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WO2007109368A3 - Substrat à conduction améliorée du courant électrique pour module thermoélectrique - Google Patents

Substrat à conduction améliorée du courant électrique pour module thermoélectrique Download PDF

Info

Publication number
WO2007109368A3
WO2007109368A3 PCT/US2007/007325 US2007007325W WO2007109368A3 WO 2007109368 A3 WO2007109368 A3 WO 2007109368A3 US 2007007325 W US2007007325 W US 2007007325W WO 2007109368 A3 WO2007109368 A3 WO 2007109368A3
Authority
WO
WIPO (PCT)
Prior art keywords
current carrying
electric current
thermoelectric module
improved electric
carrying substrate
Prior art date
Application number
PCT/US2007/007325
Other languages
English (en)
Other versions
WO2007109368A2 (fr
Inventor
Joel Lindstrom
Bernhard Piwczyk
Original Assignee
Leonardo Technologies Inc
Joel Lindstrom
Bernhard Piwczyk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonardo Technologies Inc, Joel Lindstrom, Bernhard Piwczyk filed Critical Leonardo Technologies Inc
Publication of WO2007109368A2 publication Critical patent/WO2007109368A2/fr
Publication of WO2007109368A3 publication Critical patent/WO2007109368A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module thermoélectrique à substrats conducteurs autorisant une l'intensité maximale admissible accrue entre les éléments thermiques grâce à la présence de conducteurs sur l'intérieur et l'extérieur des substrats.
PCT/US2007/007325 2006-03-22 2007-03-22 Substrat à conduction améliorée du courant électrique pour module thermoélectrique WO2007109368A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78482406P 2006-03-22 2006-03-22
US60/784,824 2006-03-22

Publications (2)

Publication Number Publication Date
WO2007109368A2 WO2007109368A2 (fr) 2007-09-27
WO2007109368A3 true WO2007109368A3 (fr) 2008-10-16

Family

ID=38523121

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/007325 WO2007109368A2 (fr) 2006-03-22 2007-03-22 Substrat à conduction améliorée du courant électrique pour module thermoélectrique

Country Status (1)

Country Link
WO (1) WO2007109368A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9310112B2 (en) 2007-05-25 2016-04-12 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
EP2315987A2 (fr) 2008-06-03 2011-05-04 Bsst Llc Pompe à chaleur thermoélectrique
CN102239579A (zh) * 2008-08-01 2011-11-09 Bsst有限责任公司 增强的绝热热电装置
JP5908975B2 (ja) 2011-06-06 2016-04-26 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ カートリッジベース熱電システム
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
EP2880270A2 (fr) 2012-08-01 2015-06-10 Gentherm Incorporated Génération thermoélectrique à haute efficacité
CN104956539B (zh) 2013-01-30 2018-06-12 詹思姆公司 基于热电的热管理系统
US9252512B2 (en) 2013-08-14 2016-02-02 Hamilton Sundstrand Corporation Power connector having enhanced thermal conduction characteristics
JP2017069443A (ja) * 2015-09-30 2017-04-06 ヤマハ株式会社 熱電変換モジュール
CN108305935A (zh) * 2018-02-08 2018-07-20 南方科技大学 柔性热电器件及制备方法
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
EP4338210A1 (fr) * 2021-05-10 2024-03-20 European Thermodynamics Limited Module thermoélectrique
GB2606594A (en) * 2021-05-10 2022-11-16 European Thermodynamics Ltd Thermoelectric module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020139123A1 (en) * 2001-02-09 2002-10-03 Bell Lon E. Efficiency thermoelectrics utilizing thermal isolation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020139123A1 (en) * 2001-02-09 2002-10-03 Bell Lon E. Efficiency thermoelectrics utilizing thermal isolation

Also Published As

Publication number Publication date
WO2007109368A2 (fr) 2007-09-27

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