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WO2008015775A1 - Châssis de dissipation thermique et boîtier de dissipation thermique - Google Patents

Châssis de dissipation thermique et boîtier de dissipation thermique Download PDF

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Publication number
WO2008015775A1
WO2008015775A1 PCT/JP2007/000761 JP2007000761W WO2008015775A1 WO 2008015775 A1 WO2008015775 A1 WO 2008015775A1 JP 2007000761 W JP2007000761 W JP 2007000761W WO 2008015775 A1 WO2008015775 A1 WO 2008015775A1
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WO
WIPO (PCT)
Prior art keywords
resin
mass
heat
rubber
parts
Prior art date
Application number
PCT/JP2007/000761
Other languages
English (en)
Japanese (ja)
Inventor
Shinsuke Fujioka
Fusamichi Kitada
Original Assignee
Techno Polymer Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006208599A external-priority patent/JP2008033147A/ja
Priority claimed from JP2006208598A external-priority patent/JP5352947B2/ja
Priority claimed from JP2006208597A external-priority patent/JP5352946B2/ja
Application filed by Techno Polymer Co., Ltd. filed Critical Techno Polymer Co., Ltd.
Publication of WO2008015775A1 publication Critical patent/WO2008015775A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon

Definitions

  • the present invention relates to a heat dissipation chassis and a heat dissipation housing, and more particularly, to a heat dissipation chassis and a heat dissipation housing used for releasing heat from a heating element.
  • the heat dissipating case includes a heat dissipating toner case capable of efficiently removing heat from the inside of the case.
  • a toner case for example, a toner case provided with a stirring mechanism for toner stored inside is known (for example, Patent Documents 1 to 3).
  • Patent Documents 1 to 3 a stirring mechanism for toner stored inside
  • it is desired to remove the heat generated by stirring or the heat of the toner itself from the viewpoint of maintaining the quality of the toner, but conventionally, such a function has been actively provided.
  • No heat dissipation toner case has been proposed.
  • Patent Document 4 a resin composition containing a thermoplastic resin such as PBT and PEEK, an inorganic fiber such as aluminum nitride, and an inorganic powder
  • Patent Document 5 a resin composition containing a specific block copolymer or hydrogenated block copolymer, a rubber softener, and a heat conductive material such as magnesium hydroxide has been proposed (Patent Document 5).
  • a filler made of aluminum nitride sintered powder is dispersed in the matrix resin, and the melting point is as low as 500 ° C. or less.
  • a high thermal conductive composite in which the above fillers are continuously welded to each other through a metal network formed in a network by a melting point metal or an eutectic alloy.
  • Patent Document 7 There has been proposed a conductive composition including a fibrous substance and including non-spherical massive graphite particles and a resin (Patent Document 7). Furthermore, there has been proposed a conductive resin composition containing a thermoplastic resin and graphite powder having a 70% or more particle aspect ratio of 3 or less (Patent Document 8).
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2 0205 _ 4 3 5 2 4
  • Patent Document 2 Japanese Patent Laid-Open No. 2 0 0 5-7 7 5 7 2
  • Patent Document 3 Japanese Patent Laid-Open No. 2 0 0 6 _ 1 1 9 5 4 9
  • Patent Document 4 Japanese Patent Laid-Open No. 8-2 8 3 4 5 6
  • Patent Document 5 Japanese Patent Laid-Open No. 2 0 0 1 _ 1 0 6 8 6 5
  • Patent Document 6 Japanese Patent Application Laid-Open No. 6-1 9 6 8 8 4
  • Patent Document 7 Japanese Patent Laid-Open No. 2 0 0 3 _ 2 5 3 1 2 7
  • Patent Document 8 Japanese Patent Laid-Open No. 2 0 0 1 _ 6 0 4 1 3
  • the metal material has low formability, the degree of freedom in shape selection, and the heat dissipation rate is low, so that heat is dissipated in the chassis. In some cases, there may be a problem with the heat inside the case. Further, the above resin composition has low moldability and may not have sufficient thermal conductivity, and is not used as a chassis.
  • An object of the present invention is a heat radiating chassis that is excellent in molding processability, thermal conductivity, heat dissipation, and electromagnetic shielding properties, and that has a thermal conductivity and thermal emissivity that are approximately intermediate values between metal and general-purpose resin. And providing a heat dissipation housing. Another object of the present invention is to provide a toner case suitable for releasing the heat possessed by the hot toner generated by stirring, in addition to the above-mentioned characteristics, and with less heat. Means for solving the problem
  • the first gist of the present invention is a heat radiating chassis used for releasing heat from a heating element, and is defined by the thermoplastic resin [A] and the following (1) to (3).
  • One or more kinds of heat conductive fillers [B] and force, and the amount of the heat conductive filler [B] with respect to 100 parts by mass of the thermoplastic resin [A] is 10 to 1, 000 masses
  • the heat-dissipating chassis is composed of a thermally conductive resin composition as a part.
  • the second gist of the present invention is a heat radiating housing in which a heating element is housed, and includes thermoplastic resin [A] and any one or more kinds of heats defined in the following (1) to (3): Thermal conductive resin composition wherein the blending amount of the thermal conductive filler [B] is 10 to 1,000 parts by mass with respect to 100 parts by mass of the thermoplastic resin [A].
  • the heat dissipating case is characterized by being composed of
  • Graphite particles having an aspect ratio of 10 to 20, a weight average particle diameter of 10 to 20 Om, and a fixed carbon content of 98% by mass or more.
  • the purity is 95.0 mass% or more, the BET specific surface area is 5.0 m2 / g or less, the volume average particle diameter (D v) is 0.5-60; u m , and the volume Oxidized magnesium particles having a ratio D v / D n of 10 to 55 between the average particle diameter (D v) and the number average particle diameter (D n).
  • Boron nitride particles having a BET specific surface area of 0.05 to 10 m 2 / g, a weight average particle diameter of 1 to 20 Om, and a scale-like shape.
  • the heat dissipation chassis and the heat dissipation housing of the present invention are easy to mold, have a high emissivity compared to metal, and can exhibit the effect of depriving and releasing heat from a heat source. Does it heat up in the body and has higher thermal conductivity than general-purpose resins? It is suitable for releasing heat.
  • FIG. 1 is an external view of an example of a toner case having a conventionally known stirring mechanism.
  • (co) polymer means homopolymerization and copolymerization
  • (meth) acryl means acrylic and methacrylic.
  • FIG. 1 is an external view of an example of a toner case having a conventionally known stirring mechanism.
  • the illustrated toner case is a toner replenishing device described in Japanese Patent Laid-Open No. 2 0 5-7 7 5 7 2 described above. It has the same structure as In other words, the toner case (11) has a container body (13) having a lid (12), an agitating blade and a conveying screw (both not shown) disposed therein, and drives these.
  • the shutter (1 5) is opened, and the toner is supplied into the copying apparatus by the operation of the conveying screw.
  • the toner case of the present invention is not limited to the one illustrated above, and as long as it has a stirring mechanism, its shape and structure Is not limited.
  • the thermally conductive resin composition used in the present invention is a thermoplastic resin [A] (hereinafter also referred to as “component [A]”) and a specific heat.
  • Conductive filler [B] (hereinafter also referred to as “component [B]”) The blending amount of [thermal conductive filler [B] to 100 parts by mass of thermoplastic resin [A] 1,000 parts by mass.
  • Component [A] is not particularly limited as long as it is a thermoplastic polymer.
  • Olefin resins such as monoolefin (co) polymers and modified polymers thereof (chlorinated polyethylene, etc.), cyclic olefin copolymers, etc .; ionomer, ethylene ⁇ vinyl acetate Copolymers, ethylene copolymers such as ethylene 'vinyl alcohol copolymer; polyvinyl chloride, ethylene ⁇ vinyl chloride polymer Polyvinylidene chloride and other vinyl chloride resins; Polymethyl methacrylate (PMMA) and other (meth) acrylic acid esters (co) polymers using at least one kind of (meth) acrylic ester; Polyamide 6, Polyamide 6 Polyamide resins such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate, etc.
  • PMMA Polymethyl methacrylate
  • PBT polybutylene terephthalate
  • polyethylene naphthalate etc.
  • Polyacetal resin Polystrength resin (PC): Polyacrylate resin; Polyphenylene ether; Polyphenylene sulfide; Fluororesin such as polytetrafluoroethylene and polyvinylidene fluoride; Liquid crystal polymer; Imide resins such as polyamide, polyamide, and polyetherimide; polyether ketone, polyether ether Ketone-based resins such as Teruketon Sulfone resins such as polysulfone and polyethersulfone; urethane resin; polyvinyl acetate; polyethylene oxide; polyvinyl alcohol; polyvinyl ether; polyvinyl propylal; phenoxy resin; photosensitive resin; . These can be used in combination of two or more. Of these, rubber reinforced resins, polystrength Ponate resins, and alloys thereof, olefin resins, polyamide resins and polyester resins are preferred.
  • the rubber-reinforced resin is a rubber-reinforced vinyl resin (A1) obtained by polymerizing a vinyl monomer (b) containing an aromatic vinyl compound in the presence of a rubbery polymer (a). Or a mixture of the rubber-reinforced vinyl resin (A 1) and a (co) polymer (A 2) of a vinyl monomer.
  • the rubbery polymer (a) may be a homopolymer or a copolymer as long as it is rubbery at room temperature, but it may be a gen-based polymer (gen-based rubbery polymer). ) And non-gen based polymers (non-gen based rubbery polymers) are preferred. Furthermore, the rubber polymer (a) may be a non-crosslinked polymer or a crosslinked polymer. These can be used in combination of two or more.
