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WO2007018040A1 - Dispositif de decoupe de feuille et procede de decoupe - Google Patents

Dispositif de decoupe de feuille et procede de decoupe Download PDF

Info

Publication number
WO2007018040A1
WO2007018040A1 PCT/JP2006/314851 JP2006314851W WO2007018040A1 WO 2007018040 A1 WO2007018040 A1 WO 2007018040A1 JP 2006314851 W JP2006314851 W JP 2006314851W WO 2007018040 A1 WO2007018040 A1 WO 2007018040A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
plate
cutting
wafer
cutting device
Prior art date
Application number
PCT/JP2006/314851
Other languages
English (en)
Japanese (ja)
Inventor
Kenji Kobayashi
Hideaki Nonaka
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2007018040A1 publication Critical patent/WO2007018040A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/005—Manipulators for mechanical processing tasks
    • B25J11/0055—Cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
    • B26F1/3813—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a sheet cutting apparatus and a cutting method, and more specifically, in a state where a sheet is attached to a plurality of plate-like members supported by a table so as to straddle each plate-like member.
  • the present invention relates to a sheet cutting apparatus and a cutting method that can sequentially cut a sheet along the outer edge of each plate-like member.
  • a protective sheet for protecting the circuit surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) is pasted, or a heat-sensitive adhesive sheet is pasted on the back surface or the front surface. To be done.
  • Patent Document 1 Japanese Patent No. 2919938
  • Patent Document 1 the cutting apparatus disclosed in Patent Document 1 is intended for a case where the wafer supported by the table is one, and a plurality of wafers are placed on the same plane. It is inconvenient that it cannot be placed and cut sequentially.
  • the cutting device is configured to include a force cutter blade at the tip of an arm having a rotation center on the center line of the wafer, the movement trajectory of the cutter blade is in the circumferential direction, and has various planar shapes.
  • the sheet When a sheet is attached to a plate-like member, the sheet cannot be cut along the outer edge of the plate-like member.
  • the present invention has been devised by paying attention to such inconveniences. It is an object of the present invention to provide a sheet cutting apparatus and a cutting method capable of sequentially cutting a sheet affixed across a plate member along the outer edge of the plate member.
  • Another object of the present invention is to perform heating for each region supporting a plate-like member whose sheet has been cut when performing sheet cutting on a plurality of plate-like members. It is an object of the present invention to provide a sheet cutting apparatus and a cutting method capable of securing the heating time for a sheet-shaped plate-shaped member, which is necessary for adhesion, while the sheet-shaped member is being cut.
  • the present invention provides a sheet cutting apparatus for cutting a sheet along an outer edge of the plate member after the sheet is attached to a plate member supported by a table.
  • a plurality of plate-like members are arranged on the table, and sheets having a size straddling each plate-like member are attached, and sheets are sequentially placed along the outer edge of each plate-like member. It is configured to cut.
  • the sheet cutting device is constituted by an articulated robot.
  • the table can be heated for each plate-like member from which the sheet is cut.
  • the plate-like member is a semiconductor wafer
  • the sheet is a protective sheet that protects the circuit surface of the wafer.
  • the plate-like member is a semiconductor wafer, and the sheet is a heat-sensitive adhesive sheet.
  • the plate-like member may be a compound wafer, and the sheet may be a protective sheet that protects the surface of the wafer.
  • the articulated robot is configured to include a cutter blade provided with a blade at the tip of a blade holder on the free end side, and the blade is heated according to the property of the sheet and / or is subjected to vibration. It is good to adopt the configuration of being given.
  • the present invention provides a sheet cutting method for cutting the sheet along an outer edge of the plate-like member after sticking the sheet to the plate-like member supported by the table. After arranging a plurality of plate-like members on the table, a sheet having a size straddling each plate-like member is affixed to the plate-like member, and in this state, sheets are sequentially placed along the outer edge of each plate-like member. The method of cutting is used.
  • a plurality of plate-like members are arranged on the table, and the sheets attached to these plate-like members are sequentially cut along the outer edges of the plate-like members. And cutting can be performed very efficiently.
  • each plate-like member is heated on the table, when the adhesive sheet is a heat-sensitive adhesive sheet, when cutting the sheet of another plate-like member, the outer edge sheet has already been cut. By heating the wafer that has been completed, sufficient heating can be performed to bond the adhesive sheet to the wafer.
