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WO2007108364A1 - Dispositif de formation d'un film mince et procédé de formation d'un film mince - Google Patents

Dispositif de formation d'un film mince et procédé de formation d'un film mince Download PDF

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Publication number
WO2007108364A1
WO2007108364A1 PCT/JP2007/054930 JP2007054930W WO2007108364A1 WO 2007108364 A1 WO2007108364 A1 WO 2007108364A1 JP 2007054930 W JP2007054930 W JP 2007054930W WO 2007108364 A1 WO2007108364 A1 WO 2007108364A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
film forming
substrate
chamber
spray coating
Prior art date
Application number
PCT/JP2007/054930
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiie Matsumoto
Original Assignee
Lan Technical Service Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006073312A external-priority patent/JP2006289355A/ja
Application filed by Lan Technical Service Co., Ltd. filed Critical Lan Technical Service Co., Ltd.
Publication of WO2007108364A1 publication Critical patent/WO2007108364A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/28—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes, envelopes, e.g. flat-bed ink-jet printers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Definitions

  • the present invention relates to an apparatus and a method for forming a film by spray coating on a substrate using an inkjet head.
  • Liquid crystal display devices which have great advantages as products of thin and light weight and low power consumption, have been greatly developed as mainstream of mobile phones, personal computers, and recently flat-screen televisions.
  • a liquid crystal display element a liquid crystal composition is sandwiched between two substrates on which electrodes are formed, and when a voltage is applied between the two electrodes, the liquid crystal is twisted and a molecular arrangement is generated, causing light to travel straight.
  • an image is displayed in combination with a polarizing plate.
  • the alignment film serves as a trigger for the liquid crystal to cause a change in molecular alignment.
  • the thin film surface of the alignment film plays an important role, and lightly rubs with a cloth after forming the thin film. If a voltage is applied between the two electrodes (rubbing treatment), the liquid crystal molecules are aligned in a certain direction.
  • the role of the alignment film is important for even display, and the uniformity of the film thickness and composition is required.
  • IPS lateral electric field alignment
  • VA vertical alignment
  • this method has a transport table 8 for transporting the substrate 1, and above this transport table 8, a plurality of inkjet heads 2 having a plurality of nozzles 9 are used. It is installed along a direction substantially orthogonal to the conveyance direction of the substrate 1.
  • the inkjet 'head 2 and the transport table 8 are controlled by the arithmetic device 4 while being related to each other.
  • Each inkjet head 2 is supplied with a solution from a solution tank 11 containing an alignment film solution connected via a supply pipe 12.
  • the solution sprayed from each nozzle 9 is applied as a spherical dot on the substrate 1 on the upper surface of the substrate 1 that is transported in a predetermined direction at a predetermined speed, and this is spread, dried, and baked to align the alignment film. 44 is completed. Further, the substrate 1 may be fixed and the inkjet head 2 may move during the film formation process.
  • Patent Document 1 Japanese Patent Laid-Open No. 54-21862
  • Patent Document 2 Japanese Patent Laid-Open No. 2003-80130
  • Patent Document 3 JP-A-2005-721
  • the conventional non-contact type alignment film forming method is performed under normal pressure, that is, atmospheric pressure.
  • the droplets of the alignment film solution spray-applied from the nozzles are extremely small (the current ink jet head has a droplet volume of about 1 to 80 picoliters per nozzle).
  • the film thickness is greatly affected by variations in the processing position of the nozzle, resistance variation error in the drive circuit, and the connection position and length of the solution supply pipe connected to the inkjet head. It becomes a factor of fluctuation.
  • the landing position accuracy is the relative movement speed between the inkjet head and the substrate (inkjet
  • the non-contact formation method using an inkjet 'head is a method in which dots are applied on a substrate and diffused to create a surface called an alignment film. The current situation is that it is a factor and is dealt with by control methods such as how to separate dots, how to overlap, and how to shift timing (Patent Document 3).
  • An inkjet head which is a key device of the ink jet method, has a structure as shown in Fig. 19, and is manufactured by the same fine process as a semiconductor.
  • the main parts of the head are a drive unit (piezoelectric element drive circuit) 42 and a nozzle 9 based on a piezoelectric element.
  • a drive unit piezoelectric element drive circuit
  • a nozzle 9 based on a piezoelectric element.
  • the viscosity is about 1 to 15 mPa's, and the surface tension is about 25 to 45 mN / m.
  • polyimide which is the main component
  • the thick part of the film is at least twice to three times the thickness of the thin part of the film. In itself, the difference in unevenness becomes intense and it becomes a huge amount.
  • a first object of the present invention is to improve the uniformity of film thickness including a local portion when a thin film is formed by spray coating on a substrate using an inkjet head.
  • An object of the present invention is to provide a thin film forming apparatus and method.
  • a second object of the present invention is to provide a thin film forming apparatus and method for improving the use efficiency of a solution material for forming a thin film.
  • a third object of the present invention is to provide a thin film forming apparatus and method that improve production tact including reduction of setup time and also consider the environment.
  • the inventions of claims 1 and 11 include a head support structure including a single or a plurality of inkjet heads each having a plurality of nozzles arranged at regular intervals.
