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WO2007015372A1 - Film conducteur anisotrope et procédé de production correspondant - Google Patents

Film conducteur anisotrope et procédé de production correspondant Download PDF

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Publication number
WO2007015372A1
WO2007015372A1 PCT/JP2006/314267 JP2006314267W WO2007015372A1 WO 2007015372 A1 WO2007015372 A1 WO 2007015372A1 JP 2006314267 W JP2006314267 W JP 2006314267W WO 2007015372 A1 WO2007015372 A1 WO 2007015372A1
Authority
WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
support
layer
conductive film
width
Prior art date
Application number
PCT/JP2006/314267
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to CN2006800282694A priority Critical patent/CN101233655B/zh
Priority to JP2007529209A priority patent/JP4650490B2/ja
Publication of WO2007015372A1 publication Critical patent/WO2007015372A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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Definitions

  • the present invention relates to an anisotropic conductive film. More specifically, the anisotropic conductive adhesive is formed in a film-like support on a film-like support, and the anisotropic conductivity is suppressed by preventing the adhesive from seeping out from the side edge of the adhesive.
  • the present invention relates to a film and its manufacturing method.
  • An anisotropic conductive film (hereinafter sometimes referred to as ACF) is used as a connection material for connecting connected members having a large number of opposing electrodes.
  • the ACF keeps the conductive state between the opposing electrodes when connecting substrates such as printed wiring boards, glass substrates for LCDs, flexible printed boards, etc., and semiconductor elements such as ICs and LSIs, and packages.
  • It is a connecting material that performs electrical connection and mechanical fixation so as to maintain insulation between the electrodes.
  • ACF includes an adhesive component containing a thermosetting resin and conductive particles blended as necessary, and is formed into a film on a support (separator) such as a PET (polyethylene terephthalate) film.
  • a support such as a PET (polyethylene terephthalate) film.
  • the product has been commercialized as a reel-shaped narrow and long tape (coiled body) wound around the core material in the same concentric shape.
  • ACF narrow width products for example, widths of 0.8 mm or less
  • the ACF width and thickness are close to each other, resulting in a problem of poor recognition.
  • the present invention has been made in view of the above-described problems, and suppresses the seepage of the adhesive component constituting the ACF in the width direction, reduces blocking during the feeding of the ACF, and reduces the width of the narrow product.
  • the purpose is to provide an ACF that prevents elongation and breakage due to insufficient strength of the support and improves recognition in the thickness direction and width direction.
  • an anisotropic conductive film in which a support and an anisotropic conductive adhesive layer are laminated, the width direction of the support being An anisotropic conductive film having an anisotropic conductive region on which the anisotropic conductive adhesive layer is formed at both ends is provided.
  • the width of the support is wider than the width of the anisotropic conductive adhesive layer.
  • the adhesive component exudes from the end in the width direction beyond the width of the support. Can be suppressed. Therefore, blocking during use of the anisotropic conductive film can be reduced.
  • the support has a first support layer having the same width as the anisotropic conductive adhesive layer, and a width of the anisotropic conductive adhesive layer.
  • An anisotropic conductive film having a structure in which a second support layer having a wider width is laminated is provided.
  • the support body has a laminated structure of the first support layer and the second support layer, so that the conventional manufacturing method of the anisotropic conductive film described above can be utilized to An anisotropic conductive film having a width wider than that of the anisotropic conductive adhesive layer can be obtained.
  • the strength of the support can be improved by forming the support in a laminated structure, it is possible to prevent elongation and breakage due to insufficient strength of the support, particularly in the case of a narrow product.
  • the anisotropic conductive adhesive layer at both ends in the width direction of the support.
  • the width of each region is different.
  • the frame portion to be connected is narrow, by forming the anisotropic conductive adhesive 14 close to one end side of the support, the handleability of the anisotropic conductive film can be improved.
  • a method for producing an anisotropic conductive film comprising a step of laminating the first support layer and the adhesive layer so as to contact each other, and bonding the first support layer and the second support layer.
  • the conventional anisotropic conductive film having the same width of the support and the anisotropic conductive adhesive layer can be used as the first laminate, the conventional anisotropic conductive film The manufacturing method can be used effectively.
  • the second laminate can also be produced in the same manner as the first laminate, except that the adhesive used is different.
  • the first laminate and the second laminate thus obtained are laminated so that the first support layer and the adhesive layer are in contact with each other, and the first support layer and the second support layer are combined. By adhering, the anisotropic conductive film of the present invention can be easily produced.