  • the blade of the cutter blade is heated according to the properties of the sheet and / or given vibration, so that the cutting performance can be exhibited well.
  • FIG. 1 is a schematic front view of a sheet sticking device according to the present embodiment.
  • FIG. 2 is a schematic perspective view of the sheet sticking apparatus.
  • FIG. 3 is an enlarged perspective view showing a distal end side region of the cutting device.
  • FIG. 4 is an enlarged perspective view of the cutter blade.
  • FIG. 5 is a partial cross-sectional view of a table and a cutting device.
  • FIG. 1 shows a schematic front view of a sheet sticking device to which a cutting device according to the present invention is applied
  • FIG. 2 shows a schematic perspective view thereof.
  • the sheet affixing device 10 is fed to the upper side of the sheet feeding unit 12 arranged on the upper part of the base 11, the table 13 supporting the UENO and W as the plate-like members, and the UENO and W.
  • a pressing roller 14 that applies a pressing force to the bonded sheet S and affixes the adhesive sheet S to the wafer W, and affixes the adhesive sheet S to the wafer W and then cuts the adhesive sheet S along the outer edge of the wafer W
  • the cutting device 15 includes a peeling device 18 that peels the unnecessary adhesive sheet S1 outside the wafer W from the upper surface force of the table 13, and a scraping device 19 that winds up the unnecessary adhesive sheet S1.
  • the sheet feeding unit 12 includes a support roller 20 that supports a roll-shaped raw sheet L in which a strip-shaped adhesive sheet S is temporarily attached to one surface of a strip-shaped release sheet PS, and the support roller 20
  • the peeled-out sheet L is abruptly reversed to peel the adhesive sheet S from the release sheet PS, the peel plate 22 that winds up and collects the release sheet PS, the support roller 20 and the recovery roller 23
  • a plurality of guide rollers 25 to 31 arranged between the guide rollers 25 and 26, a buffer roller 33 arranged between the guide rollers 25 and 26, and arranged between the guide rollers 27 and 28, and supported by the load cell 39 and the load cell 39
  • the tension measuring means 35 including the tension measuring roller 40 positioned on the base side of the peel plate 22, and the peel plate 22, guide rollers 27, 28, 29, and the tension measuring means 35 are integrally supported and pressed.
  • the guide rollers 27 and 29 are provided with brake shoes 32 and 42. These brake shoes 32 and 42 correspond to the cylinders 38 and 48 when the adhesive sheet S is attached to the wafer W, respectively. By advancing and retreating with respect to the guide rollers 27 and 29, the adhesive sheet S is sandwiched and its feeding is suppressed.
  • the sheet feeding unit 12 and the tension measuring means constituting the unit 35 and the sticking angle maintaining means 37 are the same as those disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, and detailed description thereof is omitted here.
  • the table 13 is arranged in four locations so as to be adjacent to each other in the region of the outer table 51 and the outer table 51 having a substantially square shape in plan view.
  • the inner table 52 is substantially circular in plan view.
  • the outer table 51 is provided with four recesses that can receive the inner table 52 in a state where gaps C are formed between the outer table 51 and the outer edge of each inner table 52. It can be moved up and down with respect to the machine 11.
  • each inner table 52 is provided so as to be movable up and down with respect to the outer table 51 via a single-axis robot 56.
  • each inner table 52 can be moved up and down integrally, and can be moved up and down independently of each other, so that depending on the thickness of the adhesive sheet S and the thickness of the wafer W, It can be adjusted to a fixed height position.
  • each inner table 51 can be heated via heating means (not shown). Therefore, when a heat-sensitive adhesive sheet is adopted as the adhesive sheet S, the wafer W can be heated and bonded.
  • the pressing roller 14 is supported via a portal frame 57.
  • Cylinders 59, 59 are provided on the upper surface side of the portal frame 57, and the pressure roller 14 is provided so that it can be moved up and down by the operation of these cylinders 59.
  • the portal frame 57 is provided so as to be movable in the X direction in FIG. 1 via a single-axis robot 60 and a guide rail 61 as shown in FIG.
  • the cutting device 15 is constituted by an articulated robot. That is, as shown in FIGS. 3 to 5, the cutting device 15 includes a robot main body 62 and a cutter blade 63 supported on the free end side of the robot main body 62. As shown in FIG. 5, the robot body 62 includes a base portion 64 and first arm 65A to sixth arm 65F arranged on the upper surface side of the base 64 portion and provided to be rotatable in the directions of arrows A to F. And a tool holding chuck 69 attached to the distal end side of the sixth arm 65F, that is, the free end side of the robot body 52.
  • the second, third, and fifth arms 65B, 65C, and 65E are rotatably provided in the YXZ plane in FIG.