  • a substrate transfer mechanism having a substrate transfer table that can move relatively between these nozzles in a direction orthogonal to the arrangement direction, and a thin film forming solution is supplied from these nozzles to the substrate mounted on the substrate transfer table.
  • the present invention relates to a non-contact type thin film forming apparatus that forms a thin film by spraying onto a surface and a method for forming a thin film using this apparatus, and has the following features.
  • the thin film forming apparatus is provided with a vacuum chamber including at least a substrate transfer table, an inkjet head, and a head support structure, and a decompression unit that depressurizes the inside of the vacuum chamber.
  • This vacuum chamber is a spray coating film forming chamber.
  • the substrate transport table is provided with a temperature adjusting unit, whereby the temperature of the substrate transport table is controlled to control the temperature of the substrate.
  • a pressure adjustment preliminary chamber including a substrate transfer mechanism having a substrate transfer table in one or both of the front and rear stages of the spray coating film forming chamber.
  • the pressure adjustment preliminary chamber is preliminarily adjusted to carry in or out the substrate between the pressure adjustment preliminary chamber and the spray coating film forming chamber.
  • the substrate transport mechanism in the pressure adjustment preliminary chamber and the substrate transport mechanism in the spray coating film forming chamber are provided with the common substrate transport drive system, respectively, and the pressure A gate valve is provided between the preparatory adjustment chamber and the spray coating film formation chamber, and the gate valve is opened and closed at a timing that enables substrate transfer between each substrate common transport drive system. To do.
  • the pressure reducing means is constituted by a vacuum exhaust system including a vacuum pump and a vacuum exhaust pipe communicating between the vacuum pump and the spray coating film forming chamber.
  • a device for collecting evaporated contaminants in the spray coating thin film chamber is attached to either the front or rear stage of the vacuum pump, and this recovery device collects contaminants generated during spray coating film formation. It is characterized by.
  • the pressure reducing means communicates between the vacuum pump and the pressure adjustment preliminary chamber provided downstream of the vacuum pump and the spray coating film forming chamber.
  • a vacuum exhaust system including a vacuum exhaust pipe is installed, and a contaminant recovery device is installed in either the upstream or downstream of the vacuum pump, and the contaminant is recovered by this recovery device. It is characterized by the configuration.
  • the surface for modifying the surface of the substrate on which the spray coating film is formed is provided in the pressure adjustment preliminary chamber provided in the front stage of the spray coating film forming chamber.
  • a modification means is provided, and the surface modification means is used to modify the substrate surface.
  • the laser irradiation means for irradiating the droplets of the thin film forming solution grounded to the substrate from the oblique upper side of the inkjet head is provided and grounded to the substrate It is characterized by a configuration in which a droplet is irradiated with a laser.
  • the laser irradiation means for irradiating the droplets of the thin film forming solution sprayed from the plurality of nozzles in the air from the lateral direction is provided, It is characterized by irradiating the flying droplet with laser from the lateral direction.
  • the present invention relates to a liquid crystal display element when the thin film described above is formed as an alignment film of a liquid crystal display element.
  • the apparatus includes at least a substrate transport table and an inkjet head and a head support structure that form a portion that performs spray coating on the substrate.
  • the vacuum tank is formed as a spray coating film forming chamber for performing spray coating film formation in an atmosphere
  • a thin film forming solution for example, a solvent constituting an alignment film solution is adjusted by adjusting the reduced pressure state.
  • the evaporation temperature can be controlled.
  • the film thickness distribution can be made more uniform than when the film is formed at atmospheric pressure.
  • the invention of claim 1 or 11 is a thin film formed on a substrate that is suitable for a large substrate compared to conventional offset printing (flexographic printing).
  • the thickness distribution can be made more uniform over the entire substrate than when the film is formed at atmospheric pressure.
  • the swell that occurs at the edge of the coating region can be prevented more than when the film is formed at atmospheric pressure.
  • a vacuum tank is provided as a spray coating film forming chamber for performing spray coating film formation in a reduced pressure atmosphere, and a temperature control unit is provided on the substrate transfer table. Therefore, it is possible to control the evaporation temperature of the solvent that forms the solution for forming a thin film, such as the alignment film solution, by adjusting the reduced pressure state. It becomes possible to control the diffusion of the solution on the substrate surface. As a result, since the flow of the solid content in the solution can be controlled more precisely, the film thickness accuracy can be further improved.
  • the substrate in the atmosphere is carried into the pressure adjustment preliminary chamber, and the internal pressure is reduced.
  • the substrate After depressurizing the pressure adjustment preliminary chamber until it becomes equal to the spray coating film forming chamber, the substrate can be carried into the spray coating film forming chamber.
  • the pressure reduction time can be shortened by making the volume of the pressure adjustment preliminary chamber smaller than that of the vacuum tank of the spray coating film forming chamber. As a result, production efficiency Can be improved.
  • the pressure adjustment preliminary chamber is provided in the subsequent stage, after the substrate in the spray coating film forming chamber is carried out to the pressure adjustment preliminary chamber which has been decompressed to a pressure equal to that of the spray coating film forming chamber. Then, the pressure adjustment preliminary chamber is released to the atmosphere, and the substrate can be carried out.
