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WO2008146129A3 - Eine flache heatpipe (wärmeleitrohr) und kühlkörper, welche diese verwenden - Google Patents

Eine flache heatpipe (wärmeleitrohr) und kühlkörper, welche diese verwenden Download PDF

Info

Publication number
WO2008146129A3
WO2008146129A3 PCT/IB2008/001315 IB2008001315W WO2008146129A3 WO 2008146129 A3 WO2008146129 A3 WO 2008146129A3 IB 2008001315 W IB2008001315 W IB 2008001315W WO 2008146129 A3 WO2008146129 A3 WO 2008146129A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat pipe
water
cooling bodies
flat
Prior art date
Application number
PCT/IB2008/001315
Other languages
English (en)
French (fr)
Other versions
WO2008146129A2 (de
Inventor
Frank Baxmann
Original Assignee
Boston Cooltec Corp
Frank Baxmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boston Cooltec Corp, Frank Baxmann filed Critical Boston Cooltec Corp
Publication of WO2008146129A2 publication Critical patent/WO2008146129A2/de
Publication of WO2008146129A3 publication Critical patent/WO2008146129A3/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Eine flache Heatpipe (Wärmeleitrohr) in Plattenform bestehend aus einer Bodenpiatte in Form einer Wanne, einer gesinterten kapillaren Bodenschicht Pulver, einem kapillaren Oberseitenkorpus und einer Oberplatte in Form einer Wanne, dadurch gekennzeichnet, dass zwischen der Oberplatte und der Bodenpiatte durch em gleichmaßiges Raster von kapillaren Verbindungsbrücken des Oberseitenkorpus em geschlossenes Kapillarsystem bestehend aus Oberseitenkorpus und Bodenschicht für optimalen kapillaren Flüssigkeitstransport besteht, und eine optimale thermische und mechanisch stabile Verbindung zwischen den gesinterten Innenteilen, bestehend aus Oberseitenkorpus und Bodenschicht, sowohi miteinander, als auch mit der Bodenpiatte und mit der Oberplatte besteht.
PCT/IB2008/001315 2007-05-25 2008-05-26 Eine flache heatpipe (wärmeleitrohr) und kühlkörper, welche diese verwenden WO2008146129A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202007007568.5 2007-05-25
DE200720007568 DE202007007568U1 (de) 2007-05-25 2007-05-25 Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden

Publications (2)

Publication Number Publication Date
WO2008146129A2 WO2008146129A2 (de) 2008-12-04
WO2008146129A3 true WO2008146129A3 (de) 2009-01-29

Family

ID=38537274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/001315 WO2008146129A2 (de) 2007-05-25 2008-05-26 Eine flache heatpipe (wärmeleitrohr) und kühlkörper, welche diese verwenden

Country Status (2)

