+

WO2008039959A3 - Structure composite avec couche d'organophosphonate adhésive et procédé de production - Google Patents

Structure composite avec couche d'organophosphonate adhésive et procédé de production Download PDF

Info

Publication number
WO2008039959A3
WO2008039959A3 PCT/US2007/079802 US2007079802W WO2008039959A3 WO 2008039959 A3 WO2008039959 A3 WO 2008039959A3 US 2007079802 W US2007079802 W US 2007079802W WO 2008039959 A3 WO2008039959 A3 WO 2008039959A3
Authority
WO
WIPO (PCT)
Prior art keywords
adherent layer
organophosphonate
substrate
article
preparing
Prior art date
Application number
PCT/US2007/079802
Other languages
English (en)
Other versions
WO2008039959A2 (fr
Inventor
Eric L Hanson
Gerry Gruber
Eric Bruner
Original Assignee
Aculon Inc
Eric L Hanson
Gerry Gruber
Eric Bruner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aculon Inc, Eric L Hanson, Gerry Gruber, Eric Bruner filed Critical Aculon Inc
Priority to JP2009530615A priority Critical patent/JP2010504874A/ja
Publication of WO2008039959A2 publication Critical patent/WO2008039959A2/fr
Publication of WO2008039959A3 publication Critical patent/WO2008039959A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/04—Electrophoretic coating characterised by the process with organic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
    • C25D13/16—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/20—Pretreatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un article qui comprend: un substrat présentant une surface et comprenant une feuille de cuivre ou une feuille en alliage de cuivre déposée par voie galvanique; une couche adhésive destinée à favoriser l'adhérence, contenant au moins un organophosphonate ou un sel de celui-ci, liée par covalence à la surface; et une couche fonctionnelle, contenant au moins un polymère lié à la couche adhésive. Par ailleurs, la présente invention concerne des dispositifs qui comprennent une source de chaleur ou un composant électronique, ainsi que l'article décrit ci-dessus. La source de chaleur est en contact thermique avec le substrat et le composant électronique est en contact électrique avec le substrat. L'invention concerne en outre un procédé de production de l'article précité.
PCT/US2007/079802 2006-09-28 2007-09-28 Structure composite avec couche d'organophosphonate adhésive et procédé de production WO2008039959A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009530615A JP2010504874A (ja) 2006-09-28 2007-09-28 有機ホスホネート接着層を備えたコンポジット構造および調製方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US82736706P 2006-09-28 2006-09-28
US60/827,367 2006-09-28
US11/862,175 2007-09-26
US11/862,175 US20080131709A1 (en) 2006-09-28 2007-09-26 Composite structure with organophosphonate adherent layer and method of preparing

Publications (2)

Publication Number Publication Date
WO2008039959A2 WO2008039959A2 (fr) 2008-04-03
WO2008039959A3 true WO2008039959A3 (fr) 2008-11-06

Family

ID=39230998

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/079802 WO2008039959A2 (fr) 2006-09-28 2007-09-28 Structure composite avec couche d'organophosphonate adhésive et procédé de production

Country Status (3)