  • the force S for changing the pressure in the vacuum chamber of the spray coating film forming chamber which requires strict pressure control, becomes unnecessary.
  • the pressure reducing time can be shortened by designing the volume of the pressure adjusting preliminary chamber to be smaller than the vacuum tank of the spray coating film forming chamber. As a result, the production efficiency can be further improved.
  • the collection device allows a contaminant, for example, an unnecessary component entering from the outside, an unnecessary component evaporating from the wall of each chamber, or the surface. It is possible to adsorb or decompose gas components generated during the modification and solvent components evaporated when the alignment film solution is solidified to form the alignment film. Therefore, emissions of volatile organic compounds (VOC) can be reduced as much as possible, which is beneficial for environmental measures that can comply with VOC regulations.
  • VOC volatile organic compounds
  • the chemical substance adhering to the surface of the substrate is decomposed and cleaned by modifying the surface of the substrate.
  • the surface energy of the substrate changes and surface properties such as wettability are improved.
  • This surface modification treatment is, for example, purple It is preferred that the surface of the substrate is subjected to an excitation treatment by irradiating the substrate surface with ultraviolet rays by means of an external radiation means.
  • a rapid temperature rise or chemical change of a droplet of a thin film forming solution is caused by laser irradiation. Can be generated, and evaporation of the solvent can be accelerated. This makes it possible to control the diffusion state of the droplets.
  • the alignment film by forming the alignment film using such a thin film forming apparatus, unevenness due to uneven distribution of the alignment film material due to the coffee sting phenomenon of droplets is suppressed.
  • the thickness of the alignment film can be made uniform. As a result, a liquid crystal display element free from shading and streaks due to non-uniformity of the alignment film thickness can be manufactured.
  • FIG. 1 is a configuration diagram of a thin film forming apparatus using an ink jet system under a reduced pressure environment according to an embodiment of the present invention.
  • FIG. 2 is an explanatory diagram of the arrangement of inkjet heads corresponding to the substrate width direction.
  • FIG. 3 is a diagram showing the results of film thickness distribution measurement after curing of a liquid crystal alignment film under a reduced pressure environment.
  • FIG. 4 is a diagram for explaining film forming shape parameters and schematically showing a film thickness distribution of an alignment film formed by coating.
  • FIG. 5 is a curve diagram for explaining the influence of the reduced pressure atmosphere on the film formation shape parameter (te / tc) obtained from the experimental results shown in FIG.
  • FIG. 6 is a block diagram schematically showing the overall system configuration of an inkjet coating apparatus as a thin film forming apparatus under reduced pressure.
  • FIG. 7 is a configuration diagram for explaining a specific embodiment of pressure reduction control.
  • FIG. 8 is a configuration diagram of a thin film forming apparatus using an inkjet system under a substrate temperature control and reduced pressure environment according to an embodiment of the present invention.
  • FIG. 9 is a configuration diagram of an actual production line including a front preliminary chamber, an ink jet thin film spray coating apparatus main body, and a rear preliminary chamber in a thin film forming process according to an embodiment of the present invention. 10] Time chart explanatory diagram of each chamber pressure and each gate vano reb operation in the embodiment of FIG.
  • FIG. 13 is a configuration diagram of an inkjet spray coating apparatus under a reduced pressure environment in consideration of environmental measures in a thin film formation process according to an embodiment of the present invention.
  • FIG. 21 is an explanatory diagram of the film thickness distribution of the entire thin film coated substrate.
  • an alignment film of a liquid crystal display element is described as an example as a thin film. Therefore, a solution for forming a thin film is used as an alignment film solution.
  • FIG. 1 (A) and 1 (B) are an internal front view and FIG. 1 (FIG. 1) showing a part of the configuration of the apparatus for explaining the method of forming the alignment film by the ink jet method of the present embodiment. It is an internal block diagram (A arrow view) seen from the direction of arrow A in A).
  • 2 (A), 2 (B) and 2 (C) are diagrams for explaining the inkjet head and nose, and FIG. 2 (A) is an explanatory diagram of the relationship between the head support structure and the head. Yes, Fig.
  • FIG. 2 (B) is a diagram (magnified view of arrow B) for explaining the directional force indicated by arrow B in Fig. 2 (A), the arrangement relationship between the inkjet head and the nozzle.
  • FIG. 2 (C) is a diagram showing a state of droplets formed when a solution is sprayed and applied with the nozzle of the arrangement shown in FIG. 2 (B).
  • the alignment film forming apparatus which is an ink-jet thin film forming apparatus, includes a head support structure 5 and a substrate transport mechanism 50, which are disposed on a common base 60.
  • the head support structure 5 includes a solution tank 11 and an ink jet head 2 communicated with the solution tank 11 through a supply pipe 12, and is guided and moved on a guide rail 52 provided on a base by a drive actuator 7a. Is done.
  • a nozzle 9 is provided at the tip of the inkjet head 2.
  • a plurality of heads 2 are arranged in parallel in two rows.
  • the end face shape of each head 2 is a long rectangle in one direction.
  • each head 2 On the end face of each head 2, a plurality of nozzles 9 are arranged in a row at regular intervals. Therefore, the nozzles of one head row are all arranged on the same straight line. Nozzle on the other head row Similarly, the nozzles are arranged on a straight line parallel to the straight line of one head row.
