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WO2007015115A1 - In-situ and real-time determination of the thickness, optical properties and quality of transparent coatings - Google Patents

In-situ and real-time determination of the thickness, optical properties and quality of transparent coatings Download PDF

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Publication number
WO2007015115A1
WO2007015115A1 PCT/GR2006/000035 GR2006000035W WO2007015115A1 WO 2007015115 A1 WO2007015115 A1 WO 2007015115A1 GR 2006000035 W GR2006000035 W GR 2006000035W WO 2007015115 A1 WO2007015115 A1 WO 2007015115A1
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properties
fact
optical
real
thickness
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PCT/GR2006/000035
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French (fr)
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Stergios Logothetidis
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Stergios Logothetidis
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Application filed by Stergios Logothetidis filed Critical Stergios Logothetidis
Priority to EP06765394.9A priority Critical patent/EP1910804B1/en
Priority to US11/920,465 priority patent/US7777882B2/en
Publication of WO2007015115A1 publication Critical patent/WO2007015115A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21Polarisation-affecting properties
    • G01N21/211Ellipsometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21Polarisation-affecting properties
    • G01N21/211Ellipsometry
    • G01N2021/213Spectrometric ellipsometry

Definitions

  • This method can be used in-line for the monitoring and/or control of the production processes (in air and in vacuum), that concern substrates on which the thin films will be grown, and of the growth processes of transparent oxides, nitrides and other inorganic and organic films with final result the production of integrated
  • Spectroscopic Ellipsometry is a non destructive optical technique that is based on the measurement of the change of the light polarization state and provides information for the optical, and not only, materials properties. Spectroscopic Ellipsometry can be used for the in-situ and real-time monitoring during growth of inorganic and organics thin films, for the
  • Optical quantities such as the energy in which appears the maximum electronic absorption in a composite material, known as mean Gap or Perm Gap (E 0 ), and the energy where the edge of electronic absorption appears, known as the fundamental optical energy gap (E g ), are the ones that are directly related with their composition.
  • E 0 mean Gap or Perm Gap
  • E g fundamental optical energy gap
  • an appropriate, smart and reliable control process must: a) control the technical requirements for coatings (e.g. good adhesion of the substrate) in new applications, b) provide material and energy reduction and c) keep low the cost of combined processes.
  • This new methodology was applied in deposition processes of thin and transparent oxides on semiconducting but also polymeric substrates, as well as in pretreatment processes of polymeric substrates for the activation of their surfaces, on which later are grown transparent thin films such as Silicon Oxide (SiO x ), Titanium Oxide (TiO x ), Silicon Nitride (SiN x ) for various technological applications.
  • SiO x Silicon Oxide
  • TiO x Titanium Oxide
  • SiN x Silicon Nitride
  • the thickness and deposition rate of transparent films are determined with high accuracy.
  • the use of the geometrical model consisted by three phases (air/thin film/polymeric substrate) in the analysis of the SE spectra deducted during oxide deposition, provides the ability to determine the thickness d of the transparent inorganic (oxide, nitride, etc) and organic film. With this analysis, the stability and effectiveness of the deposition processes can be controlled and monitored.
  • the deposition processes of the transparent oxides films are monitored in real-time.
  • the E 0 is related to the stoichiometry x of the film
  • the barrier properties in gases and vapors of the system thin film/polymeric substrate are determined. This determination is the result of the correlation between the optical and other properties of the system that were measured in real-time with the above mentioned methodology (e.g.
  • the methodology that has been developed can be used in-line for the monitoring and control of the various vacuum processes of the substrates on which the thin films will be grown, and for the growth process of transparent inorganic (oxides and nitrides) or and organic films, to finally result in the production of complete systems, with desirable properties.
  • This is especially important for the control of production & manufacturing processes in real-time and for the minimization of the time needed for production control, of the losses and of the production cost.
  • FIGURE 1 Schematic representation of the in-situ Fourier Transform IR Spectroscopic Ellipsometer (FTIRSE) adjusted in a Ultra High Vacuum Chamber.
  • FTIRSE Fourier Transform IR Spectroscopic Ellipsometer
  • FIGURE 2 Spectra of the imaginary part ⁇ 2 (E)> of the dielectric function during the surface treatment of the polymeric substrate Poly(Ethylene Terephthalate) (PET) with Nitrogen (N 2 ) ion bombardment by Pulsed DC Plasma Etching.
  • FIGURE 3 Schematic representation of the ex-situ of Spectroscopic Ellipsometry unit of the near infrared (Near IR)-Visible-Far Ultraviolet (Visible - FUV) spectral region.
