+

WO2008156760A1 - Module frontal duplex par répartition dans le temps - Google Patents

Module frontal duplex par répartition dans le temps Download PDF

Info

Publication number
WO2008156760A1
WO2008156760A1 PCT/US2008/007542 US2008007542W WO2008156760A1 WO 2008156760 A1 WO2008156760 A1 WO 2008156760A1 US 2008007542 W US2008007542 W US 2008007542W WO 2008156760 A1 WO2008156760 A1 WO 2008156760A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
receive
power amplifier
circuit board
signals
Prior art date
Application number
PCT/US2008/007542
Other languages
English (en)
Inventor
Thomas Knecht
Glen Reeser
Original Assignee
Cts Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/823,735 external-priority patent/US20080153451A1/en
Application filed by Cts Corporation filed Critical Cts Corporation
Priority to CN2008900000673U priority Critical patent/CN201590820U/zh
Publication of WO2008156760A1 publication Critical patent/WO2008156760A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching

Definitions

  • the invention relates to a module and, more particularly, to a time division duplex radio frequency (RF) module adapted for use on the front end of a cellular base station such as, for example, a WiMax wireless femtocell communication base station.
  • RF radio frequency
  • macrocells which today sit atop cellular/wireless towers, operate at approximately 1 ,000 watts.
  • the coverage of macrocells is in miles.
  • Microcells which are smaller in size than macrocells, are adapted to sit atop telephone poles, for example, and the coverage is in blocks. Microcells operate at approximately 20 watts. A smaller yet microcell requires about 5 watts of power to operate.
  • Picocells are base stations approximately 8" x 18" in size, are adapted for deployment inside buildings such as shopping malls, office buildings or the like, and output about .25 watts of power. The coverage of a picocell is about 50 yards. Femtocells output about .10 watts of power and are used in the home.
  • All of the picocells and microcells in use today include a "motherboard" upon which various electrical components have been individually mounted by the customer.
  • a front end portion of the motherboard i.e., the RF transceiver section thereof located roughly between the picocell antenna and mixers thereof
  • the node B local area front end i.e., a portion of the femtocell, picocell, or microcell on which all the radio frequency control electrical components such as, for example, the filters, amplifiers, couplers, inductors and the like have been individually mounted and interconnected.
  • the present invention provides a compact front end RF component module particularly adapted and structured for the transmission and reception of WiMax signals which addresses and solves the above-identified needs.
  • the present invention relates generally to a radio frequency (RF) module adapted for use on the front end of a wireless base station such as a femtocell, picocell, or microcell base station.
  • the RF module includes a printed circuit board/substrate having a plurality of electrical components mounted directly thereto and adapted to allow for the transmission and reception of wireless signals between the antenna of the cell on one end and the respective input and output pads on the motherboard of the cell at the other end.
  • a first section on the printed circuit board/substrate defines a transmit path for RF signals and includes at least the following electrical components mounted thereon: a power amplifier, a coupler and a lowpass filter.
  • the module includes a second section on the printed circuit board/substrate which defines a receive path for RF signals and includes at least the following electrical components mounted thereon: a receive bandpass filter and a low-noise amplifier.
  • An RF single pole double throw (SPDT) switch is located between and interconnects the respective transmit (Tx) and receive (Rx) sections to an antenna pin.
  • a lid is adapted to cover selected ones of the electrical components mounted to the printed circuit board. At least the power amplifier is preferably located outside the lid. A plurality of through-holes or vias located below the amplifier are adapted to define a sink for heat created by the power amplifier.
  • FIGURE 1 is a simplified block diagram depicting the flow of wireless signals being transmitted and received through the various RF components defining the time division duplex front end module of the present invention
