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WO2008005325A2 - Station d'accueil de porte-tranches - Google Patents

Station d'accueil de porte-tranches Download PDF

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Publication number
WO2008005325A2
WO2008005325A2 PCT/US2007/015111 US2007015111W WO2008005325A2 WO 2008005325 A2 WO2008005325 A2 WO 2008005325A2 US 2007015111 W US2007015111 W US 2007015111W WO 2008005325 A2 WO2008005325 A2 WO 2008005325A2
Authority
WO
WIPO (PCT)
Prior art keywords
wafer carrier
kinematic
rechargeable battery
docking station
coupling
Prior art date
Application number
PCT/US2007/015111
Other languages
English (en)
Other versions
WO2008005325A3 (fr
Inventor
Barry Gregerson
James M. Anderson
Original Assignee
Entegris, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris, Inc. filed Critical Entegris, Inc.
Publication of WO2008005325A2 publication Critical patent/WO2008005325A2/fr
Publication of WO2008005325A3 publication Critical patent/WO2008005325A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J5/00—Circuit arrangements for transfer of electric power between AC networks and DC networks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • H02J7/0044—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction specially adapted for holding portable devices containing batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • H02J7/0045—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction concerning the insertion or the connection of the batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/02—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/40—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
    • H02J50/402—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas

