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WO2008152833A1 - Curable composition and optical device - Google Patents

Curable composition and optical device Download PDF

Info

Publication number
WO2008152833A1
WO2008152833A1 PCT/JP2008/053439 JP2008053439W WO2008152833A1 WO 2008152833 A1 WO2008152833 A1 WO 2008152833A1 JP 2008053439 W JP2008053439 W JP 2008053439W WO 2008152833 A1 WO2008152833 A1 WO 2008152833A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
optical device
compound
temperature
anoptical
Prior art date
Application number
PCT/JP2008/053439
Other languages
French (fr)
Japanese (ja)
Inventor
Seiji Nakajima
Tomohiro Fukuhara
Mitsuo Ito
Naoki Masutani
Hiroyuki Terai
Original Assignee
Omron Corporation
Toagosei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation, Toagosei Co., Ltd. filed Critical Omron Corporation
Publication of WO2008152833A1 publication Critical patent/WO2008152833A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L13/00—Compositions of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A curable composition which comprises: a bisphenol A epoxy compound (A-1) modified with a carboxy-terminated butadiene/nitrile rubber and/or an epoxidized polybutadiene compound (A-2); and a cationically polymerizable compound (B) other than the compounds (A-1) and (A-2). The curable composition is characterized by giving a cured object which has a refractive index as measured at 25°C and 589 nm of 1.40-1.60. This curable composition enables an optical device to be kept bonded over long without suffering any trouble such as separation even in a high-temperature environment or high-temperature high-humidity environment. Also provided is anoptical device made with the curable composition.
PCT/JP2008/053439 2007-06-14 2008-02-27 Curable composition and optical device WO2008152833A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-157987 2007-06-14
JP2007157987A JP5401767B2 (en) 2007-06-14 2007-06-14 Curable composition and optical device

Publications (1)

Publication Number Publication Date
WO2008152833A1 true WO2008152833A1 (en) 2008-12-18

Family

ID=40129446

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053439 WO2008152833A1 (en) 2007-06-14 2008-02-27 Curable composition and optical device

Country Status (2)

Country Link
JP (1) JP5401767B2 (en)
WO (1) WO2008152833A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150422A (en) * 2008-12-25 2010-07-08 Toagosei Co Ltd Adhesive composition
JP2010265360A (en) * 2009-05-13 2010-11-25 Nitto Denko Corp Resin composition for optical part and optical part using the same
JP2012001689A (en) * 2010-06-21 2012-01-05 Adeka Corp Photocurable resin composition
JP2012121980A (en) * 2010-12-08 2012-06-28 Ube Industries Ltd Modified homopolymeric diene rubber and method for producing the same, and rubber composition using the same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5446902B2 (en) * 2009-03-05 2014-03-19 Ｄｉｃ株式会社 Cationic polymerizable adhesive and polarizing plate obtained using the same
JP5351850B2 (en) * 2010-07-30 2013-11-27 日立電線株式会社 Optical module
JP5697927B2 (en) * 2010-09-03 2015-04-08 株式会社日本触媒 Optical adhesive composition
JP2012082261A (en) * 2010-10-07 2012-04-26 Kaneka Corp Photocurable composition and cured product of the same
WO2013027833A1 (en) * 2011-08-25 2013-02-28 東洋インキＳｃホールディングス株式会社 Photopolymerizable composition, photopolymerizable coating agent, laminate, and polarizing plate
JP5304859B2 (en) * 2011-08-25 2013-10-02 東洋インキＳｃホールディングス株式会社 Photopolymerizable composition and use thereof
JP5967654B2 (en) * 2012-11-28 2016-08-10 日本化薬株式会社 Resin composition and cured product thereof (2)
JP6284721B2 (en) * 2013-08-26 2018-02-28 株式会社Adeka Energy ray sensitive composition
WO2017018279A1 (en) * 2015-07-27 2017-02-02 株式会社Adeka Resin composition and cured object
JP6880809B2 (en) * 2016-12-09 2021-06-02 東亞合成株式会社 Composition for active energy ray-curable encapsulant
CN119256254A (en) * 2022-06-16 2025-01-03 松下知识产权经营株式会社 Optical waveguide connection method and optical waveguide connection device
WO2024204230A1 (en) * 2023-03-29 2024-10-03 三井化学株式会社 Resin composition, liquid crystal sealing agent, and liquid crystal display panel using same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136563A (en) * 1984-12-07 1986-06-24 Toyo Ink Mfg Co Ltd Photo-curing adhesive composition and bonding using same
JPS61213217A (en) * 1985-03-19 1986-09-22 Nippon Soda Co Ltd Photosetting resin composition for sealing
JPS6296579A (en) * 1985-10-24 1987-05-06 Nippon Soda Co Ltd Photocurable adhesive for optical disk memory
JP2001040068A (en) * 1999-07-27 2001-02-13 Asahi Denka Kogyo Kk Photopolymerizable composition
WO2003087187A1 (en) * 2002-04-15 2003-10-23 Toagosei Co., Ltd. Actinic radiation hardenable resin composition and hardening product thereof
JP2005042052A (en) * 2003-07-24 2005-02-17 Sekisui Chem Co Ltd Photo-cationically polymerizable composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136563A (en) * 1984-12-07 1986-06-24 Toyo Ink Mfg Co Ltd Photo-curing adhesive composition and bonding using same
JPS61213217A (en) * 1985-03-19 1986-09-22 Nippon Soda Co Ltd Photosetting resin composition for sealing
JPS6296579A (en) * 1985-10-24 1987-05-06 Nippon Soda Co Ltd Photocurable adhesive for optical disk memory
JP2001040068A (en) * 1999-07-27 2001-02-13 Asahi Denka Kogyo Kk Photopolymerizable composition
WO2003087187A1 (en) * 2002-04-15 2003-10-23 Toagosei Co., Ltd. Actinic radiation hardenable resin composition and hardening product thereof
JP2005042052A (en) * 2003-07-24 2005-02-17 Sekisui Chem Co Ltd Photo-cationically polymerizable composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150422A (en) * 2008-12-25 2010-07-08 Toagosei Co Ltd Adhesive composition
JP2010265360A (en) * 2009-05-13 2010-11-25 Nitto Denko Corp Resin composition for optical part and optical part using the same
JP2012001689A (en) * 2010-06-21 2012-01-05 Adeka Corp Photocurable resin composition
JP2012121980A (en) * 2010-12-08 2012-06-28 Ube Industries Ltd Modified homopolymeric diene rubber and method for producing the same, and rubber composition using the same

Also Published As

Publication number Publication date
JP5401767B2 (en) 2014-01-29
JP2008308588A (en) 2008-12-25

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