  • FIGURE 2 is an enlarged simplified perspective view of a time division duplex front end module in accordance with the present invention
  • FIGURE 3 is an enlarged simplified plan view of the front or top surface of the printed circuit board of the front end module of the present invention with the lid removed therefrom;
  • FIGURE 4 is an enlarged simplified plan view of the back or bottom surface of the printed circuit board of the front end module of the present invention. Detailed Description of the Preferred Embodiment
  • FIGURE 1 is a simplified block diagram of the RF (radio frequency) front end module, generally designated 20, constructed in accordance with the present invention and adapted for use in connection with a wireless base station including, for example, a WiMax femtocell, picocell, or microcell.
  • the TDD (time division duplex) WiMax front end module 20 utilizes filtering with two filters: a receive Rx bandpass filter 36, and a transmit Tx lowpass filter 28.
  • the module 20 also includes a power amplifier (PA) 26, a low-noise amplifier (LNA) 39 and other appropriate RF components. In the embodiment shown, all of the appropriate RF components are of the discrete surface-mountable type.
  • PA power amplifier
  • LNA low-noise amplifier
  • Module 20 is adapted to replace all of the discrete RF components that would be typically individually mounted and used in a WiMax Node B local area front end. Module 20 allows customers to select different values for receiver sensitivity, selectivity, and output power. Moreover, module 20 is RoHS compliant and lead-free. Some of the features of the module 20 as introduced above and described in more detail below include the scalable power amplifier 26 capable of delivering about 25 dBm at the antenna port; the above-identified filters 28 and 36 offering excellent isolation and harmonic suppression; and the low noise amplifier 39.
  • Table 1 summarizes the proposed operational parameters and characteristics of the time division duplex front end module of the present invention: TABLE 1
  • module 20 is defined by a plurality of RF electrical components and pins associated with a substrate 22 and defining respective RF signal transmit and receive sections or paths.
  • the lower RF transmit section or path of module 20 includes a first Tx (transmit) signal input pin 17 adapted to be coupled to a corresponding Tx (transmit) signal pad on the motherboard (not shown) of a picocell or microcell.
  • Pin 17 in turn is coupled to a Tx PA (transmit power amplifier) 26 which, in turn, is coupled to a coupler 30 which, in turn, is coupled to a Tx LPF (transmit low pass filter) 28.
  • Tx PA transmit power amplifier
  • VPA power amplifier supply voltage
  • PA bias is adapted to be measured through pin 1 coupled to power amplifier 26.
  • a portion of the transmit signal is split off from coupler 30 and passed to a power detect pin 3.
  • the Tx LPF 28 is, in turn, coupled to an RF SPDT (single pole double throw) switch 29.
  • the switch 29 is coupled to an antenna via antenna pin 11.
  • Voltage is supplied to the module 20 through the V supply (voltage supply) pin 9 coupled to switch 29.
  • the voltage supplied to module 20 is controlled via and through VCT R L (voltage control) pin 13, also coupled to the switch 29.
  • the VC T R L pin 13 can be omitted and the switching function can be facilitated with the use of only one voltage input pin (i.e., pin 9).
  • the Tx (transmit) RF wireless signal is adapted to travel from the femtocell/picocell/microcell motherboard into and up through the substrate 22 of module 20 via Tx input pin 17 extending between the lower and upper substrate surfaces, and then from Tx input pin 17 into and through power amplifier 26, coupler 30, lowpass filter 28, switch 29, antenna pin 11 , and then back down through the substrate 22 via antenna pin 11 extending between the upper and lower substrate surfaces and into the motherboard antenna pad in direct surface contact with module antenna pin 11.
  • the top receive section or path of the signals being received i.e., Rx signals
  • Rx signals signals being received
  • FIGURES 1-4 shows the Rx signal being transmitted and passed in a left to right, clockwise direction from the picocell or microcell antenna (not shown) through the module antenna pin 11 and then initially through the switch 29.
