WO2008016541B1 - Entretien des constituants d'un bain de sulfate de cuivre par dissolution chimique de métal cuivre - Google Patents
Entretien des constituants d'un bain de sulfate de cuivre par dissolution chimique de métal cuivreInfo
- Publication number
- WO2008016541B1 WO2008016541B1 PCT/US2007/016844 US2007016844W WO2008016541B1 WO 2008016541 B1 WO2008016541 B1 WO 2008016541B1 US 2007016844 W US2007016844 W US 2007016844W WO 2008016541 B1 WO2008016541 B1 WO 2008016541B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- plating
- tank
- solution
- process according
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract 29
- 229910052802 copper Inorganic materials 0.000 title claims abstract 29
- 239000010949 copper Substances 0.000 title claims abstract 29
- 238000004090 dissolution Methods 0.000 title claims abstract 8
- 239000002184 metal Substances 0.000 title claims abstract 7
- 229910052751 metal Inorganic materials 0.000 title claims abstract 7
- 229910000365 copper sulfate Inorganic materials 0.000 title claims 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 title claims 7
- 239000000126 substance Substances 0.000 title claims 3
- 239000000470 constituent Substances 0.000 title 1
- 238000012423 maintenance Methods 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract 26
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 6
- 229910001431 copper ion Inorganic materials 0.000 claims abstract 6
- 239000001301 oxygen Substances 0.000 claims abstract 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 6
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract 5
- 229910001882 dioxygen Inorganic materials 0.000 claims abstract 5
- 238000009713 electroplating Methods 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims 13
- 239000007800 oxidant agent Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 4
- 238000013022 venting Methods 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 3
- 238000012806 monitoring device Methods 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
L'invention se rapporte à un bain de galvanoplastie du cuivre alimenté de façon constante en ions cuivre en se fondant sur le suivi de la concentration en cuivre du bain. Sur la base de la concentration en ions cuivre, un régulateur est utilisé pour réguler la dissolution du cuivre dans un système distinct et pour alimenter le bain de galvanoplastie en cuivre dissous. Le cuivre est dissous au moyen d'acide sulfurique dans un système distinct comprenant au moins un réacteur électriquement isolé du bain. Les réacteurs sont pressurisés à l'oxygène. Du bain de galvanoplastie appauvri en cuivre est transféré vers une cuve de mélange où il est mélangé avec la solution de cuivre en provenance du ou des réacteurs. La solution de galvanoplastie ainsi rechargée est filtrée et renvoyée vers le bain de galvanoplastie. Le taux de dissolution du cuivre est déterminé par le rythme d'addition de l'oxygène qui, à son tour, est contrôlé par la pression d'oxygène dans les réacteurs et par l'utilisation d'un régulateur tel qu'un compteur d'ampères-heures/minutes qui contrôle la quantité de courant électrique envoyée vers la cuve de galvanoplastie durant le fonctionnement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83402206P | 2006-07-31 | 2006-07-31 | |
| US60/834,022 | 2006-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008016541A1 WO2008016541A1 (fr) | 2008-02-07 |
| WO2008016541B1 true WO2008016541B1 (fr) | 2008-05-15 |
Family
ID=38997469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/016844 WO2008016541A1 (fr) | 2006-07-31 | 2007-07-27 | Entretien des constituants d'un bain de sulfate de cuivre par dissolution chimique de métal cuivre |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008016541A1 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2194165A1 (fr) | 2008-10-21 | 2010-06-09 | Rohm and Haas Electronic Materials LLC | Procédé de régénération d'étain et ses métaux d'alliage dans des solutions électrolytes |
| JP2013224467A (ja) * | 2012-04-20 | 2013-10-31 | Nippon Steel & Sumikin Engineering Co Ltd | 錫溶解装置および錫溶解方法 |
| US9863054B2 (en) * | 2013-10-03 | 2018-01-09 | Neo Industries, Llc | Systems and methods for preparing and plating of work rolls |
| CN106119933A (zh) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | 安全防控电镀槽 |
| CN106119942A (zh) * | 2016-08-29 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | 安装电镀保护机器人的电镀槽 |
| US11237144B2 (en) | 2018-04-05 | 2022-02-01 | Schlumberger Technology Corporation | Using resistivity measurements to monitor the reaction kinetics between acids and carbonate rocks |
| CN113755937B (zh) * | 2021-09-09 | 2022-12-09 | 中国航发南方工业有限公司 | 电镀铂槽液的维护方法 |
| CN114214672A (zh) * | 2021-12-16 | 2022-03-22 | 九江德福科技股份有限公司 | 一种锂电铜箔制液过程中溶铜速率的控制方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6451089B1 (en) * | 2001-07-25 | 2002-09-17 | Phelps Dodge Corporation | Process for direct electrowinning of copper |
| US20040159551A1 (en) * | 2003-02-14 | 2004-08-19 | Robert Barcell | Plating using an insoluble anode and separately supplied plating material |
-
2007
- 2007-07-27 WO PCT/US2007/016844 patent/WO2008016541A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008016541A1 (fr) | 2008-02-07 |
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