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WO2008000551A2 - Dissipateur de chaleur - Google Patents

Dissipateur de chaleur Download PDF

Info

Publication number
WO2008000551A2
WO2008000551A2 PCT/EP2007/054881 EP2007054881W WO2008000551A2 WO 2008000551 A2 WO2008000551 A2 WO 2008000551A2 EP 2007054881 W EP2007054881 W EP 2007054881W WO 2008000551 A2 WO2008000551 A2 WO 2008000551A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
recess
medium
conducting medium
heat sink
Prior art date
Application number
PCT/EP2007/054881
Other languages
German (de)
English (en)
Other versions
WO2008000551A3 (fr
Inventor
Ian Trevor Williams
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2008000551A2 publication Critical patent/WO2008000551A2/fr
Publication of WO2008000551A3 publication Critical patent/WO2008000551A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to a heat sink for heat dissipation of an electronic assembly.
  • the invention is therefore an object of the invention to provide a heat sink for the dissipation of heat from an electronic assembly, which is efficient, mechanically advantageous executable and inexpensive to implement.
  • the invention is characterized by a heat sink for dissipating heat from an electrical unit, with a thermally conductive base body having a recess, and a heat-conducting medium arranged in the recess, which is connected to the base body in FIG thermally conductive contact is, wherein the heat-conducting medium is formed and arranged so that the electronic assembly protrudes when properly coupled to the heat sink at least partially into the recess and is in heat-conducting contact with the heat-conducting medium.
  • the heat-conducting medium has viscoelastic material.
  • a deformation of a viscoelastic material is zeitab ⁇ pendent. After a discharge, the visco-elastic elongation returns after a certain time to the part of the plastic strain. This means that a viscoelastic material relaxes only incompletely after removal of the external force. The remaining energy is dissipated in the form of flow processes. This makes it possible that the electronic assembly can reach a large contact surface with the heat-conducting medium, since the electronic assembly can dive into the heat-conducting medium and thus reach a large area for the heat transfer from the electronic assembly to the viscoelastic material of the heat ⁇ conductive medium is.
  • the heat-conducting medium has spontaneously elastic material.
  • the deformation of spontaneously elastic materials is time-independent and has an immediate effect on the change of a force acting on the spontaneous elastic material. out of sight. It can be achieved so that the electronic assembly achieved by the spontaneous elastic behavior of the heat-conducting medium secure contact with the heat-conducting medium, since the heat-conducting medium can be pressed against the electronic assembly.
  • the recess is formed as a depression in the base body, that is, the base body is only weakened in the region of the recess, but there may be carried out without a breakthrough.
  • the recess can be provided with a heat-conducting medium made of a material that should not come into contact with the environment. This is especially true if the material of the thermally conductive Medi ⁇ ums in a wider sense could cause contamination of the environment.
  • the heat conductive ⁇ Me dium can be shielded tightly against the environment. This means that even a pasty thermally conductive medium, without causing pollution of the environment, can be arranged in the recess. Since the base body is only weakened in the region of the recess, but has no breakthrough, allows the formation of the recess as Vertie ⁇ tion of the body further high stability of the body.
  • the invention is characterized by a circuit carrier arrangement with a heat sink and at least one electronic component.
  • the circuit carrier arrangement has a carrier plate, which is mechanically coupled to the heat sink and on which the electronic nische component is arranged. It is thus possible to save space to arrange the elekt ⁇ tronic component on the circuit carrier arrangement and directly by means of the heat sink to cow ⁇ len.
  • the single FIGURE is a sectional view of a Heidelbergungsträ ⁇ geranix.
  • the sectional view shown in the figure illustrates the structure of a circuit carrier assembly 10th
  • a circuit carrier 12 is mounted on a base body 14 formed of a thermally conductive material, which is preferably a part of a housing.
  • the circuit carrier 12 has a carrier plate 20 on which on a first component side 22 electronic components 26 are arranged ⁇ .
  • the electronic ⁇ rule components 26, 28 are electrically and mechanically fixedly coupled in a known manner by means of soldering or gluing to the carrier plate twentieth
  • the circuit carrier assembly 10 further comprises a heat sink 30, which comprises the base body 14, which in turn has a recess 18 in which a heat-conducting medium 16 is arranged.
  • the heat-conducting medium 16 is connected to the Base body 14 of the heat sink 30 in heat-conducting contact, so that a heat flow from the heat-conducting medium 16 to the base body 14 may be made.
  • the electronic components 28 on the second component side 24 are in heat-conducting contact with the heat-conducting medium 16. It is thus possible to deliver heat accumulating in the electronic components 28 to the heat-conducting medium 16 and from there to the base body 14 of the heat sink 30. From the main body 14, the heat can then be discharged directly or preferably via not shown heat sink fingers to the environment.
  • the heat-conducting medium 16 is preferably made of a viscoelastic material or has a viscoelastic material
  • the electronic components 28 of the second component side 24, as shown here can dip into the heat-conducting medium 16.
  • a particularly large area of contact between the electronic components 28 of the second component side 24 and the thermally conductive medium 16 may be formed, and thus a particularly good heat transfer from the electronic components 28 of the second component side 24 to the thermally conductive medium 16 reaches ⁇ the.
  • the recess 18 in the base body 14 is formed here as a recess. This is particularly advantageous if that would ⁇ me technicallyde medium 16 consisting of a visco-elastic material. This is then placed in the heat sink 30, without it coming into contact with the environment and this could contaminate it. In addition, can be dispensed with a breakthrough in the base body 14, which allows a high stability of the base body 14.
  • the arrangement of the electronic components 28 on the second component side 24 in the recess 18 no additional space for the electronic components 28 is required. It can be as a high packing density of electronic construction share ⁇ 26, reached 28 on the circuit substrate 12, while still a good heat dissipation from the electronic components 28 are achieved. In addition, the outer dimensions of the circuit carrier assembly 10 can be maintained unchanged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dissipateur de chaleur (30) pour la dissipation de chaleur d'un composant électronique (12, 28), comprenant un corps de base thermoconducteur (14) qui présente un évidement (18), et un agent thermoconducteur (16) qui est placé dans un évidement (18) et est en contact thermoconducteur avec le corps de base (14), l'agent thermoconducteur (16) étant conçu et disposé de telle façon que le composant électronique (12, 28) pénètre au moins partiellement dans l'évidement (18) lorsque le composant électronique est couplé, comme prévu, au dissipateur de chaleur (30) et est en contact thermoconducteur avec l'agent thermoconducteur (16).
PCT/EP2007/054881 2006-06-27 2007-05-21 Dissipateur de chaleur WO2008000551A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006029463 2006-06-27
DE102006029463.7 2006-06-27