  • a first slit step of cutting the stack original fabric of the first laminate into a predetermined width, and a stack original fabric of the second laminate A second slit step for cutting wider than the cutting width of the first laminate, a first laminate cut in the first slit step, and a second laminate cut in the second slit step are stacked.
  • a method for producing an anisotropic conductive film comprising: a step of bonding the first support layer and the second support layer by brazing to the same core material.
  • the first laminate having a predetermined width and the second laminate having a width wider than the cutting width of the first laminate are cut from the two kinds of raw materials, respectively, and the same.
  • the first support layer and the second support layer are bonded together by being attached to the core material.
  • the anisotropic conductive adhesive layer of the present invention even if the adhesive component of the anisotropic conductive adhesive layer flows out of the adhesive layer, the anisotropic conductive adhesive layer is formed at the end in the width direction of the support. Since there is a large area, the amount of the edge extruding in the width direction beyond the width of the support can be reduced. Therefore, blocking during use of the anisotropic conductive film can be reduced. Furthermore, since the strength of the support can be improved, it is possible to prevent the support from being stretched and cut, and to improve the recognition in the thickness direction and the width direction.
  • FIG. 1 is a diagram showing an anisotropic conductive film according to a first embodiment of the present invention, in which (a) is an external perspective view of the anisotropic conductive film, and (b) is a width of the anisotropic conductive film.
  • FIG. 1 is a diagram showing an anisotropic conductive film according to a first embodiment of the present invention, in which (a) is an external perspective view of the anisotropic conductive film, and (b) is a width of the anisotropic conductive film.
  • FIG. 2 is a cross-sectional view in the width direction of an anisotropic conductive film according to a second embodiment of the present invention.
  • FIG. 3 is a view showing an example of use of the anisotropic conductive film of the present invention.
  • FIG. 4 is a schematic view showing a method for producing an anisotropic conductive film of the present invention.
  • FIG. 1 is a view showing an anisotropic conductive film according to a first embodiment of the present invention, (a) is an external perspective view of the anisotropic conductive film, and (b) is a cross-sectional view in the width direction of the anisotropic conductive film. It is.
  • An anisotropic conductive film 10 according to the present embodiment is formed by stacking a support 13 and an anisotropic conductive adhesive layer 14 by concentrically overlapping a core material 12 having a reel side plate 11 to form a stacked body.
  • Have An anisotropic conductive adhesive layer 14 is formed on both ends in the width direction of the support 13 to form a!
  • the anisotropic conductive adhesive layer 14 is heated and pressurized at the time of use, and flows and solidifies to connect a substrate or the like as an adherend member.
  • the anisotropic conductive adhesive layer 14 of the anisotropic conductive film which is in the form of a double layer, forms the anisotropic conductive adhesive layer 14 due to pressure applied during the winding process, dimensional variation due to changes over time, etc.
  • a part of the adhesive may flow in the width direction of the support. As a result, the adhesive sometimes oozes out to the side of the stack beyond the width of the support. Therefore, the anisotropic conductive film 10 is stuck on the reel side plate 11.
  • the anisotropic conductive film 10 is blocked when the anisotropic conductive film 10 is rolled out.
  • the non-formed region 14 ′ even if the adhesive component flows, it remains in the non-formed region 14 ′, so that it is prevented from exuding from the end in the width direction beyond the width of the support 13. it can. Thereby, generation
  • the width of the unformed region 14 ' is appropriately adjusted according to the total width of the support 13 and the type and thickness of the adhesive constituting the anisotropic conductive adhesive layer 14.
  • FIG. 2 is a cross-sectional view in the width direction of the anisotropic conductive film according to the second embodiment of the present invention.
  • the support 13 has a structure in which a first support layer 13-1 and a second support layer 13-2 wider than this are stacked. This is the same as the first embodiment described above.
  • the support 13 a laminated structure of the first support layer 13-1 and the second support layer 132, the general manufacturing method of the anisotropic conductive film is utilized, An anisotropic conductive film 20 in which the width of the support 13 is wider than the width of the anisotropic conductive adhesive layer 14 can be obtained.
  • the strength of the support can be improved by forming the support 13 in a laminated structure, it is possible to prevent elongation and breakage due to insufficient strength of the support, particularly in the case of a narrow product. .
  • the adhesive used for the adhesive layer 15 is an anisotropic conductive adhesive. Unlike layer 14, there is no need to flow when the substrate is connected. Therefore, even if the adhesive is applied to the entire surface of the first support layer 13-1, it does not ooze out.
  • FIG. 3 shows a cross-sectional view of the state in which the anisotropic conductive film is transferred to the glass substrate on which the liquid crystal color filter 52 is formed.