  • the substrate transport mechanism 50 includes a distance detection means 6, a drive actuator 7 b, a substrate transport table 8, and a guide rail 54.
  • the guide rail 54 is provided on the pedestal 60, and the substrate transport table is guided and driven on the rail 54 in a direction orthogonal to the arrangement direction of the plurality of nozzles.
  • the substrate 1 is mechanically held on the substrate transfer table 8 by the holding means 10 such as an electrostatic chuck.
  • the substrate transfer table 8 and the head support structure 5 are movable relative to each other. Therefore, there are cases where the inkjet 'head 2 constrained by the head support structure 5 moves and cases where the inkjet' head 2 is fixed and the substrate transfer table 8 moves, but each has advantages and disadvantages. Yes.
  • the former is described, but the same can be considered for the latter.
  • This operation will be described. As is well known, this operation is controlled by a computer (hereinafter simply referred to as a microcomputer or a PC) as in the prior art.
  • a computer hereinafter simply referred to as a microcomputer or a PC
  • the setting input means 3 such as the operation panel of a personal computer
  • a predetermined spray application interval and application pattern information are calculated (comprised of CPU) 4
  • the arithmetic device 4 generates a coating start signal according to a predetermined control algorithm based on a program that has been read into a personal computer in advance and supplies it to the head support structure 5.
  • the head support structure 5 moves at a predetermined speed. This movement must be performed strictly and accurately.
  • the detection signal of the distance detection means 6 such as a linear scale is given to the arithmetic unit 4.
  • the feedback is made to the drive actuator 7a such as a linear motor.
  • the value detected by the distance detection means 6 is compared with the distance to be ejected by the nozzle 9 of the ink jet head calculated in the same way as in the past, and coating starts at the same timing.
  • a signal is given to nozzle 9 of the inkjet head.
  • the alignment film solution is supplied from the solution tank 11 that stores the alignment film solution to the inkjet head 2 through the supply pipe 12, and is ejected from the nozzle 9 by a coating start signal.
  • the calculated value in the arithmetic device 4 and the detected value in the distance detecting means 6 are compared.
  • Dots 13 as shown in FIG. 2 (C) having a predetermined coating interval can be obtained by repeating and continuously spraying.
  • the above operation control is the same as that of the prior art, and can be easily realized by those skilled in the art, and thus detailed description thereof is omitted.
  • the region where the ink jet coating is realized is covered with a vacuum tank 14, and the inside of the tank is decompressed and sprayed by a vacuum pump 15. Therefore, it is preferable to accommodate at least the substrate transport table 8, the ink jet head 2, and the head support structure 5 in the vacuum chamber 14.
  • the substrate transport table 8 the ink jet head 2, and the head support structure 5 in the vacuum chamber 14.
  • other components constituting the apparatus for example, guide rails 52 and 54 and distance detecting means 6 are also accommodated in the vacuum chamber 14.
  • Other required components may be accommodated in the vacuum chamber 14 as necessary.
  • the evaporation temperature of the solvent constituting the alignment film solution can be controlled in diffusion development after coating. Is possible. As a result, the flow of solids in the solution can be unified, and the film thickness distribution can be made more uniform than when the film is formed at atmospheric pressure.
  • the pressure reduction means that the pressure is lower than the atmospheric pressure around the apparatus where the apparatus of the present invention is installed.
  • the atmospheric pressure is 1 atm.
  • the reduced pressure is a pressure lower than 1 atm, that is, a vacuum.
  • NMP N- methylpyrrolidone
  • FIG. 3 shows the results of film thickness distribution measurement after curing of the alignment film for liquid crystal under a reduced pressure environment.
  • the horizontal axis shows the distance (unit: mm) from one side on the central axis passing through the center point of the square coating area to the other side facing the other, and the vertical axis shows the film thickness (unit: nm). ).
  • a contact level meter (trade name “DEKTAK” manufactured by ULVAC, Inc.) was used. Film formation was carried out in the atmosphere and when the vacuum pressure was 0.5 atm, 0.0 latm, 0.01 atm, 0.005 atm, and 0.003 atm. However, latmf or, 1. 01 X 10 5 N / m 2 (7.6 X 10 2 Torr).
  • the film thickness at the edge is higher (150 nm or more) than the film thickness at the center (about 7 nm).
  • the film thickness at the end was 89 nm, 64 nm, 38 nm, 16 nm, and On m, respectively.
  • FIG. 4 is a diagram for explaining the film formation shape parameters, and is a diagram schematically showing the film thickness distribution of the alignment film formed by coating.
  • the horizontal axis shows the position coordinates on the center line passing through the center of the square coating area in arbitrary units (unsigned), and the vertical axis shows the film thickness in arbitrary units (unnamed).
  • the symbol tc represents the film thickness near the center, here the landing position
  • the symbol te represents the film thickness at the fluid diffusion end.
  • te / tc is called the film-forming shape parameter, and this parameter is considered below.
