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WO2008031981A3 - Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other - Google Patents

Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other Download PDF

Info

Publication number
WO2008031981A3
WO2008031981A3 PCT/FR2007/051904 FR2007051904W WO2008031981A3 WO 2008031981 A3 WO2008031981 A3 WO 2008031981A3 FR 2007051904 W FR2007051904 W FR 2007051904W WO 2008031981 A3 WO2008031981 A3 WO 2008031981A3
Authority
WO
WIPO (PCT)
Prior art keywords
mass
support
arranging
bonding
elements
Prior art date
Application number
PCT/FR2007/051904
Other languages
French (fr)
Other versions
WO2008031981A2 (en
Inventor
Jean-Michel Morelle
Laurent Vivet
Mathieu Medina
Sandra Dimelli
Original Assignee
Valeo Electronique Sys Liaison
Jean-Michel Morelle
Laurent Vivet
Mathieu Medina
Sandra Dimelli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique Sys Liaison, Jean-Michel Morelle, Laurent Vivet, Mathieu Medina, Sandra Dimelli filed Critical Valeo Electronique Sys Liaison
Priority to US12/310,907 priority Critical patent/US20100089879A1/en
Priority to JP2009527866A priority patent/JP5399247B2/en
Priority to EP07823800A priority patent/EP2064017A2/en
Publication of WO2008031981A2 publication Critical patent/WO2008031981A2/en
Publication of WO2008031981A3 publication Critical patent/WO2008031981A3/en
Priority to US13/672,400 priority patent/US8952288B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Plasma & Fusion (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Ceramic Products (AREA)

Abstract

This method comprises a step of heating a mass (16) forming a braze. In accordance with the invention, before the heating step, the method includes steps of arranging the mass (16) and the member (12) on the support (14). In particular, it includes a step of positioning the mass (16) on the support (14) and a step of applying a first compressive force (F1) on the mass (16) so as to compress said mass (16) against the support (14), the intensity of the first force (F1) increasing up to a predetermined first value chosen so as to flatten the mass (16). Next, the method includes a step of positioning the member (12) on the flattened mass (16) and a step of applying a second compressive force (F2) to the member (12) so as to compress said member (12) against the flattened mass (16) and the support (14), the intensity of the second force (F2) increasing up to a second predefined value, the second predefined value being lower than the first predefined value.
PCT/FR2007/051904 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other WO2008031981A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/310,907 US20100089879A1 (en) 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
JP2009527866A JP5399247B2 (en) 2006-09-14 2007-09-11 How to solder components to a holder
EP07823800A EP2064017A2 (en) 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
US13/672,400 US8952288B2 (en) 2006-09-14 2012-11-08 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0653731 2006-09-14
FR0653731A FR2905883B1 (en) 2006-09-14 2006-09-14 METHOD FOR WELDING AN ORGAN ON A SUPPORT BY DELIVERING MATERIAL AND DEVICE FOR ARRANGING TWO ELEMENTS ON ONE ANOTHER

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/310,907 A-371-Of-International US20100089879A1 (en) 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other
US13/672,400 Continuation US8952288B2 (en) 2006-09-14 2012-11-08 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

Publications (2)

Publication Number Publication Date
WO2008031981A2 WO2008031981A2 (en) 2008-03-20
WO2008031981A3 true WO2008031981A3 (en) 2008-05-08

Family

ID=37909780

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/051904 WO2008031981A2 (en) 2006-09-14 2007-09-11 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

Country Status (5)

