WO2008076366A2 - Configuration abrasive pour l'élimination dynamique fluidique du matériau abrasé et similaires - Google Patents
Configuration abrasive pour l'élimination dynamique fluidique du matériau abrasé et similaires Download PDFInfo
- Publication number
- WO2008076366A2 WO2008076366A2 PCT/US2007/025626 US2007025626W WO2008076366A2 WO 2008076366 A2 WO2008076366 A2 WO 2008076366A2 US 2007025626 W US2007025626 W US 2007025626W WO 2008076366 A2 WO2008076366 A2 WO 2008076366A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- abrasive
- apertures
- substrate
- pressure differential
- component
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract description 26
- 239000012530 fluid Substances 0.000 title description 14
- 239000002699 waste material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 230000005465 channeling Effects 0.000 claims 1
- 230000003750 conditioning effect Effects 0.000 description 17
- 238000005498 polishing Methods 0.000 description 15
- 230000006870 function Effects 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 239000003082 abrasive agent Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 239000002826 coolant Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
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- 238000004140 cleaning Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
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- 239000010410 layer Substances 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Definitions
- the present invention relates to an abrasive utilized to remove material from a workpiece and, more particularly, to an abrasive including fluid-dynamically-designed features to efficiently use the mechanical energy of the equipment to remove (or direct) abraded material, heat, coolants and waste from the surface of the workpiece.
- Abrasive grinders of the prior art generally comprise a portable body that is adapted to be held by a user, the grinder including a motor that drives a backing plate which in turn carries an abrasive component for grinding the surface of a workpiece.
- the abrasive component may take the form of a disk, belt, drum, wheel or any other configuration suitable for a given grinding/polishing operation.
- a shroud in the vicinity of the backing plate and abrasive component defines a chamber through which air and entrained particles flow to an outlet leading to an accumulation point.
- the abrasive and backing plate are provided with holes that, when aligned, form an air passage to allow the flow of air and entrained particles which are drawn by suction applied to the shroud.
- the vacuum effectiveness cannot be reliably controlled since the vacuum must be sufficient over the surface area of the entire abrasive so as to entrain swarf created at any point on the abrasive (e.g., if grinding on a bevel, only the cross- sectional area being cut is in contact with the abrasive).
- porous abrasive tools having pores positioned throughout the entirety of the abrasive structure, are well-known in the art.
- Conventional porous metal composite grinding wheels are commonly formed by sintering a loosely-packed metal composite, or by adding hollow glass and ceramic spheres to the composite.
- these porous abrasive tools are capable of trapping removed debris, they do not have any type of channel or pathway for clearing the debris from the tool itself. Therefore, additional mechanisms are required to move the abraded material away from the interface between the workpiece and the abrasive or the same clogging, smearing and overheating can occur.
- the removal and containment of debris from various types of grinding/polishing operations may also raise various health and/or environmental issues.
- the removal of asbestos, paint, silica, fiber composites and the like needs to be carefully controlled in a manner that minimizes the creation of any airborne contaminants that may be inhaled, released into the environment or become re-incorporated into the workpiece.
- the present invention relates to an abrasive utilized to remove material from a workpiece and, more particularly, to an abrasive including fluid-dynamically-designed features that are configured to efficiently remove abraded material and waste from the surface of the workpiece.
- the direction of flow through the features may also be reversed in accordance with the present invention (i.e., toward the workpiece) to provide the introduction of cleaning fluids, coolants, process chemicals and the like.
- an abrasive component (and/or backing plate) is formed to include fluid-dynamically-designed features which create an air flow stream/pressure differential that draws surface materials (including coolants or other process consumables) and the created debris (variously referred to as "swarf, meaning in general any material removed by an abrading tool) away from the grinding surface.
- Various other features formed within the abrasive may be specifically designed to introduce materials onto the workpiece surface.
- the abrasive component itself may take the form of a disk, belt, drum, wheel or any other suitable design.
- the fluid- dynamically-designed features include elements such as apertures, air foils, blower vanes and the like.
- the created flow properties are used to control environmental properties such as the velocity, pressure, density (including abrasive particle density), chemistry, cleanliness and temperature at the workpiece surface.
- the included features function individually to remove localized debris, while the entirety functions globally to manage the environmental conditions across the workpiece and abrasive tool surface.