  • the value of this parameter is 3 to 10; on the other hand, the lower the degree of decompression, that is, the higher the degree of vacuum, the less active the diffusion. Get closer to. If the value of this parameter is close to 1, the film thickness distribution is flatter than that under normal temperature and normal pressure, although there is some unevenness in the film thickness in the region between the center and the edge. And an excellent alignment film can be obtained. In addition, if the value is smaller than 1, the thin film region may not be connected, which is not suitable for forming a thin film with a large area. You can think of it as showing.
  • FIG. 5 shows the reduced-pressure atmosphere obtained from the experimental results shown in FIG. It is a curve diagram for demonstrating the influence which it has on Ac).
  • the pressure axis (unit: atm) is taken on the horizontal axis and shown in logarithmic form, and the vertical axis shows the film formation shape parameter (te / tc).
  • the parameter values f are about 4.7, 2.5, 1, 0.3, and 0.2, respectively. From this experimental result, when the vacuum pressure is about 0. Olatm d.
  • the parameter value becomes almost 1, and when the vacuum level increases, the film thickness increases at the center.
  • the continuous film may not be formed over the entire substrate surface.
  • an inkjet coating apparatus as a thin film forming apparatus under reduced pressure
  • This system consists of an XY stage positioning unit 70, an inkjet 'head positioning unit 72, an ink jet head control system 74, a substrate / head alignment correction optical system 76, an operation panel 78, and the same as a conventional ink-jet coating device.
  • a personal computer also called a PC or a personal computer, which naturally has a display, a keyboard, and other input means (corresponding to the setting control input means 3 in FIG. 1)).
  • the invention is newly equipped with a decompression system 82.
  • FIG. 6 shows As the functional means realized by executing the program with the control unit 80, the drive control means 90 for controlling the control of the positioning control means 92, the head control means 94, the alignment control means 96 including the image processing unit, and the like, and Pressure adjusting means 98 for controlling the decompression system 82 is shown.
  • the drive control means 90 and the pressure adjustment means 98 correspond to the arithmetic device 4 in FIG.
  • the system shown in FIG. 6 controls a positioning system, an inkjet head control system, an alignment correction optical system, and a decompression system by a personal computer 80 that also serves as a setting input means 3 and an arithmetic unit 4.
  • Substrate 1 is basically set manually. In the atmosphere, the gate valve 102 is opened, the substrate 1 is set on the substrate transfer table 8, the gate valve 102 is closed again, and the vacuum chamber 14 in the spray coating chamber is sealed, so that the substrate 1 is set. Complete.
  • a signal for turning on the switch of the decompression pump (operating state) is output from the personal computer, and the decompression vacuum pump 84 is activated.
  • the pressure in the vacuum chamber 14 begins to drop.
  • a pressure sensor 86 is provided in the vacuum chamber 14, and the output signal of this sensor is input to a personal computer 80, and the pressure is constantly monitored.
  • the computing device 4 of the personal computer compares the pressure value of the pressure sensor 86 with a set value registered in a memory (not shown) in advance as a reference value in the pressure adjusting means 98, and the vacuum chamber 14 is based on the comparison.
  • a command is sent to the pressure adjustment valve 88 installed in, and the opening is adjusted.
  • the pressure adjustment valve is opened to decrease the pressure, and when the pressure in the vacuum chamber becomes lower than the set value, the vacuum regulator 14 is opened. Increase the degree to reduce the degree of decompression.
  • the inside of the vacuum chamber 14 is set to a constant reduced pressure environment.
  • a pressure sensor for example, an environmentally-resistant small-sized pressure sensor negative pressure type manufactured by Keyence Corporation: trade name AP — 51A
  • a pressure sensor for example, an environmentally-resistant small-sized pressure sensor negative pressure type manufactured by Keyence Corporation: trade name AP — 51A
  • the pressure in the decompression chamber 14 is evacuated by a decompression vacuum pump 84 (corresponding to the vacuum pump 15 in FIG. 1). If the vacuum seal in the decompression chamber 14 is perfect and there are few leaks, the pressure is reduced gradually, making it difficult to control to a constant pressure.
  • a variable constant vano lev (pressure regulating valve) 88 is provided between the decompression chamber 14 and the decompression vacuum pump 84, where control for minute pressure fluctuations is possible. That is, when the pressure in the decompression chamber 14 increases due to a leak or the like, this is detected by the pressure sensor 86, and a detection signal is input to the bath computer 80 that is the basic control system.
  • the pressure adjusting means 98 feeds back an opening control signal for controlling the opening of the variable conductance valve 88 to the motor M by a preset control algorithm. As a result, the pressure in the decompression chamber 14 is kept constant.
  • the control algorithm moves to the next coating operation while always controlling the degree of vacuum in the decompression chamber 14 with high accuracy.
  • the personal computer 80 has positioning control means 92 for each drive system, and sends coordinate values and movement commands to the servo amplifiers of each drive system (70, 72) based on the calculation results according to the control algorithm.
  • Transfer table 8 inkjet 'head 2 is moved.
  • the substrate Z head alignment correction optical system 76 is provided with a CCD camera for detecting the position of the substrate 1, and a mark for detecting the position of the substrate 1 is detected by the image processing unit of the alignment control means 96 inside the personal computer. Measure the coordinates of the substrate and move the substrate transfer table 8 so that the substrate 1 is at the determined position.