Country Link
US (1) US20080131709A1 (fr)
JP (1) JP2010504874A (fr)
WO (1) WO2008039959A2 (fr)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9060560B2 (en) 2007-08-10 2015-06-23 Greenhill Antiballistics Corporation Composite material
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
US20090056991A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
DE102009016659A1 (de) * 2008-09-23 2010-06-24 Siemens Aktiengesellschaft Ankergruppe für Monolagen organischer Verbindungen auf Metall und damit hergestelltes Bauelement auf Basis organischer Elektronik
DE102009037691A1 (de) 2009-08-17 2011-03-03 Siemens Aktiengesellschaft Dielektrische Schutzschicht für eine selbstorganisierende Monolage (SAM)
EP2477997B1 (fr) * 2009-09-18 2014-08-20 Henkel Ireland Limited Compositions de collage à base de phosphonate
WO2012005723A1 (fr) * 2010-07-06 2012-01-12 Zettacore, Inc. Procédés de traitement des surfaces de cuivre pour améliorer l'adhérence à des substrats organiques utilisés dans les cartes de circuit imprimé
WO2012054472A2 (fr) 2010-10-18 2012-04-26 Greenhill Antiballistics Corporation Matériau composite à nanoparticules à gradient-allotropes de carbone-polymère
US20140134426A1 (en) * 2011-06-23 2014-05-15 Rok Investment Group Limited Nano-based self-healing anti-corrosion coating
US10675138B2 (en) 2011-12-07 2020-06-09 The Trustees Of Princeton University Scaffolds for soft tissue and uses thereof
WO2017062417A1 (fr) * 2015-10-05 2017-04-13 The Trustees Of Princetion University Échafaudages pour tissus neuronaux et leurs utilisations
US10563160B2 (en) 2011-12-07 2020-02-18 The Trustees Of Princeton University Scaffolds for tissues and uses thereof
US8932933B2 (en) * 2012-05-04 2015-01-13 Micron Technology, Inc. Methods of forming hydrophobic surfaces on semiconductor device structures, methods of forming semiconductor device structures, and semiconductor device structures
US9476754B2 (en) 2013-02-28 2016-10-25 Electrolab, Inc. Method and kit for treatment of components utilized in a crude oil service operation
US11130899B2 (en) 2014-06-18 2021-09-28 Schlumberger Technology Corporation Compositions and methods for well cementing
US9994732B1 (en) 2014-09-12 2018-06-12 Steven Martin Johnson Polysilazane and fluoroacrylate coating composition
WO2016118349A1 (fr) 2015-01-21 2016-07-28 The Trustees Of Princeton University Formation de motifs sur des surfaces fragiles ou non-planes pour l'alignement cellulaire
US10534120B2 (en) 2015-04-03 2020-01-14 Moxtek, Inc. Wire grid polarizer with protected wires
US9703028B2 (en) 2015-04-03 2017-07-11 Moxtek, Inc. Wire grid polarizer with phosphonate protective coating
US20160289458A1 (en) * 2015-04-03 2016-10-06 Moxtek, Inc. Hydrophobic Phosphonate and Silane Chemistry
US20160291227A1 (en) 2015-04-03 2016-10-06 Moxtek, Inc. Wire Grid Polarizer with Water-Soluble Materials
US10054717B2 (en) 2015-04-03 2018-08-21 Moxtek, Inc. Oxidation and moisture barrier layers for wire grid polarizer
US10562065B1 (en) 2015-11-03 2020-02-18 Newtech Llc Systems and methods for application of polysilazane and fluoroacrylate coating compositions
WO2017137788A1 (fr) 2016-02-11 2017-08-17 Services Petroliers Schlumberger Ciment à expansion retardée et opérations de cimentation
US10526523B2 (en) 2016-02-11 2020-01-07 Schlumberger Technology Corporation Release of expansion agents for well cementing
US10584264B1 (en) 2016-02-25 2020-03-10 Newtech Llc Hydrophobic and oleophobic coating compositions
WO2017177040A1 (fr) 2016-04-06 2017-10-12 Sanctioned Risk Solutions, Inc. Dissipation de chaleur à l'aide de matériaux nanométriques
WO2017174208A1 (fr) 2016-04-08 2017-10-12 Schlumberger Technology Corporation Boue comprenant un agent d'expansion encapsulé pour la cimentation de puits
CN106985472A (zh) * 2017-03-23 2017-07-28 苏州道众机械制造有限公司 一种船舶零件用复合金属制品
US11674050B2 (en) 2017-10-11 2023-06-13 Microvention, Inc. Phosphonates and uses thereof
KR20230092990A (ko) 2020-10-20 2023-06-26 메르크 파텐트 게엠베하 유도 자기 조립(dsa)을 위한 포스포네이트 말단 브러시 폴리머

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US5721056A (en) * 1993-06-25 1998-02-24 Zipperling Kessler & Co. (Gmbh & Co.) Process for the production of corrosion-protected metallic materials and materials obtainable therewith
US20040023048A1 (en) * 1997-02-04 2004-02-05 Jeffrey Schwartz Enhanced bonding layers on native oxide surfaces
US20040099535A1 (en) * 2000-05-06 2004-05-27 Mattias Schweinsberg Electrochemically produced layers for providing corrosion protection or wash primers
US20040265571A1 (en) * 2003-02-11 2004-12-30 Princeton University Surface-bonded, organic acid-based mono-layers
US6871776B2 (en) * 2003-03-10 2005-03-29 Trucco Horacio Andres Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh
US20050112369A1 (en) * 2003-09-29 2005-05-26 Rohm And Haas Electronic Materials, L.L.C. Printed circuit board manufacture