Definitions

  • the present invention is generally applicable to the field of docking stations. More specifically, the invention is directed to the field of interfacing with microenvironments having on-board microprocessors or sensors.
  • a variety of portable microenvironments utilized in the transport and storage of semiconductor wafers and substrates have evolved to include a system for continuous or periodic monitoring of conditions (e.g. temperature, pressure, humidity and/or static charge) inside or immediately outside the microenvironment.
  • conditions e.g. temperature, pressure, humidity and/or static charge
  • Some on-board systems may include a microprocessor for monitoring and digitization of instrumentation signals, storage capability for logging the data, and a radio frequency (RF) transmitter that relays the information to a central processing station. Power is usually supplied by a battery that is often rechargeable.
  • the microenvironments include but are not limited to front-opening unified pods (FOUPs), front-opening shipping boxes (FOSBs) or standard mechanical interface pods (SMIF pods).
  • containers that include such on-board systems may be referred to as "smart" containers (e.g. "smart FOUPs").
  • Containers may reside in inventory for a period of months for engineering and testing. During such extended period, there may be a need to keep the battery above a threshold charge in order to maintain monitoring and transmission of microenvironment data.
  • short term storage e.g. on the order of a few hours or days
  • Stockers can be relatively complex and expensive structures, adapted to accommodate robotic manipulators in clean room environments.
  • smart containers are relatively new to the semiconductor industry, many existing stockers are not equipped to maintain or accommodate smart containers. Replacement of existing stockers with new stockers that are compatible with smart containers may be an expensive proposition that inhibit adoption of smart container technology.
  • a number of stocker systems utilize conveyor rail flanges on the container for locating the microenvironment within the stocker. Placement by conveyor rail lacks the repeatability required for reliable coupling between the smart container and the charger.
  • Semiconductor fabrication facilities would benefit from a system that enables ready and reliable connection with chargers or data acquisition/storage devices and that overcomes the problem of unreliable RF data transmission, preferably without the need to replace existing stockers.
  • a rechargeable battery interface on the smart container mates with a docking station through terminal contacts rather than through electrical wiring to provide ready mounting / dismounting of the portable device to the docking station, and to eliminate dangling electrical cords that may hinder the use or performance of the portable device. Alignment of contact terminals and selective energization of the charging source contact terminations may also be provided.
  • Some embodiments of the invention include a docking station having a base that is configured to support and accept a smart container equipped with kinematic couplings, such as a smart FOUP. The kinematic couplings may align power terminals on the smart container for reliable and repeatable coupling with a recharging interface on the charging staion.
  • Various embodiments of the invention may include an interface for transfer of data from the monitoring instrumentation therethrough.
  • the mode of transfer may be by via electrical contacts, by transfer across an inductive coupling, by fiber optic coupling, or by other interfacing techniques available to the artisan.
  • the stocker may be outfitted to include cabling appropriate for the type of interface for transfer of the data to a central processing station. Transferring data in this way may negate the need for monitoring signals by RF transmission while the smart carrier is stored in the stocker.
  • a station comprising a base plate having a top surface and at least one edge, a plurality of kinematic coupling pins extending from the top surface, and an interface module mounted to the base plate near the edge.
  • the interface module may have an exposed surface accessible from the top surface of the base plate.
  • the interface module may include a transformer that converts an AC power source to a DC power source, at least one terminal contact extending upward from the exposed surface and operatively coupled to the DC power source.
  • a single remote transformer may supply a plurality of docking stations with DC power.
  • a contact switch may be operatively connected between at least one of the terminal contacts and the DC power source to energize the terminal when the contact switch is closed.
  • a docking station for recharging at least one rechargeable battery on a wafer carrier comprises a base plate including kinematic coupling pins arranged for engagement with a plurality of kinematic couplings on the wafer carrier.
  • An interface module may be operatively coupled with the base plate and including a power converter
  • the power converter may be operatively coupled with a pair of charger terminal contacts configured to operatively couple the at least one rechargeable battery to provide the electrical current for recharging.
  • the pair of charger terminal contacts may be operatively coupled to the rechargeable battery when the kinematic couplings of the wafer carrier are engaged with the kinematic coupling pins of the base plate.
  • the contacts may be spring biased.
  • a contact switch may also be configured to enable flow of the electrical current to the rechargeable battery when the kinematic couplings of the wafer carrier are engaged with the kinematic coupling pins of the base plate.
  • Light emitting diodes operatively configured for indicating a status of said docking station may also be visible from an exposed surface of the interface module.
  • Another embodiment comprises a wafer carrier including at least one rechargeable battery operatively coupled thereto, the wafer carrier having kinematic couplings, the at least one rechargeable battery including at least one electrical receiving coupling adapted to receive electrical current for recharging the at least one rechargeable battery.
  • a a base plate including kinematic coupling pins may be arranged for engagement with the kinematic couplings of the wafer carrier.
  • An interface module may be operatively coupled with the base plate and include a power converter operatively coupled with at least one electrical source coupling, the at least one electrical source coupling arranged to operatively couple with the at least one electrical receiving coupling to provide electrical current for recharging the at least one rechargeable battery.
  • the at least one electrical source coupling and the at least one electrical receiving coupling may be operatively aligned when the kinematic couplings of the wafer carrier are engaged with the kinematic coupling pins of the base plate.
  • the at least one electrical source coupling may include a first pair of charger terminal contacts and the at least one electrical receiving coupling may include a second pair of charger terminal contacts. Either one of the first pair of charger terminal contacts and the second pair of charger terminal contacts may be spring biased.
  • the wafer carrier system may also be mounted within a stocker.