Country Link
US (2) US20100089879A1 (en)
EP (1) EP2064017A2 (en)
JP (2) JP5399247B2 (en)
FR (1) FR2905883B1 (en)
WO (1) WO2008031981A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2937216B1 (en) 2008-10-10 2010-12-31 Valeo Etudes Electroniques METHOD AND DEVICE FOR ASSEMBLING A PASTILLE ON A SUBSTRATE BY PROVIDING A BRASS MASS.
CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
DE102014110915A1 (en) * 2014-07-31 2016-02-04 Thyssenkrupp Ag Hold-down device, welding device and method for checking the presence and / or the quality of a joint connection
US10104772B2 (en) 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
FR3036301B1 (en) 2015-05-21 2017-10-20 Valeo Equip Electr Moteur WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY
US10939600B2 (en) * 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
CN111511122B (en) * 2020-05-19 2022-11-29 中国电子科技集团公司第二十九研究所 Clamping soldering paste coating device and method for bottom pin-free packaged device
CN113618192B (en) * 2021-10-13 2021-12-24 深圳荣耀智能机器有限公司 Circuit board assembly welding device and circuit board assembly welding method
DE102022116028A1 (en) 2022-06-28 2023-12-28 Pac Tech - Packaging Technologies Gmbh Device and method for producing a contact connection

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5673844A (en) * 1995-12-29 1997-10-07 Gte Laboratories Incorporated Gas pressure adjustable diebonding apparatus and method
US6471110B1 (en) * 1999-09-10 2002-10-29 Esec Trading Sa Method and apparatus for mounting semiconductor chips
WO2003001572A2 (en) * 2001-06-26 2003-01-03 Datacon Semiconductor Equipment Gmbh Positioning device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420630A (en) * 1987-07-15 1989-01-24 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS6420630U (en) 1987-07-28 1989-02-01
JPH02134831A (en) * 1988-11-16 1990-05-23 Fujikura Ltd Die-bonding
JPH055388U (en) * 1991-07-15 1993-01-26 山形カシオ株式会社 Component mounting device
US5615012A (en) * 1996-03-04 1997-03-25 Motorola, Inc. Method for detecting obstructed nozzles
US6270898B1 (en) 1996-05-27 2001-08-07 Sumitomo Electric Industries, Ltd. Tool tip and bonding tool comprising the tool tip and control method for the bonding tool
JP3520702B2 (en) * 1996-12-24 2004-04-19 澁谷工業株式会社 Light irradiation bonding head
CN1134056C (en) * 1997-07-23 2004-01-07 因芬尼昂技术股份公司 Apparatus and method for establishing chip-substrate-connection
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
DE10038330C2 (en) 2000-08-05 2002-07-11 Bosch Gmbh Robert Soldering method for fastening electrical components
US6666368B2 (en) * 2000-11-10 2003-12-23 Unitive Electronics, Inc. Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween
US7296727B2 (en) * 2001-06-27 2007-11-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic components
US6951125B2 (en) * 2002-01-31 2005-10-04 Stmicroelectronics, Inc. System and method for aligning an integrated circuit die on an integrated circuit substrate
JP3817207B2 (en) 2002-08-21 2006-09-06 Ｔｄｋ株式会社 Mounting processing device and control device for mounting processing device
JP4038435B2 (en) * 2002-10-15 2008-01-23 Ｊｕｋｉ株式会社 Die bonding equipment
JP2004303757A (en) * 2003-03-28 2004-10-28 Japan Aviation Electronics Industry Ltd Bonding equipment
JP2006324533A (en) * 2005-05-20 2006-11-30 Nidec Tosok Corp Bonding load control unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5673844A (en) * 1995-12-29 1997-10-07 Gte Laboratories Incorporated Gas pressure adjustable diebonding apparatus and method
US6471110B1 (en) * 1999-09-10 2002-10-29 Esec Trading Sa Method and apparatus for mounting semiconductor chips
WO2003001572A2 (en) * 2001-06-26 2003-01-03 Datacon Semiconductor Equipment Gmbh Positioning device

Also Published As

Publication number Publication date
FR2905883B1 (en) 2008-12-05
JP5733633B2 (en) 2015-06-10
JP2010503982A (en) 2010-02-04
US8952288B2 (en) 2015-02-10
JP2012138583A (en) 2012-07-19
US20100089879A1 (en) 2010-04-15
EP2064017A2 (en) 2009-06-03
US20130062326A1 (en) 2013-03-14
FR2905883A1 (en) 2008-03-21
JP5399247B2 (en) 2014-01-29
WO2008031981A2 (en) 2008-03-20

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