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WO2008146655A1 - 光学素子保持装置、鏡筒及び露光装置ならびにデバイスの製造方法 - Google Patents

光学素子保持装置、鏡筒及び露光装置ならびにデバイスの製造方法 Download PDF

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Publication number
WO2008146655A1
WO2008146655A1 PCT/JP2008/059210 JP2008059210W WO2008146655A1 WO 2008146655 A1 WO2008146655 A1 WO 2008146655A1 JP 2008059210 W JP2008059210 W JP 2008059210W WO 2008146655 A1 WO2008146655 A1 WO 2008146655A1
Authority
WO
WIPO (PCT)
Prior art keywords
block
optical element
element holding
connecting block
lens barrel
Prior art date
Application number
PCT/JP2008/059210
Other languages
English (en)
French (fr)
Inventor
Takaya Okada
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2009516258A priority Critical patent/JPWO2008146655A1/ja
Priority to CN200880100236A priority patent/CN101772720A/zh
Publication of WO2008146655A1 publication Critical patent/WO2008146655A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lens Barrels (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

光学素子保持装置（２９）のステンレス鋼製の枠体（４５）内に、枠体（４５）とは線膨張係数の異なるアルミニウム製の緩衝部材（８８）を収容する。緩衝部材（８８）を回転リンクブロック（８１）の第1部材（８１ａ）に当接させる。枠体（４５）は、スリット（７５）により区画された、回転リンクブロック（８１）、第２連結ブロック（８０）、第１連結ブロック（７９）及び変位ブロック（７８）を有する。温度変化に伴う緩衝部材（８８）の伸長により生じる駆動力は、回転リンクブロック（８１）、第２連結ブロック（８０）、第１連結ブロック（７９）及び変位ブロック（７８）により増幅されて支持部材（４４）に伝達され、支持部材（４４）をレンズ（２８）側に変位させる。
PCT/JP2008/059210 2007-05-25 2008-05-20 光学素子保持装置、鏡筒及び露光装置ならびにデバイスの製造方法 WO2008146655A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009516258A JPWO2008146655A1 (ja) 2007-05-25 2008-05-20 光学素子保持装置、鏡筒及び露光装置ならびにデバイスの製造方法
CN200880100236A CN101772720A (zh) 2007-05-25 2008-05-20 光学元件保持装置、镜筒、曝光装置以及器件的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007138913 2007-05-25
JP2007-138913 2007-05-25

Publications (1)

Publication Number Publication Date
WO2008146655A1 true WO2008146655A1 (ja) 2008-12-04

Family

ID=40072148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059210 WO2008146655A1 (ja) 2007-05-25 2008-05-20 光学素子保持装置、鏡筒及び露光装置ならびにデバイスの製造方法

Country Status (5)

Country Link
US (1) US20080291555A1 (ja)
JP (1) JPWO2008146655A1 (ja)
KR (1) KR20100018581A (ja)
CN (1) CN101772720A (ja)
WO (1) WO2008146655A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102004409A (zh) * 2009-08-28 2011-04-06 株式会社理光 曝光装置以及图像形成装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009024192A1 (en) 2007-08-23 2009-02-26 Carl Zeiss Smt Ag Optical element module with minimized parasitic loads
JP5317624B2 (ja) * 2008-10-17 2013-10-16 キヤノン株式会社 保持装置、望遠鏡および光学装置
JP2011090250A (ja) * 2009-10-26 2011-05-06 Canon Inc 光学装置、それを用いた露光装置及びデバイスの製造方法
DE102010022934A1 (de) * 2010-06-04 2011-12-08 Carl Zeiss Ag Optische Baugruppe
US9166116B2 (en) * 2012-05-29 2015-10-20 Formosa Epitaxy Incorporation Light emitting device
US20160041361A1 (en) * 2014-08-06 2016-02-11 Sandia Corporation Mounting apparatus
US20180239102A1 (en) * 2017-02-20 2018-08-23 Corning Incorporated Optical mount
JP7093221B2 (ja) * 2018-04-26 2022-06-29 キヤノン株式会社 光学装置の調整方法、光学装置の製造方法、および、物品製造方法
CN112068277B (zh) * 2020-08-31 2021-08-20 中国科学院长春光学精密机械与物理研究所 大口径光学透镜的多级柔性支撑结构
IL284361B2 (en) * 2021-06-24 2024-08-01 Rafael Advanced Defense Systems Ltd Temperature compensated spacer
CN114679532B (zh) * 2022-05-27 2022-08-02 苏州次源科技服务有限公司 一种带减震系统的运动图像传感器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208516A (en) * 1981-06-19 1982-12-21 Olympus Optical Co Ltd Plastic lens whose lens interval varies with temperature and lens holder
JPH02287308A (ja) * 1989-04-03 1990-11-27 Mikhailovich Khodosovich Vladimir 光学ユニットのマウント内のレンズの中心合わせの方法
JP2005250495A (ja) * 2004-02-26 2005-09-15 Carl Zeiss Smt Ag 少なくとも１つの光学エレメントを備える対物レンズ
JP2006349946A (ja) * 2005-06-15 2006-12-28 Nikon Corp 光学素子保持装置、鏡筒及び露光装置並びにデバイスの製造方法