  • the above-mentioned gen-based polymers include polybutadiene, polyisoprene, polychloroprene, and other homopolymers; styrene butadiene copolymer, styrene butadiene styrene copolymer Styrene butadiene copolymer rubber such as styrene butadiene copolymer; styrene isoprene copolymer, styrene isoprene styrene copolymer, acrylonitrile styrene isoprene copolymer, etc.
  • Styrene / isoprene copolymer rubber ; natural rubber and the like.
  • Each of these copolymers may be a block copolymer or a random copolymer.
  • the above-mentioned gen-based polymers can be used in combination of two or more.
  • the non-gen-based polymer includes an ethylene unit and a unit composed of monoolefin having 3 or more carbon atoms.
  • Each of these copolymers may be a block copolymer or a random copolymer.
  • the above non-gen-based polymers can be used in combination of two or more.
  • a polymer obtained by hydrogenating an ethylene / one-olefin-based copolymer rubber and a (co) polymer containing a unit composed of a conjugated-gen compound is preferable.
  • the shape of the rubbery polymer (a) used for forming the rubber-reinforced vinyl resin (A1) is not particularly limited. And when it is in the form of particles, its weight average particle diameter is usually from 50 to 3, 0 00 nm, preferably from 1 200 to 2, 0 00 nm, more preferably from 1 2 to 80,000. nm. When the weight average particle size is less than 50 nm, the impact resistance of the composition of the present invention tends to be inferior, and when it exceeds 3,00 nm, the surface appearance of the heat dissipating chassis and the heat dissipating case tends to be inferior. It is in.
  • the weight average particle diameter can be measured by a laser diffraction method, a light scattering method, or the like.
  • the rubbery polymer (a) is in the form of particles, as long as the weight average particle diameter is within the above range, for example, It is also possible to use a material enlarged by a known method described in, for example, 9-9 3701 and JP-A-56-171677.
  • the average particle size can be adjusted by selecting the production conditions such as the type of emulsifier and the amount used, the type of initiator and the amount used, polymerization time, polymerization temperature, and stirring conditions.
  • a method of blending two or more rubber polymers ( a ) having different particle sizes may be used.
  • the vinyl monomer (b) used for the formation of the rubber-reinforced vinyl resin (A 1) may contain an aromatic vinyl compound. Otherwise, for example, a vinyl cyanide compound, ( (Meth) acrylic acid ester compounds, maleimides A compound that can be copolymerized with the aromatic vinyl compound such as a compound or an acid anhydride can be used in combination. Two or more types can be used in combination. Accordingly, the vinyl monomer (b) includes at least one aromatic vinyl compound, or at least one aromatic vinyl compound and at least one compound copolymerizable with the aromatic vinyl compound. Monomers in combination with can be used.
  • the aromatic vinyl compound is not particularly limited as long as it is a compound having at least one vinyl bond and at least one aromatic ring, and examples thereof include styrene, monomethyl. Styrene, o-methyl styrene, p_methyl styrene, vinyl toluene, S-methyl styrene, ethyl styrene, p_ tert _ butyl styrene, vinyl xylene, vinyl naphthalene, monochrome port styrene, dichlorostyrene, monopromo styrene, dib port mostyrene, Examples thereof include fluorostyrene. These can be used in combination of two or more. Of these, styrene and monomethylstyrene are preferred.
  • Examples of the vinyl cyanide compound include acrylonitrile and methacrylonitrile. Of these, acrylonitrile is preferred. These can be used in combination of two or more.
  • the above (meth) acrylic acid ester compounds include (meth) methyl acrylate, (meth) ethyl ethyl acrylate, (meth) acrylic acid n-propyl, (meth) acrylic acid isopropyl, (meth) acrylic acid n_ptyl, (meth) acrylic acid isoptyl, (meth) acrylic acid tert_butyl, (meth) acrylic acid hexyl
  • Examples include (meth) cyclohexyl acrylate, (meth) acrylic acid phenyl, and the like. These can be used in combination of two or more.
  • the maleimide compounds include maleimide, N-methylmaleimide, N-butylmaleimide, N-phenylmaleimide, N- (2-methylphenyl) maleimide, N- (4-hydroxyphenyl).
  • Examples include maleimide and N-sucrose hexylmaleimide. These are used in combination of two or more Can be.
  • a method of copolymerizing maleic anhydride and then imidizing it may be used as another method for introducing a unit comprising a maleimide compound.
  • the acid anhydride include maleic anhydride, itaconic anhydride, and anhydrous citraconic acid. These can be used in combination of two or more.
  • a vinyl compound having a functional group such as a hydroxyl group, an amino group, an epoxy group, an amide group, a strong lpoxyl group, or an oxazoline group may be used. I can do it.
  • vinyl compounds examples include (meth) acrylic acid 2-hydroxyethyl, hydroxystyrene, (meth) acrylic acid N, N-dimethylaminomethyl, N, N-jetyl_p-aminomethylstyrene, ( (Meth) acrylic acid glycidyl, (meth) acrylic acid 3,4-oxycyclohexyl, vinyl glycidyl ether, methallyl glycidyl ether, allylic glycidyl ether, methacrylamide, acrylamide, (meth)
  • acrylic acid and vinyloxazoline examples include acrylic acid and vinyloxazoline. These can be used in combination of two or more.
  • the vinyl monomer (b) contains an aromatic vinyl compound.
  • the aromatic vinyl compound (b 1) and the other vinyl monomers (b 2) The polymerization rate is usually (2 to 95) mass% / (98 to 5) mass 0 / o, preferably (10 to 90) mass 0 / o / (90 to 10)% by mass. If the amount of the aromatic vinyl compound (b 1) is too small, the moldability tends to be inferior. If it is too large, the chemical resistance and heat resistance of the heat dissipating chassis and heat dissipating case of the present invention are not sufficient. There is.
  • the vinyl monomer (b) used for forming the rubber-reinforced vinyl resin (A1) is preferably used in the following combinations.
  • a vinyl cyanide compound By using a vinyl cyanide compound, the physical property balance of chemical resistance and discoloration resistance is improved.
  • the rubber-reinforced vinyl resin (A 1) is a vinyl resin in the presence of the rubber polymer (a). It is obtained by polymerizing the monomer (b).
  • the rubber-reinforced vinyl resin (A 1) may be one or more of rubber-reinforced vinyl resins (i) obtained by using only an aromatic vinyl compound as the vinyl monomer (b).
  • the vinyl monomer (b) may be one or more of rubber-reinforced vinyl resins (ii) obtained using the monomer (1) above, and the vinyl monomer (b)
  • One or more rubber-reinforced vinyl resins (iii) obtained using the monomer (2) may be used. Furthermore, these may be appropriately combined.
  • the rubber-reinforced resin may be only rubber-reinforced vinyl resin (A 1), and rubber-reinforced vinyl-based resin. It may be a mixture of the resin (A 1) and the (co) polymer (A2) obtained by polymerization of a vinyl monomer.
  • the vinyl monomer include compounds used for forming the rubber-reinforced vinyl resin (A 1), that is, aromatic vinyl compounds, vinyl cyanide compounds, (meth) acrylic acid ester compounds, maleimides. One or more selected from compounds, acid anhydrides and compounds having a functional group can be used.
  • the (co) polymer (A2) is a polymer obtained by polymerizing components having exactly the same composition as the vinyl monomer (b) used to form the rubber-reinforced vinyl resin (A 1). It may be a polymer obtained by polymerizing the same type of monomer with different compositions, or may be a polymer obtained by polymerizing different types of monomers with different compositions. There may be. Two or more of these polymers may be contained.
  • the (co) polymer (A2) is a homopolymer or copolymer obtained by polymerization of a vinyl monomer, and is exemplified by the following (3) to (8).
  • a compound used for forming the rubber-reinforced vinyl resin (A 1) can be applied, and preferable compounds are also the same.
  • specific examples of the (co) polymer (A 2) include acrylonitrile-styrene copolymer, acrylonitrile'-one methylstyrene copolymer, acrylonitrile styrene styrene methyl methacrylate copolymer, Examples include styrene methyl methacrylate copolymer and acrylonitrile 'styrene N-phenylmaleimide copolymer.
  • the rubber-reinforced vinyl resin (A 1) can be produced by polymerizing the vinyl monomer (b) in the presence of the rubbery polymer (a).
  • the polymerization method emulsion polymerization, solution polymerization or bulk polymerization is suitable.
  • the rubber polymer (a) and the vinyl monomer (b) are used in the reaction system in the rubber polymer (a).
  • the vinyl monomer (b) may be added all at once, or divided or continuously.
  • the method which combined these may be used.
  • polymerization may be carried out by adding all or part of the rubbery polymer ( a ) during the polymerization.
  • the amount of the rubbery polymer (a) used is usually 5 to 80 parts by mass, preferably 10 to 70 parts by mass, Preferably it is 15-60 mass parts.
  • the amount of the vinyl monomer (b) used is usually 25 to 1,900 parts by mass, preferably 60 to 560 parts by mass with respect to 100 parts by mass of the rubbery polymer (a).
  • the polymerization initiator organic peroxides such as cumene high dropperoxide, diisopropyl benzene high dropperoxide, paramentane high dropperoxide, and reduction such as sugar-containing pyrophosphate prescription and sulfoxylate prescription are used.
  • Redox initiators in combination with agents; persulfates such as persulfuric power; benzoyl peroxide (BPO), lauroyl peroxide, tert-butyl carboxylate, tert-butyl carboxylate Examples include peroxides such as ponates. These can be used in combination of two or more.
  • the above polymerization initiator can be added to the reaction system all at once or continuously.
  • the amount of the polymerization initiator used is usually 0.1 to 1.5% by mass, preferably 0.2 to 0.7% by mass, based on the total amount of the vinyl monomer (b). is there.