- the ability to lower the temperature via the inventive fluid-dynamic abrasive prevents overheating of the material.
- the apertures and associated pressure differential associated with the fluid- dynamic abrasive also allow for a more uniform flow over the contact area and localized control of the workpiece/abrasive interface (balancing waste entrainment and abrasive contact area).
- the use of a large number of apertures allows the abrasive to function in the manner of a serrated cutting tool, creating swarf of minimal chip size, while maximizing 'cutting tool' clearance.
- the aperture dimensions and configuration are designed to result in a predictable flow pattern at a finite granularity/resolution in conjunction with macroscopic or collected vortices to: move debris from the surface in a preferred direction (e.g., flow from the edge of a disk/drum/wheel to the center, from the center to the edge, a radial flow around a disk, a lifting flow above an abrasive belt, etc.).
- a backing plate may be configured to include a plurality of containment channels to balance exhaust and/or coolant flow from the center of an abrasive element to its outer periphery.
- the unique configuration of the subject abrasive components which incorporates various principles of fluid dynamics, has provided the following features: the overall process is "cleaner” than prior art arrangements since the constant movement (rotational or translational) of the abrasive itself creates the 'pull' to remove the debris from the surface without allowing re-entry or "clogging" of the work area or abrasive surface; the overall process is “cooler” since the same increased air flow also functions to remove heat as it is created; the overall process is “uniform” in terms of providing the same abrading function and balanced cooling across the entire face of the workpiece (regardless of the degree of contact between the workpiece and the abrasive) in a manner such that the waste or by-products are not permitted to interact with, damage or taint the freshly-exposed surfaces; the overall process is more economical than prior art systems requiring utilization and maintenance of a separate vacuum source; and the overall process provides a higher quality result, since any potential contaminants are immediately and continuously removed from
- FIG. 1 illustrates a prior art tool including an abrasive disk and vacuum system for removing debris from the work area;
- FIG. 2 is a side view of a prior art conditioning head for a chemical mechanical planarization (CMP) system, illustrating the apertured abrasive disk included within the conditioning head;
- CMP chemical mechanical planarization
- FIG. 3 is an exploded view of a portion of the arrangement in FIG. 2, illustrating in particular the impeller and apertured abrasive disk components of the conditioning head;
- FIG. 4 is a top view of one exemplary fluid-dynamically-designed abrasive disk formed in accordance with the present invention;
- FIG. 5 illustrates an alternative embodiment of the present invention where the geometry of the apertures within the abrasive disk are themselves configured to provide the fluid dynamic improvements in debris removal;
- FIG. 6 shows yet another embodiment of the present invention, where the disk apertures are tilted to create the desired pressure differential and directional force component
- FIG. 7 illustrates another fluid-dynamic-based abrasive disk design of the present invention
- FIG. 8 contains an illustration of yet another fluid-dynamic-based abrasive disk configuration formed in accordance with the present invention.
- FIG. 9 contains an isometric perspective view of an exemplary fluid- dynamically-designed impeller (backing plate) for use with an abrasive disk in accordance with the present invention
- FIG. 10 illustrates an alternative fluid-dynamically-designed impeller configuration
- FIG. 1 1 illustrates an exemplary fluid-dynamically-designed abrasive belt formed in accordance with the present invention
- FIG. 12 illustrates an exemplary fluid-dynamically-designed abrasive drum formed in accordance with the present invention
- FIG. 13 illustrates an exemplary fluid-dynamically-designed abrasive wheel formed in accordance with the present invention.
- the fluid-dynamic based abrasive component of the present invention is intended to find use in a variety of applications, where any specific application mentioned in the following discussion is intended to merely provide a full illustration of the various features of the inventive abrasive component.
- abrasives are used in grinding/polishing many different surfaces (metals, glass, ceramic and the like) in a variety of heavy-duty industrial and/or commercial applications.
- abrasives are typically driven at speeds in the range of 1750 — 3200 rpm. The generated swarf will follow the path of abrasive grit impact.
- Other applications may utilize a higher speed abrasive or a lower speed abrasive.
- a lower speed abrasive is typically used in semiconductor industry applications when polishing/treating the surface of semiconductor wafers and in particular conditioning the polishing pads used to perform the polishing operations.
