WO2007109368A3 - Substrat à conduction améliorée du courant électrique pour module thermoélectrique - Google Patents
Substrat à conduction améliorée du courant électrique pour module thermoélectrique Download PDFInfo
- Publication number
- WO2007109368A3 WO2007109368A3 PCT/US2007/007325 US2007007325W WO2007109368A3 WO 2007109368 A3 WO2007109368 A3 WO 2007109368A3 US 2007007325 W US2007007325 W US 2007007325W WO 2007109368 A3 WO2007109368 A3 WO 2007109368A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- current carrying
- electric current
- thermoelectric module
- improved electric
- carrying substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
L'invention concerne un module thermoélectrique à substrats conducteurs autorisant une l'intensité maximale admissible accrue entre les éléments thermiques grâce à la présence de conducteurs sur l'intérieur et l'extérieur des substrats.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78482406P | 2006-03-22 | 2006-03-22 | |
US60/784,824 | 2006-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007109368A2 WO2007109368A2 (fr) | 2007-09-27 |
WO2007109368A3 true WO2007109368A3 (fr) | 2008-10-16 |
Family
ID=38523121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/007325 WO2007109368A2 (fr) | 2006-03-22 | 2007-03-22 | Substrat à conduction améliorée du courant électrique pour module thermoélectrique |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2007109368A2 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9310112B2 (en) | 2007-05-25 | 2016-04-12 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
EP2315987A2 (fr) | 2008-06-03 | 2011-05-04 | Bsst Llc | Pompe à chaleur thermoélectrique |
CN102239579A (zh) * | 2008-08-01 | 2011-11-09 | Bsst有限责任公司 | 增强的绝热热电装置 |
JP5908975B2 (ja) | 2011-06-06 | 2016-04-26 | ジェンサーム インコーポレイテッドGentherm Incorporated | カートリッジベース熱電システム |
US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
EP2880270A2 (fr) | 2012-08-01 | 2015-06-10 | Gentherm Incorporated | Génération thermoélectrique à haute efficacité |
CN104956539B (zh) | 2013-01-30 | 2018-06-12 | 詹思姆公司 | 基于热电的热管理系统 |
US9252512B2 (en) | 2013-08-14 | 2016-02-02 | Hamilton Sundstrand Corporation | Power connector having enhanced thermal conduction characteristics |
JP2017069443A (ja) * | 2015-09-30 | 2017-04-06 | ヤマハ株式会社 | 熱電変換モジュール |
CN108305935A (zh) * | 2018-02-08 | 2018-07-20 | 南方科技大学 | 柔性热电器件及制备方法 |
US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
EP4338210A1 (fr) * | 2021-05-10 | 2024-03-20 | European Thermodynamics Limited | Module thermoélectrique |
GB2606594A (en) * | 2021-05-10 | 2022-11-16 | European Thermodynamics Ltd | Thermoelectric module |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020139123A1 (en) * | 2001-02-09 | 2002-10-03 | Bell Lon E. | Efficiency thermoelectrics utilizing thermal isolation |
-
2007
- 2007-03-22 WO PCT/US2007/007325 patent/WO2007109368A2/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020139123A1 (en) * | 2001-02-09 | 2002-10-03 | Bell Lon E. | Efficiency thermoelectrics utilizing thermal isolation |
Also Published As
Publication number | Publication date |
---|---|
WO2007109368A2 (fr) | 2007-09-27 |
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