  • the robot body 62 as the cutting device 15 in this embodiment is NC-controlled, and the cutter blade 63 is moved to the outside position where the upper region force of the table 13 is out of the table 13 during the non-cutting operation, that is, the table 13. It is provided to retreat to the side position.
  • the tool holding chuck 69 is disposed in a substantially cylindrical cutter blade receptacle 70 and at a position spaced apart by approximately 120 degrees in the circumferential direction of the cutter blade receptacle 70. And three chuck claws 71 for detachably holding the cutter blade 63.
  • Each chuck claw 71 is a pointed portion 71A having an acute inner end, and can advance and retreat in the radial direction with respect to the center of the cutter blade receiver 70 by pneumatic pressure.
  • the cutter blade 63 includes a blade holder 63A that forms a base region, and a blade 63B that is inserted and fixed to the distal end side of the blade holder 63A.
  • the blade holder 63A has a substantially cylindrical shape, and grooves 72 having a length extending from the base end to the intermediate portion are formed along the axial direction at positions at intervals of about 120 degrees in the circumferential direction on the outer peripheral surface.
  • the blade holder 63A incorporates a heater (not shown) and a vibration device.
  • the blade 63B can be heated by the heater and the blade 63B can be vibrated by the vibration device.
  • a coil heater can be illustrated as a heater
  • an ultrasonic vibration apparatus can be illustrated as a vibration apparatus.
  • the peeling device 18 includes a small-diameter roller 80 and a large-diameter roller 81.
  • the small diameter roller 80 and the large diameter roller 81 are supported by the moving frame F.
  • This moving frame F is composed of a front frame F1 relatively disposed along the Y direction in FIG. 2 and a rear frame F2 connected to the front frame F1 via a connecting member 83.
  • the rear frame F2 is While supported by the single-axis robot 85, the front frame F1 is supported by the guide rail 61, so that the moving frame F can move in the X direction in FIG. As shown in FIG.
  • the large-diameter roller 81 is supported by an arm member 84, and the arm member 84 is moved in a direction in which the large-diameter roller 81 is separated from and approaches the small-diameter roller 80 by a cylinder 88. Displaceable.
  • the scraping device 19 is supported on the driving roller 90 supported by the moving frame F and the free end side of the rotating arm 91, and is in contact with the outer peripheral surface of the driving roller 90 via the spring 92. It is constituted by a take-off roller 93 that pulls up S1.
  • a drive motor M is disposed at the shaft end of the drive roller 90. The drive roller 90 rotates by driving the motor M, and the take-off roller 93 rotates following the rotation of the drive roller 90. It is getting rolled up. Note that the scraping roller 93 rotates to the right in FIG. 1 against the force of the spring 92 as the scraping amount increases.
  • the external dimensions of the wafer, the cutting angle of the cutter blade 63, the orientation of the cutter blade 63, and the like are input to an input device (not shown).
  • the movement trajectory data stored in the storage unit of the control device is read, and the blade 63B is on each inner table 52
  • the adhesive sheet S is cut along the wafer outline.
  • the blade 63B may be heated by a coil heater, or may be vibrated by an ultrasonic vibration device. As a result, the adhesive sheet S can be cut in a state where the adhesive sheet coincides with the outer edge of the wafer W and the cutting resistance is very small.
  • the cutting device 15 causes the cutting device 15 to remove the adhesive sheet S on the next wafer W according to a preset order. Transition to cutting operation.
  • the adhesive sheet S is a heat-sensitive adhesive sheet
  • the inner table 52 that supports the wafer W is heated to heat the adhesive sheet S to the wafer W that has been cut. It is supposed to adhere.
  • a plurality of wafers W can be adhered to the same table 13 substantially simultaneously, and the adhesive sheet S is sequentially adhered along the outer edge of the wafer by the cutting device 15. Since the sheet can be cut, it is possible to perform extremely efficient sheet sticking and cutting.
  • the wafer W is targeted as the plate-shaped member.
  • the plate-like member is not limited to a circular shape, and may be a polygonal shape.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de découpe de feuille (15) pour coller une feuille adhésive (S) sur des galettes (W) supportées sur une table (13) et pour découper la feuille (S) le long des bords extérieurs des galettes (W). Le dispositif de découpe (15) possède un robot à articulations multiples pour découper séquentiellement la feuille adhésive (S) le long des bords extérieurs des galettes (W), la feuille adhésive (S) ayant une dimension couvrant les galettes (W) collées sur la table (13).
PCT/JP2006/314851 2005-08-08 2006-07-27 Dispositif de decoupe de feuille et procede de decoupe WO2007018040A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005229226A JP4739853B2 (ja) 2005-08-08 2005-08-08 シート切断装置及び切断方法
JP2005-229226 2005-08-08

