WO2008149987A1 - パターニング方法 - Google Patents
パターニング方法 Download PDFInfo
- Publication number
- WO2008149987A1 WO2008149987A1 PCT/JP2008/060480 JP2008060480W WO2008149987A1 WO 2008149987 A1 WO2008149987 A1 WO 2008149987A1 JP 2008060480 W JP2008060480 W JP 2008060480W WO 2008149987 A1 WO2008149987 A1 WO 2008149987A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- sacrifice
- thin film
- patterned
- patterning method
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000000059 patterning Methods 0.000 title abstract 2
- 239000010408 film Substances 0.000 abstract 6
- 239000010409 thin film Substances 0.000 abstract 4
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 229910003697 SiBN Inorganic materials 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3088—Process specially adapted to improve the resolution of the mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020097005558A KR101291766B1 (ko) | 2007-06-07 | 2008-06-06 | 패터닝 방법 |
US12/441,741 US7754622B2 (en) | 2007-06-07 | 2008-06-06 | Patterning method utilizing SiBN and photolithography |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007151065 | 2007-06-07 | ||
JP2007-151065 | 2007-06-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008149987A1 true WO2008149987A1 (ja) | 2008-12-11 |
Family
ID=40093791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/060480 WO2008149987A1 (ja) | 2007-06-07 | 2008-06-06 | パターニング方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7754622B2 (ja) |
JP (1) | JP4589983B2 (ja) |
KR (1) | KR101291766B1 (ja) |
TW (1) | TWI376745B (ja) |
WO (1) | WO2008149987A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219106A (ja) * | 2009-03-13 | 2010-09-30 | Tokyo Electron Ltd | 基板処理方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011040561A (ja) * | 2009-08-11 | 2011-02-24 | Tokyo Electron Ltd | 半導体装置の製造方法。 |
US8343881B2 (en) | 2010-06-04 | 2013-01-01 | Applied Materials, Inc. | Silicon dioxide layer deposited with BDEAS |
CN102064096B (zh) * | 2010-12-03 | 2012-07-25 | 北京大学 | 一种细线条的制备方法 |
US8633077B2 (en) | 2012-02-15 | 2014-01-21 | International Business Machines Corporation | Transistors with uniaxial stress channels |
CN103632928A (zh) * | 2012-08-29 | 2014-03-12 | 中芯国际集成电路制造(上海)有限公司 | 自对准双重图形的形成方法 |
CN104078417A (zh) * | 2013-03-28 | 2014-10-01 | 中芯国际集成电路制造(上海)有限公司 | 自对准双构图方法及nand闪存的金属互连结构 |
US9263282B2 (en) * | 2013-06-13 | 2016-02-16 | United Microelectronics Corporation | Method of fabricating semiconductor patterns |
JP6607827B2 (ja) * | 2016-06-14 | 2019-11-20 | 東京エレクトロン株式会社 | 基板処理方法及び硼素添加珪素の除去方法 |
US11264428B2 (en) * | 2017-09-29 | 2022-03-01 | Intel Corporation | Self-aligned embedded phase change memory cell having a fin shaped bottom electrode |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62126637A (ja) * | 1985-11-18 | 1987-06-08 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 開孔の形成方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950013789B1 (ko) * | 1992-12-02 | 1995-11-16 | 현대전자산업주식회사 | 반도체 소자의 미세 게이트 전극 형성 방법 |
JP2000173979A (ja) | 1998-12-07 | 2000-06-23 | Sanyo Electric Co Ltd | エッチングマスク及び微細パターンの形成方法 |
US20080145536A1 (en) * | 2006-12-13 | 2008-06-19 | Applied Materials, Inc. | METHOD AND APPARATUS FOR LOW TEMPERATURE AND LOW K SiBN DEPOSITION |
KR100843236B1 (ko) * | 2007-02-06 | 2008-07-03 | 삼성전자주식회사 | 더블 패터닝 공정을 이용하는 반도체 소자의 미세 패턴형성 방법 |
-
2008
- 2008-06-06 US US12/441,741 patent/US7754622B2/en active Active
- 2008-06-06 JP JP2008149270A patent/JP4589983B2/ja active Active
- 2008-06-06 KR KR1020097005558A patent/KR101291766B1/ko active Active
- 2008-06-06 WO PCT/JP2008/060480 patent/WO2008149987A1/ja active Application Filing
- 2008-06-09 TW TW097121385A patent/TWI376745B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62126637A (ja) * | 1985-11-18 | 1987-06-08 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 開孔の形成方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219106A (ja) * | 2009-03-13 | 2010-09-30 | Tokyo Electron Ltd | 基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2009016813A (ja) | 2009-01-22 |
US7754622B2 (en) | 2010-07-13 |
TW200915418A (en) | 2009-04-01 |
TWI376745B (en) | 2012-11-11 |
JP4589983B2 (ja) | 2010-12-01 |
KR20090057023A (ko) | 2009-06-03 |
US20100112796A1 (en) | 2010-05-06 |
KR101291766B1 (ko) | 2013-08-01 |
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