  • Certain embodiments of the invention include a wafer carrier including an instrumentation module for monitoring conditions within or proximate the wafer carrier, the wafer carrier having kinematic couplings.
  • a docking station with an interface module adapted to transmit data to or receive data from the instrumentation module may have kinematic coupling pins arranged for engagement with the kinematic couplings of the wafer carrier.
  • the interface module and the instrumentation module may be operatively coupled when the kinematic couplings of the wafer carrier are engaged with the kinematic coupling pins of the docking station.
  • the interface module may be operatively coupled with a data bus for transmission of data to or from the interface module.
  • the data bus may be operatively coupled with a remote computer.
  • the instrumentation module may include a microprocessor adapted to transmit data to or receive data from the interface module.
  • the system may include at least one rechargeable battery operative Iy coupled with the microprocessor, the at least one rechargeable battery including at least one electrical receiving coupling adapted to receive electrical current for recharging the at least one rechargeable battery.
  • the interface module may be configured for inductive coupling with a carrier-side coil operatively coupled to the instrumentation module and a stationary- side coil operatively coupled to the interface module, the inductive coupling made operative when the kinematic couplings of the wafer carrier are engaged with the kinematic coupling pins of the base plate.
  • the docking station may stand alone or be mounted to a stocker.
  • An advantage of various embodiments of the invention is the ability to recharge the batteries of smart carriers while they are in inventory.
  • Another advantage of certain embodiments of the invention is the ability to retrofit existing stocker facilities with docking stations for accommodation of smart carriers, thereby eliminating the need to replace entire stocker structures.
  • Another advantage of various embodiments of the invention is the ability to monitor smart carriers without resorting to radio frequency links.
  • FIG. 1 is a perspective view of a docking station in an embodiment of the invention
  • FIG. IA is a partial sectional view of the docking station of FIG. 1 ;
  • FIG. 2 is a perspective view of the docking station of FIG. 1 with a smart FOUP placed thereon in an embodiment of the invention
  • FIG. 3 is an electrical schematic of a wafer carrier system in an embodiment of the invention.
  • FIG. 4 is a schematic of a rechargeable battery inductively coupled to a docking station in an embodiment of the invention
  • FIG. 5 is a schematic of a docking station having an inductively coupled charging and data transfer interface in an embodiment of the invention.
  • a smart container 10 and a charging or docking station 12 is depicted.
  • the docking station 12 may comprise a base plate 14 having a width 16, an overall length 18, an upper surface 20 and a perimeter portion 22.
  • a trio of kinematic coupling pins 24, 26 and 28 extend upward from the upper surface 20.
  • a charging or interface module 30 having an exposed face 31 is mounted to the base plate 14.
  • the base plate 14 may be shaped to correspond approximately to the plan view or "footprint" of the smart container 10.
  • the base plate 14 may include a projecting portion 32 that extends substantially beyond the footprint of the smart container 10.
  • the interface module 30 includes a power converter such as a direct current (DC) power source 33 having positive (+) and negative (-) hookups (FIG. 3).
  • the DC power source 33 may be in the form of an AC to DC power supply that is operatively coupled with an AC power source.
  • the DC power source 33 may be operatively coupled to electrical source couplings such as a pair of charger terminal contacts 34 and 36.
  • the electrical circuit (FIG. 3) may further include a contact switch 38.
  • the terminal contacts 34 and 36 may be biased with biasing springs 39, such as depicted in FIG. IA.
  • the embodiment of FIG. 1 also depicts the exposed face 31 of the interface module 30 as being substantially flush with the upper surface 20 of the base plate 14.
  • the interface module 30 may also include a light source or sources, such as the pair of light emitting diodes (LEDs) 40 and 42 depicted in FIG. 1.
  • the interface module 30 may be operatively coupled with the base plate 14 so that the light sources 40, 42 are positioned in the projecting portion 32 of the base plate 14.
  • the LEDs 40 and 42 may be configured to indicate the status of the docking station 12 in a variety of ways. One light may be configured to emit red only when there is current flowing through the terminal contacts 34 and 36. The second light may be configured to emit green when the contact switch 38 is closed, yet there is not current flowing through the terminal contacts 34 and 36.
  • the control of the LEDs 40 and 42 may be performed through relay circuits that are controlled by a microprocessor (not depicted).
  • the base plate may be made of a metal, such as steel, aluminum or magnesium, or an electrically conducting composite. Where an oxidizing metal is utilized for the base material, the base plate may be coated with a protective coating such as a polymer powder coating, an anodized coating, a plating or paint to inhibit oxidation.
  • a protective coating such as a polymer powder coating, an anodized coating, a plating or paint to inhibit oxidation.
  • the smart container 10 includes an instrumentation module 44 powered by a rechargeable battery 46.
  • a number of sensors are included with the instrumentation module 44 to monitor the environmental conditions within the smart container 10.
  • the parameters monitored may include, but are not limited to temperature, pressure, humidity and static charge.
  • the sensors may communicate to a wafer fabrication control center via radio frequency (RF) transmission (not depicted).
  • RF radio frequency
  • the smart container 10 is equipped with kinematic couplings (not depicted) on the underside that are in alignment with the kinematic coupling pins 24, 26 and 28. The smart container 10 is thus suspended over the upper surface 20 of the base plate 14.
  • the docking station 12 may be a stand-alone unit that plugs into a wall outlet (not depicted) to supply the AC to DC transformer.
  • the docking station 12 may also include feet 45 to elevate the base plate 14.
  • a plurality docking stations 12 may be hard wired in a stocking arrangement for storage of inventory in multiple smart containers 10.
  • the docking station may be dimensioned to retrofit existing stocker.
  • Representative and non-limiting dimensions for the base plate 14 are 15.25-in. for the width 16, 15.5-in. for the length 18, 0.5-in for the thickness, and 0.512-in. for the height of the kinematic coupling pins 24, 26 and 28 extending above the base plate 14.
  • the underside of the smart container 10 engages the contact switch 38 causing it to close, thereby completing the circuit that energizes the terminal contacts 34 and 36 for charging the battery 46.
  • the LEDs 40 and 42 may remain exposed when the smart container 10 is in place on the docking station 12.
  • the contact switch 38 remains in a normally open configuration, and the terminal contacts 34 and 36 are not energized. This arrangement prevents inadvertent shorting of the terminal contacts 34 and 36 which could damage the interface module 30.
