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WO2007015593A1 - Microphone à condensateur basé sur du silicium et son procédé d'emballage - Google Patents

Microphone à condensateur basé sur du silicium et son procédé d'emballage Download PDF

Info

Publication number
WO2007015593A1
WO2007015593A1 PCT/KR2006/000384 KR2006000384W WO2007015593A1 WO 2007015593 A1 WO2007015593 A1 WO 2007015593A1 KR 2006000384 W KR2006000384 W KR 2006000384W WO 2007015593 A1 WO2007015593 A1 WO 2007015593A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal case
silicon based
condenser microphone
board
pcb
Prior art date
Application number
PCT/KR2006/000384
Other languages
English (en)
Inventor
Chung-Dam Song
Original Assignee
Bse Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd filed Critical Bse Co., Ltd
Publication of WO2007015593A1 publication Critical patent/WO2007015593A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a condenser microphone, and, more particularly, to a silicon based condenser microphone which packages a silicon microphone chip fabricated by a MEMS technology to increase a mechanical firmness and enhance effects for preventing noise from entering the microphone and a packaging method for the silicon based condenser microphone.
  • a condenser microphone which has been widely used in a mobile equipment or an audio equipment consists of a voltage bias element, a pair of a diaphragm and a back plate for forming a capacitor which is changed corresponding to sound pressure, and a JFET for buffering an output signal.
  • This typical condenser microphone has an assembly which is integrally assembled by inserting a vibration plate, a spacer ring, an insulating ring, a back plate, a conductive ring and a PCB into a case.
  • MEMS Micro Electro Mechanical System
  • a sensor, an actuator and an electro mechanical structure can be fabricated in a D unit using a micromachining technology which applies a semiconductor fabricating process, especially, an integrated circuit technology.
  • a MEMS chip microphone manufactured by the micromachining technology has merits that miniaturization, high- performance, multifunction and integration can be obtained through the high precise micromachining technology and safety and reliability can be enhanced.
  • the MEMS chip microphone manufactured by the micromachining technology should perform electrical driving and signal processing, it is required to package the microphone with another special purpose semiconductor chip device, that is, an ASIC (Application Specific Integrated Circuit).
  • ASIC Application Specific Integrated Circuit
  • US Patent No. 6,781,231 which is published in August 25, 2004 and entitled by "Micro Electro Mechanical System Package with Environmental and Interference Shield".
  • the above package has a structure for adhering a cover which consists of an internal conductive layer and an external conductive layer on a multi-layered substrate which is alternately overlapped by a conductive layer and a non conductive layer using a conductive adhesive.
  • the conventional packaging method has problems in that a manufacturing cost is raised and a bonding property is deteriorated due to a complex process, and it is sensitive to an external noise such as an electromagnetic wave noise and the like since a non conductive material unlike a metal housing is used. Disclosure of Invention Technical Problem
  • an object of the present invention is to provide a silicon based condenser microphone for increasing bonding strength and having high resistance to external noise such as electromagnetic waves by welding an opened end of a metal case to a substrate which is mounted with MEMS microphone parts and a packaging method for the silicon based condenser microphone.
  • a silicon based condenser microphone comprising: a metal case; and a board which is mounted with a MEMS microphone chip and an ASIC chip having a electric pressure pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, the connecting pattern being welded to the metal case.
  • a method for packaging a silicon based condenser microphone comprising the steps of: inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case; aligning the metal case on the connecting pattern of the board; and welding an opened end of the metal case to the connecting pattern of the board.
  • the metal case may have any one of a cylindrical shape and a rectangular parallelepiped shape. Further, an opened end of the metal case may have any one of a straight line shape and a skirt shape which is formed by bending the opened end outwardly.
  • the board may be any one selected from the group of a PCB, a ceramic board, a FPCB and a metal PCB.
  • the metal case may be made of any one selected from the group of brass, aluminum and nickel alloy.
  • the welding may be any one selected from the group of laser welding, electric welding, soldering, and bonding using a conductive adhesive.
  • Fig. 1 is a sectional side view of a first embodiment according to the present invention
  • Fig. 2 is an exploded perspective view of a first embodiment according to the present invention
  • Fig. 3 is a view showing an example of a structure for a MEMS chip of a silicon based condenser microphone according to the present invention
  • Fig. 17 is a view showing an example of a structure for a MEMS chip of a silicon based condenser microphone according to the present invention.
  • FIG. 4 is a circuit diagram of a silicon based condenser microphone according to the present invention
  • Fig. 5 is a flow chart showing a packaging process of a silicon based condenser microphone according to the present invention
  • Fig. 6 is an exploded perspective view of a second embodiment according to the present invention
  • Fig. 7 is an exploded perspective view of a third embodiment according to the present invention
  • Fig. 8 is an exploded perspective view of a fourth embodiment according to the present invention
  • Fig. 9 is a sectional side view of a fifth embodiment for endowing directivity with a microphone according to the present invention.
  • FIG. 1 is a sectional side view of a first embodiment according to the present invention