  • Switch 29 is, of course, adapted and structured as known in the art to allow the same to switch from the passage of Tx signals out of the module 20 through the antenna pin 11 to the passage of Rx signals into and through the module 20 from the antenna pin 11.
  • the Rx signal is adapted to pass and travel in a general clockwise direction through the switch 29 and into Rx bandpass filter 36 and LNA (low noise amplifier) 39. Voltage is supplied to low noise amplifier 39 via LNA supply voltage pin 8 coupled thereto.
  • the Rx signal then passes through Rx O/P (output) signal pin 7 which, in turn, is adapted to extend between the front and back surfaces 23 and 27 of the module 20 for direct surface coupling to the corresponding Rx output signal pad (not shown) on the motherboard of the picocell or microcell.
  • FIGURES 2-4 depict one simplified embodiment of a module 20 adapted and structured to be direct surface mounted to the front end of a WiMax TDD (time division duplex) femtocell, picocell, or microcell. It is understood, however, that the module embodiment of FIGURES 2-4 differs from the module embodiment of FIGURE 1 in that, in the FIGURES 2-4 embodiment, PA power is detected through the use of a VDET pin 3 instead of a coupler as in the FIGURE 1 embodiment.
  • WiMax TDD time division duplex
  • module 20 of the present invention as depicted in FIGURES 2-4 measures about 19.0mm in width, 27.0mm in length, and 6.0mm max. in height (with the lid secured thereon), and is adapted to be mounted to the motherboard of a WiMax picocell measuring about 8 inches by 18 inches which, as described above, is adapted for use as a wireless signal transfer base station inside a building such as a shopping mall or office complex.
  • module 20 initially comprises a printed circuit board or substrate 22 which, in the embodiment shown, is preferably made of multiple layers of GETEK® or the like dielectric material and is about 1 mm (i.e., .040 inches) in thickness.
  • a printed circuit board or substrate 22 which, in the embodiment shown, is preferably made of multiple layers of GETEK® or the like dielectric material and is about 1 mm (i.e., .040 inches) in thickness.
  • predetermined regions of both the upper and lower surfaces 23 and 27 of the substrate 22 are covered with copper or the like material and solder mask material, both of which have been applied thereto and/or selectively removed therefrom as is known in the art to create the desired copper, dielectric, and solder mask regions and electrical circuits which interconnect the various electrical components.
  • the metallization system is preferably ENIG 1 electroless nickel/immersion gold over copper.
  • a lid 45 (FIGURE 2), which is adapted to cover a portion of the top surface 23 of the printed circuit board 22, is preferably brass with a Cu/Ni/Sn (copper/nickel/tin) plated material for ROHS compliance purposes. Lid 45 is adapted to act both as a dust cover and a Faraday shield.
  • substrate 22 has top or front surface 23 (FIGURES 2 and 3), a bottom or back surface 27 (FIGURE 4), and an outer peripheral circumferential edge defining respective upper and lower faces or edges 42 and 44 and side faces or edges 46 and 48 (FIGURES 2-5).
  • substrate 22 will be comprised of a plurality of stacked laminate layers of suitable dielectric material sandwiched between respective layers of conductive material as is known in the art such as, for example, a bottom RF ground plane layer, an RF intermediate signal layer, a top RF ground layer, and a topmost DC/RF layer plus ground layer.
  • Castellations 35 are defined and located about the outer peripheral edge of board 22.
  • Castellations 35 define the various ground and DC voltage input/output pins of the module 20.
  • Castellations 35 are defined by metallized semicircular grooves which have been carved out of the respective edges 42, 44, 46 and 48 and extend between the respective top and bottom surfaces 23 and 27 of the substrate 22.
  • the castellations 35 are defined by plated through-holes which have been cut in half during manufacturing of the substrates from an array.
  • Castellations 35 extend along the length of the respective edges of substrate 22 in spaced-apart and parallel relationship.
  • the top substrate edge 42 defines seven spaced-apart castellations 35
  • the lower substrate edge 44 defines five spaced-apart castellations 35
  • the side substrate edge 46 defines three castellations 35
  • the opposed side substrate edge 48 defines one castellation 35.