  • Examples of the chain transfer agent include octyl mercaptan, n_dodecyl mercaptan, tert-dodecyl mercaptan, n_hexyl mercaptan, n-hexadecyl mercaptan, n_tetradecyl mercaptan, tert-tetradecyl Examples include mercabtans such as mercabtan, dimer of tapininolene and monomethylstyrene. These can be used in combination of two or more. The amount of the chain transfer agent used is usually 0.05 to 2.0% by mass with respect to the total amount of the vinyl monomer (b).
  • emulsifiers used in emulsion polymerization include higher alcohol sulfates, alkylbenzene sulfonates such as sodium dodecylbenzene sulfonate, aliphatic sulfonates such as sodium lauryl sulfate, higher aliphatic carboxylates, phosphorus
  • Nonionic surfactants such as acid-based anionic surfactants; polyethylene glycol alkyl ester types, alkyl ether types, and the like. These can be used in combination of two or more.
  • the amount of the above emulsifier is usually 0.3 to 5.0% by mass with respect to the total amount of the vinyl monomer (b).
  • Latex obtained by emulsion polymerization is usually purified by coagulation with a coagulant to form a polymer component in powder form, and then washing and drying.
  • a coagulant inorganic salts such as calcium chloride, magnesium sulfate, magnesium chloride and sodium chloride; inorganic acids such as sulfuric acid and hydrochloric acid; organic acids such as acetic acid and lactic acid are used.
  • rubber-reinforced vinyl resins (A 1) when a plurality of rubber-reinforced vinyl resins (A 1) are used in combination, they may be mixed after being isolated, but as another method, they are mixed after the latex containing each resin is manufactured. Thereafter, the rubber-reinforced vinyl resin (A 1) mixed can be obtained by solidifying.
  • the graft ratio of the rubber-reinforced vinyl resin (A 1) is usually 1 0-200 wt%, preferably from 1 5 to 1 50 weight 0 / &, more preferably Ru 20 to 1 00% by mass. If the graft ratio is less than 10% by mass, the surface appearance and impact resistance of the heat dissipating chassis and heat dissipating case of the present invention may be deteriorated. On the other hand, if it exceeds 200%, the moldability is poor.
  • the graft ratio means that X-gram of rubber component in 1 gram of rubber-reinforced vinyl resin (A 1) and 1 gram of rubber-reinforced vinyl resin (A 1) dissolved in acetone. This is the value obtained by the following equation, where y is the insoluble matter.
  • the rubber polymer (a) is an acrylic rubber, acetonitrile is used.
  • the intrinsic viscosity of the soluble component of the rubber-reinforced vinyl resin (A 1) of acetone is usually 0.1 to 1.
  • the above-mentioned graft ratio and intrinsic viscosity [77] are the types and amounts of polymerization initiator, chain transfer agent, emulsifier, solvent, etc. when producing the rubber-reinforced vinyl resin (A 1). Furthermore, it can be easily controlled by adjusting the polymerization time and polymerization temperature.
  • the (co) polymer (A2) can be produced by polymerizing the monomer components using a polymerization initiator or the like applied to the production of the rubber-reinforced vinyl resin (A1). I can do it.
  • a polymerization initiator or the like applied to the production of the rubber-reinforced vinyl resin (A1).
  • the polymerization method solution polymerization, bulk polymerization, emulsion polymerization, suspension polymerization, and the like, thermal polymerization without using a polymerization initiator, and a combination of these polymerization methods can be employed.
  • the intrinsic viscosity [77] of the (co) polymer (A2) is usually 0.1 to 1. O dl / g, preferably 0.15 ⁇ 0.7 dI / g. When the intrinsic viscosity [ ⁇ ] is within the above range, the physical property balance between molding processability and impact resistance is excellent.
  • the intrinsic viscosity [77] of this (co) polymer ( ⁇ 2) can be controlled by adjusting the production conditions as in the case of the rubber-reinforced vinyl resin ( ⁇ 1).
  • Intrinsic viscosity of soluble component by acetone of the above rubber reinforced resin is usually 0.1 to 0.8 dl / g, preferably 0.15 to 0.7 dl / g.
  • the intrinsic viscosity [7?] Is within the above range, the physical properties / lances of molding processability and impact resistance are excellent.
  • the component [A] a rubber reinforced resin is used, and the rubber reinforced resin is a rubber reinforced vinyl resin (A 1), and a rubber reinforced vinyl resin (A 1) and a vinyl single resin.
  • the content of the rubbery polymer (a) in the composition of the present invention is usually 1 to 50. % By mass, preferably 3 to 40% by mass, more preferably 3 to 35% by mass, and particularly preferably 5 to 35% by mass.
  • the moldability is excellent, and the heat dissipation chassis and heat dissipation casing of the present invention are excellent in impact resistance, surface appearance, rigidity, and heat resistance.
  • various compositions can be obtained by selecting the type of the rubber reinforced vinyl resin (A 1). For example, a composition combining a gen rubber-reinforced vinyl resin using a gen polymer as a rubber polymer (a) and a polycarbonate resin, and a non-gen polymer as a rubber polymer (a). And a composition comprising a combination of a non-gen rubber-reinforced vinyl resin and an olefin resin.
  • the above-mentioned polystrength resin is not particularly limited as long as it has a striking bond in the main chain, and may be an aromatic polycarbonate or an aliphatic polycarbonate. But you can. Moreover, you may use combining these. In the present invention, aromatic polycarbonate is preferable from the viewpoint of impact resistance, heat resistance, and the like.
  • the end of this polystrength Ponate resin may be modified with an R_CO_ group and an R′_0_CO_ group (wherein R and R ′ each represents an organic group). This polycarbonate resin can be used in combination of two or more.
  • the aromatic polycarbonate is obtained by transesterification (transesterification reaction) of an aromatic dihydroxy compound and a carbonic diester by melting, and obtained by an interfacial polycondensation method using phosgene. And those obtained by the pyridine method using the reaction product of pyridine and phosgene can be used.
  • the aromatic dihydroxy compound may be any compound having two hydroxyl groups in the molecule, such as hydroquinone and resorcinol dihydroxybenzene, 4, 4'-biphenol, 2, 2_bis (4 —Hydroxyphenyl) propane (hereinafter referred to as “bisphenol A”), 2, 2_bis (3,5_dibromo_4-hydroxyphenyl) propane, 2,2_bis (4-hydroxyphenyl) 3 _Methylphenyl) propane, 2, 2_bis (3_ tert butyl _ 4-hydroxyphenyl) propane, 2, 2_bis (3,5-dimethyl _4-hydroxyphenyl) propane, bis (4-hydroxyphenyl) Methane, 1,1_bis (p-hydroxyphenyl) ethane, 2, 2_bis (p-hydroxyphenyl) butane, 2,2_bis (p-hydroxyphenyl) pentane, 1,1_bis (p-hydroxyphenyl) cyclohexane,
  • the hydrocarbon group may be a halogen-substituted hydrocarbon group.
  • the benzene ring may be one in which a hydrogen atom contained in the benzene ring is substituted with a halogen atom.
  • the above compounds include bisphenol A, 2, 2_bis (3,5_dibromo_4-hydroxyphenyl) propane, 2,2_bis (4—hydroxyphenyl-1-methylphenyl) propane, 2, 2_bis (3_tert_butyl_4-hydroxyphenyl) propane, 2,2_bis (3,5-dimethyl_4-hydroxyphenyl) propane, bis (4-hydroxyphenyl) methane, 1, 1_bis (p-hydroxyphenyl) ethane, 2,2_bis (p-hydroxyphenyl) butane and the like. Of these, bisphenol A is particularly preferred.
  • Examples of the carbonic acid diester used to obtain an aromatic polycarbonate by transesterification include dimethyl carbonate, jetyl carbonate, di-tert-butyl carbonate, diphenyl carbonate, ditolyl ketone, and the like. It is done. These can be used in combination of two or more.
  • the viscosity average molecular weight of the polycarbonate resin is usually 15, 0 00 to 4 0, 0 0 0, preferably 1 7, 0 0 0 to 3 0, 0 0 0, more preferably 1 8, 0 0 0 to 2 8, 0 0 0. As the viscosity average molecular weight is higher, the fluidity is not sufficient and the moldability tends to be lowered.
  • the polycarbonate resin may be a mixture of two or more polycarbonate resins having different viscosity average molecular weights as long as the overall viscosity average molecular weight falls within the above range.
  • the above polycarbonate resin is the above rubber reinforced resin or (co) polymer.
  • the rubber-reinforced resin preferably includes a rubber-reinforced vinyl resin (Gen-based rubber-reinforced vinyl resin) using a gen-based polymer as the rubbery polymer (a).
  • the proportion of these used is usually 30 to 30%, assuming that the total of the polycarbonate resin and the rubber reinforced resin is 100% by mass.
  • 90 mass% and 70 to 10 mass 0 / o preferably 40 to 85 mass% and 60 to 15 mass%, more preferably 50 to 80 mass% and 50 ⁇ 20% by mass.
  • the total of the polyester resin and rubber reinforced resin is 100% by mass.
  • the content of the rubbery polymer ( a ) is usually 1 to 50% by mass, preferably 3 to 40% by mass. More preferably 3 to 35% by mass, particularly preferably 5 to 35% by mass %.
  • the above-mentioned olefin-based resin is a non-rubber-like monoolefin-containing (co) polymer containing at least one unit of olefins having 2 to 10 carbon atoms at room temperature. Polymers and the like, and these modified polymers are also included.
  • Monoolefins having 2 to 10 carbon atoms include ethylene, propylene, butene-1, pentene_1, hexene_1, 3-methylbutene_1, 4_methylpentene_1, 3— And methylhexene_1. These can be used in combination of two or more. Of these, ethylene, propylene, butene-1, 1, 3-methylbutene_1 and 4-methylpentene_1 are preferred.