  • substrate 1 When substrate 1 reaches the coating start position, it sends a coating start signal from the head control means 94 of the personal computer 80 to the head controller of the inkjet head control system 74. Begins. The details of the spray coating of the alignment film solution have already been described, and will be omitted. With such a system configuration, coating with an ink jet is performed under reduced pressure.
  • the substrate 1 is dried at a predetermined temperature and time, and further heated and fired at a predetermined temperature and time, so that the solvent component in the alignment film solution is removed. By removing, a continuous alignment film 44 can be formed.
  • the same effect can also be obtained when the alignment film solution is sprayed and applied while the transport table 8 on which the head support structure 5 is fixed and the substrate 1 is restrained by the substrate holding means 10 such as an electrostatic chuck is moved. .
  • the surface properties of the alignment film are much better when sprayed at once in the direction perpendicular to the relative movement direction than the time difference coating, which is divided into several times. As shown in Fig.
  • jetting in the width direction with respect to movement is realized by the arrangement method of the inkjet 'head 2'.
  • the inkjet 'head 2 has a finite ejection width, and an inkjet' head in which the nozzles 9 are arranged so that the effective ejection width covers the width direction of the substrate 1 is attached to the head support structure 5.
  • the alignment film in the liquid crystal display element is formed on the substrate 1 by droplets ejected from the nozzle 9 of the inkjet head, and the dot group 13 (FIG. )). Thereafter, the solvent components in the solution are diffused along the substrate surface while evaporating, and the shear resistance with the substrate 1 overcomes the diffusion energy and stops. At this time, the acceleration of evaporation is realized by reducing the pressure. However, in order to strictly control this and control the subsequent surface diffusion, the temperature management of the substrate 1 is necessary.
  • a temperature adjusting device 16 is provided on the substrate transfer table 8 to solve this problem.
  • the substrate holding means 10 such as an electrostatic chuck is used for restraining the substrate, it is impossible to hold the heater in this part, but the vacuum Since it is expected that the adiabatic state will be achieved under a reduced pressure close to, a method of circulating hot water at a predetermined temperature from the outside of the vacuum chamber 14 is considered suitable. With this method, an alignment film with higher film thickness accuracy can be obtained.
  • the temperature adjustment device 16 of the substrate transfer table 8 includes a heater, a heater power supply, a temperature sensor, and a temperature controller (not shown).
  • a through hole parallel to the table surface is provided inside the substrate transport table 8, and the heater is inserted into the through hole to heat the table surface from below.
  • a temperature sensor such as a thermocouple is provided at the center of the table, and this output is input to the temperature controller to monitor the temperature.
  • the temperature controller performs feedback control, that is, compares the temperature of the table with the set temperature, and increases or decreases the current value of the heater power supply based on the result. This adjusts the table temperature to the set temperature.
  • a hot water pipe When a hot water pipe is used, similarly to the above, a through hole is provided in the table, and the hot water pipe is inserted instead of the heater to heat the table.
  • a pump is provided to constantly circulate hot water in the pipe.
  • a pipe heating heater that heats the pipe will be installed at any location of the hot water pipe to adjust the temperature of the hot water.
  • the control method monitors the output of the temperature sensor provided at an arbitrary location on the table, and the temperature controller determines the current value of the pipe heating heater based on the comparison result of this temperature and the set temperature. To adjust the table temperature to the set temperature.
  • a third embodiment according to the present invention will be described with reference to FIG.
  • production efficiency is the most concern.
  • the process is performed in the atmosphere, and the image is transferred onto the substrate by one rotation of the plate cylinder. It is necessary not only to increase the injection speed but also to quickly create a predetermined pressure reduction condition. To do so, spray on the substrate 1 This can be handled by providing a decompression preliminary chamber 18 as a pressure adjustment preliminary chamber in the front stage of the main body device 17 as a spray coating film forming chamber for coating, and a rear preliminary chamber 19 as a pressure adjustment preliminary chamber in the rear stage. .
  • the first gate valve 20 is opened and the substrate 1 that has been transported in the atmosphere is carried into the decompression preparatory chamber 18 at the preceding stage.
  • This room has the capacity of one substrate, and the gate vano lev 20 is closed, and is first lowered to a predetermined pressure by the vacuum pump 21 for the preparatory chamber.
  • a leak valve 22 is provided in the pre-stage preliminary chamber 18 so that it can return to atmospheric pressure immediately in response to the next substrate loading.
  • the main unit 17 is always lowered to a predetermined pressure by a dedicated vacuum pump 15, and when the pressure in the pre-stage preliminary chamber 18 drops to the pressure of the main unit 17, the second gate valve 23 that separates both units 23 Is opened, and the substrate 1 is carried into the main unit 17 from the preparatory chamber 18.
  • the gate valve 23 is closed, the substrate 1 is aligned, and ink jet spray coating is performed.
  • the third gate vano lev 24 that partitions the main unit 17 and the rear stage preliminary chamber 19 is opened, and the substrate 1 is transferred to the rear stage preliminary chamber 19 and then closed. Then, the series of operations is completed by opening the leak valve 25 for the rear-stage spare chamber, returning to the normal condition by opening the fourth gate vano lev 26 to the atmospheric state.