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3013904A (en) * 1959-04-13 1961-12-19 Du Pont Substrate having an organic polymer containing pentavalent phosphorus bonded thereto
BE606888A (fr) * 1960-08-05 1900-01-01
DE1546786C3 (de) * 1965-06-03 1973-12-13 Kalle Ag, 6202 Wiesbaden-Biebrich Verfahren und Material zur Her stellung von Flachdruckplatten
US3634146A (en) * 1969-09-04 1972-01-11 American Cyanamid Co Chemical treatment of metal
US3677828A (en) * 1970-07-30 1972-07-18 Olin Corp Tarnish resistant copper and copper alloys
US3770514A (en) * 1972-06-08 1973-11-06 American Cyanamid Co Chemical treatment of metal
DE2344197A1 (de) * 1973-09-01 1975-03-27 Dynamit Nobel Ag Funktionelle organophosphonsaeureester als konservierende haftvermittler oder ueberzuege fuer metalle
SE421006B (sv) * 1974-03-19 1981-11-16 Mitsubishi Gas Chemical Co Herdbar hartskomposition av en cyanatesterkomponent och en bismaleinsyraimidkomponent
US4209487A (en) * 1975-06-02 1980-06-24 Monsanto Company Method for corrosion inhibition
US4264379A (en) * 1980-01-11 1981-04-28 Olin Corporation Process for coating copper and copper alloy
US4452650A (en) * 1980-01-11 1984-06-05 Olin Corporation Copper and copper alloy coating
US4399021A (en) * 1980-09-26 1983-08-16 American Hoechst Corporation Novel electrolytes for electrochemically treated metal plates
US4769419A (en) * 1986-12-01 1988-09-06 Dawdy Terrance H Modified structural adhesives
US5126210A (en) * 1989-08-23 1992-06-30 Aluminum Company Of America Anodic phosphonic/phosphinic acid duplex coating on valve metal surface
US5132181A (en) * 1989-08-23 1992-07-21 Aluminum Company Of America Phosphonic/phosphinic acid bonded to aluminum hydroxide layer
US5059258A (en) * 1989-08-23 1991-10-22 Aluminum Company Of America Phosphonic/phosphinic acid bonded to aluminum hydroxide layer
US5622782A (en) * 1993-04-27 1997-04-22 Gould Inc. Foil with adhesion promoting layer derived from silane mixture
US6127127A (en) * 1995-06-27 2000-10-03 The University Of North Carolina At Chapel Hill Monolayer and electrode for detecting a label-bearing target and method of use thereof
US6387625B1 (en) * 1995-06-27 2002-05-14 The University Of North Carolina At Chapel Hill Monolayer and electrode for detecting a label-bearing target and method of use thereof
US7569285B2 (en) * 1996-10-17 2009-08-04 The Trustees Of Princeton University Enhanced bonding layers on titanium materials
US6146767A (en) * 1996-10-17 2000-11-14 The Trustees Of Princeton University Self-assembled organic monolayers
US6645644B1 (en) * 1996-10-17 2003-11-11 The Trustees Of Princeton University Enhanced bonding of phosphoric and phosphoric acids to oxidized substrates
US7396594B2 (en) * 2002-06-24 2008-07-08 The Trustees Of Princeton University Carrier applied coating layers
DE19654642C2 (de) * 1996-12-28 2003-01-16 Chemetall Gmbh Verfahren zur Behandlung metallischer Oberflächen mit einer wässerigen Lösung
US6299983B1 (en) * 1997-06-27 2001-10-09 E. I. Du Pont De Nemours And Company Derivatized metallic surfaces, composites of functionalized polymers with such metallic surfaces and processes for formation thereof
EP2287937A3 (fr) * 1997-07-11 2012-02-22 The University of Southern California Générateurs de charges prévus dans des films minces hétérolamellaires multicouches
JPH11354684A (ja) * 1998-06-09 1999-12-24 Nitto Denko Corp 低熱膨張配線基板および多層配線基板
US6528603B1 (en) * 1999-01-13 2003-03-04 Board Of Trustees Operating Michigan State University Phosphonate copolymer and methods of use
US6632872B1 (en) * 2000-09-19 2003-10-14 3M Innovative Properties Company Adhesive compositions including self-assembling molecules, adhesives, articles, and methods
US6488990B1 (en) * 2000-10-06 2002-12-03 Chemetall Gmbh Process for providing coatings on a metallic surface
US6632508B1 (en) * 2000-10-27 2003-10-14 3M Innovative Properties Company Optical elements comprising a polyfluoropolyether surface treatment
US6660805B1 (en) * 2002-05-16 2003-12-09 Lord Corporation Two-part adhesive: part A-monomer, toughener(s), optional adhesion promotor and reducing agent; part B-epoxy resin
US6933046B1 (en) * 2002-06-12 2005-08-23 Tda Research, Inc. Releasable corrosion inhibitor compositions
US7005237B2 (en) * 2003-05-27 2006-02-28 North Carolina State University Method of making information storage devices by molecular photolithography