- the configuration of the subject abrasive is not considered to be dependent upon its field of use. Rather, the fluid dynamic properties of the abrasive are designed specifically for the operating speeds, fluid properties (viscosity, volume, containment, lift, flow direction, pressures, etc.) and the like.
- FIG. 1 is a cut-away side view of an exemplary prior art sanding head 1 that requires the use of a separate, stand-along vacuum system (not shown) for removing debris from the surface of the workpiece being sanded.
- Sanding head 1 includes a shaft 2 rotatably mounted in a casing 3 and mechanically connectible to a drive motor of an electric drill (not shown). Shaft 2 is also connected at one end to a backing plate 4.
- Backing plate 4 has in its center, as is known, a hollow cylindrical element 5 which is closed at its lower end by an end wall 6.
- An abrasive disk 7 is attached to shaft 2 in a ' manner that allows abrasive disk 7 to rotate and perform the sanding operation.
- a vacuum port 8 allows for the sanding debris to be drawn up around the periphery of abrasive disk 7, through an inner chamber 9 of sanding head 1 , then through vacuum port 8 and into a collection unit (not shown).
- the debris generated by abrasive disk 7 is projected by centrifugal force towards the periphery of disk 7.
- the vacuumed debris along the periphery is then drawn upward into inner chamber 9 and through port 8 to the separate vacuum system.
- FIG. 1 shows a conventional sanding head as used for many diverse applications, there are also specialized applications as mentioned above that require the use of an abrasive for operations such as fine polishing of glass, planarizing of semiconductor wafers and, even more particularly, re-conditioning the polishing pad surface of the material used to planarize semiconductor wafers.
- CMP chemical mechanical planarization
- FIG. 2 is a cut-away side view of an exemplary prior art CMP conditioning head 20
- FIG. 3 contains an exploded view of certain of the pertinent elements within conditioning head 20.
- prior art conditioning head 20 comprises an outer housing 22 including an inlet port 24 for dispensing conditioning/cleaning agents onto a polishing pad 26 and a vacuum outlet port 28.
- An abrasive conditioning disk 30 is disposed at the bottom of conditioning head 20 and functions to rotate against the surface of polishing pad 26, sufficiently abrading the surface to remove any embedded particulates.
- abrasive conditioning disk 30 includes a plurality of apertures 32 formed across the entire surface. The exploded view of FIG. 3 best illustrates the placement and size of apertures 32.
- an impeller 34 is disposed between abrasive disk 30 and outer housing 22, where impeller 34 is used to provide the rotational motion to abrasive disk 30.
- Impeller blades 36 function to sectionalize the vacuum. This improves the localized pressure and corresponding removal of the effluent and, in some embodiments, may also include apertures for either dispensing conditioning materials or evacuating debris (or both).
- an apertured abrasive component e.g., disk, belt, drum, wheel or the like
- the various embodiments of the present invention will create an extremely localized pressure differential (i.e., a pressure differential in the region of the aperture, also referred to variously as a "venturi") that assists or replaces the vacuum removal operation, balance flow across the radial direction and direct flow toward the periphery, thereby improving the performance of the abrasive.
- a pressure differential in the region of the aperture also referred to variously as a "venturi”
- the fluid-dynamic design is useful in any abrasive application, from industrial heavy-duty abrasive tasks to the highly-specialized pad conditioning of polishing pads in the semiconductor industry.
- FIG. 4 is a top view of one exemplary fluid-dynamicaliy-designed abrasive disk 100 formed in accordance with the present invention. Similar to prior art abrasive disk 20 described above, fluid-dynamic abrasive disk 100 includes a plurality of apertures 1 10 formed therethrough to allow for the abrading debris to be drawn away from the workpiece surface (not shown).
- a plurality of blower vanes 120 are disposed around the outer periphery of disk 100, as shown in FIG. 4. Between each pair of adjacent blower vanes, a vacuum outlet channel 130 is formed. Accordingly, when abrasive disk 100 is rotated (illustrated by the arrows labeled "R" in FIG.
- blower vanes 120 creates a pressure differential across the surface of abrasive disk 100. That is, the pressure in the central area of disk 100 is greater than the pressure around the periphery of disk 100, forcing the evacuated debris into vacuum outlet channels 130.
- the configuration of apertures 1 10 remains similar to those of prior art designs. More generally, it is conceivable that such a fluid dynamic abrasive disk of this embodiment of the present invention may utilize fewer apertures (or apertures of varying size - smaller toward the center to balance flow and abrasive particle engagement as a function of revolution), relying on the pressure differential created by blower vanes 120 to move the debris from the workpiece surface into channels 130.