  • each of the respective castellations 35 is coated as by electroplating or the like, with a layer of copper or the like conductive material which is initially applied to all of the surfaces of the substrate 22 during the manufacturing of the substrate 22 as is known in the art and then removed from selected portions of the surfaces to define the copper coated castellations 35.
  • Castellations 35 and, more specifically, the copper thereon creates an electrical path between top surface 23 and bottom or back surface 27 of substrate 22.
  • the copper extends around both the top and bottom edges of each of the castellations 35 to define pads of copper or the like conductive material on the top surface 23 of substrate 22 and surrounding the top or front edge of each of the respective castellations 35; and a plurality of pads extending inwardly from the bottom or back edge of each of the castellations 35 on the bottom surface 27 of substrate 22 which allow the module 20 to be directly surface mounted by reflow soldering or the like, to corresponding pads located on the surface of the motherboard of the picocell (not shown).
  • respective ones of the castellations define respective voltage input/output pins while other ones of the castellations 35 define pins adapted for direct coupling to the ground copper layer applied to both of the surfaces 23 and 27.
  • Conductive vias 38 defined in the board 22 define the respective RF component signal input/output and antenna pins 7, 11 , and 17 of the module 20.
  • Vias 38 extend through the substrate 22 between the substrate surfaces 23 and 27 thereof and, as known in the art, define an interior cylindrical surface which has been plated with copper or the like conductive material.
  • the use of vias 38 which are spaced from the respective substrate edges instead of castellations 35 defined in respective substrate edges insures a constant 50-ohm characteristic impedance.
  • Pinouts 1 and 3 extend along the bottom longitudinal edge 44 of board 22.
  • Pinout 7 extends along the side longitudinal edge 48.
  • Pinouts 8, 9, and 13 extend along the top longitudinal edge 42 of board 22.
  • Pinout 17 extends along the side longitudinal edge 46 of board 22.
  • power amplifier 26 (together with the other components which are part of the Tx signal path) is preferably located in an area of the printed circuit board 22 not intended to be covered by the lid 45, to allow for the dissipation of heat created by the amplifier 26 and also to reduce the transfer of heat created by the amplifier 26 to any of the electrical components located under the lid 45. More specifically, it is understood that, in the preferred embodiment, power amplifier 26 is generally centrally located on the left hand half of the top or front surface 23 of the substrate/board 22. Pinout 13 extends generally opposite the top edge of power amplifier 26 along longitudinal board edge 42. Pinouts 1 and 3 extend generally along the bottom edge of power amplifier 26 along the length of bottom longitudinal board edge 44.
  • Pinout 17 extends generally opposite the left side edge of power amplifier 26 along (but spaced inwardly from) board side edge 46.
  • a first set of appropriate resistors and capacitors 101 , 102, 103, 104, 105, 106, and 107 are all generally located and fixed on the top or front surface 23 of board 22 generally below the power amplifier 26 and, more specifically, between the power amplifier 26 and the lower longitudinal edge 44 of board 22.
  • 109, 110, 111 , 112, and 113 are all generally located and fixed on the top or front surface 23 of the board 22 to the left of the power amplifier 26 and, more specifically, between the power amplifier 26 and the left side longitudinal edge 46 of the board 22.
  • 117 are all generally located and fixed on the top or front surface 23 of the board 22 generally above the top edge of power amplifier 26 and, more specifically, between the power amplifier 26 and the top longitudinal edge 42 of board 22.
  • Tx low pass filter 28 is located and fixed on the left half of the top or front surface 23 of the board 22 generally between the right side edge of the power amplifier 26 and the left edge of the lid 45.
  • Capacitors 122 and 123 are located the top surface 23 of the board 22 generally above Tx low pass filter 28 and, more specifically, between the Tx low pass filter 28 and the top longitudinal edge 42 of board 22.