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US5721056A (en) * 1993-06-25 1998-02-24 Zipperling Kessler & Co. (Gmbh & Co.) Process for the production of corrosion-protected metallic materials and materials obtainable therewith
US20040023048A1 (en) * 1997-02-04 2004-02-05 Jeffrey Schwartz Enhanced bonding layers on native oxide surfaces
US20040099535A1 (en) * 2000-05-06 2004-05-27 Mattias Schweinsberg Electrochemically produced layers for providing corrosion protection or wash primers
US20040265571A1 (en) * 2003-02-11 2004-12-30 Princeton University Surface-bonded, organic acid-based mono-layers
US6871776B2 (en) * 2003-03-10 2005-03-29 Trucco Horacio Andres Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh
US20050112369A1 (en) * 2003-09-29 2005-05-26 Rohm And Haas Electronic Materials, L.L.C. Printed circuit board manufacture

Also Published As

Publication number Publication date
WO2008039959A2 (fr) 2008-04-03
JP2010504874A (ja) 2010-02-18
US20080131709A1 (en) 2008-06-05

Similar Documents

Publication Publication Date Title
WO2008039959A3 (fr) Structure composite avec couche d'organophosphonate adhésive et procédé de production
MY151913A (en) Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layer
WO2008126426A1 (fr) Film en résine adsorbant les substances conductrices, procédé de fabrication dudit film, film en résine revêtu d'une couche métallique fabriqué à partir de celui-ci et son procédé de fabrication
WO2009035059A1 (fr) Film électroconducteur, élément électroconducteur et processus de production de film électroconducteur
TW200724583A (en) Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board
MY147431A (en) Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, surface-treated copper foil with carrier sheet and copper-clad laminate using the surface-treated copper foil with carrier sheet
EP3048864A3 (fr) Feuille de cuivre avec support, stratifié, carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé
TW200746933A (en) Substrate for flexible wiring and method for producing the same
TW201129476A (en) Laminate having porous layer and functional laminate using the same
MY152161A (en) Surface-treated copper foil, method for producing surface-treated copper foil, and surface-treated copper foil coated with extremely thin primer resin layer
EP2458620A3 (fr) Fabrication de dispositifs électroniques à graphène utilisant un contour de surface étagée
WO2007098484A8 (fr) Activation a rendement eleve de surfaces polymeriques pour une liaison par covalence de molecules
JP2008544551A5 (fr)
EP1895820A3 (fr) Carte de circuit et procédé de production correspondant
TW200700581A (en) Copper foil for printed wiring board
EP2363891A3 (fr) Conducteurs transparents basés sur des nanofils
WO2008146448A1 (fr) Stratifié pelable et son procédé de fabrication
EP2341566A3 (fr) Composite de film protecteur, appareil d'affichage incluant le composite de film protecteur et procédé de fabrication de l'appareil d'affichage incluant le composite de film protecteur
EP1930155A4 (fr) Corps multicouche faisant barriere au gaz et stratifie
EP1930250A3 (fr) Couche barrière, article composite la comprenant, dispositif électroactif et procédé
TW200700221A (en) Copper clad laminated sheet and its manufacturing method
WO2007025521A3 (fr) Procede pour produire un composant semi-conducteur presentant une metallisation planaire et composant semi-conducteur
WO2008129815A1 (fr) Pré-imprégné avec support, procédé de fabrication du pré-imprégné, planche de câblage imprimé multicouche et dispositif semiconducteur
TW200641914A (en) Coated fine particle and their manufacturing method, and conductive fine particle
TW200702162A (en) Fiber-rein composite, laminate article, and board for printed wiring, and method for producing board for printed wiring

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07843423

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
ENP Entry into the national phase

Ref document number: 2009530615

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07843423

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载