  • Fig. 2 is an exploded perspective view of a first embodiment according to the present invention
  • Fig. 3 is a view showing an example of a structure for a MEMS chip of a silicon based condenser microphone according to the present invention
  • Fig. 4 is a circuit diagram of a silicon based condenser microphone according to the present invention. [27] According to a first embodiment, as shown in Figs. 1 and 2, a cylindrical metal case
  • a PCB 120 which is mounted with a MEMS chip 10 and an ASIC chip 20 by a laser.
  • the PCB 120 is mounted with the MEMS chip 10 and the
  • ASIC chip 20 and is formed with a circular connecting pattern 121 on a portion which contacts the metal case 110. Meanwhile, if necessary, the PCB 120 may be mounted with a capacity or a resistor, which is not shown in the drawings, for shielding electromagnetic waves or ESD.
  • the connecting pattern 121 is formed by forming a copper clad through a PCB manufacturing process and then plating Ni or Au.
  • the board 120 may be a PCB, a ceramic board, a FPCB or a metal PCB.
  • the metal case 110 has a cylindrical shape having an opening which faces the PCB
  • the metal case 110 is made of any one selected from the group of brass, copper, stainless steel, aluminum, nickel alloy and the like. Further, the metal case 110 is plated with Au or Ag. The metal case 110 may have various shapes such as a circle, a square and the like.
  • a connecting portion 130 thereof is welded by a laser (not shown), thereby finishing a microphone package.
  • the connecting pattern 121 is connected with a ground terminal 125, wherein, if the metal case 110 is welded to the connecting pattern 121, there is a merit in that it is easy to eliminate noise by interrupting the inflow of external noise.
  • the metal case 110 is firmly adhered to the connecting pattern 121 of the PCB 120 by the laser welding, wherein a space 150 between the metal case 110 and the PCB 120 serves as a sound chamber.
  • the PCB 120 may be formed with connecting terminals 123 and 125 for connecting with the external device on a bottom surface thereof, wherein the number of the connecting terminals 123 and 125 is two to eight.
  • Each of the connecting terminals 123 and 125 is electrically connected through through-hole 124 to a chip part surface.
  • the MEMS chip 10 as shown in Fig. 3, has a structure that a back plate 13 is formed on a silicon wafer 14 by using a MEMS technology and then the back plate faces a vibration membrane 11 with a spacer 12 interposed between the back plate 13 and the vibration membrane 11. Since this fabricating technology of the MEMS chip 10 has been opened, the further explanation will be omitted.
  • the ASIC chip 20 which is connected with the MEMS chip 10 to process electrical signals, as shown in Fig. 4, consists of an electric pressure pump 22 for supplying an electric pressure to allow the MEMS chip 10 to operate as a condenser microphone, and a buffer IC 24 for amplifying an electric sound signal sensed through the MEMS chip 10 or performing impendence matching of the sensed electric sound signal, thereby supplying the processed signal through the connecting terminal to the outside.
  • the electric pressure pump 22 may be a DC-DC converter
  • the buffer IC 24 may be an analogue amplifier or ADC.
  • a condenser symbol "CO" indicates an electrical equilibrium circuit for the MEMS chip 10.
  • the MEMS microphone package 100 is connected with the external device through three connecting terminals (Vdd, GND, Output).
  • FIG. 5 is a flow chart showing a packaging process of a silicon based condenser microphone according to the present invention.
  • a method for packaging a silicon based condenser microphone according to the present invention includes the steps of inputting a board (Sl), mounting a MEMS part and an ASIC chip on the board (S2), inputting a metal case (S3), aligning the case on a connecting pattern of the board (S4), and welding an opened end of the case to the connecting pattern of the board (S5).
  • the board may be a PCB, a ceramic board, a FPCB or a metal PCB.
  • the board is formed with the connecting pattern for connecting with the metal case.
  • the PCB 120 may be mounted with a capacity or a resistor for shielding electromagnetic waves or ESD.
  • the metal case is made of any one selected from the group of brass, copper, stainless steel, aluminum, nickel alloy and the like. Further, the metal case is plated with Au or Ag. The metal case may have various shapes such as a circle, a square and the like.
  • the welding operation is performed by laser welding, but it may be substituted with electric welding, soldering or bonding using a conductive epoxy adhesive.
  • the metal case is welded to the board by the laser, whereby a bonding force (that is, an electrical boding force and a sealing performance) is strengthened.
  • a bonding force that is, an electrical boding force and a sealing performance
  • the microphone has a high-resistance to noise from the outside.
  • a process expense is saved, thereby sharply cutting a total manufacturing cost.
  • FIG. 6 is an exploded perspective view of a second embodiment according to the present invention, wherein a rectangular parallelepiped shaped metal case 210 is welded to a PCB 220 by a laser.
  • the PCB 220 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a rectangular connecting pattern 221 on a portion which contacts the metal case 210.
  • the connecting pattern 221 is made of a copper clad film through a general PCB pattern forming technology.
  • the metal case 210 has a rectangular parallelepiped shape having an opening which faces the PCB 220, wherein an upper surface thereof is formed with a sound hole 212 for collecting sound.
  • Fig. 7 is an exploded perspective view of a third embodiment according to the present invention, wherein a cylindrical metal case 110 which is formed with a skirt 116 projected in a shape of "D" from an opened end of the case is welded to a PCB 120 by a laser.