  • olefin-based resin is a homopolymer
  • polyethylene, polypropylene pyrene, and the like can be given. These can be used in combination of two or more.
  • the olefinic resin is a copolymer
  • a copolymer comprising two or more of the above-mentioned olefins, such as an ethylene / propylene copolymer and an ethylene / 1-butene copolymer.
  • the above-mentioned monoolefins and non-conjugated gens such as 4_methyl-1,1,4_hexagen, 5_methyl-1,1,4_hexagen, 7_methyl-1,1,6-octadiene, 1,9-decadiene, etc.
  • a copolymer consisting of These can be used in combination of two or more.
  • the above olefin resin is a copolymer, it may be a random copolymer or a block (type) copolymer.
  • the olefin-based resin is preferably a polyethylene and a (co) polymer containing propylene units.
  • the content of propylene units comprising a (co) polymer containing propylene units is usually 40 to 100% by mass, preferably 55 to 100% by mass, more preferably 70 to 1%, based on the total amount of all units. 00% by mass.
  • olefin-based resin is a polypropylene-based homopolymer (homotype)
  • homopolymer homopolymer
  • Polymers tend to be excellent in impact resistance and flexibility.
  • the above olefin-based resin includes an acid anhydride group-modified olefin-based resin obtained by modifying the above monoolefin (co) polymer with an acid anhydride such as maleic anhydride, It may be a modified polymer such as a group-modified olefin-based resin or chlorinated polyethylene.
  • the above olefin-based resin may or may not have crystallinity, but the crystallinity by X-ray diffraction is preferably 20% or more at room temperature.
  • the melting point measured according to JISK7 1 2 1 is preferably 40 ° C or higher.
  • the melt flow rate of the above olefin-based resin is usually from 0.01 to 500 g / 10 minutes, preferably from 0.05 to 100 g / 10 minutes. .
  • component [A] When an olefin-based resin is used as component [A], it is excellent in releasability when a heat dissipation chassis or a heat dissipation housing is formed using a mold. In addition, the resulting heat dissipation chassis and heat dissipation housing are excellent in impact resistance.
  • the above olefin-based resin can be used as the component [A] together with the rubber-reinforced resin.
  • component [A] is an olefin resin
  • it is superior in molding processability, releasability, impact resistance and bending modulus compared to the conventional gen rubber-reinforced vinyl resin.
  • Thermal conductivity and heat resistance tend to decrease, and bending strain tends to increase.
  • by combining an olefin resin and a rubber reinforced resin it is possible to obtain a heat radiating chassis and a heat radiating casing excellent in the balance of impact resistance, bending modulus, bending strain and hardness.
  • a rubber-reinforced vinyl resin (non-gen rubber-reinforced vinyl resin) using a non-gen based polymer as the rubber polymer (a). It is preferable to contain.
  • the polyamide resin is not particularly limited as long as it is a polymer having an acid amide bond (_CO_N H-) in the main chain.
  • This polyamide resin is usually prepared by a known method such as ring-opening polymerization of a lactam compound having a ring structure, polymerization of an aminocarboxylic acid, or condensation polymerization of a dicarboxylic acid and a diamine compound. Manufactured. Therefore, the above polyamide resin is used as a homopolyamide, a copolyamide or the like.
  • lactam compound used in the ring-opening polymerization examples include ⁇ -force prolactam and ⁇ -laurolactam.
  • aminocarboxylic acid examples include aminocaproic acid, aminoenanoic acid, aminocaprylic acid, aminobergonic acid, 7-aminoheptanoic acid, 11 1-aminoundecanoic acid, 9_aminononanoic acid, and 12-aminododecanoic acid.
  • Examples of the dicarboxylic acid used for polycondensation of dicarboxylic acid and diamine compound include adipic acid, suberic acid, sebacic acid, dodecanedicarboxylic acid, glutaric acid, cyclohexanedicarboxylic acid, terephthalic acid, 2-methyl terephthalic acid.
  • Examples include taric acid, isophthalic acid, and naphthalenedicarboxylic acid.
  • Diamine compounds include ethylene diamine, tetramethylene diamine, hexamethylene diamine, nonamethylene diamine, decamethylene diamine, undecamethylene diamine, dodecamethylene diamine, 2, 3, 4_trimethylhexamethylenediamine, 2,4,4_trimethylhexamethylenediamine, bis ( ⁇ -aminocyclohexyl) methane, m_xylylenediamine, P-xylylenediamine Minh, Parafuji dilamin, metapheny dilamin and the like.
  • polyamide-based resin examples include nylon 4, 6, 7, 8, 11, 1 2, 6, 6, 6, 9, 6, 10, 6, 1 1, 6, 1 2, 6th, 6/6, 6, 6/1 2, 6 / 6th, 6T / 6I, etc. can be used.
  • the ends of this polyamide component may be sealed with carboxylic acid, amine or the like.
  • carboxylic acid examples include aliphatic monocarboxylic acids such as cabronic acid, strong prillic acid, strong purine acid, lauric acid, myristic acid, palmitic acid, stearic acid, and behenic acid.
  • the amine examples include aliphatic primary amines such as hexylamine, octylamine, decylamine, laurylamine, myristylamine, palmitylamamine, stearylamine, and behenylamine.
  • aliphatic primary amines such as hexylamine, octylamine, decylamine, laurylamine, myristylamine, palmitylamamine, stearylamine, and behenylamine.
  • the polyester-based resin may be any of aliphatic polyester, alicyclic polyester, and aromatic polyester.
  • This polyester resin is usually produced by a reaction between an acid component containing dicarboxylic acid and / or an ester-forming derivative of dicarboxylic acid, and a diol component containing a diol compound and / or an ester-forming derivative of a diol compound. Therefore, the above polyester resins can be used as homopolyesters, copolyesters, and the like.
  • the crystallinity of the polyester resin is not particularly limited.
  • dicarboxylic acids include terephthalic acid, isophthalic acid, orthophthalic acid, 2, 6 _ naphthalenedicarboxylic acid, 4, 4 '— biphenyldicarbonic acid, 4, 4' — diphenyl
  • aromatic dicarboxylic acids such as lutedicarboxylic acid, 4,4'-diphenylmethanedicarboxylic acid, 4,4'-diphenylsulfonedicarboxylic acid, 4,4'-diphenylisopropylidenedicarboxylic acid .
  • substitution products alkyl group substitution products such as methyl isophthalic acid
  • derivatives alkyl ester compounds such as dimethyl terephthalate and dimethyl 2,6-naphthalenediphthalate
  • oxyacids and their ester-forming derivatives such as p_oxybenzoic acid and p-hydroxyethoxybenzoic acid can also be used.
  • the above acid components can be used in combination of two or more.
  • diol component examples include aliphatic glycols such as ethylene glycol, propylene glycol, butylene glycol, hexylene glycol, and neopentyl glycol; alicyclic compounds such as 1,4-cyclohexanedimethanol Glycol and the like. These substitution products and derivatives can also be used. It is also possible to use cyclic ester compounds such as prolacton. If necessary, long-chain diol compounds (polyethylene glycol, polytetramethylene glycol, etc.), bisphenols alkyles A nonoxide addition polymer (such as an ethylene oxide addition polymer of bisphenol A) can also be used. The above diol components can be used in combination of two or more.
  • aliphatic glycols such as ethylene glycol, propylene glycol, butylene glycol, hexylene glycol, and neopentyl glycol
  • alicyclic compounds such as 1,4-cyclohexanedimethanol Gly
  • polyester resin examples include polyethylene terephthalate (PET), polypropylene terephthalate, polybutylene terephthalate (PBT), polyhexamethylene terephthalate, polycyclohexane 1 4, 4-dimethyl terephthalate, polyneopentyl terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene naphthalate, polyhexamethylene naphthalate, etc. can be used.
  • a copolymerized polyester can also be used. These can be used in combination of two or more.
  • a preferable copolyester is a dicarboxylic acid component mainly containing terephthalic acid and / or a derivative thereof (lower alkyl ester such as dimethyl ester, acid halide such as acid anhydride or acid chloride, etc.). And a copolymerized polybutylene terephthalate having a glass transition temperature of preferably in the range of 0 to 75 ° C., for example, by polycondensation with a dihydroxy component containing 1,4-butanediol.
  • copolymer polybutylene terephthalate is particularly preferred.
  • Copolymerized polybutylene terephthalate is known to be substantially more flexible than the above-mentioned polybutylene terephthalate (P B T), and is also called “soft P B T”.
  • the dicarboxylic acid component used in the production of the copolymerized polyethylene terephthalate is usually 30% by mass or more, preferably 40% by mass or more, more preferably 50% by mass, based on the total amount.
  • dicarboxylic acid components other than terephthalic acid and its derivatives Is as described above, such as isophthalic acid.
  • Two or more other dicarponic acid components can be used in combination.
  • the dihydroxy component used in the production of the copolymerized polyethylene terephthalate is usually 10% by mass or more, preferably 30% by mass or more, more preferably 50% by mass or more, based on the total amount. Contains 1, 4 _ butanediol.
  • dihydroxy components other than 1,4_butanediol include linear or branched aliphatic alkylene glycols having about 2 to 12 carbon atoms such as ethylene glycol; aromatic diols; Polyoxyalkylene glycol and the like are as described above. Other dihydroxy components can be used in combination of two or more.
  • preferred copolymer-type polybutylene terephthalate is exemplified as follows, but a dicarponic acid component containing 50% by mass or more of terephthalic acid and / or a derivative thereof, 1,4_butanediol and others And a polymer obtained by polycondensation with a dihydroxy component containing 1,4_butanediol usually in a range of 50 to 90% by mass, preferably 60 to 90% by mass.