  • the smart container 10 may be equipped with standard kinematic couplings that engage with the kinematic coupling pins 24, 26 and 28 and orients the smart container 10 so that the terminal contacts 34 and 36 are in alignment with the contacts of the rechargeable battery 46.
  • the kinematic couplings may negate the need for a separate alignment structure.
  • the base plate 14 is made preferably of an electrical conductor to enable discharge of static dissipative potential to ground.
  • the width 16 of the base plate 14 may be dimensioned to cooperate with standard or conventional stock racks that presently house FOUPs in existing fabrication environments. In so adapting the docking station 12 to the appropriate width, the kinematic coupling system employed by the docking station 12 may be utilized and supported by existing infrastructure without need for modification of that infrastructure.
  • the smart container 10 substantially covers the docking station 12.
  • the projecting portion 32 remains uncovered, thereby leaving the light sources 40 and 42 exposed and visible. This enables personnel to check the charging status of the smart container 10.
  • the exposed surface 31 may be substantially flush with the upper surface 20 of the base plate 14, or register above or below the upper surface 20.
  • the kinematic coupling pins 24, 26 and 28 suspend the smart container 10 over the upper surface 20.
  • the position of the exposed face 31 relative to the upper surface 20 is a function of the height of the kinematic coupling pins 24, 26 and 28, the depth of the kinematic couplings, and the vertical position of the engaging portion of the smart container 10 relative to the interface between the kinematic coupling pins 24, 26 and 28 and the kinematic couplings.
  • Terminal contacts 34 and 36 that are spring biased may comply with the placement of the smart container 10 and mitigate concerns that the smart container 10 is being supported by the contacts rather than the kinematic coupling pins 24, 26.
  • the biasing springs 39 may further provide a reliable contact pressure at the terminal contacts 34, 36.
  • the spring biasing of terminal contacts 34 and 36 may also provide a degree of lateral movement that accommodates some degree of misalignment.
  • an inductive charger coupling 50 including a source or stationary-side coil 52 contained within the interface module 30 inductively coupled to a pickup or carrier-side coil 54 is depicted in an embodiment of the invention.
  • An example of an inductive coupling arrangement is provided by United States Patent No. 5,959,433 to Rohde, the disclosure of which is hereby incorporated by reference other than any express definitions of terms specifically defined therein.
  • the carrier-side coil 54 may be included within the housing of the rechargeable battery 46, which may also include a rectifier 56 and other conditioning circuitry 58 for DC charging the cells 60 of the rechargeable battery 46.
  • some inductive chargers are configured to charge across planar interfaces.
  • the inductive charger coupling 50 may enable charging of the rechargeable battery 46 without substantially altering the profile of the docking station 12.
  • other inductive coupling configurations such as the stationary-side coil 52 being located in a post that mates with a recess for coaxial alignment with the carrier-side coil 54 (not depicted), may be incorporated within the scope of the invention.
  • the embodiment depicted in FIG. 4 also eliminates moving parts in making the contact, and enables hermetic seal of the components to inhibit contamination that may lead to failure of the various components.
  • the instrumentation module 44 may include a microprocessor 72 operatively coupled to analog-to-digital (A/D) converters 74 that digitize the signals received from a plurality of instrumentation 76 monitoring various parameters within a microenvironment 77.
  • the microprocessor 72 may also be operatively coupled to receive data (e.g.
  • the receiver demodulator 78 and the transmitter driver 80 may be coupled to the carrier-side coil 54 using transmission lines 82 that are also used to charge the cells 60 of the rechargeable battery 46.
  • the stationary-side coil 52 is operatively coupled with an AC source 84 and a bi-directional modulator / demodulator 86.
  • the bi-directional modulator / demodulator 86 may receive data from a remote computer 88 across a data bus 90 and modulate the data for transmission between the carrier-side coil 54 and the stationary-side coil 52 and through the transmission lines 82 for reception by the receiver demodulator 78 and subsequent communication with the microprocessor 72.
  • the microprocessor 72 may operate the transmitter driver 80 to send a modulated signal back through the transmission lines 82, across the stationary-side coil 52 and the carrier-side coil 54 interface to the bidirectional modulator / demodulator 86, which demodulates the signal for transmission across the data bus 90 to the remote computer 88.
  • FIG. 5 depicts a single microenvironment 77 being monitored.
  • a plurality of microenvironments may also be configured for transfer of power and data, such as would be encountered in a stocker facility.
  • the data bus 90 may be configured for polling of multiple microenvironments through utilization of an IEEE- 488 General Purpose Interface Bus or other interface busses suited for polling multiple devices.
  • inventions may incorporate alternative configurations for transmitting data across the smart container / docking station interface.
  • separate transmission lines could be utilized instead of a shared arrangement with the power transmission.
  • the separate lines could still utilize inductive coupling across the interface, or could use other connections such as analog contact, digital contact (e.g. serial transmission lines), infrared coupling or fiber optic coupling.
  • An analog cable with conductors for various of the instrumentation signals may be used instead of the data bus 50.
  • the power / data transmission system 70 provides ready coupling of the rechargeable battery 46 to a charging source, and may also provide data transmission from the microenvironment to a central processing data bank without the need for a RF link.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne une station d'accueil pour charger une batterie rechargeable sur un contenant tel qu'une nacelle unitaire à ouverture frontale (FOUP) et/ou coupler des instruments sur le contenant avec un moniteur distant. La station d'accueil est configurée afin de supporter et aligner un contenant comportant un module d'instruments qui surveille le porte-tranches. Le module d'instruments peut être alimenté par une batterie rechargeable à travers une interface avec des couplages tels que des couplages inducteurs ou des contacts électriques pour la mise en prise avec les contacts de chargement sur la station d'accueil. Un commutateur de contact peut permettre de fournir du courant au circuit de chargement uniquement lorsque le contenant est présent sur la station d'accueil. La batterie peut être alignée sur les contacts sur la station d'accueil par l'utilisation de couplages cinématiques sur le contenant. Des sources lumineuses telles que des diodes électroluminescentes (LED) peuvent indiquer le statut de l'unité de chargement.
PCT/US2007/015111 2006-06-30 2007-06-28 Station d'accueil de porte-tranches WO2008005325A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81780006P 2006-06-30 2006-06-30
US60/817,800 2006-06-30