  • the PCB 120 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a circular connecting pattern 121 on a portion which contacts the metal case 110'. Since the PCB 120 is broader than the metal case 110, connecting pads or connecting terminals for connecting with an external device can be freely disposed on the broad PCB.
  • the connecting pattern is formed by forming a copper clad through a PCB manufacturing process and then plating the copper clad with Ni or Au.
  • the width of the connecting pattern 121 according to the third embodiment is wider than that of the connecting pattern of the first embodiment to correspond to the skirt 116 of the metal case.
  • the metal case 110' has a cylindrical shape having an opening which faces the PCB 120, wherein an upper surface thereof is formed with a sound hole 112 for collecting sound.
  • a case body 114 is formed with the skirt 116 projected outwardly on the opened end thereof.
  • FIG. 8 is an exploded perspective view of a fourth embodiment according to the present invention, wherein a rectangular parallelepiped shaped metal case 210 which is formed with a skirt 216 projected in a shape of "D" from an opened end of the case is welded to a PCB 220 by a laser.
  • the PCB 220 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a rectangular connecting pattern 221 on a portion which contacts the metal case 210' Since the PCB 220 is broader than the metal case 210' connecting pads or connecting terminals for connecting with an external device can be freely disposed on the broad PCB.
  • the connecting pattern 221 is formed by forming a copper clad through a PCB manufacturing process and then plating the copper clad with Ni or Au.
  • the width of the connecting pattern 221 according to the fourth embodiment is wider than that of the connecting pattern of the second embodiment to correspond to the skirt 216 of a body 214 of the metal case 210'.
  • the metal case 210' has a rectangular parallelepiped shape having an opening which faces the PCB 220, wherein an upper surface thereof is formed with a sound hole 212 for collecting sound.
  • the case body 214 is formed with the skirt 216 projected outwardly on the opened end thereof.
  • FIG. 9 is a sectional side view of a fifth embodiment for allowing a microphone to have directivity according to the present invention.
  • a structure having directivity by forming a front sound inlet hole 110a on a portion of the metal case 110 which corresponds to a portion where the MEMS chip 10 is positioned in the first embodiment to the fourth embodiment and forming a rear sound inlet hole 120a which is formed on a portion of the PCB where the MEMS chip 10 is mounted and then adding a sound resistor 140 to the inside and outside of the front sound inlet hole 110a or the inside of the rear sound inlet hole 120a.
  • the metal case 110 is firmly adhered to the connecting pattern 121 of the PCB 120 which is mounted with the MEMS chip 10 and the ASIC chip 20 by laser welding, wherein a space 150 between the metal case 110 and the PCB 120 is served as a sound chamber.
  • the metal case 110 is formed with the front sound inlet hole 110a for collecting front sound on a portion thereof corresponding to a position of the MEMS chip 10
  • the PCB 120 is formed with a rear sound inlet hole 120a for collecting rear sound at a portion thereof corresponding to a portion where the MEMS chip 10 is mounted.
  • the sound resistor 140 is attached to the inside of the front sound inlet hole 110a.
  • the PCB 120 may be formed with connecting terminals 123 and 125 for connecting with the external device on a bottom surface thereof, wherein the number of the connecting terminals 123 and 125 may be two to eight. Each of the connecting terminals 123 and 125 is electrically connected through a through-hole 124 to a chip part surface of the PCB.
  • the sound resistor 140 is positioned at the inside of the front sound inlet hole 110a, but it may be positioned at the outside of the front sound inlet hole 110a or the inside or the outside of the rear sound inlet hole 120a.
  • the metal case is welded to the board by the laser, thereby strengthening a bonding force and thus enhancing a mechanical firmness and highly resisting noise from the outside.
  • the process expense is saved, thereby sharply cutting a total manufacturing cost.
  • a curling process for joining a metal case with a PCB is removed in a conventional microphone manufacturing process and the metal case is directly welded to the PCB which is mounted with condenser microphone parts, thereby enhancing an electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that a sound pressure from the outside does not enter the case.
  • a shape of the PCB is not limited by the size of the case, the PCB which is used for the microphone is freely designed, thereby forming various shapes of terminals. Further, since an assembling work can be performed without a physical force applied in the curling process, a thinner PCB can be adapted. As a result, the height of a product can be lowered, whereby a thinner microphone can be manufactured.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne un microphone à condensateur basé sur du silicium ainsi que son procédé d'emballage. Ledit microphone comprend un boîtier métallique et une plaque pourvue d'une puce de microphone MEMS et une puce ASIC ayant une pompe à pression électrique et une CI tampon ; il est formé avec un motif de raccordement pour effectuer la liaison avec le boîtier métallique ; le motif de raccordement est soudé au boîtier métallique. Le procédé d'emballage dudit microphone passe par les étapes d'entrée d'une plaque pourvue d'une puce MEMS et d'une puce ASIC et formé avec un motif de raccordement, l'entrée d'un boîtier métallique, l'alignement du boîtier métallique sur le motif de raccordement de la plaque et la soudure d'une extrémité ouverte du boîtier métallique au motif de raccordement de la plaque. Le boîtier métallique est ainsi soudé à la plaque par laser.
PCT/KR2006/000384 2005-08-02 2006-02-03 Microphone à condensateur basé sur du silicium et son procédé d'emballage WO2007015593A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2005-0070601 2005-08-02
KR20050070601 2005-08-02