  • the other dihydroxy component is preferably a polyoxyalkylene glycol having a poly (oxyalkylene) unit such as diethylene glycol or polytetramethylene glycol and having an oxyalkylene unit having about 2 to 4 repeats.
  • a dicarboxylic acid component comprising terephthalic acid and / or a derivative thereof
  • 1,4-butanediol and other dihydroxy components is usually contained in an amount of 50 to 90% by mass, preferably 60 to 90% by mass.
  • the glass transition temperature of the copolymerized polybutylene terephthalate is usually 0 to 75 ° C.
  • the lower limit temperature is preferably a temperature exceeding 0 ° C.
  • the upper limit temperature is preferably less than 70 ° C, more preferably less than 65 ° C, particularly preferably less than 60 ° C, and most preferably less than 50 ° C. If the glass transition temperature is too low, the mechanical strength and heat resistance of the molded article containing the composition of the present invention are not sufficient, while if too high, the flexibility is poor.
  • the glass transition temperature can be obtained by a dynamic viscoelasticity measurement method.
  • the temperature of the esterification reaction is usually 150 to 280 ° C, preferably 180 to 265 ° C, and the pressure is usually 50 to 1 000 Torr (6666 to 1 33322 Pa), preferably 70. ⁇ 760 Torr (9333 ⁇ 1 0 1 325 Pa), reaction time is usually 2 ⁇ 5 hours.
  • the temperature of the polycondensation reaction is usually 2 10 to 280 ° C, preferably 220 to 265 ° C, and the pressure is usually 2 OOT orr (26664 Pa) or less, preferably 1 50 Torr (1 9998 P a)
  • the reaction time is usually 2 to 5 hours.
  • the reaction format may be continuous, semi-continuous or batch.
  • the resin obtained by the polycondensation reaction is usually transferred from the bottom of the polycondensation reaction tank to a polymer extraction die, extracted into a strand, and not cooled with water. Or after cooling with water, it is cut with a cutter to form pellets, chips, etc.
  • the esterification reaction catalyst include titanium compounds, tin compounds, magnesium compounds, calcium compounds, and zirconium compounds.
  • the resulting heat dissipation chassis and heat dissipation housing are excellent in heat resistance.
  • Component [B] is a heat conduction filler having specific physical properties, and includes at least one of the following three types, components [B 1] to [B 3].
  • Component [B 1] is graphite particles having specific physical properties. That is, graphite particles having an aspect ratio of 10 to 20, a weight average particle diameter of 10 to 200; U m, and a fixed carbon content of 98% by mass or more.
  • the above aspect ratio is preferably 12 to 18; the weight average particle size is preferably 15 to 180; U m; and the fixed carbon content is preferably 98.5% by mass or more, more preferably 99% by mass or more.
  • the thermal conductivity is further improved.
  • the above aspect ratio can be calculated by measuring the length and width of an object with an electron microscope or the like.
  • the weight average particle diameter can be measured by a laser diffraction method, a light scattering method, or the like.
  • the “weight average particle diameter” according to the present invention means the particle diameter (D 50) obtained by measuring the particle size distribution when the cumulative weight is 50%.
  • the amount of fixed carbon can be measured according to JISM8511.
  • component [B 1] is a ratio of particle diameters D 20 and D 80 when the cumulative weights obtained by measuring the particle size distribution are 20% and 80%, respectively.
  • D 80 / D 20 Is preferably 2 to 12. More preferably, it is 2.5-10.
  • the component [B 1] may be either Hishi graphite or S-graphite. Moreover, you may combine these. Furthermore, either natural graphite or artificial graphite can be used. Moreover, you may combine these.
  • Natural graphite is not particularly limited as long as no band is observed at a wavelength of about 1 360 cm- 1 by laser-Raman measurement, and examples thereof include scale-like graphite, massive graphite, and earth-like graphite. . Of these, scaly graphite is preferred.
  • the amount of component [B 1] is 10 to 100 parts by mass with respect to 100 parts by mass of component [A], depending on the required performance of the heat dissipation chassis or heat dissipation housing, etc. , Can be determined as appropriate. If the blending amount of component [B 1] is less than 10 parts by mass, the thermal conductivity and electromagnetic shielding properties are insufficient, while if it exceeds 1,000 parts by mass, the moldability may not be sufficient.
  • the amount of component [B 1] is usually 10 to 100 parts by weight, preferably 25 to 82 parts by weight, Preferably it is 42-82 mass parts.
  • the amount of component [B 1] is usually 100 to 1, 000 parts by weight, preferably 150 to 900 parts by weight. More preferably, it is 230 to 570 parts by mass.
  • composition of the present invention mainly containing components [A] and [B1], or the component [B1] contained in the heat-dissipating chassis or heat-dissipating case is used for a test piece prepared by a known method.
  • the aspect ratio and the average particle size (more specifically, the number average particle size) can be obtained.
  • the aspect ratio and the average particle size are usually the same as the aspect ratio and the weight average particle size of the component [B 1] before blending, respectively.
  • Component [B2] is magnesium oxide particles having specific physical properties. That is, the purity is 95.0% by mass or more, the BET specific surface area is 5.0 m 2 / g or less, the volume average particle size (D V) is 0.5 to 60 m, and the volume average particle size (D v) And the number average particle size (D n) ratio Magnesium oxide with D v / D n of 10-55 It is a particle.
  • a water-absorbing-treated product in which 100 parts by mass of magnesium oxide particles are heat-treated with 0.1 to 10 parts by mass of an organosilicon compound is preferable.
  • the type of magnesium oxide is not particularly limited, and is a lightly burned magnesium obtained by firing carbonate (magnesite), nitrate, hydroxide, etc. at 1,400 ° C or lower, and the above temperature.
  • Hard-fired magnesia obtained by sintering at a higher temperature (for example, 1800 ° C or higher) also called “high-temperature fired magnesia cleansing force”
  • electrofused magnesia obtained by crushing after ingot is mentioned. These can be used in combination of two or more. In the present invention, electrofused magnet is preferred.
  • the purity of the components [B2] is preferably 96.0 to 1 00% by weight, further preferably rather is 98.0 to 1 00 weight 0/0, and particularly preferably from 98.5 to 1 00% by weight,
  • the layer is preferably 99.0 to 100% by mass. If the purity is too low, water resistance and thermal conductivity may not be sufficient when a heat dissipation chassis or heat dissipation chassis is used.
  • the purity can be measured according to JIS K6224.
  • B2 preferably has a BET specific surface area of 0.1 to 3.5 m 2 / g, more preferably 0.1 to 3 m 2 / g, particularly preferably 0.2 to 2 m 2 / g, a single layer. Preferably it is 0.2-0.8m ⁇ 2 > / g. If this BET specific surface area is too high, water resistance may not be sufficient when a heat radiating chassis or heat radiating chassis is used. The BET specific surface area can be measured using a commercially available device.
  • D v of component [B2] is preferably 2 to 50; Um, more preferably 5 to 3. If this D v is too large, the desired thermal conductivity may not be obtained when a resin composition is used, and the appearance and mechanical properties of the heat dissipation chassis and heat dissipation housing may deteriorate. . On the other hand, if Dv is too small, water resistance and thermal conductivity may not be sufficient when a heat dissipation chassis or heat dissipation housing is used. The
  • the ratio D v / D n is preferably 12 to 50, more preferably 15 to 40. If this ratio is too large, the heat dissipation chassis or the heat dissipation housing may not have sufficient water resistance. On the other hand, if it is too small, the desired thermal conductivity may not be obtained.
  • the above Dv and Dn can be measured by a laser diffraction scattering method, a dynamic light scattering method, or the like.
  • Component [B2] may be a combination of two or more of them in any ratio as long as the above physical properties fall within the above ranges.
  • organosilicon compound used for the modification of magnesium oxide examples include silicone oils, silane coupling agents, alkoxysilane compounds, and silylating agents. Of these, silicone oil and silane coupling agent are preferable, and silicone oil is particularly preferable.
  • silicone oil any of unmodified silicone oil and modified silicone oil may be used, or a combination thereof may be used.
  • Non-modified silicone oils include dimethyl silicone oil in which all of the side chains and terminals of the polysiloxane are methyl groups, methylphenyl silicone oil in which some of the side chains of the polysiloxane are phenyl groups, polysiloxane And methylhydridosilicone oil in which a part of the side chain is a hydrogen atom.
  • Modified silicone oils include alkoxy modification, amino modification, force oxyl modification, epoxy modification, silazane modification, phenol modification, carbinol modification, methacryl modification, mercapto modification, polyether modification, methyl styryl modification, alkyl modification, high grade. Examples include fatty acid ester modification, fluorine modification, and hydrophilic special modification, but the presence or absence of reactivity is not particularly limited. Of these, alkoxy-modified silicone oil and methylhydrogen silicone oil are preferable, and alkoxy-modified silicone oil is particularly preferable.
  • the above silicone oils can be used in combination of two or more.
  • the kinematic viscosity (25 ° C) of the silicone oil is usually 0.5 to 10, 0 0 0 c c St, preferably 1 to 5, 0 0 c c St, more preferably 1.5-3, OOO c St. If the viscosity is too high, the water resistance may not be improved. On the other hand, if the viscosity is too low, it may be difficult to prepare the mixture before the heating step, and the water resistance may not be improved.
  • the viscosity of the silicone oil can be measured by the Ostwald method.
  • silane coupling agents include vinyltrichlorosilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (; 3-methoxyxoxy) silane, r- (methacryloxypropyl) trimethoxysilane, r
  • Examples of the alkoxysilane compound include tetramethoxysilane, tetraethoxysilane, and methyltriethoxysilane.
  • the above alkoxysilane compounds can be used in combination of two or more.
  • Examples of the silylating agent include trimethylchlorosilane and hexamethyldisilazane. The above silylating agents can be used in combination of two or more.