- the pressure differential created by the fluid-dynamic abrasive of the present invention includes, but are not limited to, the rotational/translational speed of the abrasive, the size, shape, and number of blower vanes/airfoils, the distribution of blower vanes/airfoils on the abrasive, the size and number of outlet channels, and the like. Any or all of these factors (and others) may be considered when implementing the inventive fluid-dynamic abrasive for a particular purpose.
- the abrasive of the present invention may be formed to include only a surface layer of abrasive material or a distributed volume of abrasive throughout a cast or sintered abrasive material.
- the fluid- dynamic-based attributes are formed as part of the 'substrate' or backing plate upon which the abrasive layer is affixed.
- the fluid-dynamic-based abrasive of the present invention functions to increase the amount of waste material removed from the workpiece surface, and provides the additional benefit of also removing heat from the work area.
- various types of directed flow may be created. That is, the abrasive apertures may be configured to direct the flow upward away from the work area (lift), between the abrasive and workpiece (flush), or from the center to edge of the disk/drum/wheel, or vice versa (radial).
- the apertures may also be configured to improve the evacuation of abraded material from the center portion of the abrasive, relative to prior art arrangements, thus improving the cleanliness of the abraded workpiece surface, as well as the abrasive itself and aiding in the collection/containment from otherwise uncontrolled waste dispersion.
- FIG. 5 illustrates an alternative disk embodiment of the present invention where the geometry of the apertures within the abrasive disk is specifically configured to provide the improvements in debris removal.
- an exemplary fluid-dynamic abrasive disk 200 is shown as including a plurality of apertures 210.
- each aperture 210 tapers outwardly from a first diameter Dl along bottom surface 230 of abrasive disk 200 to a second, larger diameter D2 along top surface 240 of abrasive disk 200.
- the tapered apertures (increasing from Dl to D2) create an inverse pressure gradient as disk 200 is rotated (again, the magnitude of the gradient being a function of factors such as taper design, disk rotation speed, etc.).
- This pressure gradient illustrated by the references +P and -P in FIG. 5, is created locally at each aperture 210, thus providing instantaneous and offsetting forces for particle entrainment.
- the various, localized venturi will force the removed debris from the central portion of the workpiece being abraded (not shown) upward, through and outward toward the periphery of the abrasive disk and thereafter into the waste stream.
- the process of removing debris is significantly accelerated when compared to standard prior art structures; indeed, the aggregate airflow can be sufficient to eliminate the need for an external vacuum source.
- the pressure differential is localized, the removal forces and effectiveness are not affected by the workpiece size or abrasive contact area.
- the use of the localized venturi complement separately applied flows and will allow for a sufficient vacuum to be maintained as the abrasive moves outward over the edge of the polishing pad (a situation which, in the past, would cause the applied vacuum force to "break" and allow the debris to remain in the peripheral region of the pad).
- the swarf can therefore be directed in a more predictable manner.
- the localized aspect of the created flow is also useful from a mechanical point of view, in terms of allowing for localized introduction of coolants, removal of heat, and the ability to control the stream direction for both introduced and removed elements.
- a fluid-dynamically-configured abrasive disk 300 includes a plurality of apertures 310.
- Each aperture 310 has essentially the same diameter D, as illustrated along bottom surface 320 and top surface 330 of abrasive disk 300.
- the apertures are shown as tilted to a predetermined angle ⁇ , where the angled arrangement will create the desired pressure differential or impart a predetermined directional force vector at a predetermined radial position.
- FIGs. 7 and 8 illustrate two more exemplary arrangements, also shown in the form of an abrasive disk.
- FlG. 7 illustrates a fluid-dynamic abrasive disk 400 where each aperture 410 is formed to comprise a first diameter dl through a certain predetermined thickness of disk 400, and thereafter taper outward, as shown by opening 420, to a final diameter d2.
- the resultant structure exhibits a funnel-like configuration. Again, the difference in diameter from dl to d2 will provide the pressure differential sufficient to force the debris upward and away from the workpiece surface (venturi action).
- the apertures need not comprise linear sidewalls, as shown by the embodiment of FIG.