Publications (2)

Publication Number Publication Date
WO2008005325A2 true WO2008005325A2 (fr) 2008-01-10
WO2008005325A3 WO2008005325A3 (fr) 2008-07-31

Family

ID=38895129

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/015111 WO2008005325A2 (fr) 2006-06-30 2007-06-28 Station d'accueil de porte-tranches

Country Status (2)

Country Link
TW (1) TW200807609A (fr)
WO (1) WO2008005325A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140122654A1 (en) * 2012-10-30 2014-05-01 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
EP4207453A4 (fr) * 2020-08-28 2024-08-14 Eagle Industry Co., Ltd. Instrument électronique

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US6119093A (en) * 1997-07-01 2000-09-12 Walker Asset Management Limited Partnership System for syndication of insurance
US6397990B1 (en) * 1998-10-20 2002-06-04 Pri Automation, Inc. Materials transport system having inductive power transfer
US6917182B2 (en) * 2003-07-24 2005-07-12 Motorola, Inc. Method and system for providing induction charging having improved efficiency

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140122654A1 (en) * 2012-10-30 2014-05-01 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
US9356822B2 (en) * 2012-10-30 2016-05-31 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
EP4207453A4 (fr) * 2020-08-28 2024-08-14 Eagle Industry Co., Ltd. Instrument électronique

Also Published As

Publication number Publication date
TW200807609A (en) 2008-02-01
WO2008005325A3 (fr) 2008-07-31

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