  • silicone oil silane coupling agent, alkoxysilane compound, silylating agent and the like may be used in combination.
  • the amount of the organosilicon compound used is usually 0.5 to 7 parts by mass, preferably 1 to 3 parts by mass with respect to 100 parts by mass of magnesium oxide. If the amount of the organosilicon compound used is too small, the effect of improving water resistance by the modified magnesium oxide may not be sufficient. On the other hand, if too much, thermal conductivity may not improve.
  • the method for preparing the mixture containing magnesium oxide and the organosilicon compound is not particularly limited, and a known charging method, stirring method, or the like can be applied in a known container. By stirring, the entire surface of the magnesium oxide is covered with the organosilicon compound.
  • the mixture is heated using an industrial furnace such as an electric furnace or a gas furnace.
  • the heating time at that time is usually 10 minutes to 5 hours, preferably 30 minutes to 4 hours, more preferably 30 minutes to 3 hours.
  • the heating temperature is too low and when the heating time is too short, the improvement effect of water resistance by the modified magnesium oxide tends to be insufficient.
  • the temperature is too high and when the heating time is too long, the water resistance tends to decrease.
  • silicone oil is used as the organosilicon compound, the adhesiveness between the silicone oil and the magnesium oxide and the hydrophobicity that develops with the temperature and time conditions at which the silicone oil is completely decomposed tend to decrease.
  • Component [B2] may be obtained by the heating step described above, and further, phosphate ester, higher fatty acid and its metal salt, higher fatty acid ester, higher fatty acid amide, higher alcohol. It may be treated with a surface treatment agent such as hardened oil. By using these surface treatment agents, water resistance may be further improved, and dispersibility in the thermoplastic resin may be further improved.
  • the amount of the surface treatment agent to be used is not particularly limited, but is usually 0.05 to 5 parts by mass, preferably 0.1 to 4 parts by mass, more preferably 100 parts by mass of magnesium oxide. 0.2 to 3 parts by mass.
  • a desired amount of the above surface treatment agent is added to the above magnesium oxide, and the temperature at which this melts, for example, usually 50 to 1550 ° C, preferably 80 to 1 3 0. It can be carried out by stirring and mixing while heating to ° C. Heating time is usually 5 minutes to 3 The time, preferably 10 minutes to 1 hour.
  • Component [B2] can have a water absorption of 1% by mass or less, preferably 0.5% by mass or less after standing for 8 days in an atmosphere at a temperature of 60 ° C and a relative humidity of 90%. It can be below.
  • the amount of component [B2] is 10 to 100 parts by mass with respect to 100 parts by mass of component [A], and depending on the required performance of the heat dissipation chassis or heat dissipation housing, It can be determined as appropriate.
  • the amount of component [B2] is preferably 15 to 800 parts by mass, more preferably 20 to 600 parts by mass, and particularly preferably 25 to 400 parts by mass. If the blending amount of the component [B 1] is less than 10 parts by mass, the thermal conductivity is not sufficient, while if it exceeds 1,000 parts by mass, the moldability, the appearance of the heat dissipation chassis and the heat dissipation case and Impact resistance may be reduced.
  • Component [B3] is boron nitride particles having specific physical properties. That is, boron nitride particles having a BET specific surface area of 0.05 to 10 m 2 / g, a weight average particle diameter of 1 to 20 O m and a scale-like shape. The boron nitride particles may be subjected to various surface treatments as in the case of the component [B2]. The amount of component [B3] is the same as that of component [B2].
  • the above boron nitride has a plurality of stable structures such as c_BN (zincite structure), w-BN (urbite structure), h_BN (hexagonal crystal structure), r_BN (rhombohedral crystal structure).
  • c_BN zincite structure
  • w-BN urbite structure
  • h_BN hexagonal crystal structure
  • r_BN rhombohedral crystal structure
  • the composition of the present invention can be blended with other heat conductive filler (component [C]).
  • the weight average particle diameter of component [C] is usually 0.1 to 500; Um, preferably 1 to 300 m.
  • those having a high aspect ratio are preferred, scale-like (plate-like), needle-like, etc. are preferred, but the aspect ratio of a sphere, cube, etc. is preferred.
  • a value close to 1 can also be used.
  • mixing with a material having a high aspect ratio may be preferable because it exhibits thermal conductivity regardless of the direction of resin flow during molding. Either conductive or insulating can be used. However, if a failure such as a short circuit occurs due to electrical connection depending on the application, an insulating filler can be used.
  • Specific examples of component [c] include the following (1
  • Carbon-based heat conduction fillers include graphite (artificial graphite, natural graphite), force pon fiber (PAN, pitch), force pon nanotube (multi-walled carbon nanotube, single-walled carbon) Nanotubes, carbon nanocoils) and the like.
  • Examples of the insulating heat conduction filter include crystalline silica, fused silica, silicon carbide, alumina, zinc oxide, titanium oxide, aluminum nitride, silicon nitride, and beryllia.
  • metal-based heat conduction fillers include stainless steel, copper, silver, zinc, iron, aluminum, and nickel.
  • Examples of other heat conduction fillers include fibers such as Tsukibon Fiber 1, glass fiber, and polyamide fiber, and those having a metal coating on the surface of flakes.
  • Component [C] can be surface treated in the same manner as component [B 2].
  • composition of the present invention can contain an impact resistance improver (component [D]).
  • Component [D] is a polymer component (soft resin, rubber and elastomer) that improves impact resistance in the heat dissipating chassis and heat dissipating housing of the present invention.
  • a polymer component soft resin, rubber and elastomer
  • conjugation-based polymers ethylene 'olefin copolymers, ethylene-
  • conjugated gen-based polymers ethylene'-olefin-based copolymers, ethylene- (meth) acrylic acid ester-based copolymers, and unsaturated bonds in the presence of these polymers.
  • An acid anhydride grafted polymer obtained by reacting an acid anhydride having the acid anhydride and a metal salt thereof are preferred.
  • Component [D] may be a non-crosslinked polymer or a crosslinked polymer.
  • Component [D] has an unsaturated bond in the presence of the above-mentioned conjugated gen-based polymer, ethylene'-olefin-based copolymer, or ethylene (meth) acrylate ester-based copolymer
  • An acid anhydrous grafted polymer obtained by reacting one or more acid anhydrides can also be used.
  • the acid anhydride include anhydrous maleic acid, itaconic anhydride, citraconic anhydride, and crotonic anhydride.
  • the acid anhydride grafted polymer may be an unhydrogenated or hydrogenated styrene / butadiene / styrene block copolymer_g_maleic anhydride copolymer (“g” represents a graft.
  • the amount of acid anhydride grafted (also referred to as "acid-modified amount”) is usually 0.3 to 0 relative to the acid anhydride grafted copolymer. 7% by mass, preferably 0.35 to 0.65% by mass, and more preferably 0.4 to 0.6% by mass. If it is in this range, sufficient impact resistance can be obtained, and a decrease in thermal stability can be suppressed.
  • the amount of component [D] is usually 1 to 50 parts by weight, preferably 3 to 45 parts by weight, more preferably 5 to 4 parts per 100 parts by weight in total of components [A] and [D]. 0 parts by mass. Within this range, sufficient impact resistance can be obtained. If the amount of component [D] is too large, moldability may be reduced.
  • composition of the present invention can be blended with additives depending on the purpose and application.
  • additives include fillers, heat stabilizers, antioxidants, ultraviolet absorbers, flame retardants, anti-aging agents, plasticizers, antibacterial agents, and coloring agents.
  • the above fillers include heavy calcium carbonate, light calcium carbonate, very fine activated calcium carbonate, special calcium carbonate, basic magnesium carbonate, kaolin clay, calcined clay, pyrophyllite clay, silane-treated clay, Synthetic calcium silicate, synthetic magnesium silicate, synthetic aluminum silicate, magnesium carbonate, magnesium hydroxide, kaolin, sericite, tarc, fine talc, wollastonite, zeolite, zonolite, aspest, PM F (Processed Mineral Fiber), pepper, sepiolite, potassium titanate, elastadite, gypsum fiber, glass balun, silica balun, hydrated talcite, fly ash balun, shirasu balun, carbon balun, barium sulfate, Sulfur Aluminum, calcium sulfate, molybdenum disulfide, and the like. These can be used in combination of two or more.
  • the amount of the filler is usually 1 to 30 parts by mass, preferably
  • Examples of the heat stabilizer include phosphites, hindered phenols, And ethers. These can be used in combination of two or more.
  • the amount of the heat stabilizer is usually 0.01 to 5 parts by mass with respect to 100 parts by mass of the component [A].
  • antioxidants examples include phosphites, hindered amines, hydroquinones, hindered phenols, and sulfur-containing compounds. These can be used in combination of two or more.
  • the amount of the above-mentioned antioxidant is usually from 0. 1 to 5 parts by weight, preferably from 0.05 to 3 parts by weight, more preferably from 0. 1 part by weight of component [A]. 1 to 2 parts by mass.
  • Examples of the ultraviolet absorber include benzophenones, benzotriazols, salicylic acid esters, and metal complex salts. These can be used in combination of two or more.
  • the blending amount of the above-mentioned ultraviolet absorber is usually from 0.001 to 10 parts by weight, preferably from 0.05 to 5 parts by weight, more preferably from 0.1 to 100 parts by weight of the component [A]. ⁇ 5 parts by weight.
  • Examples of the flame retardant include organic flame retardants, inorganic flame retardants, and reactive flame retardants. These can be used in combination of two or more.
  • organic flame retardants include brominated epoxy compounds, brominated alkyltriazine compounds, brominated bisphenol-based epoxy resins, brominated bisphenol-based phenoxy resins, brominated bisphenol-based polycarbonate resins, brominated polystyrene.