- a fluid-dynamic abrasive disk 500 includes apertures 510 having a curved or 'airfoil' -shaped sidewall(s) 520. As described above, the rotation of abrasive disk 500 will draw the material from the workpiece surface and into a collection system (not shown).
- the impeller blades themselves may be configured to improve the flow of debris from the workpiece surface to the waste system. It is possible to design both the abrasive disk and impeller to exhibit fluid dynamic attributes or, alternatively, so design one or the other component. Indeed, by incorporating fluid-dynamic features into the impeller design, additional advantages may be obtained. For example, the movement of air will function to cool the surface of the workpiece being abraded (thus preventing overheating). Moreover, the application of cleaning materials (in conjunction with the abrading process) will be considerably more uniform across the workpiece surface by virtue of the specific impeller configuration. Additionally, the impeller can be designed to contain the removed waste material or alternatively pump 'coolant' back into the workpiece for additional process benefits.
- FIG. 9 contains an isometric perspective view of an exemplary fluid-dynamic impeller 600 formed to include a plurality of impeller blades 610.
- each blade 610 is specifically designed to exhibit an airfoil-like structure (i.e., curvedly tapering inward from the outer periphery 620 of impeller plate 630 toward the central region 640 of impeller plate 630).
- the curvature of blades 610 in the manner shown will improve the pressure balance and flow of debris from a workpiece surface toward an associated outlet port.
- An alternative impeller configuration is shown in FIG. 10, where a two-dimensional modification of the blade profile (compared to the prior art blade shown in FIG. 3) will provide fluid-dynamically- based improvement in the movement of debris material from the workpiece surface.
- an impeller 700 comprises a set of impeller blades 710 disposed in a type of "pinwheel" configuration such that as the impeller is rotated, the created pressure differential will force the debris to the periphery of the system.
- FIG. 1 1 illustrates an exemplary fluid- dynamically-designed abrasive belt grinder 800, including a belt 810 that moves in a linear direction with respect to the workpiece being abraded, this translational movement indicated by arrow L in FIG. 1 1.
- a plurality of apertures 820 are formed in belt 810 that create a pressure differential between bottom surface 830 and top surface 840 of belt 810, directing the swarf upward and away from a workpiece (a lifting force).
- the swarf is drawn through apertures 845 in a vacuum plenum 850 and ultimately directed into a containment vessel (not shown).
- the fluid-dynamically- designed arrangement of FIG. 1 1 will draw substantially all of the swarf/debris from the workpiece.
- the workpiece being abraded includes a hazardous material that will be introduced into the exhaust flow.
- the ability to provide an efficient and complete containment of this material in accordance with the fluid dynamic aspects of the inventive abrasive greatly diminishes the potential for contamination of the environment, inhalation by a worker, and/or re-incorporation of the material into the workpiece.
- FIG. 12 illustrates an exemplary abrasive drum embodiment of the present invention.
- a drum 900 is formed to include at least an outer surface 910 of abrasive material (alternatively, the abrasive grit may be disposed through the thickness / of the drum), with a plurality of apertures 920 formed therethrough. The number and configuration of the apertures is considered to be a matter of design choice.
- a plurality of airfoils 930 are disposed on an inner surface 940 in the manner shown in FIG. 12. As drum 900 rotates (shown by arrow r in FIG. 12), the presence of the airfoils will pull any swarf created by the abrading process through apertures 920 and toward the center 950 of drum 900. A central vacuum attachment (not shown) may then be used to remove the entrained swarf.
- FIG. 13 Yet another embodiment of the present invention is shown in FIG. 13, in this case in the form of an abrasive wheel 1000, having an abrasive outer surface 1 100.
- Abrasive wheel 1000 is shown as having a thickness T , with a plurality of apertures 1200 formed through the thickness thereof.
- a plurality of airfoils 1300 are disposed around the inner periphery 1400 of wheel 1000. As wheel 1000 rotates, the combination of apertures 1200 and airfoils 1300 will draw the swarf towards the center of wheel 1000.
