WO2008101704A3 - Plasmadeponiertes elektrisch isolierendes, diffusionsdichtes und elastisches schichtsystem - Google Patents
Plasmadeponiertes elektrisch isolierendes, diffusionsdichtes und elastisches schichtsystem Download PDFInfo
- Publication number
- WO2008101704A3 WO2008101704A3 PCT/EP2008/001388 EP2008001388W WO2008101704A3 WO 2008101704 A3 WO2008101704 A3 WO 2008101704A3 EP 2008001388 W EP2008001388 W EP 2008001388W WO 2008101704 A3 WO2008101704 A3 WO 2008101704A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- diffusion
- plasma
- resistant
- electrically insulating
- elastic layer
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 title abstract 3
- 150000002500 ions Chemical class 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/37512—Pacemakers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Veterinary Medicine (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Materials Engineering (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Inorganic Chemistry (AREA)
- Biophysics (AREA)
- Heart & Thoracic Surgery (AREA)
- Laminated Bodies (AREA)
- Fixing For Electrophotography (AREA)
Abstract
Vielfachschichtsystem auf einem Substrat, wobei das Vielfachschichtsystem auf das Substrat mit Hilfe von Plasmadeposition aufgebracht wird, dadurch gekennzeichnet, dass das Vielfachschichtsystem derart aufgebaut ist, dass es eine weitgehende Diffusionsdichtheit gegenüber Ionen in wässriger Lösung aufweist, wobei der durch die Diffusion der Ionen bei Anliegen eines elektrischen Feldgradienten von mehr als 104V/m, bevorzugt mehr als 105V/m, ganz bevorzugt von mehr als 107V/m erzeugte Strom IIon < 6,5x10-8 A/cm2, vorzugsweise IIon < 6,5x10 -10 A/cm2, insbesondere IIon < 1x10-12 A/cm2 ist.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/528,320 US20110122486A1 (en) | 2007-02-23 | 2008-02-22 | Plasma-Deposited Electrically Insulating, Diffusion-Resistant and Elastic Layer System |
EP08707792A EP2137337A2 (de) | 2007-02-23 | 2008-02-22 | Plasmadeponiertes elektrisch isolierendes, diffusionsdichtes und elastisches schichtsystem |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007008861.4 | 2007-02-23 | ||
DE102007008861 | 2007-02-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008101704A2 WO2008101704A2 (de) | 2008-08-28 |
WO2008101704A3 true WO2008101704A3 (de) | 2009-01-29 |
Family
ID=39636906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/001388 WO2008101704A2 (de) | 2007-02-23 | 2008-02-22 | Plasmadeponiertes elektrisch isolierendes, diffusionsdichtes und elastisches schichtsystem |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110122486A1 (de) |
EP (1) | EP2137337A2 (de) |
WO (1) | WO2008101704A2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012200969A1 (de) * | 2012-01-24 | 2013-07-25 | BSH Bosch und Siemens Hausgeräte GmbH | Bauteil für ein Haushaltsgerät |
CN105556698B (zh) * | 2013-06-29 | 2019-06-11 | 艾克斯特朗欧洲公司 | 用于高性能涂层的沉积的方法以及封装的电子器件 |
DE102013110394B4 (de) * | 2013-09-20 | 2016-10-27 | NMI Naturwissenschaftliches und Medizinisches Institut an der Universität Tübingen | Chirurgisches Instrument mit einer spannungsfesten, elektrisch isolierenden Beschichtung |
US9378941B2 (en) * | 2013-10-02 | 2016-06-28 | Applied Materials, Inc. | Interface treatment of semiconductor surfaces with high density low energy plasma |
US9984915B2 (en) | 2014-05-30 | 2018-05-29 | Infineon Technologies Ag | Semiconductor wafer and method for processing a semiconductor wafer |