  • FIGURE 4 The ⁇ 2 (E)> spectra in real-time during SiO 2 thin film growth on polymeric substrate PET, with e-beam evaporation technique and with the evaporation SiO 2 material.
  • the triangles correspond to the measured imaginary part ⁇ 2 (E)> of PET before the SiO 2 deposition, while the circles correspond to the ⁇ 2 (E)> of SiO 2 .
  • FIGURE 5 The ⁇ 2 (E)> spectra in real-time during SiO thin film growth on polymeric substrate PET 5 with e-beam evaporation technique and with the evaporation of SiO material.
  • the triangles correspond to the measured imaginary part ⁇ 2 (E)> of PET before the SiO deposition, while the circles correspond to the ⁇ 2 (E)> of SiO.
  • FIGURE 6 The ⁇ 2 (E)> spectra in real-time during SiO x thin film growth on polymeric substrate PET, with e-beam evaporation technique and with the evaporation mixed SiO and SiO 2 material.
  • the triangles correspond to the measured imaginary part ⁇ 2 (E)> of PET before the SiO x deposition, while the circles correspond to the ⁇ 2 (E)> of SiO x .
  • FIGURE 7 Time dependence of the thickness, the Penn gap E 0 and the energy gap E g of the SiO x thin film grown on the PET polymeric substrate. The results were obtained with the real-time analysis of the SE spectra measured by the FMWE unit.
  • FIGURE 8 Time dependence of the thickness of the SiO x thin film grown on the PET polymeric substrate by electron beam evaporation of SiO. The results were obtained with, the real-time analysis of the SE spectra measured by the FMWE unit.
  • FIGURE 11 Evolution of the thickness of SiO 2 , SiO and SiO x films during the first 50 s of their growth process.
  • FIGURE 12 Evolution of E 0 Of SiO 2 , SiO and SiO x films during the first 50 s of their growth process.
  • FIGURE 13 Evolution of E g Of SiO 2 , SiO and SiO x films during the first 50 s of their growth process.
  • PET Poly(Ethylene Terephthalate)
  • PVD Physical or Chemical Vapor Deposition techniques
  • This methodology can be generally applied in the case of monolayered and multilayered, transparent and non- transparent thin films, that can be comprised only of (or combination of) thin films of Silicon Oxide (SiO x ), Titanium Oxide (TiO x ), Silicon Nitride (SiN x ), Titanium Nitride (TiN x ), Zinc Oxide (ZnO x ), Boron Nitride (BN x ), Carbon Nitride (CN x ), Aluminium Oxide ⁇ (AlO x ) for all the stoichiometry values x that are developed with the various Physical and Chemical Vapor Deposition growth techniques, such as magnetron sputtering (dc, rf or/and reactive), e-beam evaporation, ion beam sputtering, ion beam assisted deposition, CVD, Plasma Enhanced CVD, laser, ablation, laser deposition.
  • SiO x Silicon Oxide
  • TiO x Titanium Oxide
  • PET Poly(Ethylene Terephthalate)
  • PEN Poly(Ethylene Naphthalate)
  • PES Polyethylene Sulfate
  • PC PolyCarbonate
  • PA Polyamide
  • PP Polypropylene
  • PVC Polyvinyl Chloride
  • PTFE PolyTetraFluoroEthylene
  • the realization of measurements in such short time is in accordance with the one needed for the real-time control of thin films that are grown with deposition rate of ⁇ 5 A/s, such as the SiO x thin films growth on a PET polymeric substrate.
  • Spectroscopic Ellipsometry- SE measurements ( Figure 1) in the spectral region of Visible- Far Ultraviolet (Vis-FUV) were realised with a Fast MultiWavelength Ellipsometer (FMWE) unit that was developed in collaboration with Horiba/Jobin-Yvon, while the SE measurements in the spectra area of Infrared (IR) were realised with the Fourier Transform IR Spectroscopic Ellipsometer (FTIRSE) unit. Both units are adjusted on a ultra high vacuum chamber where the angle of incidence is 70°. Other angles, lower or higher, from 70° can also be used.
  • FMWE Fast MultiWavelength Ellipsometer
  • FTIRSE Fourier Transform IR Spectroscopic Ellipsometer
  • the chamber is equipped with various Physical Vapor Deposition techniques (PVD) while for the thin films growth on polymeric substrates is used the e-beam evaporation technique.
  • PVD Physical Vapor Deposition techniques
  • the substrate holder on which the substrate is adjusted is positioned horizontally on stable position and it has the capability to rotate around a vertical axis.