  • Halogen flame retardants such as resin, brominated crosslinked polystyrene resin, brominated bisphenol cyanurate resin, brominated polyphenylene ether, decabromodiphenyl oxide, tetrabromobisphenol A and oligomers thereof; trimethyl phosphate, trie Tyl phosphate, tripropyl phosphate, tributyl phosphate, tripentyl phosphate, toxyl phosphate, tricyclohexyl phosphate, triphenyl phosphate, tricresyl phosphate Chromatography, trixylenyl phosphate, cresyl diphenyl phosphate, Axis registration Ruff enyl phosphate, dimethyl Chill E chill phosphate, methyl dibutyl phosphate, Echirujipuropiru Hosufue Ichito, phosphoric acids such as hydroxyphenyl diphenyl phosphate Hue one DOO S. And phosphorous
  • inorganic flame retardants include aluminum hydroxide, antimony oxide, magnesium hydroxide, zinc borate, zirconium-based, molybdenum-based, zinc stannate, guanidine salt, silicone-based, and phosphazene-based compounds. . These can be used in combination of two or more.
  • Reactive flame retardants include tetrabromobisphenol A, dibromophenol glycidyl ether, brominated aromatic triazine, tribromophenol, tetrabromophthalate, tetrachlorophthalic anhydride, dibromoneopentyl glycol, poly (pe Ntab mouth mobenzyl polyacrylate), chlorendic acid (hett acid), anhydrous chlorendic acid (anhydrous het acid), brominated phenol glycidyl ether, dipromocredyl glycidyl ether, and the like. These can be used in combination of two or more.
  • the amount of the flame retardant is usually 1 to 30 parts by weight, preferably 3 to 25 parts by weight, and more preferably 5 to 20 parts by weight with respect to 100 parts by weight of the component [A].
  • the composition of the present invention contains a flame retardant
  • a flame retardant aid include antimony trioxide, antimony tetroxide, antimony pentoxide, sodium antimonate, antimony tartrate and other antimony compounds, zinc borate, barium metaborate, hydrated alumina, zirconium oxide, Examples include ammonium polyphosphate, tin oxide, and iron oxide. These can be used in combination of two or more.
  • silicone oil can be added to improve flame retardancy.
  • Examples of the anti-aging agent include naphthylamine compounds, diphenylamine compounds, p-phenylenediamine compounds, quinoline compounds, hydroquinone derivative compounds, monophenol compounds, and bisphenol compounds. Compounds, trisphenol compounds, polyphenol compounds, thiobisphenol compounds, hindered phenol compounds, phosphite compounds, imidazole compounds, nickel dithiocarbamate compounds, phosphate compounds, etc. Is mentioned. These can be used in combination of two or more.
  • the blending amount of the above-mentioned anti-aging agent is usually 0 with respect to 100 parts by mass of the component [A].
  • plasticizer examples include dimethyl phthalate, jetyl phthalate, dibutyl phthalate, diisobutyl phthalate, dioctyl phthalate, butyl octyl phthalate, di (2-ethylhexyl) phthalate, diisooctyl phthalate, diisodecyl.
  • Phthalic acid esters such as phthalates; dimethyl adipate, diisobutyl adipate, di (2-ethylhexyl) adipate, diisooctyl adipate, diisodecyl adipate, octyldecyl adipate, di (2-ethylhexyl) Fatty acid esters such as azelate, diisooctyl azelate, diisoptylazelate, dibutyl sebacate, di (2-ethylhexyl) sebacate, diisooctyl sebacate; Trimellitic acid octyl ester, trimellitic acid n-octyl ester, trimellitic acid isononyl ester trimellitic acid esters; di- (2-ethylhexyl) fumarate, diethylene glycol monooleate, Examples include glyceryl monoricinoleate, tri
  • the amount of the plasticizer is usually 0.5 to 0.1 parts by mass of component [A].
  • antibacterial agent examples include silver-based zeolite and silver-zinc-based zeolite.
  • Light-based antibacterial agents silica gel-based antibacterial agents such as complexed silver-silica gel, glass-based antibacterial agents, calcium phosphate-based antibacterial agents, zirconium phosphate-based antibacterial agents, and silicate-based antibacterial agents such as silver-magnesium aluminate Agent
  • inorganic antibacterial agent such as titanium oxide antibacterial agent, ceramic antibacterial agent, whisker antibacterial agent; formaldehyde release agent, halogenated aromatic compound, rhodopropargyl derivative, thiocyanato compound, isothiazolinone derivative, trihalomethylthio compound
  • Organic antibacterial agents such as quaternary ammonium salts, biguanide compounds, aldehydes, phenols, pyridine oxides, carbanilides, diphenyl ethers, carboxylic acids, organometallic compounds; inorganic ⁇ organic hybrid
  • the amount of the above antibacterial agent is generally 0.001 to 10 parts by weight, preferably 0.05 to 5 parts by weight, and more preferably 0 to 100 parts by weight of component [A]. 1 to 5 parts by mass.
  • Examples of the colorant include organic dyes, inorganic pigments, and organic pigments, and these can be used in combination of two or more.
  • the composition of the present invention is produced by charging the above-described raw material components at a predetermined ratio into an extruder, a Banbury-mixer, a mixer, a roll, a feeder-louder, etc., and then kneading. I can do it.
  • the method of using the raw material components is not particularly limited, and each component may be mixed and then kneaded, or may be kneaded after being divided and mixed in multiple stages.
  • the kneading temperature is selected according to the type of component [A].
  • the composition of the present invention is excellent in thermal conductivity, and the thermal conductivity measured by the method described in the following test examples is usually 1 W / m K or more, preferably 1 to 5 OW / m. (2) More preferably, it is 3 to 45 W / m 2 K, and particularly preferably 7 to 4 OW / m 2.
  • the composition of the present invention is excellent in radioactivity, and the emissivity measured by the method described in the following test examples is usually from 0.65 to 0.99, preferably from 0.70 to 0.9. 8, more preferably from 0.75 to 0.97.
  • the composition of the present invention has excellent electromagnetic shielding properties, and electromagnetic shielding at a frequency of 100 MHz. The effect is usually 15 dB or more, preferably 15 to 60 dB, more preferably 20 to 55 dB.
  • the heat-dissipating chassis of the present invention can be obtained by molding the composition of the present invention.
  • the composition of the present invention does not have to be used on the entire chassis, and one surface of the chassis is made of another material. Alternatively, a hole may be provided on any surface.
  • metals such as aluminum and copper; other general-purpose resins such as ABS resin, olefin resin, polycarbonate resin, polyamide resin, and polyester resin may be laminated.
  • the thickness of the chassis is not particularly limited, but is usually 0.3 to 5 mm, and preferably about 0.5 to 4 mm.
  • Examples of the molding method of the heat dissipation chassis include injection molding, extrusion molding (sheet extrusion, profile extrusion), two-color molding, hollow molding, compression molding, vacuum molding, foam molding, blow molding, and the like.
  • the heat dissipating case of the present invention is obtained by forming a box shape using the composition of the present invention.
  • the composition of the present invention does not need to be used on the entire surface of the case. It may be made of a material, and a hole may be provided on any surface.
  • the same general-purpose resin as described above may be laminated.
  • the thickness of one surface of the housing is not particularly limited, but is usually 1 to 7 mm, preferably about 2 to 5 mm. Examples of the method for forming the heat-dissipating casing include the same molding method as described above.
  • the toner case of the present invention is obtained by forming a box shape using the composition of the present invention. It is not necessary to use the composition of the present invention over the entire surface of the toner case, You may comprise with material. In addition, metals such as aluminum and copper; other general-purpose resins such as ABS resin, olefin resin, poly-polynate resin, polyamide resin, and polyester resin may be laminated.
  • the thickness of the toner case is not particularly limited, but is usually about 1 to 7 mm, preferably about 2 to 5 mm. Examples of the toner case molding method include injection molding, extrusion molding (sheet extrusion, profile extrusion), two-color molding, hollow molding, compression molding, vacuum molding, foam molding, blow molding, and the like.
  • the molding temperature and the mold temperature are selected depending on the type of the component [A].
  • component [A] contains rubber-reinforced vinyl resin (A 1)
  • the cylinder temperature during molding is usually 2 20 to 30 ° 0 °, preferably 2 3 0 to 2 80 ° C.
  • the mold temperature is usually 70 to 90 ° C.
  • component [A] contains an olefin resin
  • the cylinder temperature at the time of molding is usually 2200 to 2800 ° C, preferably 2100 to 2500 ° C.
  • the mold temperature is usually 30 to 50 ° C.
  • component [A] contains a polyamide-based resin
  • the cylinder temperature at the time of molding is usually from 230 to 300 ° C., preferably from 25 to 80 ° C.
  • the mold temperature is usually 70 to 90 ° C.
  • the temperature of the cylinder at the time of molding is usually 2 30 to 30 ° 0 °, preferably 2 5 0 to 2 80 ° C.
  • the mold temperature is usually 70 to 90 ° C. If the heat-dissipating chassis or heat-dissipating chassis is large, it is generally manufactured by setting the cylinder temperature higher.
  • the heat dissipating chassis of the present invention is used as a key chassis or sub-chassis to release heat from the heating element.
  • Typical examples of heating elements include exothermic parts that are themselves exothermic, and specific examples include LD (laser-diode) and IC (integrated) in electronic and electrical products such as mobile phones and TVs. Circuit)) and the like.
  • LD laser-diode
  • IC integrated in electronic and electrical products such as mobile phones and TVs. Circuit
  • the heat dissipating chassis of the present invention is also suitably used as a LED mounting substrate and a reflector of LED (light emitting diode) lighting package material.
  • the heat dissipating casing of the present invention is used with a heating element housed therein.
