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WO2007101228A8 - Semiconductor wafer handling and transport - Google Patents

Semiconductor wafer handling and transport

Info

Publication number
WO2007101228A8
WO2007101228A8 PCT/US2007/062921 US2007062921W WO2007101228A8 WO 2007101228 A8 WO2007101228 A8 WO 2007101228A8 US 2007062921 W US2007062921 W US 2007062921W WO 2007101228 A8 WO2007101228 A8 WO 2007101228A8
Authority
WO
WIPO (PCT)
Prior art keywords
processing
transport
efficiency
modules
functionality
Prior art date
Application number
PCT/US2007/062921
Other languages
French (fr)
Other versions
WO2007101228A2 (en
WO2007101228A3 (en
Inventor
Der Meulen Peter Van
Christopher C Kiley
Patrick D Pannese
Raymond S Ritter
Thomas A Schaefer
Original Assignee
Blueshift Technologies Inc
Der Meulen Peter Van
Christopher C Kiley
Patrick D Pannese
Raymond S Ritter
Thomas A Schaefer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blueshift Technologies Inc, Der Meulen Peter Van, Christopher C Kiley, Patrick D Pannese, Raymond S Ritter, Thomas A Schaefer filed Critical Blueshift Technologies Inc
Publication of WO2007101228A2 publication Critical patent/WO2007101228A2/en
Publication of WO2007101228A8 publication Critical patent/WO2007101228A8/en
Publication of WO2007101228A3 publication Critical patent/WO2007101228A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Modular wafer transport and handling facilities (6100) are combined in a variety o ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems (6150) to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
PCT/US2007/062921 2006-02-27 2007-02-27 Semiconductor wafer handling and transport WO2007101228A2 (en)

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
US77744306P 2006-02-27 2006-02-27
US60/777,443 2006-02-27
US77970706P 2006-03-05 2006-03-05
US77968406P 2006-03-05 2006-03-05
US77947806P 2006-03-05 2006-03-05
US77960906P 2006-03-05 2006-03-05
US77946306P 2006-03-05 2006-03-05
US60/779,684 2006-03-05
US60/779,478 2006-03-05
US60/779,609 2006-03-05
US60/779,707 2006-03-05
US60/779,463 2006-03-05
US78483206P 2006-03-21 2006-03-21
US60/784,832 2006-03-21
US74616306P 2006-05-01 2006-05-01
US60/746,163 2006-05-01
US80718906P 2006-07-12 2006-07-12
US60/807,189 2006-07-12
US82345406P 2006-08-24 2006-08-24
US60/823,454 2006-08-24

Publications (3)

Publication Number Publication Date
WO2007101228A2 WO2007101228A2 (en) 2007-09-07
WO2007101228A8 true WO2007101228A8 (en) 2008-10-16
WO2007101228A3 WO2007101228A3 (en) 2009-03-26

Family

ID=38461797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/062921 WO2007101228A2 (en) 2006-02-27 2007-02-27 Semiconductor wafer handling and transport

Country Status (2)

Country Link
SG (1) SG170048A1 (en)
WO (1) WO2007101228A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7897525B2 (en) 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
US8367565B2 (en) 2008-12-31 2013-02-05 Archers Inc. Methods and systems of transferring, docking and processing substrates
US8110511B2 (en) 2009-01-03 2012-02-07 Archers Inc. Methods and systems of transferring a substrate to minimize heat loss
CN102320472B (en) * 2011-06-03 2013-07-10 深圳市华星光电技术有限公司 Substrate conveying system and conveying method
KR102034706B1 (en) * 2013-03-28 2019-10-21 주식회사 원익아이피에스 Substrate processing system and substrate processing method
CN104078383A (en) * 2013-03-28 2014-10-01 圆益Ips股份有限公司 Substrate processing system and substrate processing method
JP6240695B2 (en) * 2016-03-02 2017-11-29 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
JP7231721B2 (en) 2018-10-04 2023-03-01 アプライド マテリアルズ インコーポレイテッド Conveyor system
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus

Also Published As

Publication number Publication date
WO2007101228A2 (en) 2007-09-07
SG170048A1 (en) 2011-04-29
WO2007101228A3 (en) 2009-03-26

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