Publications (1)

Publication Number Publication Date
WO2007015593A1 true WO2007015593A1 (fr) 2007-02-08

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ID=37708862

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008150063A1 (fr) * 2007-06-04 2008-12-11 Bse Co., Ltd. Microphone électrostatique
WO2010051707A1 (fr) * 2008-11-07 2010-05-14 歌尔声学股份有限公司 Microphone au silicium
CN110095225A (zh) * 2019-04-23 2019-08-06 瑞声声学科技(深圳)有限公司 一种玻璃破碎检测装置及方法
CN110118702A (zh) * 2019-04-23 2019-08-13 瑞声声学科技(深圳)有限公司 一种玻璃破碎检测装置及方法
WO2022000644A1 (fr) * 2020-06-30 2022-01-06 瑞声声学科技(深圳)有限公司 Microphone

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020181725A1 (en) * 2001-05-31 2002-12-05 Ib Johannsen Method of providing a hydrophobic layer and a condenser microphone having such a layer
EP1403212A2 (fr) * 2002-09-26 2004-03-31 Samsung Electronics Co., Ltd. Transducteur flexible micro-électromécanique (mems) et procédé de fabrication dudit transducteur, et microphone flexible micro-électromécanique
US6870939B2 (en) * 2001-11-28 2005-03-22 Industrial Technology Research Institute SMT-type structure of the silicon-based electret condenser microphone

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020181725A1 (en) * 2001-05-31 2002-12-05 Ib Johannsen Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6870939B2 (en) * 2001-11-28 2005-03-22 Industrial Technology Research Institute SMT-type structure of the silicon-based electret condenser microphone
EP1403212A2 (fr) * 2002-09-26 2004-03-31 Samsung Electronics Co., Ltd. Transducteur flexible micro-électromécanique (mems) et procédé de fabrication dudit transducteur, et microphone flexible micro-électromécanique

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008150063A1 (fr) * 2007-06-04 2008-12-11 Bse Co., Ltd. Microphone électrostatique
WO2010051707A1 (fr) * 2008-11-07 2010-05-14 歌尔声学股份有限公司 Microphone au silicium
CN110095225A (zh) * 2019-04-23 2019-08-06 瑞声声学科技(深圳)有限公司 一种玻璃破碎检测装置及方法
CN110118702A (zh) * 2019-04-23 2019-08-13 瑞声声学科技(深圳)有限公司 一种玻璃破碎检测装置及方法
WO2022000644A1 (fr) * 2020-06-30 2022-01-06 瑞声声学科技(深圳)有限公司 Microphone

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