  • the heating element may be a thing that is exothermic per se or a substance that generates heat when heated from the outside.
  • Typical heating elements are exothermic parts or equipment (devices), for example, electronic parts such as LD (laser diode) and IC (integrated circuit), electronic equipment using computers such as personal computers, word processors and video games. Based on information such as the amount of air sucked into the car engine and the throttle opening
  • ECUs engine control units
  • fog lamps fog lamps
  • wiper motors which are computers that determine the fuel injection amount and ignition timing.
  • the present invention is carried out as described above.
  • the evaluation results of the composition of the present invention, which is a characteristic part of the present invention, are shown below.
  • the present invention is not limited to the following test examples as long as the gist thereof is not exceeded. In the following, parts and% are based on mass unless otherwise specified.
  • the raw material component used for manufacture of a heat conductive resin composition is shown below. It should be noted that the weight average particle diameter of the rubbery polymer; the ratio of the particle diameters D 20 and D 80 when the weight average particle diameter and the cumulative weight of the graphite particles are 20% and 80%, respectively. D 80 / D 20 was measured using a Microtrac particle size distribution measuring device “FRA type” manufactured by Nikkiso Co., Ltd. The aspect ratio of the graphite particles was calculated from the average value of the longest and shortest diameters of 100 particles from an image taken with an electron microscope (SEM). Further, the fixed carbon content of the graphite particles was measured according to JIS M8511.
  • Genogen rubber reinforced vinyl resin consisting of 1.5%, styrene unit amount 42.7% and acrylonitrile unit amount 15.8% was used.
  • the graft ratio of this resin is 55%, and the intrinsic viscosity of acetone-soluble components [77] (measured in methyl ethyl ketone at 30 ° C) is 0.45 dl / g.
  • a copolymer having a styrene unit amount of 74.5% and an acrylonitrile unit amount of 25.5% was used.
  • Intrinsic viscosity [77] (measured in methyl ethyl ketone at 30 ° C ) Is 0.60 dI / g.
  • NOVADURAN 550 5S (trade name) manufactured by Mitsubishi Engineering Plastics Co., Ltd. (modified PBT with flexibility, dimethyl terephthalate, copolymer of 1,4-butanediol and polytetramethylene glycol) It was.
  • T 7741 P (trade name) manufactured by JSR was used. Acid modification amount by infrared spectroscopy 0.5%, a density of MFR equivalent to 0. 86 g / cm 3, JISK 721 0 ( temperature 23 ° C, the load 2. 1 6 kg) is 1. O g / 1 0 minutes.
  • H F — 150A (trade name) manufactured by Chuetsu Graphite Industries Co., Ltd. was used. The shape is scaly, the aspect ratio is 16, the weight average particle size is 161 m, and the fixed carbon content is 99.8%. D80 / D20 is 2.7.
  • Water-resistant magnesium oxide (trade name “A_ 1 0”) manufactured by Kamishima Chemical Co., Ltd. (Spherical, average particle size: 10 m, BET specific surface area: 1.2 m 2 / g, D v: 1 4.2, DM / ⁇ n: 3 1.0)
  • Table 1 below shows the molding processability of a 55 mm long, 80 mm wide, 2.4 mm thick plate-shaped test piece using the NN 30 B type injection molding machine manufactured by Niigata Iron Works. Judgment was made according to the criteria shown.
  • the molding conditions of the test piece are as follows.
  • thermoplastic resin (1) is used as component [A]
  • the cylinder temperature is 280 ° C
  • the mold temperature is 70 ° C
  • the injection pressure is 80 ⁇ 1 ⁇ 2.
  • resin (4) is used, the cylinder temperature is 250 ° C
  • mold temperature is 50 ° C
  • injection pressure is 20%
  • thermoplastic resins (5) and (6) are used, the cylinder temperature is 280 ° C, mold temperature is 70 ° C, injection pressure is 80%.
  • the thermal conductivity is a value measured with respect to the flow direction of the composition at the time of molding of the test piece. Conductivity was measured.
  • the test piece is a disk with an inner diameter of 1 Omm and a thickness of 1.5 mm.
  • the measurement was performed at an ambient temperature of 25 ° C by a reflected energy measurement method using infrared detection using a thermospot sensor “TSS_5X type” manufactured by Japan Sensor.
  • the specimen is a flat plate of 1 50 mm X l 50 mm X 3 mm.
  • the test piece is a flat plate of 1 50 mm ⁇ 1 50 mm ⁇ 3 mm.
  • the specimen is a disk with an inner diameter of 1 O Omm and a thickness of 2 mm.
  • the unit of resistance is ⁇ .
  • Charbi impact strength (notched) was measured according to ISO 179. The unit is k J / m 2 .
  • each of the above raw material components was mixed with a hensil mixer at the blending ratios shown in Tables 4-7. Then, it melt-kneaded (cylinder temperature 240-280 degreeC) using the twin-screw extruder, and manufactured the pellet (thermal conductive resin composition). After that, this pellet was supplied to the “J1 OOE type” injection molding machine manufactured by Nippon Steel Co., Ltd., with a cylinder temperature of 240-280 ° C, a mold temperature of 70 ° C, an injection speed of 6 Omm / second, And, under the condition of holding pressure of 7 OMPa, test pieces for evaluation having a predetermined shape and size according to the evaluation items were prepared and subjected to various evaluations. The results are shown in Tables 4-7.
  • Valuation mix Is combined (weight heat test (warm.) Physical properties c ⁇

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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne un châssis de dissipation thermique et un boîtier de dissipation thermique présentant d'excellentes propriétés d'aptitude au moulage, de conductivité thermique, de dissipation thermique et de blindage électromagnétique. Le châssis de dissipation thermique et le boîtier de dissipation thermique comprennent respectivement un taux de conductivité thermique et de dissipation thermique généralement intermédiaire entre ceux d'un métal et ceux d'une résine courante. De manière spécifique, l'invention concerne un châssis de dissipation thermique utilisé pour dissiper la chaleur à partir d'un corps chauffant ou un boîtier de dissipation thermique pour contenir un corps chauffant, qui est constitué d'une composition de résine conductrice de chaleur contenant une résine thermoplastique [A]et une charge conductrice de chaleur spécifique [B]. La quantité de mélange de charge conductrice de chaleur [B]pour 100 parties en poids de la résine thermoplastique [A]est de 10 à 1000 parties en poids.
PCT/JP2007/000761 2006-07-31 2007-07-12 Châssis de dissipation thermique et boîtier de dissipation thermique WO2008015775A1 (fr)

Applications Claiming Priority (6)

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JP2006-208597 2006-07-31
JP2006208599A JP2008033147A (ja) 2006-07-31 2006-07-31 トナーケース
JP2006-208599 2006-07-31
JP2006208598A JP5352947B2 (ja) 2006-07-31 2006-07-31 放熱シャーシ
JP2006-208598 2006-07-31
JP2006208597A JP5352946B2 (ja) 2006-07-31 2006-07-31 放熱筐体

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WO2012053168A1 (fr) * 2010-10-19 2012-04-26 オイレス工業株式会社 Objet d'étanchéité à bande sphérique et son processus de production
JP2012107135A (ja) * 2010-11-18 2012-06-07 Ube Industries Ltd ポリアミド樹脂組成物及びそれからなる成形品
CN103172993A (zh) * 2011-12-23 2013-06-26 奇美实业股份有限公司 树脂组成物
CN103172994A (zh) * 2011-12-23 2013-06-26 奇美实业股份有限公司 树脂组成物
CN103459489A (zh) * 2011-03-23 2013-12-18 日东电工株式会社 散热构件及其制造方法
JP2014001335A (ja) * 2012-06-20 2014-01-09 Toyobo Co Ltd 熱伝導性樹脂組成物
WO2015190324A1 (fr) * 2014-06-10 2015-12-17 株式会社カネカ Composition de résine thermoconductrice
US10305521B2 (en) 2002-05-01 2019-05-28 Dali Wireless, Inc. High efficiency linearization power amplifier for wireless communication
CN114174435A (zh) * 2020-05-28 2022-03-11 迪睿合株式会社 导热片及其制造方法以及散热结构体和电子设备

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US10305521B2 (en) 2002-05-01 2019-05-28 Dali Wireless, Inc. High efficiency linearization power amplifier for wireless communication
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WO2012043640A1 (fr) * 2010-09-30 2012-04-05 宇部興産株式会社 Composition de résine de polyamide et objet moulé la comprenant
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WO2012053168A1 (fr) * 2010-10-19 2012-04-26 オイレス工業株式会社 Objet d'étanchéité à bande sphérique et son processus de production
JP2012107135A (ja) * 2010-11-18 2012-06-07 Ube Industries Ltd ポリアミド樹脂組成物及びそれからなる成形品
CN103459489A (zh) * 2011-03-23 2013-12-18 日东电工株式会社 散热构件及其制造方法
CN103172994A (zh) * 2011-12-23 2013-06-26 奇美实业股份有限公司 树脂组成物
CN103172993A (zh) * 2011-12-23 2013-06-26 奇美实业股份有限公司 树脂组成物
JP2014001335A (ja) * 2012-06-20 2014-01-09 Toyobo Co Ltd 熱伝導性樹脂組成物
WO2015190324A1 (fr) * 2014-06-10 2015-12-17 株式会社カネカ Composition de résine thermoconductrice
JPWO2015190324A1 (ja) * 2014-06-10 2017-04-20 株式会社カネカ 熱伝導性樹脂組成物
CN114174435A (zh) * 2020-05-28 2022-03-11 迪睿合株式会社 导热片及其制造方法以及散热结构体和电子设备
CN114174435B (zh) * 2020-05-28 2023-04-25 迪睿合株式会社 导热片及其制造方法以及散热结构体和电子设备

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