TWI658943B (zh) * | 2014-06-04 | 2019-05-11 | 日商琳得科股份有限公司 | 氣阻性層積體及其製造方法、電子裝置用元件以及電子裝置 |
JP6571389B2 (ja) * | 2015-05-20 | 2019-09-04 | シャープ株式会社 | 窒化物半導体発光素子およびその製造方法 |
KR102743683B1 (ko) * | 2018-05-04 | 2024-12-18 | 지앙수 페이보레드 나노테크놀로지 컴퍼니., 리미티드 | 전기 디바이스에 대한 나노-코팅 보호 방법 |
CN108511629A (zh) * | 2018-05-31 | 2018-09-07 | 京东方科技集团股份有限公司 | Oled显示基板及其制作方法、显示装置 |
DE102019206388A1 (de) * | 2019-05-03 | 2020-11-05 | Neuroloop GmbH | Implantierbare elektrische Kontaktanordnung |
KR20220124305A (ko) * | 2021-03-02 | 2022-09-14 | 삼성디스플레이 주식회사 | 표시 장치, 이의 제조 방법 및 이를 포함하는 타일형 표시 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006068992A (ja) * | 2004-09-01 | 2006-03-16 | Konica Minolta Holdings Inc | ガスバリア性フィルム |
US20060208634A1 (en) * | 2002-09-11 | 2006-09-21 | General Electric Company | Diffusion barrier coatings having graded compositions and devices incorporating the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5654084A (en) * | 1994-07-22 | 1997-08-05 | Martin Marietta Energy Systems, Inc. | Protective coatings for sensitive materials |
SE9601154D0 (sv) * | 1996-03-26 | 1996-03-26 | Pacesetter Ab | Aktivt implantat |
US5858477A (en) * | 1996-12-10 | 1999-01-12 | Akashic Memories Corporation | Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon |
US6066399A (en) * | 1997-03-19 | 2000-05-23 | Sanyo Electric Co., Ltd. | Hard carbon thin film and method of forming the same |
WO1999046765A1 (fr) * | 1998-03-13 | 1999-09-16 | Hitachi, Ltd. | Support d'enregistrement magnetique et memoire magnetique |
EP2261956A3 (de) * | 2001-09-17 | 2011-03-30 | Advion BioSystems, Inc. | Dielektrische Schicht |
DE10152055A1 (de) * | 2001-10-25 | 2003-05-08 | Nttf Gmbh | Mechanisch und thermodynamisch stabile amorphe Kohlenstoffschichten für temperaturempfindliche Oberflächen |
US6875664B1 (en) * | 2002-08-29 | 2005-04-05 | Advanced Micro Devices, Inc. | Formation of amorphous carbon ARC stack having graded transition between amorphous carbon and ARC material |
DE10242086A1 (de) * | 2002-09-11 | 2004-04-15 | Sig Technology Ltd. | Behälter zur Verpackung von Produkten, Vorrichtung zur Verarbeitung von Kunstoff sowie Verfahren zur Behälterherstellung |
EP1589916A2 (de) * | 2003-02-07 | 2005-11-02 | Optobionics Corporation | Implantat mit kristalliner kohlenstoff-beschichtung |
TW579569B (en) * | 2003-02-11 | 2004-03-11 | Au Optronics Corp | Multi-level diffusion barrier layer structure of TFT LCD and manufacturing method thereof |
WO2005097673A1 (ja) * | 2004-03-30 | 2005-10-20 | Toyo Advanced Technologies Co., Ltd. | 基材の表面処理方法及び表面処理された基材、医療用材料、医療用器具 |
US20070020451A1 (en) * | 2005-07-20 | 2007-01-25 | 3M Innovative Properties Company | Moisture barrier coatings |
-
2008
- 2008-02-22 EP EP08707792A patent/EP2137337A2/de not_active Withdrawn
- 2008-02-22 US US12/528,320 patent/US20110122486A1/en not_active Abandoned
- 2008-02-22 WO PCT/EP2008/001388 patent/WO2008101704A2/de active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060208634A1 (en) * | 2002-09-11 | 2006-09-21 | General Electric Company | Diffusion barrier coatings having graded compositions and devices incorporating the same |
JP2006068992A (ja) * | 2004-09-01 | 2006-03-16 | Konica Minolta Holdings Inc | ガスバリア性フィルム |
Also Published As
Publication number | Publication date |
---|---|
WO2008101704A2 (de) | 2008-08-28 |
US20110122486A1 (en) | 2011-05-26 |
EP2137337A2 (de) | 2009-12-30 |
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