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WO2008032128A8 - Technique d'assemblage - Google Patents

Technique d'assemblage

Info

Publication number
WO2008032128A8
WO2008032128A8 PCT/GR2007/000047 GR2007000047W WO2008032128A8 WO 2008032128 A8 WO2008032128 A8 WO 2008032128A8 GR 2007000047 W GR2007000047 W GR 2007000047W WO 2008032128 A8 WO2008032128 A8 WO 2008032128A8
Authority
WO
WIPO (PCT)
Prior art keywords
bonding
substrates
bonding technique
plexiglass
methylmethacrylate
Prior art date
Application number
PCT/GR2007/000047
Other languages
English (en)
Other versions
WO2008032128A1 (fr
Inventor
Konstantinos Misiakos
Angeliki Tserepi
Maria-Elena Vlachopoulou
Original Assignee
Nat Ct Of Scient Res Demokrito
Konstantinos Misiakos
Angeliki Tserepi
Maria-Elena Vlachopoulou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Ct Of Scient Res Demokrito, Konstantinos Misiakos, Angeliki Tserepi, Maria-Elena Vlachopoulou filed Critical Nat Ct Of Scient Res Demokrito
Publication of WO2008032128A1 publication Critical patent/WO2008032128A1/fr
Publication of WO2008032128A8 publication Critical patent/WO2008032128A8/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/146—Glass in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/008—Presence of styrenic polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/008—Presence of (meth)acrylic polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/008—Presence of epoxy resin in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/008—Presence of polysiloxane in the pretreated surface to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne un processus rapide, bon marché et basse température d'assemblage de dispositifs microfluidiques, qui sont composés d'au moins un substrat plastique, et qui repose sur la modification de la surface des substrats constituant le dispositif se traduisant par une liaison irréversible entre les substrats. Il s'agit d'un procédé générique d'assemblage de substrats nus ou structurés dont au moins un est un substrat polymère en plexiglas (connu également comme méthacrylate polyméthylique, PMMA), ou en PS, ou en époxy (comme la résine photosensible commerciale SU(8).
PCT/GR2007/000047 2006-09-15 2007-08-14 Technique d'assemblage WO2008032128A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης
GR20060100518 2006-09-15

Publications (2)

Publication Number Publication Date
WO2008032128A1 WO2008032128A1 (fr) 2008-03-20
WO2008032128A8 true WO2008032128A8 (fr) 2008-05-22

Family

ID=38752416

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GR2007/000047 WO2008032128A1 (fr) 2006-09-15 2007-08-14 Technique d'assemblage

Country Status (2)

Country Link
GR (1) GR1006447B (fr)
WO (1) WO2008032128A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103183310A (zh) * 2011-12-27 2013-07-03 中国科学院理化技术研究所 一种微流控芯片的低温键合的方法
CN108777915A (zh) * 2017-05-30 2018-11-09 杨军 高导电连接无钻孔的单层和多层电路的高效制造方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100868769B1 (ko) 2007-06-07 2008-11-17 삼성전자주식회사 미세유체 칩 및 이의 제조방법
ITBO20070588A1 (it) * 2007-08-13 2009-02-14 Silicon Biosystems Spa Metodo per legare uno strato di silicone ad un substrato di polimero metacrilico
FR2946658B1 (fr) * 2009-06-11 2011-08-05 Commissariat Energie Atomique Dispositif microfluidique comportant deux couches hydrophobes assemblees l'une a l'autre et procede d'assemblage
AU2010302952A1 (en) * 2009-09-30 2012-05-10 Mycrolab Diagnostics Pty Ltd Selective bond reduction in microfluidic devices
US9500645B2 (en) 2009-11-23 2016-11-22 Cyvek, Inc. Micro-tube particles for microfluidic assays and methods of manufacture
US9855735B2 (en) 2009-11-23 2018-01-02 Cyvek, Inc. Portable microfluidic assay devices and methods of manufacture and use
CN102713621B (zh) 2009-11-23 2016-10-19 西维克公司 用于施行化验的方法和设备
US9700889B2 (en) 2009-11-23 2017-07-11 Cyvek, Inc. Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results
US10065403B2 (en) 2009-11-23 2018-09-04 Cyvek, Inc. Microfluidic assay assemblies and methods of manufacture
WO2013133899A1 (fr) * 2012-03-08 2013-09-12 Cyvek, Inc Systèmes d'analyse microfluidiques utilisant des micro-particules et procédés de fabrication
US10022696B2 (en) 2009-11-23 2018-07-17 Cyvek, Inc. Microfluidic assay systems employing micro-particles and methods of manufacture
US9759718B2 (en) 2009-11-23 2017-09-12 Cyvek, Inc. PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use
CA2830533C (fr) 2011-03-22 2020-02-18 Cyvek, Inc. Dispositifs micro-fluidiques et leurs procedes de fabrication et d'utilisation
JP5870813B2 (ja) * 2012-03-29 2016-03-01 スターライト工業株式会社 マイクロ化学デバイスの製造方法
CN102701145A (zh) * 2012-05-04 2012-10-03 南京大学 一种高质量的pdms-聚烯烃类塑料不可逆键合的方法
WO2014010299A1 (fr) * 2012-07-09 2014-01-16 ソニー株式会社 Micropuce et son procédé de production
JP6353451B2 (ja) * 2013-08-23 2018-07-04 株式会社朝日Ｆｒ研究所 マイクロ化学チップ及び反応装置
ES2614252B1 (es) * 2015-10-27 2018-03-12 Universidad De Zaragoza Chip microfluídico, dispositivo microfluídico, procedimientos y usos asociados
US10228367B2 (en) 2015-12-01 2019-03-12 ProteinSimple Segmented multi-use automated assay cartridge
JP2019107857A (ja) * 2017-12-20 2019-07-04 東芝テック株式会社 薬液吐出装置及び薬液滴下装置
WO2025082310A1 (fr) * 2023-10-17 2025-04-24 The Hong Kong University Of Science And Technology Puce microfluidique réversible pour la culture et l'extraction de cellules polyvalentes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10237280A1 (de) * 2002-08-14 2004-03-11 Micronas Holding Gmbh Verfahren zum Verbinden von Oberflächen, Halbleiter mit verbundenen Oberflächen sowie Bio-Chip und Bio-Sensor
US20050079364A1 (en) * 2003-10-08 2005-04-14 University Of Cincinnati Silane compositions and methods for bonding rubber to metals
EP1706467B1 (fr) * 2004-10-13 2011-08-24 Rheonix, Inc. Structures microfluidiques stratifiees et leur procede de fabrication
KR100590581B1 (ko) * 2005-05-10 2006-06-19 삼성전자주식회사 미세유동장치 및 그 제조방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103183310A (zh) * 2011-12-27 2013-07-03 中国科学院理化技术研究所 一种微流控芯片的低温键合的方法
CN103183310B (zh) * 2011-12-27 2015-08-19 中国科学院理化技术研究所 一种微流控芯片的低温键合的方法
CN108777915A (zh) * 2017-05-30 2018-11-09 杨军 高导电连接无钻孔的单层和多层电路的高效制造方法
CN108777915B (zh) * 2017-05-30 2021-07-23 杨军 在多孔基底上制造高导电特性铜-纤维混合物的方法

Also Published As

Publication number Publication date
GR20060100518A (el) 2008-04-15
WO2008032128A1 (fr) 2008-03-20
GR1006447B (el) 2009-06-19

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