  • the anisotropic conductive adhesive layer 14 may be formed close to one end of the support 13 such as when the frame portion 51-1 is narrow.
  • a support for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyol, which are generally commercially available are subjected to release treatment.
  • a release treatment agent may be coated on the surface of the support so that the anisotropic conductive adhesive layer provided on the support can be easily removed.
  • the thickness of the support is not particularly limited, but is preferably 4 ⁇ m to 200 ⁇ m.
  • the width of the support may be set wider than the width of the anisotropic conductive adhesive layer. For example, 500 / ⁇ ⁇ to 3 Omm is preferable.
  • the support When the support has a laminated structure of the first support layer and the second support layer, it is in contact with each adhesive layer 15 in order to improve the adhesive strength of their adhesive surfaces.
  • Various treatments can be applied to the surface.
  • a primer layer may be formed between the adhesive layer 15 and each surface, the support layer surface may be subjected to plasma treatment, or a physical roughening treatment may be performed.
  • the anisotropic conductive adhesive a material exhibiting curability by heat or light can be widely applied. It is preferable to use a crosslinkable material because of its excellent heat resistance and moisture resistance after connection. Among them, the epoxy adhesive is preferable because it can be cured for a short time and has a good workability in terms of molecular structure and excellent adhesion.
  • Epoxy adhesives include, for example, high molecular weight epoxy, solid epoxy and liquid epoxy, urethane, polyester, acrylic rubber, NBR, Generally, an epoxy resin modified with a pyrone or the like is used as a main component, and a curing agent, a catalyst, a coupling agent, a filler, or the like is added.
  • the conductive particles used as the conductive material in the connection member include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and carbon, and these conductive particles are used as a core material.
  • it may be a non-conductive glass, ceramic, plastic or other high molecular weight core material that is covered with a conductive layer having the above material strength! / ⁇ .
  • insulating coating particles formed by coating a conductive material with an insulating layer, or a combination of conductive electrons and insulating particles.
  • the thickness of the anisotropic conductive adhesive layer is not particularly limited, and is appropriately selected according to the adhesive to be used and the object to be adhered, but 5 111 to 100 111 is preferable.
  • the width of the anisotropic conductive adhesive layer may be adjusted according to the intended use, but in general 0.5mn! About 5mm.
  • the adhesive strength between the first support layer and the second support layer is the first support layer.
  • the peel force may be made smaller than the adhesive strength between the second support layer and the first support layer.
  • the thickness of the first support layer and the second support layer is not particularly limited, but it is preferable that the total thickness of the two layers be between 0 ⁇ m and 300 ⁇ m! / ⁇ .
  • FIG. 4 is a schematic view showing a method for producing the anisotropic conductive film of the present invention.
  • the production method of the present invention includes a first laminate 31 in which a first support layer 13-1 and an anisotropic conductive adhesive layer 14 are laminated, a second support layer 13-2, A second laminate 32 having a structure in which a support layer and an adhesive layer 15 for adhering the second support layer are laminated, and wider than the width of the first laminate 31, The support layer 13-1 and the adhesive layer 15 are laminated so as to be in contact with each other, and the first support layer 13-1 and the second support layer 13-2 are bonded.
  • the first laminate 31 and the second laminate 32 can be produced by a general method for producing an anisotropic conductive film. That is, an anisotropic conductive adhesive or an adhesive that bonds the first support layer 13-1 and the second support layer 13-2 on a wide support (separator) is applied to a roll coater or the like. Using various coaters, apply to a width of about 10 to 50cm and dry. Then, the raw fabric may be continuously cut into a width of about 0.5 to 5 mm using a blade of an unwinding cutter or the like.
  • first laminate 31 and the second laminate 32 are laminated so that the first support layer 13-1 and the adhesive layer 15 are in contact with each other, and the first support layer 13-1 Glue the second support layer 13-2.
  • the first laminate 31 and the second laminate 32 are bonded to the same core material.
  • a method of bonding using the pressure at the time of brazing that occurs is mentioned.
  • the pressure during brazing is the tension applied to the first laminated body 31 and the second laminated body 32, that is, the feeding speed of the first laminated body 31 and the second laminated body 32 and the winding speed to the core material.
  • the anisotropic conductive film of the present invention can suppress the seepage of the anisotropic conductive adhesive in the width direction, reduce blocking when the anisotropic conductive film is fed, and support in the case of a narrow product. It is possible to prevent elongation and breakage due to insufficient strength of the steel and to improve recognition in the thickness direction and width direction. For this reason, since the handling property when using the anisotropic conductive film is good, it is possible to improve the yield when mounting components such as an IC chip, an LSI chip, a resistor and a capacitor on the circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