  • a dedicated vacuum pump 27 is installed in the rear-stage preliminary chamber so that it can handle the next substrate.
  • the opening and closing of these four gate valves 20, 23, 24 and 26, and the pressure operation in the front stage preparatory chamber 18, the main body 17, and the rear stage preparatory room 19 are shown as a time chart in FIG.
  • FIG. 10 shows the pressure state of each of the front preliminary chamber 18, the coating chamber 17 which is the main unit, and the rear preliminary chamber 19, and the opening and closing of the gate bubbles 20, 23, 24 and 26 in each chamber.
  • the timing and the transfer status of boards No. 1 to No. 5 are shown.
  • the production efficiency can be improved. In other words, if the operation is such that the substrate 1 is always stored in the three chambers, the production tact will be greatly improved.
  • Substrate transport tape in two chambers (one is the front chamber 18 and the other is the rear chamber 17)
  • the nozzle 8 can move to the vicinity of the gate valve 23 between the front chamber 18 and the rear chamber 17, respectively.
  • a substrate common transport drive system 29 (not shown) is provided on the upper surface of each substrate transport table 8.
  • a substrate feed roller is provided as the substrate common transport drive system 29, for example.
  • the transfer table 8 in both the front chamber and the rear chamber is moved to the vicinity of the gate valve 23, and the transfer table in the front chamber is opened with the gate vano rev 23 open.
  • the substrate holding of 8 is released, and the substrate 1 is moved onto the transfer table 8 in the rear chamber by the substrate feeding roller 29.
  • the substrate transfer between the front chamber 17 and the rear chamber 19 is performed by the substrate feed roller according to the opening / closing of the gate valve 24.
  • the substrates are transferred between the chambers 18 and 17 and 17 and 19 by using the common substrate transport drive system 29, and the gate vano lev opening / closing timing between these common substrate transport drive systems.
  • the three-chamber method shown in FIG. 9 is ideal, it is expensive and requires a large installation area. Even if production tact is slightly reduced, if a low-cost device with a small installation area is required, the configuration shown in Fig. 11, that is, the two-chamber method is available. In this method, the front and rear standby chambers in the three-chamber method are combined into one spare chamber, that is, the carry-in / out spare chamber 28, and the series of operation algorithms is the same as in the three-chamber method.
  • the substrate 1 passes through the carry-in / carry-out spare chamber 28, enters the main body device 17, and after spraying is completed, is returned to the carry-in / carry-out spare chamber 28 and discharged to the line in the atmosphere.
  • This embodiment is a specific configuration for obtaining a reduction in the size of the apparatus at the same time when realizing the cleanness at the time of forming the alignment film.
  • the head support structure 5 is fixed, the substrate transfer table 8 on which the substrate 1 is mounted is moved at a predetermined speed, and spraying is applied to the dust on the substrate 1 (particles). The fall of the is less.
  • the inkjet head 2 is fixed and the substrate 1 moves and sprays the entire surface, an area equivalent to at least two substrates is required.
  • the carry-in / carry-out spare chamber in FIGS. 9 and 11 is also used as the main body device 17, and the transport drive system 2 for the substrate transport table 8 between the spare chamber 28 and the main body device 17. It is characterized in that 9 is shared and controlled continuously. Unlike the one-chamber system in which the spare chamber 28 and the main unit 17 are integrated from the beginning, in the embodiment shown in FIG. 12, there is a gate valve 30 that partitions the two chambers between them. As a result, the decompression time can be shortened. In a specific configuration example of the present invention, the inkjet head 2 is placed near the gate valve 30 of the main body device 17 and spray coating is performed.
  • a fifth embodiment of the present invention will be described with reference to FIG.
  • the steps of substrate loading, preliminary pressure reduction, spray coating, air return, and substrate discharging are the same as in the case of the third embodiment described with reference to FIG. 17,
  • the evacuation system for decompression of each of the rear preliminary chambers 19 is polluted, for example, volatile organic compounds (V0C) such as solvents contained in the alignment film solution, or evaporated from the chamber walls.
  • V0C volatile organic compounds
  • Equipment for collecting undesired components, undesired components entering from the outside, and other undesired components 31, 32, 33 are installed.
  • VOC recovery equipment may be an adsorption system that uses activated carbon or the like, or a hydrocarbon compound that decomposes with the help of a plasma catalyst.
  • the solvent component of the alignment film solution there is a risk of eroding the structural materials of the vacuum pumps 21, 15, and 27 that are used for evacuation of each chamber. It is necessary to install in. If this is not the case, the final stage should
  • the preliminary stage chamber 18 is provided with substrate surface modification means 34 such as ultraviolet irradiation in addition to pressure adjustment means such as a vacuum pump and a leak valve.
  • substrate surface modification means 34 such as ultraviolet irradiation
  • pressure adjustment means such as a vacuum pump and a leak valve.
  • laser irradiation including a laser light source 35 and an optical scanning system 36 that scans the laser in the plane of the substrate from diagonally above the substrate 1 in the direction in which the ink jet head 2 is supported.
  • Means 110 are provided.
  • the laser irradiation means 110 irradiates laser light to the landing alignment film solution dot 13 to accelerate the volatilization of the solvent component in the alignment film solution, thereby smoothly diffusing the substrate surface after landing. As a result, it is possible to form an alignment film with small variations in film thickness.