Publications (1)

Publication Number Publication Date
WO2007018040A1 true WO2007018040A1 (fr) 2007-02-15

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ID=37727229

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/314851 WO2007018040A1 (fr) 2005-08-08 2006-07-27 Dispositif de decoupe de feuille et procede de decoupe

Country Status (3)

Country Link
JP (1) JP4739853B2 (fr)
TW (1) TW200714430A (fr)
WO (1) WO2007018040A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009030338A3 (fr) * 2007-08-31 2009-05-14 Abb Technology Ab Outil robot, système robot et procédé de traitement de pièces
CN111673766A (zh) * 2020-06-19 2020-09-18 刘晨辉 一种工业切割机器人
CN111916385A (zh) * 2019-05-10 2020-11-10 株式会社迪思科 晶片的加工方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020078837A (ja) * 2018-11-12 2020-05-28 リンテック株式会社 シート切断装置およびシート切断方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919938B2 (ja) * 1990-09-26 1999-07-19 日東電工株式会社 薄板に貼着した粘着テープのカット方法
JP2002190457A (ja) * 2000-12-20 2002-07-05 Fdk Corp 方向性を有する素子の作製・取扱方法
JP2003257898A (ja) * 2002-03-07 2003-09-12 Nitto Denko Corp 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919938B2 (ja) * 1990-09-26 1999-07-19 日東電工株式会社 薄板に貼着した粘着テープのカット方法
JP2002190457A (ja) * 2000-12-20 2002-07-05 Fdk Corp 方向性を有する素子の作製・取扱方法
JP2003257898A (ja) * 2002-03-07 2003-09-12 Nitto Denko Corp 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009030338A3 (fr) * 2007-08-31 2009-05-14 Abb Technology Ab Outil robot, système robot et procédé de traitement de pièces
CN101801617B (zh) * 2007-08-31 2013-06-19 Abb技术有限公司 带有切削刀片的机器人工具和相应的用于加工工件的方法
CN111916385A (zh) * 2019-05-10 2020-11-10 株式会社迪思科 晶片的加工方法
CN111673766A (zh) * 2020-06-19 2020-09-18 刘晨辉 一种工业切割机器人
CN111673766B (zh) * 2020-06-19 2021-12-10 江西联麓智能装备有限公司 一种工业切割机器人

Also Published As

Publication number Publication date
JP4739853B2 (ja) 2011-08-03
JP2007044774A (ja) 2007-02-22
TW200714430A (en) 2007-04-16

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