  • the SE measurements are performed in the spectra are of the Visble- Far Ultraviolet (Vis-FUV) from 1.5 - 6.5 eV (190 - 830 nm), and in the spectra area of IR, 0.1 - 0.49 eV (900 - 4000 cm "1 ).
  • the realization of the measurements in the spectra area of Vis-FUV are applied for the study of the material's optical properties (bulk materials and thin films), that are related to the electronic transmissions, their electronic structure and their thickness.
  • the real-time measurement is performed with the simultaneous acquisition of 32 different wavelengths (32 simultaneously measured data points) that cover the energy range of 1.5 - 6.5 eV.
  • the upper energy limit of SE spectra acquisition with the use of FMWE is 6.5 eV (190 nm), and with which can be performed the control of the polymeric membranes' and grown thin films optical properties.
  • the deposition rates of the oxide films, that have been referred are significantly lower in comparison to the ones in industrial scale, so the evaporation process on stable or moving substrate is more controllable and repeatable and the grown thin films show higher density values than the ones that are produced on moving substrates with the form of rolls (roll-to- roll) or in in-line roll-to-roll production on industrial scale,
  • these processes can be applied in an in-line constant production and industrial scale.
  • the parameterization and analysis of the measured pseudo-dielectric function ⁇ (E)> ⁇ i(E)>+i ⁇ 2 (E)> has been performed with the use of a geometrical model consisted by three phases (air/thin film/polymeric substrate) in which the determination of the optical properties of each phase has been realized with the modified Tauc-Lorentz (TL) model.[l] In the case where the surface modification of the polymeric substrate is measured, the thin film represents the modified layer. In the TL model the imaginary part ⁇ 2 (E) of the dielectric function is determined by multiplying the Tauc density of states with the ⁇ 2 that results from the Lorentz oscillator model.
  • the TL model provides the capability of determining the fundamental optical gap Eg of the interband transitions, the energy EO, the broadening C and the strength A of each oscillator.
  • the EO of this model is correlated to the known Penn gap, the energy position where the strong electronic absorption of the material, mainly amorphous, takes place.
  • the imaginary part E 2 (E) of the TL oscillator, for both amorphous and crystalline materials, is given by the following relations:
  • the basic information deduced by SE measurements/analyses concerns the film thickness, and the optical parameters and constants, which are strongly related to films' stoichiometry and quality. More specifically, it can be calculated:
  • the ⁇ ⁇ that measures the material strength and accounts the contribution of all electronic transitions, even those not taken into account in the modeling analysis, because they occur at high energies well above the experimental measured energy range, otherwise it is equal to unity.
  • the most important that are determined by the spectra analysis are the Penn gap E 0 and the refractive index n.
  • the EO is directly related to films' stoichiometry
  • Figure 2 shows the measurement of the optical properties by the use of FTIRSE in real-time, during the surface treatment of Poly(Ethylene Terephthalate) (PET) polymeric substrate with Nitrogen (N 2 ) atoms using Pulsed DC Plasma Etching.
  • the partial pressure of the chamber was ⁇ 30 mTorr and the gas flow remained constant at 40 seem, whereas the voltage applied on the substrate holder through the high voltage pulse modulator (Advanced Sparc-le V) was 700V with frequency of 100 Hz.
  • the surface treatment process has duration of 20 min.
  • the imaginary part ⁇ 2 (E)> is presented.
  • the thickness d of the SiO x thin film deposited onto PET can be determined.
  • Figure 7 shows an example of the determination of thickness d as a function of the deposition time during the sample rotation, form which we can evaluate and control in-line the deposition process stability and effectiveness.
  • the change of the deposition conditions affects the deposition rate of the SiO x thin films, as it can be seen at the points a, b, c and d in Figures 8 and 9.
  • the information that is obtained from the analysis of the measured SE spectra, in-situ and real-time is very important for industrial scale.
  • the Penn gap Eo exhibits a monotonic increase and an almost linear correlation with the stoichiometry (e.g. SiO x ).
  • B 0 for SiO 2 depending on its amorphous or crystalline microstructure that is 10.5 and 12 eV, respectively.
  • This methodology provides accurate results, rendering suitable for the characterization and the control of the properties and the quality of thin transparent films, inorganic and organic materials that are developed in polymeric substrates or other transparent substrates.