Publications (2)

Publication Number Publication Date
WO2008000551A2 true WO2008000551A2 (fr) 2008-01-03
WO2008000551A3 WO2008000551A3 (fr) 2008-04-17

Family

ID=38434061

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/054881 WO2008000551A2 (fr) 2006-06-27 2007-05-21 Dissipateur de chaleur

Country Status (1)

Country Link
WO (1) WO2008000551A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012130548A1 (fr) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Module électronique
EP2824702A1 (fr) * 2013-07-11 2015-01-14 Fujitsu Limited Plaque de rayonnement thermique et appareil sous-marin
WO2018130353A1 (fr) * 2017-01-16 2018-07-19 Zf Friedrichshafen Ag Stabilisateur antiroulis à réglage électro-mécanique et procédé pour sa fabrication

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011696A (en) * 1998-05-28 2000-01-04 Intel Corporation Cartridge and an enclosure for a semiconductor package
US7311967B2 (en) * 2001-10-18 2007-12-25 Intel Corporation Thermal interface material and electronic assembly having such a thermal interface material
US7147367B2 (en) * 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US7273095B2 (en) * 2003-03-11 2007-09-25 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Nanoengineered thermal materials based on carbon nanotube array composites

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012130548A1 (fr) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Module électronique
CN103493607A (zh) * 2011-04-01 2014-01-01 罗伯特·博世有限公司 电子模块
US9271418B2 (en) 2011-04-01 2016-02-23 Robert Bosch Gmbh Electronic module
EP2824702A1 (fr) * 2013-07-11 2015-01-14 Fujitsu Limited Plaque de rayonnement thermique et appareil sous-marin
JP2015018971A (ja) * 2013-07-11 2015-01-29 富士通株式会社 放熱板、及び海中機器
WO2018130353A1 (fr) * 2017-01-16 2018-07-19 Zf Friedrichshafen Ag Stabilisateur antiroulis à réglage électro-mécanique et procédé pour sa fabrication

Also Published As

Publication number Publication date
WO2008000551A3 (fr) 2008-04-17

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