  • RF switch 29, Rx bandpass filter 36, and Rx low noise amplifier 39 are all generally located on the right half of the board 22 and adapted to be located below the lid 45. More specifically, Rx bandpass filter 36 is seated on and covers a substantial portion of the lower portion of the right half of the top or front surface 23 of the board 22. RF switch 29 and Rx low noise amplifier 39 are both generally located above the Rx bandpass filter 36 and, more specifically, between the top longitudinal edge of the Rx bandpass filter 36 and the top longitudinal edge 42 of the board 22.
  • Pinout 7 extending along (but spaced inwardly from) the board side edge 48 is located generally opposite the right side edge of the Rx low noise amplifier 39.
  • Pinout 11 extending along (but spaced inwardly from) the board top longitudinal edge 42 is located generally opposite the top edge of the RF switch 29.
  • lid 45 includes a top wall or roof 46, a first pair of respective opposed side walls 49a and 49b, and a second pair of respective opposed side walls 51a and 51 b, all adapted to depend and extend generally perpendicularly downwardly from the peripheral edges of the roof 46 to define the lid when the walls are folded during assembly.
  • Each of the walls 49a, 49b, 51a and 51 b in turn defines a lower longitudinal terminal edge 53.
  • each of the side walls 49a and 49b in turn defines at least two spaced-apart tabs 50a and 50b projecting downwardly therefrom and adapted to be fitted into respective through-slots or castellations 37 defined in the top surface 23 of the board 22 for locating and securing the lid 45 to the board 22 in a grounded relationship with the board 22 wherein the edges 53 of the respective lid walls 49a, 49b, 51a and 51 b are seated over respective elongate ground strips (not shown) defined on the board top surface 23, thus providing and defining a grounded lid 45.
  • a plurality of through-holes or vias 136 are defined and formed on the board 22 beneath the region where the power amplifier 26 is seated on the board 22 to define a heat sink for the heat created by power amplifier 26.
  • Through-holes 136 could be double-plated with copper or the like material for added thermal conductivity and likewise extend through the board 22.
  • the process for assembling a module 20 involves the following steps. After the substrate/board 22 has been fabricated, i.e., once all of the appropriate and desired copper castellations, copper strips, copper vias, copper pads, and copper through-holes have been formed thereon as known in the art, Ag/Sn (silver/tin) solder is screen printed onto a 2.6" by 4.6" printed circuit board array and, more particularly, onto the surface of each of the appropriate solder pads and strips defined on the array following the application of predetermined layers and strips of solder mask material as known in the art. Solder is applied to the surface of all of the designated copper strips, pads and regions and all of the desired and appropriate electrical components including all of the filters defining the module 20 are then appropriately placed and located on the array.
  • Ag/Sn (silver/tin) solder is screen printed onto a 2.6" by 4.6" printed circuit board array and, more particularly, onto the surface of each of the appropriate solder pads and strips defined on the array following the application of predetermined layers and strips
  • the lid 45 is then placed over the appropriate portion of the board 22 as described above into a soldered coupled relationship wherein the tabs 50a and 50b thereof are fitted into appropriate castellations/slots 37 defined in the board 22 thereby appropriately locating and securing the lid 45 to the board 22.
  • the module 20 is then reflow soldered at a maximum temperature of 260 0 C so as to couple all of the components and lid 45 to the board. Finally, the array is diced up as is known in the art and the individual modules 20 are then final tested and subsequently "taped and reeled" and readied for shipment. While the invention has been taught with specific reference to an embodiment of the module adapted for use on the front end of a picocell, it is understood that someone skilled in the art will recognize that changes can be made in form and detail such as, for example, to the selection, number, placement, interconnection values, and patterns of the various RF elements and circuits, without departing from the spirit and the scope of the invention as defined in the appended claims. The described embodiment is to be considered in all respects only as illustrative of one embodiment and not restrictive.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)