La présente invention concerne un film conducteur anisotrope (10) dans lequel un corps de support (13) et une couche adhésive conductrice anisotrope (14) sont agencés en couches. Le corps de support (13) comprend une région (14'), dans laquelle aucune couche adhésive conductrice anisotrope (14) est formée et ce, dans les deux parties de bord dans la direction de l’épaisseur.
PCT/JP2006/314267 2005-08-04 2006-07-19 Film conducteur anisotrope et procédé de production correspondant WO2007015372A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2006800282694A CN101233655B (zh) 2005-08-04 2006-07-19 各向异性导电膜及其制造方法
JP2007529209A JP4650490B2 (ja) 2005-08-04 2006-07-19 異方導電フィルム及びその製造方法

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KR (2) KR101025369B1 (fr)
CN (1) CN101233655B (fr)
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142985A1 (fr) * 2007-05-23 2008-11-27 Hitachi Chemical Company, Ltd. Film et bobine pour connexion électroconductrice anisotrope
JP2011029207A (ja) * 2010-11-02 2011-02-10 Sony Chemical & Information Device Corp フィルム積層体、フィルム積層体の貼付方法、フィルム積層体を用いた接続方法及び接続構造体
JP2011058007A (ja) * 2010-12-24 2011-03-24 Sony Chemical & Information Device Corp リール体及びリール体の製造方法
JP2012077305A (ja) * 2011-11-07 2012-04-19 Hitachi Chemical Co Ltd 異方導電接続用フィルム及びリール体
US20130077266A1 (en) * 2010-10-28 2013-03-28 Dexerials Corporation Connection method and connection structure of electronic component
KR20140053298A (ko) 2011-08-18 2014-05-07 히타치가세이가부시끼가이샤 접착재 릴, 블록킹 억제 방법, 접착재 릴의 교환 방법, 접착재 테이프의 조출 방법, 접착재 릴의 제조 방법, 릴 키트, 및 곤포체
JP2015187221A (ja) * 2014-03-26 2015-10-29 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法
JP2018135517A (ja) * 2018-02-21 2018-08-30 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法
CN109689816A (zh) * 2016-09-27 2019-04-26 迪睿合株式会社 粘接膜卷装体、粘接膜卷装体的制造方法

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JP2011199308A (ja) * 2011-06-06 2011-10-06 Sony Chemical & Information Device Corp 接着フィルムの貼り合わせ方法、接続方法、接続構造体及び接続構造体の製造方法
JP5982159B2 (ja) 2012-04-06 2016-08-31 デクセリアルズ株式会社 リール部材、接着フィルムの巻回方法、接着フィルムの巻き出し方法
JP5982158B2 (ja) 2012-04-06 2016-08-31 デクセリアルズ株式会社 リール部材
CN104449433A (zh) * 2014-11-14 2015-03-25 李家海 容易揭开膜皮的双面胶
JP6661997B2 (ja) * 2015-11-26 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム
CN118325319A (zh) * 2016-05-05 2024-07-12 迪睿合株式会社 填充剂配置膜
WO2017191774A1 (fr) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 Film conducteur anisotrope
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム
KR102675134B1 (ko) * 2020-03-31 2024-06-12 동우 화인켐 주식회사 도전성 필름 적층체 및 이의 제조 방법

