obtained using the same |
US9907601B2 (en) | 2009-11-24 | 2018-03-06 | Regents Of The University Of Minnesota | Methods and systems for chemical ablation |
US8734406B2 (en) | 2009-11-24 | 2014-05-27 | Regents Of The University Of Minnesota | Methods and systems for chemical ablation |
JP2011175254A (en) * | 2010-02-01 | 2011-09-08 | Fujifilm Corp | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
WO2011093448A1 (en) * | 2010-02-01 | 2011-08-04 | 富士フイルム株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
CN102741751A (en) * | 2010-02-01 | 2012-10-17 | 富士胶片株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
CN102741751B (en) * | 2010-02-01 | 2014-07-16 | 富士胶片株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
JP2011213828A (en) * | 2010-03-31 | 2011-10-27 | Taiyo Holdings Co Ltd | Curable resin composition and dry film and printed wiring board using the same |
WO2011125604A1 (en) * | 2010-03-31 | 2011-10-13 | 太陽ホールディングス株式会社 | Curable resin composition, dry film using same, and printed wiring board |
CN102822284A (en) * | 2010-03-31 | 2012-12-12 | 太阳控股株式会社 | Curable resin composition, dry film using same, and printed wiring board |
JP2011257687A (en) * | 2010-06-11 | 2011-12-22 | Toagosei Co Ltd | Photosensitive resin composition, solder resist and photosensitive dry film |
JP2012008221A (en) * | 2010-06-22 | 2012-01-12 | Hitachi Chem Co Ltd | Light waveguide clad resin composition, light waveguide clad resin film and light waveguide using the same |
CN102520585A (en) * | 2010-08-20 | 2012-06-27 | 株式会社田村制作所 | Alkali soluble transparent resin composition |
JP2012088360A (en) * | 2010-10-15 | 2012-05-10 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using the same |
JP6006716B2 (en) * | 2011-03-03 | 2016-10-12 | 株式会社カネカ | Novel insulating film and printed wiring board with insulating film |
KR20140009329A (en) * | 2011-03-03 | 2014-01-22 | 가부시키가이샤 가네카 | Novel insulating film and printed wiring board provided with insulating film |
KR101899338B1 (en) * | 2011-03-03 | 2018-09-17 | 가부시키가이샤 가네카 | Novel insulating film and printed wiring board provided with insulating film |
JPWO2012117915A1 (en) * | 2011-03-03 | 2014-07-07 | 株式会社カネカ | Novel insulating film and printed wiring board with insulating film |
US8883894B2 (en) | 2011-03-03 | 2014-11-11 | Kaneka Corporation | Insulating film and printed wiring board provided with insulating film |
WO2012117915A1 (en) * | 2011-03-03 | 2012-09-07 | 株式会社カネカ | Novel insulating film and printed wiring board provided with insulating film |
CN103403619A (en) * | 2011-03-25 | 2013-11-20 | 富士胶片株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate |
JP2013020047A (en) * | 2011-07-11 | 2013-01-31 | Fujifilm Corp | Photosensitive composition |
WO2013008631A1 (en) * | 2011-07-11 | 2013-01-17 | 富士フイルム株式会社 | Photosensitive composition |
JP2013029556A (en) * | 2011-07-26 | 2013-02-07 | Fujifilm Corp | Photosensitive composition |
JP2013057956A (en) * | 2012-10-26 | 2013-03-28 | Taiyo Holdings Co Ltd | Curable resin composition, and dry film and printed wiring board using the same |
JP2013033282A (en) * | 2012-10-26 | 2013-02-14 | Taiyo Holdings Co Ltd | Curable resin composition, and dry film and printed wiring board using the same |
JP2014178708A (en) * | 2014-06-03 | 2014-09-25 | Taiyo Holdings Co Ltd | Photocurable resin composition, dry film and cured product of the same, and printed wiring board using the dry film or the cured product |
JP2021154641A (en) * | 2020-03-27 | 2021-10-07 | 味の素株式会社 | Resin sheet |
JP7459611B2 (en) | 2020-03-27 | 2024-04-02 | 味の素株式会社 | Resin Sheet |
WO2021256333A1 (en) * | 2020-06-19 | 2021-12-23 | Canon Kabushiki Kaisha | Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same |
US11835858B2 (en) | 2020-06-19 | 2023-12-05 | Canon Kabushiki Kaisha | Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same |
US12189289B2 (en) | 2020-06-19 | 2025-01-07 | Canon Kabushiki Kaisha | Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008108357A1 (en) | 2010-06-17 |
TW200844655A (en) | 2008-11-16 |
JP5051217B2 (en) | 2012-10-17 |
TWI443454B (en) | 2014-07-01 |
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