  • Figure 11 shows the comparative results from the real-time analysis of SE spectra in the Vis - FUV spectral region, from three SiG x thin films that were deposited onto polymeric substrate (PET) by electron beam evaporation of three different materials SiO 2 , SiO, and SiO x (mixed SiO + SiO 2 ). From this figure we observe the dependence of thickness as a function of deposition time from which we conclude that in small thicknesses the nucleation and coalescence stages take place, which are followed by the homogenous growth stage. From this dependence we can determine the deposition rate of the each film (6.4, 3.7 and 2.8 A/s, for SiO 2 , SiO and SiO x , respectively).
  • Figures 12 and 13 show the evolution of the Eo and E g parameters with the deposition time, as determined with the above methodology.
  • the determination of the barrier properties for gases and water vapours of the SiO x /PET system is accomplished with the correlation the optical and other properties of system, that were measured in real-time with the above methodology (e.g. stoichiometry x), with the penetrability measurements for oxygen (OTR) and water vapours (WVTR).
  • OTR oxygen
  • WVTR water vapours

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Abstract

This invention concerns the in-situ and real-time determination of thickness, optical properties and quality of transparent inorganic thin films (oxides, nitrides) and organic materials during their growth and during modification of transparent polymeric materials, with the use of Spectroscopic Ellipsometry, with measurements in the spectral region of Vis-FUV from 1.5 - 6.5 eV, and IR from 0.1 - 0.49 eV (900-4000 cm-1). This method can be used in-line for the monitoring and/or control of the processes in air and in vacuum, that concern substrates on which the thin films will be grown, and of the growth processes of transparent oxides, nitrides and other inorganic and organic films with final result the production of integrated systems with desirable properties.

Description

Title
IN-SITU AND REAL-TIME DETERMINATION OF THE THICKNESS, OPTICAL PROPERTIES AND QUALITY OF TRANSPARENT COATINGS
A method for the in-situ and real-time determination of the thickness, optical properties and quality of transparent coatings during their 5 growth onto polymeric substrates and determination of the modification, activation and the modification depth of polymeric materials surfaces.
io Technical Field
Industry has detected the necessity for monitoring the manufacturing (or production) processes in real-time, the minimization of time required for production control, as well as the minimization of product losses and failures and production cost. This invention concerns the determination of
15 the thickness, optical properties and quality of transparent inorganic thin films (oxides, nitrides) and organic materials during their growth and the modification/activation of the surfaces of transparent polymeric materials in-situ and real-time with the use of Spectroscopic Ellipsometry (SE) with measurements in the spectral region of Vis-farUY (1.5-6.5 eV) and IR,
20 (0.1-0.49 eV, or 900-4000 cm"1). This method can be used in-line for the monitoring and/or control of the production processes (in air and in vacuum), that concern substrates on which the thin films will be grown, and of the growth processes of transparent oxides, nitrides and other inorganic and organic films with final result the production of integrated
25 systems (such as multilayers of inorganic and organic materials) with desirable properties.
Reference to the Background Art, emphasizing the deficiencies that will be repaired
30 Spectroscopic Ellipsometry is a non destructive optical technique that is based on the measurement of the change of the light polarization state and provides information for the optical, and not only, materials properties. Spectroscopic Ellipsometry can be used for the in-situ and real-time monitoring during growth of inorganic and organics thin films, for the
35 determination of the mechanisms that take place during growth and for the change of optical properties and substrate properties under various processes. [1] In semiconductors, insulators but also in metals, bonded electrons with the absorption of a photon from electromagnetic radiation, are excited or undergo interband transitions, which are responsible for the strong absorption in the Vis-FUV spectral region. The application of Spectroscopic Ellipsometry technique, with the use of Synchrotron radiation, gave the possibility of spectroscopic measurements in an energy range up to 9.5 eV, that could not be covered with compatible light sources that are used in lab scale and the verification of the absorption and electronic structure of oxides and transparent materials in FUV spectral area[2-3] Thus, spectroscopic study of materials that show optical transparency in the area of Visible and Near Ultraviolet, such as Silicon Nitride (SiNx), was realized. [2] Moreover in combination with techniques that are used for the determination of the materials composition, the correlation of optical constant and properties was determined. Optical quantities, such as the energy in which appears the maximum electronic absorption in a composite material, known as mean Gap or Perm Gap (E0), and the energy where the edge of electronic absorption appears, known as the fundamental optical energy gap (Eg), are the ones that are directly related with their composition. [2-3] The correlation of optical constants, determined by Spectroscopic Ellipsometry, with other important properties, such as stoichiometry, has been certified also for metallic composite films such as Titanium Nitride films (TiNx), for which the plasma energy ωp is correlated with the stoichiometry x. [4-5] The ωp is calculated from the Spectroscopic Ellipsometry spectra in the energy region of the dielectric function and is the energy for which the real part of the dielectric function is equal to zero [εi (ω=cϋp)=0]. With the application of in-situ and real-time ellipsometry in the area of visible and Near Ultraviolet, during TiNx films growth, it was possible the real-time determination of the stoichiometry and thickness of the films TiNx.