Country Link
DE (1) DE202007007568U1 (de)
WO (1) WO2008146129A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
DE102009030356A1 (de) 2009-06-18 2010-12-23 Grimm, Friedrich, Prof. Dipl.-Ing. Zwei-Phasen-Thermosyphon als großflächiger Wärmetauscher
DE102010013734A1 (de) * 2010-03-31 2011-10-06 Siemens Aktiengesellschaft Vorrichtung zur Kühlung und Verfahren zu deren Herstellung
JP5714836B2 (ja) * 2010-04-17 2015-05-07 モレックス インコーポレイテドＭｏｌｅｘ Ｉｎｃｏｒｐｏｒａｔｅｄ 熱輸送ユニット、電子基板、電子機器
EP2527776A1 (de) 2011-05-24 2012-11-28 Thermal Corp. Kapillarvorrichtung zur Verwendung in einem Heizrohr und Verfahren zur Herstellung einer Kapillarvorrichtung
WO2013107026A1 (zh) * 2012-01-19 2013-07-25 极致科技股份有限公司 无注液管的均温装置制造方法及以该制法制成的均温装置
DE102012107570B4 (de) * 2012-08-17 2017-08-03 Rogers Germany Gmbh Verfahren zur Herstellung von Hohlkörpern, insbesondere von Kühlern, Hohlkörper sowie Kühler enthaltende elektrische oder elektronische Baugruppen
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
EP3213022A4 (de) * 2014-10-28 2018-06-13 Kelvin Thermal Technologies, Inc. Mikrgefertigte thermische massefläche auf polymerbasis
DE102014222164A1 (de) 2014-10-30 2016-05-04 Smiths Heimann Gmbh Kühlkörper, insbesondere für die Anode eines Röntgenstrahlungserzeugers
DE102015000254A1 (de) 2015-01-16 2016-07-21 Tom Bub Beleuchtungsvorrichtung
JP6623296B2 (ja) * 2016-07-01 2019-12-18 古河電気工業株式会社 ベーパーチャンバ
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
WO2018198372A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
WO2018198354A1 (ja) 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
DE102017215759A1 (de) * 2017-09-07 2019-03-07 Robert Bosch Gmbh Kühlplatte, sowie Vorrichtung mit einer solchen Kühlplatte
WO2020087357A1 (zh) * 2018-10-31 2020-05-07 深圳市万景华科技有限公司 智能终端热管及其制作方法
EP3663002A1 (de) * 2018-12-07 2020-06-10 F. Hoffmann-La Roche AG Vorrichtung zur thermischen behandlung von testproben
CN112868275B (zh) * 2019-09-12 2022-09-16 华为技术有限公司 均热板、散热器及终端
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
CN113301777B (zh) * 2021-04-26 2022-12-02 江西新菲新材料有限公司 均热板及均热板的制备方法、电子设备
US11849562B2 (en) 2022-02-24 2023-12-19 International Business Machines Corporation Hybrid in-drawer computer equipment cooling device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
JP2002318085A (ja) * 2001-04-18 2002-10-31 Hitachi Cable Ltd ヒートパイプ及びその製造方法
US20030136551A1 (en) * 2002-01-19 2003-07-24 Bakke Allan P. Light weight flat heat pipe utilizing copper foil container laminated to heat treated aluminum sheets for structural stability
US6681847B1 (en) * 2003-02-20 2004-01-27 Advanced Thermal Technologies Radiator fin formed by sintering operation
US20040016534A1 (en) * 2002-07-26 2004-01-29 Tai-Sol Electronics Co., Ltd. Bottom fixation type integrated circuit chip cooling structure
DE202004007195U1 (de) * 2003-10-01 2004-09-16 Wang, Chin-Wen, Ping Jen Verbindungskonstruktion einer Wärmeleitplatte
US20040244951A1 (en) * 1999-05-12 2004-12-09 Dussinger Peter M. Integrated circuit heat pipe heat spreader with through mounting holes
US20060005950A1 (en) * 2004-07-06 2006-01-12 Wang Chin W Structure of heat conductive plate
DE102004038932A1 (de) * 2004-08-11 2006-02-23 Mtu Aero Engines Gmbh Verfahren zum Verbinden von Bauteilen
DE102005051142A1 (de) * 2004-11-11 2006-06-01 Taiwan Microloops Corp., Kweishan Biegbarer Wärmeverteiler mit metallischer Mikrostruktur auf Basis eines Drahtnetzes sowie Verfahren zur Herstellung derselben
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
US20040244951A1 (en) * 1999-05-12 2004-12-09 Dussinger Peter M. Integrated circuit heat pipe heat spreader with through mounting holes
JP2002318085A (ja) * 2001-04-18 2002-10-31 Hitachi Cable Ltd ヒートパイプ及びその製造方法
US20030136551A1 (en) * 2002-01-19 2003-07-24 Bakke Allan P. Light weight flat heat pipe utilizing copper foil container laminated to heat treated aluminum sheets for structural stability
US20040016534A1 (en) * 2002-07-26 2004-01-29 Tai-Sol Electronics Co., Ltd. Bottom fixation type integrated circuit chip cooling structure
US6681847B1 (en) * 2003-02-20 2004-01-27 Advanced Thermal Technologies Radiator fin formed by sintering operation
DE202004007195U1 (de) * 2003-10-01 2004-09-16 Wang, Chin-Wen, Ping Jen Verbindungskonstruktion einer Wärmeleitplatte
US20060005950A1 (en) * 2004-07-06 2006-01-12 Wang Chin W Structure of heat conductive plate
DE102004038932A1 (de) * 2004-08-11 2006-02-23 Mtu Aero Engines Gmbh Verfahren zum Verbinden von Bauteilen
DE102005051142A1 (de) * 2004-11-11 2006-06-01 Taiwan Microloops Corp., Kweishan Biegbarer Wärmeverteiler mit metallischer Mikrostruktur auf Basis eines Drahtnetzes sowie Verfahren zur Herstellung derselben
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden

Also Published As

Publication number Publication date
WO2008146129A2 (de) 2008-12-04
DE202007007568U1 (de) 2007-09-20

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