Family Cites Families (12)

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US4733945A (en) * 1986-01-15 1988-03-29 The Perkin-Elmer Corporation Precision lens mounting
US4929054A (en) * 1986-04-28 1990-05-29 The Perkin-Elmer Corporation Mounting for high resolution projection lenses
US5986827A (en) * 1998-06-17 1999-11-16 The Regents Of The University Of California Precision tip-tilt-piston actuator that provides exact constraint
US6239924B1 (en) * 1999-08-31 2001-05-29 Nikon Corporation Kinematic lens mounting with distributed support and radial flexure
AUPQ605800A0 (en) * 2000-03-06 2000-03-30 Silverbrook Research Pty Ltd Printehead assembly
JP4809987B2 (ja) * 2000-03-30 2011-11-09 キヤノン株式会社 光学要素の支持構造、それを用いた露光装置及び半導体デバイスの製造方法
US6473245B1 (en) * 2000-08-10 2002-10-29 Nikon Corporation Catadioptric lens barrel structure having a plurality of support platforms and method of making the same
KR100775796B1 (ko) * 2000-08-18 2007-11-12 가부시키가이샤 니콘 광학소자 유지장치
JP4310086B2 (ja) * 2002-08-01 2009-08-05 株式会社日立製作所 エンジン用電子機器
GB0224044D0 (en) * 2002-10-16 2002-11-27 Dow Corning Silicone resins
JP2004150402A (ja) * 2002-11-01 2004-05-27 Hitachi High-Technologies Corp 液体クロマトグラフ用ポンプ
KR20060048937A (ko) * 2004-08-03 2006-05-18 가부시키가이샤 에키쇼센탄 기쥬쓰 가이하쓰센타 레이저 결정화 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208516A (en) * 1981-06-19 1982-12-21 Olympus Optical Co Ltd Plastic lens whose lens interval varies with temperature and lens holder
JPH02287308A (ja) * 1989-04-03 1990-11-27 Mikhailovich Khodosovich Vladimir 光学ユニットのマウント内のレンズの中心合わせの方法
JP2005250495A (ja) * 2004-02-26 2005-09-15 Carl Zeiss Smt Ag 少なくとも１つの光学エレメントを備える対物レンズ
JP2006349946A (ja) * 2005-06-15 2006-12-28 Nikon Corp 光学素子保持装置、鏡筒及び露光装置並びにデバイスの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102004409A (zh) * 2009-08-28 2011-04-06 株式会社理光 曝光装置以及图像形成装置
CN102004409B (zh) * 2009-08-28 2014-02-26 株式会社理光 曝光装置以及图像形成装置
US8760483B2 (en) 2009-08-28 2014-06-24 Ricoh Company, Limited Exposure device and image forming apparatus including same

Also Published As

Publication number Publication date
US20080291555A1 (en) 2008-11-27
JPWO2008146655A1 (ja) 2010-08-19
CN101772720A (zh) 2010-07-07
KR20100018581A (ko) 2010-02-17

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