Abstract

L'invention concerne un module HF conçu pour un montage direct en surface sur la surface supérieure de la partie frontale de la carte mère d'une station de base sans fil telle, par exemple, qu'une cellule à l'échelle femtométrique. Le module comprend une carte à circuit imprimé comportant une pluralité de composants électriques montés directement en surface définissant des sections respectives d'émission et de réception de signal pour des signaux HF. La section d'émission de signal est définie par au moins un amplificateur de puissance, un coupleur et un filtre passe-bas. La section de réception de signal est définie par au moins un filtre passe-bande de réception et un amplificateur à faible bruit. Un couvercle recouvre des composants sélectionnés parmi les composants électriques à l'exception d'au moins l'amplificateur de puissance. Un commutateur HF est situé entre les sections respectives d'émission et de réception et il les interconnecte à une broche d'antenne.
PCT/US2008/007542 2007-06-19 2008-06-17 Module frontal duplex par répartition dans le temps WO2008156760A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008900000673U CN201590820U (zh) 2007-06-19 2008-06-17 时分双工前端模块

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US93620107P 2007-06-19 2007-06-19
US60/936,201 2007-06-19
US11/823,735 2007-06-28
US11/823,735 US20080153451A1 (en) 2006-06-14 2007-06-28 RF Rx front end module for picocell and microcell base station transceivers

Publications (1)

Publication Number Publication Date
WO2008156760A1 true WO2008156760A1 (fr) 2008-12-24

Family

ID=39711026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/007542 WO2008156760A1 (fr) 2007-06-19 2008-06-17 Module frontal duplex par répartition dans le temps

Country Status (3)

Country Link
KR (1) KR20100035139A (fr)
CN (1) CN201590820U (fr)
WO (1) WO2008156760A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010093574A1 (fr) * 2009-02-10 2010-08-19 Cts Corporation Module frontal de duplexage par répartition temporelle
CN102301608A (zh) * 2009-01-29 2011-12-28 株式会社村田制作所 双工器模块
EP2408121A1 (fr) * 2009-03-13 2012-01-18 Huawei Technologies Co., Ltd. Unité de radiofréquence et antenne intégrée
US20130315116A1 (en) * 2012-05-23 2013-11-28 Wistron Neweb Corp. Rf circuit system and method of increasing the isolation between two wireless communications standards within an rf circuit system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103560311B (zh) * 2013-10-29 2015-03-11 成都九华圆通科技发展有限公司 小型化、高稳定性射频信号输出模块

