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WO2008107991A1 - Electromagnetic absorber - Google Patents

Electromagnetic absorber Download PDF

Info

Publication number
WO2008107991A1
WO2008107991A1 PCT/JP2007/054534 JP2007054534W WO2008107991A1 WO 2008107991 A1 WO2008107991 A1 WO 2008107991A1 JP 2007054534 W JP2007054534 W JP 2007054534W WO 2008107991 A1 WO2008107991 A1 WO 2008107991A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
absorbing layer
aluminum
electromagnetic
electromagnetic absorbing
Prior art date
Application number
PCT/JP2007/054534
Other languages
French (fr)
Japanese (ja)
Inventor
Takao Ochiai
Yutaka Shimizu
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/054534 priority Critical patent/WO2008107991A1/en
Publication of WO2008107991A1 publication Critical patent/WO2008107991A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

This invention provides an electromagnetic absorber comprising a polymeric base material such as a glass substrate, a plastic substrate, a semiconductor substrate, a ceramic substrate, or a pressure-sensitive adhesive tape and a seed layer provided on the polymeric base material. An aluminum layer and an electromagnetic absorbing layer (10) are provided in that order on the seed layer. The total thickness of the aluminum layer and the electromagnetic absorbing layer (10) is about 1 μm. A protective film is provided on the electromagnetic absorbing layer (10). The electromagnetic absorbing layer (10) comprises an anodic oxide film (4) formed, for example, by anodic oxidation of aluminum or an aluminum alloy. A plurality of cylindrical nanoholes (5) are provided on the anodic oxide film (4). The diameter of the nanohole (5) is approximately several nanometers to several hundred nanometers, and the pitch is approximately several tens of nanometers to 500 nm. A columnar magnetic material (6) is embedded in each nanohole (5). The magnetic material (6) is formed of, for example, a ferromagnetic metal such as Co.
PCT/JP2007/054534 2007-03-08 2007-03-08 Electromagnetic absorber WO2008107991A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054534 WO2008107991A1 (en) 2007-03-08 2007-03-08 Electromagnetic absorber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054534 WO2008107991A1 (en) 2007-03-08 2007-03-08 Electromagnetic absorber

Publications (1)

Publication Number Publication Date
WO2008107991A1 true WO2008107991A1 (en) 2008-09-12

Family

ID=39737896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/054534 WO2008107991A1 (en) 2007-03-08 2007-03-08 Electromagnetic absorber

Country Status (1)

Country Link
WO (1) WO2008107991A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189688A (en) * 2009-02-17 2010-09-02 Fujifilm Corp Method of producing microstructure and microstructure
CN103194776A (en) * 2013-03-25 2013-07-10 东莞旭光五金氧化制品有限公司 Manufacturing method for aluminum-based electromagnetic absorption plate
US20130176683A1 (en) * 2012-01-06 2013-07-11 Tatung Company Electronic assembly

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057461A (en) * 2001-05-10 2003-02-26 Canon Inc Optoelectronic substrate and electronic appliance
JP2003124680A (en) * 2001-10-15 2003-04-25 Sumitomo Electric Ind Ltd Electromagnetic wave absorbing material and manufacturing method thereof
JP2003152382A (en) * 2001-11-09 2003-05-23 Hitachi Metals Ltd Radio absorptive material and method of manufacturing the same, and electronic device
JP2003229694A (en) * 2002-02-05 2003-08-15 Sony Corp Electromagnetic wave absorbent and its manufacturing method
JP2006075946A (en) * 2004-09-09 2006-03-23 Fujitsu Ltd Nanohole structure and manufacturing method thereof, and magnetic recording medium and manufacturing method thereof
JP2006075942A (en) * 2004-09-09 2006-03-23 Fujitsu Ltd LAMINATED STRUCTURE, MAGNETIC RECORDING MEDIUM AND MANUFACTURING METHOD THEREOF, MAGNETIC RECORDING DEVICE AND MAGNETIC RECORDING METHOD, AND ELEMENT USING THE MULTILAYER STRUCTURE
JP2006247795A (en) * 2005-03-11 2006-09-21 Furukawa Electric Co Ltd:The Nano structure, magnetic storage material using it, wiring board and antenna base material
JP2006322067A (en) * 2005-04-18 2006-11-30 Fujifilm Holdings Corp Method for producing structure
JP2007035149A (en) * 2005-07-26 2007-02-08 Canon Inc Magnetic structure

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057461A (en) * 2001-05-10 2003-02-26 Canon Inc Optoelectronic substrate and electronic appliance
JP2003124680A (en) * 2001-10-15 2003-04-25 Sumitomo Electric Ind Ltd Electromagnetic wave absorbing material and manufacturing method thereof
JP2003152382A (en) * 2001-11-09 2003-05-23 Hitachi Metals Ltd Radio absorptive material and method of manufacturing the same, and electronic device
JP2003229694A (en) * 2002-02-05 2003-08-15 Sony Corp Electromagnetic wave absorbent and its manufacturing method
JP2006075946A (en) * 2004-09-09 2006-03-23 Fujitsu Ltd Nanohole structure and manufacturing method thereof, and magnetic recording medium and manufacturing method thereof
JP2006075942A (en) * 2004-09-09 2006-03-23 Fujitsu Ltd LAMINATED STRUCTURE, MAGNETIC RECORDING MEDIUM AND MANUFACTURING METHOD THEREOF, MAGNETIC RECORDING DEVICE AND MAGNETIC RECORDING METHOD, AND ELEMENT USING THE MULTILAYER STRUCTURE
JP2006247795A (en) * 2005-03-11 2006-09-21 Furukawa Electric Co Ltd:The Nano structure, magnetic storage material using it, wiring board and antenna base material
JP2006322067A (en) * 2005-04-18 2006-11-30 Fujifilm Holdings Corp Method for producing structure
JP2007035149A (en) * 2005-07-26 2007-02-08 Canon Inc Magnetic structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189688A (en) * 2009-02-17 2010-09-02 Fujifilm Corp Method of producing microstructure and microstructure
US20130176683A1 (en) * 2012-01-06 2013-07-11 Tatung Company Electronic assembly
US8891241B2 (en) * 2012-01-06 2014-11-18 Tatung Company Electronic assembly
TWI492704B (en) * 2012-01-06 2015-07-11 大同股份有限公司 Electronic assembly
CN103194776A (en) * 2013-03-25 2013-07-10 东莞旭光五金氧化制品有限公司 Manufacturing method for aluminum-based electromagnetic absorption plate
CN103194776B (en) * 2013-03-25 2015-12-02 东莞旭光五金氧化制品有限公司 Aluminium base electromagnetic absorption board making method

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