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WO2008105133A1 - Marqueur ci et son procédé de fabrication - Google Patents

Marqueur ci et son procédé de fabrication Download PDF

Info

Publication number
WO2008105133A1
WO2008105133A1 PCT/JP2007/075065 JP2007075065W WO2008105133A1 WO 2008105133 A1 WO2008105133 A1 WO 2008105133A1 JP 2007075065 W JP2007075065 W JP 2007075065W WO 2008105133 A1 WO2008105133 A1 WO 2008105133A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
inlet
tag
laminate
elastic layer
Prior art date
Application number
PCT/JP2007/075065
Other languages
English (en)
Japanese (ja)
Inventor
Wakahiro Kawai
Original Assignee
Omron Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation filed Critical Omron Corporation
Publication of WO2008105133A1 publication Critical patent/WO2008105133A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention vise à proposer un marqueur CI qui a d'excellentes propriétés de résistance à la chaleur et à l'eau, et ayant une résistance vis-à-vis d'une charge de contrainte mécanique provenant de l'extérieur. A cet effet, l'invention concerne un laminé d'entrée (130) ayant une entrée (110) et, superposée sur une surface majeure de celui-ci, une couche élastique (120) d'un matériau en caoutchouc. Le laminé d'entrée (130) est disposé dans une partie de réception d'un plateau fait en résine (140), et une résine liquide est amenée à s'écouler sur la couche élastique (120). La résine est durcie, de telle sorte que la zone entourant le laminé d'entrée (130) est recouverte du plateau fait en résine (140) et de résine de scellement étanche (150) pour obtenir ainsi un scellement hermétique de celui-ci.
PCT/JP2007/075065 2007-02-28 2007-12-27 Marqueur ci et son procédé de fabrication WO2008105133A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007048973A JP2008210344A (ja) 2007-02-28 2007-02-28 Ｉｃタグ及びその製造方法
JP2007-048973 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105133A1 true WO2008105133A1 (fr) 2008-09-04

Family

ID=39720976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075065 WO2008105133A1 (fr) 2007-02-28 2007-12-27 Marqueur ci et son procédé de fabrication

Country Status (2)

Country Link
JP (1) JP2008210344A (fr)
WO (1) WO2008105133A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3035248A4 (fr) * 2013-08-15 2016-08-03 Fujitsu Ltd Étiquette d'identification par radiofréquence (rfid) et son procédé de fabrication
EP2472438A4 (fr) * 2009-08-26 2017-11-08 Toppan Printing Co., Ltd. Support de communication sans contact

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5427401B2 (ja) * 2008-12-19 2014-02-26 株式会社ユニバーサルエンターテインメント Ｉｄタグ内蔵型遊技媒体
JP2016053874A (ja) * 2014-09-04 2016-04-14 アールエフ・テクノロジー株式会社 Ｒｆｉｄタグ及び管理システム並びにｒｆｉｄタグの製造方法
JP6658607B2 (ja) 2017-02-22 2020-03-04 オムロン株式会社 製品の製造方法、外装部品およびアンテナパターン選択装置
JP6750591B2 (ja) 2017-10-05 2020-09-02 カシオ計算機株式会社 インサート成形方法及びインサート成形部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11102424A (ja) * 1997-09-26 1999-04-13 Toshiba Chem Corp 非接触データキャリアパッケージ
JP2000099675A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 無線情報記憶媒体
JP2001229358A (ja) * 2000-02-18 2001-08-24 Ripuro:Kk 情報記憶モジュールおよびこれを用いる靴等の物品
JP2005100114A (ja) * 2003-09-25 2005-04-14 Toppan Printing Co Ltd 床面設置用ｉｃタグ
JP2005096423A (ja) * 2003-08-29 2005-04-14 Omron Corp 無線ｉｃタグ接合方法、無線ｉｃタグ付き物品、及び車両
JP2007018487A (ja) * 2005-06-07 2007-01-25 Hitachi Chem Co Ltd Ｉｃタグ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237351A (ja) * 2000-02-22 2001-08-31 Hitachi Maxell Ltd 半導体装置
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP2006031599A (ja) * 2004-07-21 2006-02-02 Toppan Forms Co Ltd 半導体装置およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11102424A (ja) * 1997-09-26 1999-04-13 Toshiba Chem Corp 非接触データキャリアパッケージ
JP2000099675A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 無線情報記憶媒体
JP2001229358A (ja) * 2000-02-18 2001-08-24 Ripuro:Kk 情報記憶モジュールおよびこれを用いる靴等の物品
JP2005096423A (ja) * 2003-08-29 2005-04-14 Omron Corp 無線ｉｃタグ接合方法、無線ｉｃタグ付き物品、及び車両
JP2005100114A (ja) * 2003-09-25 2005-04-14 Toppan Printing Co Ltd 床面設置用ｉｃタグ
JP2007018487A (ja) * 2005-06-07 2007-01-25 Hitachi Chem Co Ltd Ｉｃタグ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2472438A4 (fr) * 2009-08-26 2017-11-08 Toppan Printing Co., Ltd. Support de communication sans contact
EP3035248A4 (fr) * 2013-08-15 2016-08-03 Fujitsu Ltd Étiquette d'identification par radiofréquence (rfid) et son procédé de fabrication
US9740976B2 (en) 2013-08-15 2017-08-22 Fujitsu Limited RFID tag and manufacturing method thereof

Also Published As

Publication number Publication date
JP2008210344A (ja) 2008-09-11

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