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993014573A1 (fr) * 1992-01-21 1993-07-22 Motorola, Inc. Architecture radio integree
EP0736978A2 (fr) * 1995-04-07 1996-10-09 Lk-Products Oy Récepteur et transmetteur des signaux radio
WO2001005048A1 (fr) * 1999-07-14 2001-01-18 Filtronic Lk Oy Structure de circuit preamplificateur hf
US6310705B1 (en) * 1997-08-14 2001-10-30 Samsung Electronics Co., Ltd. Duplex outdoor base station transceiver subsystem utilizing a hybrid system of a high power amplifier and an optic antenna
US20010043130A1 (en) * 2000-05-19 2001-11-22 Hitachi, Ltd. Directional coupler, high frequency circuit module and wireless communication system
US20040240420A1 (en) * 2003-02-14 2004-12-02 Tdk Corporation Front end module and high-frequency functional module
US20050104685A1 (en) * 2003-10-08 2005-05-19 Kyocera Corporation High-frequency module and communication apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993014573A1 (fr) * 1992-01-21 1993-07-22 Motorola, Inc. Architecture radio integree
EP0736978A2 (fr) * 1995-04-07 1996-10-09 Lk-Products Oy Récepteur et transmetteur des signaux radio
US6310705B1 (en) * 1997-08-14 2001-10-30 Samsung Electronics Co., Ltd. Duplex outdoor base station transceiver subsystem utilizing a hybrid system of a high power amplifier and an optic antenna
WO2001005048A1 (fr) * 1999-07-14 2001-01-18 Filtronic Lk Oy Structure de circuit preamplificateur hf
US20010043130A1 (en) * 2000-05-19 2001-11-22 Hitachi, Ltd. Directional coupler, high frequency circuit module and wireless communication system
US20040240420A1 (en) * 2003-02-14 2004-12-02 Tdk Corporation Front end module and high-frequency functional module
US20050104685A1 (en) * 2003-10-08 2005-05-19 Kyocera Corporation High-frequency module and communication apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102301608A (zh) * 2009-01-29 2011-12-28 株式会社村田制作所 双工器模块
WO2010093574A1 (fr) * 2009-02-10 2010-08-19 Cts Corporation Module frontal de duplexage par répartition temporelle
EP2408121A1 (fr) * 2009-03-13 2012-01-18 Huawei Technologies Co., Ltd. Unité de radiofréquence et antenne intégrée
EP2408121A4 (fr) * 2009-03-13 2012-03-14 Huawei Tech Co Ltd Unité de radiofréquence et antenne intégrée
US8971824B2 (en) 2009-03-13 2015-03-03 Huawei Technologies Co., Ltd. Radio frequency unit and integrated antenna
US20130315116A1 (en) * 2012-05-23 2013-11-28 Wistron Neweb Corp. Rf circuit system and method of increasing the isolation between two wireless communications standards within an rf circuit system
US8797927B2 (en) * 2012-05-23 2014-08-05 Wistron Neweb Corp. RF circuit system and method of increasing the isolation between two wireless communications standards within an RF circuit system

Also Published As

Publication number Publication date
KR20100035139A (ko) 2010-04-02
CN201590820U (zh) 2010-09-22

Similar Documents

Publication Publication Date Title
US7855983B2 (en) Time division duplex front end module
US7983624B2 (en) RF front-end module for picocell and microcell base station transceivers
US20100289599A1 (en) High Performance RF Rx Module
US20100203922A1 (en) Time Division Duplex Front End Module
US7515879B2 (en) Radio frequency circuit module
KR101183272B1 (ko) Ｒｆ/무선 다중 대역 응용들을 위한 액정 폴리머 및 다층폴리머 기반 수동 신호 처리 부품들
JP3941911B2 (ja) 集積ｒｆ性能を備えたマルチチップモジュール
US7724109B2 (en) Ball grid array filter
EP1387369A1 (fr) Dispositif a module haute frequence
EP2503858B1 (fr) Circuit diplexeur et procédé de fabrication d'une carte de circuit imprimé correspondante
US9484608B2 (en) Switch module
CN110011010B (zh) 用于低通滤波器的带状线结构、低通滤波器、通信装置及系统
WO2008156760A1 (fr) Module frontal duplex par répartition dans le temps
US20080153451A1 (en) RF Rx front end module for picocell and microcell base station transceivers
JP4508194B2 (ja) モジュール
JP2004304435A (ja) マルチバンド無線通信モジュールおよびマルチバンド無線通信端末機
EP2050197A1 (fr) MODULE FRONTAL RF Rx POUR ÉMETTEURS-RÉCEPTEURS DE STATION DE BASE À PICOCELLULE ET MICROCELLULE
JP4307183B2 (ja) スイッチモジュールおよびこれを用いた電子機器
CN114678701B (zh) 一种毫米波可切换mimo天线单元及天线阵列
JP3937943B2 (ja) 無線機
JP2005167624A (ja) 積層型電子部品、無線装置
Hori et al. New multilayer techniques actualizing active antenna hardware for wireless communication systems
JP2005167625A (ja) 積層型電子部品、無線装置
KR20070040857A (ko) Ｒｆ통신모듈
KR20100024308A (ko) 다층 기판 구조의 통신모듈

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200890000067.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08768541

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097027265

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08768541

Country of ref document: EP

Kind code of ref document: A1

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载