  • the present invention includes a laser irradiation means 110 including a laser light source 35 and an optical scanning system 36 for scanning the laser in the substrate plane.
  • the alignment film droplets ejected from each nozzle 9 of the inkjet head 2 and flying are directly irradiated from the laser irradiation means 110 from the laser 35 in the lateral direction. It is a mechanism to do this. By accelerating the volatilization of the solvent component in the alignment film solution, the diffusion development on the substrate surface is facilitated.
  • the thin film formation technology based on the ink jet method under the reduced pressure environment described above is generally used for surface emission type organic EL (OLED) light emitting layer, hole transport layer thin film formation, semiconductor and flat panel display (FPD), etc. It can be applied to the formation of thin film resists frequently used in this process, and a good film thickness distribution can be obtained.
  • OLED organic EL
  • FPD semiconductor and flat panel display

Landscapes

  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Lorsqu'on forme un film mince sur un substrat en utilisant un procédé à jet d'encre, on évite des variations en termes d'épaisseur du film, on améliore le taux d'utilisation des matières et le rendement de production et on respecte l'environnement. On utilise un dispositif de formation d'un film mince lequel comprend un mécanisme support de têtes (5) comprenant une pluralité de buses (9) montées sur celui-ci et pourvu d'une seule ou d'une pluralité de têtes d'injection (2) et un mécanisme portant un substrat (50) permettant un mouvement relatif dans la direction d'un plan. Une table portant un substrat (8) et une partie effectuant une enduction par pulvérisation sur un substrat (1) sont enfermées dans une cuve sous vide (14) servant de chambre d'enduction par pulvérisation/de formation de film et on forme un film par un procédé à jet d'encre dans un environnement dépressurisé par une pompe à vide, ce par quoi on obtient un film mince ayant de faibles variations de l'épaisseur du film. Si besoin, on emploie une chambre préliminaire d'ajustement de la pression pour créer un environnement dépressurisé et en plus un dispositif de récupération de solvant organique volatil peut être installé dans un système d'évacuation. Le dispositif est particulièrement approprié pour former un film orienté.
PCT/JP2007/054930 2006-03-16 2007-03-13 Dispositif de formation d'un film mince et procédé de formation d'un film mince WO2007108364A1 (fr)

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JP2006073312A JP2006289355A (ja) 2005-03-18 2006-03-16 薄膜形成装置及び薄膜形成方法
JP2006-073312 2006-03-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012065324A1 (fr) * 2010-11-18 2012-05-24 深圳市华星光电技术有限公司 Procédés pour sécher un film et un film d'alignement et pour fabriquer un panneau d'affichage

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204529A (ja) * 1998-01-19 1999-07-30 Seiko Epson Corp パターン形成方法および基板製造装置
JP2004071222A (ja) * 2002-08-02 2004-03-04 Seiko Epson Corp 材料の配置方法、膜形成装置、電子装置及びその製造方法、電気光学装置及びその製造方法、並びに電子機器
WO2004045252A1 (fr) * 2002-11-11 2004-05-27 Semiconductor Energy Laboratory Co., Ltd. Procede de fabrication d'un dispositif electroluminescent
JP2005507770A (ja) * 2001-10-29 2005-03-24 イノベーション ケミカル テクノロジーズ リミテッド 多孔性キャリアを用いて基材上に薄膜を形成する方法
JP2005296951A (ja) * 2001-09-12 2005-10-27 Seiko Epson Corp パターニング装置、膜形成装置、及び電子装置
WO2006022217A1 (fr) * 2004-08-23 2006-03-02 Kabushiki Kaisha Ishiihyoki Procédé de régulation de la quantité de décharge d’une imprimante à jet d’encre, procédé de vérification de l’étalement des gouttelettes d’encre et procédé de formation du film d’orientation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204529A (ja) * 1998-01-19 1999-07-30 Seiko Epson Corp パターン形成方法および基板製造装置
JP2005296951A (ja) * 2001-09-12 2005-10-27 Seiko Epson Corp パターニング装置、膜形成装置、及び電子装置
JP2005507770A (ja) * 2001-10-29 2005-03-24 イノベーション ケミカル テクノロジーズ リミテッド 多孔性キャリアを用いて基材上に薄膜を形成する方法
JP2004071222A (ja) * 2002-08-02 2004-03-04 Seiko Epson Corp 材料の配置方法、膜形成装置、電子装置及びその製造方法、電気光学装置及びその製造方法、並びに電子機器
WO2004045252A1 (fr) * 2002-11-11 2004-05-27 Semiconductor Energy Laboratory Co., Ltd. Procede de fabrication d'un dispositif electroluminescent
WO2006022217A1 (fr) * 2004-08-23 2006-03-02 Kabushiki Kaisha Ishiihyoki Procédé de régulation de la quantité de décharge d’une imprimante à jet d’encre, procédé de vérification de l’étalement des gouttelettes d’encre et procédé de formation du film d’orientation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012065324A1 (fr) * 2010-11-18 2012-05-24 深圳市华星光电技术有限公司 Procédés pour sécher un film et un film d'alignement et pour fabriquer un panneau d'affichage

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