- a containment shroud 1500 is included and disposed around the central portion of wheel 1000 to collect the swarf.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
L'invention concerne un outil abrasif utilisé pour éliminer un matériau d'une pièce de fabrication qui comprend des fonctionnalités conçues pour être fluidiquement dynamiques (ouvertures, surfaces portantes), configuré pour éliminer avec efficacité le matériau abrasé et les déchets de la surface d'une pièce de fabrication. Le composant abrasif (et/ou plaque support) est prévu pour inclure des fonctionnalités fluidiquement dynamiques qui créent un courant d'écoulement d'air/différentiel de pression qui aspire les débris générés (diversement appelés copeaux pour désigner en général tout matériau enlevé par un outil abrasif) à l'écart de la surface de meulage.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002671055A CA2671055A1 (fr) | 2006-12-15 | 2007-12-14 | Configuration abrasive pour l'elimination dynamique fluidique du materiau abrase et similaires |
EP07867765A EP2097218A4 (fr) | 2006-12-15 | 2007-12-14 | Configuration abrasive pour l'élimination dynamique fluidique du matériau abrasé et similaires |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US87509406P | 2006-12-15 | 2006-12-15 | |
US60/875,094 | 2006-12-15 |
Publications (2)
Publication Number | Publication Date |
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WO2008076366A2 true WO2008076366A2 (fr) | 2008-06-26 |
WO2008076366A3 WO2008076366A3 (fr) | 2008-09-18 |
Family
ID=39536907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/025626 WO2008076366A2 (fr) | 2006-12-15 | 2007-12-14 | Configuration abrasive pour l'élimination dynamique fluidique du matériau abrasé et similaires |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080160883A1 (fr) |
EP (1) | EP2097218A4 (fr) |
CN (1) | CN101568406A (fr) |
CA (1) | CA2671055A1 (fr) |
WO (1) | WO2008076366A2 (fr) |
Families Citing this family (5)
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CN102950539B (zh) * | 2012-11-28 | 2015-06-24 | 天津市环欧半导体材料技术有限公司 | 磨片机研磨盘下砂口的改良构造 |
JP6842859B2 (ja) | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法 |
CN107052951B (zh) * | 2017-01-22 | 2023-03-10 | 华霆(合肥)动力技术有限公司 | 用于清理焊针的磨具及磨具系统 |
US10835920B2 (en) * | 2018-08-03 | 2020-11-17 | Indian Institute Of Technology Ropar | Technology and process for coating a substrate with swarf particles |
KR102268284B1 (ko) * | 2020-02-17 | 2021-06-22 | 엘지전자 주식회사 | 유체 정화 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007035292A1 (fr) | 2005-09-16 | 2007-03-29 | 3M Innovative Properties Company | Article abrasif a systeme de recuperation de poussiere integre et procedes de fabrication correspondants |
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US2813376A (en) * | 1957-06-13 | 1957-11-19 | Marvin P Middlemark | Abrading machine actuated by water pressure |
US3259959A (en) * | 1963-10-23 | 1966-07-12 | Alton E Tobey | Air cooled rasp |
FR2365411A1 (fr) * | 1976-09-27 | 1978-04-21 | Robert Jean | Ponceuse a disque de papier abrasif monte sur un plateau circulaire tournant |
US4765099A (en) * | 1986-12-11 | 1988-08-23 | Tanner John G | Sanding and dust collecting apparatus |
US5105585A (en) * | 1991-04-26 | 1992-04-21 | The United States Of America As Represented By The Department Of Health And Human Services | Dust emissions control mechanism for hand sanders |
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2007
- 2007-12-14 EP EP07867765A patent/EP2097218A4/fr not_active Withdrawn
- 2007-12-14 CA CA002671055A patent/CA2671055A1/fr not_active Abandoned
- 2007-12-14 US US12/002,013 patent/US20080160883A1/en not_active Abandoned
- 2007-12-14 WO PCT/US2007/025626 patent/WO2008076366A2/fr active Application Filing
- 2007-12-14 CN CNA2007800460075A patent/CN101568406A/zh active Pending
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WO2007035292A1 (fr) | 2005-09-16 | 2007-03-29 | 3M Innovative Properties Company | Article abrasif a systeme de recuperation de poussiere integre et procedes de fabrication correspondants |
Also Published As
Publication number | Publication date |
---|---|
CA2671055A1 (fr) | 2008-06-26 |
WO2008076366A3 (fr) | 2008-09-18 |
CN101568406A (zh) | 2009-10-28 |
US20080160883A1 (en) | 2008-07-03 |
EP2097218A2 (fr) | 2009-09-09 |
EP2097218A4 (fr) | 2011-01-05 |
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