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107847U (fr) * 1980-01-21 1981-08-21
JPH0610253A (ja) * 1992-04-17 1994-01-18 Japan Vilene Co Ltd 加工領域と未加工領域とを有するテープの製造方法
JPH0644848A (ja) * 1992-07-24 1994-02-18 Yazaki Corp 粘着テープ及び粘着テープの製造方法
JPH08316690A (ja) * 1995-05-18 1996-11-29 Fuji Mach Mfg Co Ltd 電子部品取外し装置
JPH10195399A (ja) * 1997-01-07 1998-07-28 Kanegafuchi Chem Ind Co Ltd 耐熱性ボンディングフィルムの製造方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP2000149677A (ja) * 1998-11-05 2000-05-30 Hitachi Chem Co Ltd 異方導電性接着フィルムの製造装置
JP2001284005A (ja) * 2000-03-28 2001-10-12 Hitachi Chem Co Ltd 異方導電材テープ
JP2004263030A (ja) * 2003-02-28 2004-09-24 Dainippon Ink & Chem Inc 導電性粘着シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09259945A (ja) * 1996-03-22 1997-10-03 Sony Corp 異方性導電膜テープ
JP2003142176A (ja) * 2001-10-31 2003-05-16 Optrex Corp 異方性導電膜構造
JP3921452B2 (ja) * 2003-03-04 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 異方導電性フィルムの積層テープ製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107847U (fr) * 1980-01-21 1981-08-21
JPH0610253A (ja) * 1992-04-17 1994-01-18 Japan Vilene Co Ltd 加工領域と未加工領域とを有するテープの製造方法
JPH0644848A (ja) * 1992-07-24 1994-02-18 Yazaki Corp 粘着テープ及び粘着テープの製造方法
JPH08316690A (ja) * 1995-05-18 1996-11-29 Fuji Mach Mfg Co Ltd 電子部品取外し装置
JPH10195399A (ja) * 1997-01-07 1998-07-28 Kanegafuchi Chem Ind Co Ltd 耐熱性ボンディングフィルムの製造方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP2000149677A (ja) * 1998-11-05 2000-05-30 Hitachi Chem Co Ltd 異方導電性接着フィルムの製造装置
JP2001284005A (ja) * 2000-03-28 2001-10-12 Hitachi Chem Co Ltd 異方導電材テープ
JP2004263030A (ja) * 2003-02-28 2004-09-24 Dainippon Ink & Chem Inc 導電性粘着シート

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142985A1 (fr) * 2007-05-23 2008-11-27 Hitachi Chemical Company, Ltd. Film et bobine pour connexion électroconductrice anisotrope
JP2008293751A (ja) * 2007-05-23 2008-12-04 Hitachi Chem Co Ltd 異方導電接続用フィルム及びリール体
TWI396022B (zh) * 2007-05-23 2013-05-11 Anisotropic conductive film and reel
US20130077266A1 (en) * 2010-10-28 2013-03-28 Dexerials Corporation Connection method and connection structure of electronic component
JP2011029207A (ja) * 2010-11-02 2011-02-10 Sony Chemical & Information Device Corp フィルム積層体、フィルム積層体の貼付方法、フィルム積層体を用いた接続方法及び接続構造体
JP2011058007A (ja) * 2010-12-24 2011-03-24 Sony Chemical & Information Device Corp リール体及びリール体の製造方法
WO2012086770A1 (fr) * 2010-12-24 2012-06-28 ソニーケミカル＆インフォメーションデバイス株式会社 Corps de bobine et procédé de fabrication d'un corps de bobine
KR20140053298A (ko) 2011-08-18 2014-05-07 히타치가세이가부시끼가이샤 접착재 릴, 블록킹 억제 방법, 접착재 릴의 교환 방법, 접착재 테이프의 조출 방법, 접착재 릴의 제조 방법, 릴 키트, 및 곤포체
JP2012077305A (ja) * 2011-11-07 2012-04-19 Hitachi Chemical Co Ltd 異方導電接続用フィルム及びリール体
JP2015187221A (ja) * 2014-03-26 2015-10-29 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法
CN109689816A (zh) * 2016-09-27 2019-04-26 迪睿合株式会社 粘接膜卷装体、粘接膜卷装体的制造方法
JP2018135517A (ja) * 2018-02-21 2018-08-30 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法

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JP2010257983A (ja) 2010-11-11
TW200708587A (en) 2007-03-01
KR101025369B1 (ko) 2011-03-28
JP4650490B2 (ja) 2011-03-16
KR20100117680A (ko) 2010-11-03
CN101233655A (zh) 2008-07-30
JPWO2007015372A1 (ja) 2009-02-19
CN101233655B (zh) 2010-08-18

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