Moreover, with application of in-situ and real-time ellipsometry in the area of Infrared, during transparent films Silicon Oxide (SiOx) growth on substrates of crystalline Si, the determination of deposition rate was realised. [6] Methods for the control in production line of thin films and coatings with priority in the properties of the surfaces, interfaces and layers or thin films that are related to the functional properties of the intermediate and final products are not available arid do not represent existing technologies. The lack of control systems in production line that would be used for the modification and the deposition of thin films onto polymeric surfaces, in combination with the fact that there is transfer of the quality control from the control of the final product to the control during production, requires the improvement of production line performance. This is very important since the deposition processes is comprised of several stages (e.g. surface modification/activation, inorganic or organic coating deposition). Therefore, an appropriate, smart and reliable control process must: a) control the technical requirements for coatings (e.g. good adhesion of the substrate) in new applications, b) provide material and energy reduction and c) keep low the cost of combined processes.
Short description based on the Claims
Method for real-time determination of thickness, optical properties and quality of transparent inorganic thin films (oxides, nitrides) and organic materials during their growth on polymeric or other transparent substrates. For the real-time calculation of the thickness, optical and other properties, during the growth of a transparent film on a transparent substrate, takes place the acquisition of experimental data of the dielectric function with the use of Spectroscopic Ellipsometry (SE) or in real-time with a unit that simultaneously acquires many measurements in various wavelengths (Fast Multiwavelength Ellipsometry- FMWE) adapted in a Ultra High Vacuum Chamber. During the experimental methodology, we have the following stages:
(a) Cover of the necessary energy range with extension of the energy range to the Far Ultraviolet, so that the measurements are performed in the spectral range in the Visible-far UltraViolet (Vis-FUV) for example from 1.5-6.5 eV or 190-830 nm, and in IR, from 0.1 - 0.49 eV (900 - 4000 cm" ')•
(b) Collection of experimental data with the simultaneous measurement, e.g. 32 different wavelengths, that cover the energy range 1.5-6.5eV and that represent acquisition of the dielectric function spectra, simultaneously and in short time in the range of ms.
(c) Application of the analysis model of the experimental spectra of multi wavelengths for the deduction of the optical parameters and constants of the grown transparent films. Thus the parameterization and analysis of the measured dielectric function <ε(E)> has been performed with the use of a geometrical three phase model (air/thin film/polymeric substrate) where the optical properties of each rjhase were described by using the modified Tauc-Lorentz model (TL). [7]
This new methodology was applied in deposition processes of thin and transparent oxides on semiconducting but also polymeric substrates, as well as in pretreatment processes of polymeric substrates for the activation of their surfaces, on which later are grown transparent thin films such as Silicon Oxide (SiOx), Titanium Oxide (TiOx), Silicon Nitride (SiNx) for various technological applications.
From the methodology that is applied: i) the thickness and deposition rate of transparent films are determined with high accuracy. The use of the geometrical model consisted by three phases (air/thin film/polymeric substrate) in the analysis of the SE spectra deducted during oxide deposition, provides the ability to determine the thickness d of the transparent inorganic (oxide, nitride, etc) and organic film. With this analysis, the stability and effectiveness of the deposition processes can be controlled and monitored. ii) the deposition processes of the transparent oxides films are monitored in real-time. iii) the optical constants and properties, through which the stoichiometry, composition, and quality of films and substrates are determined. More specifically, the Perm gap E0 and the refractive index n(E=0), are the most important parameters that are determined from the analysis. For example, the E0 is related to the stoichiometry x of the film, while the quantity n (E=O) is related with the stoichiometry and with the quality of oxides and nitrides thin films (that is related with the existence of voids and defects). All the other parameters provide indirect information for the quality of deposited films. iv) the barrier properties in gases and vapors of the system thin film/polymeric substrate are determined. This determination is the result of the correlation between the optical and other properties of the system that were measured in real-time with the above mentioned methodology (e.g. stoichiometry x) with Oxygen (OTR) and Water Vapor Transmission measurements (WVTR). For the exact correlation among optical and final functional properties there is use of the refractive index n (E=O) and of the Perm gap Eo. v) determination of the thickness of the surface layer that is formed with the ion bombardment (or in plasma conditions) of the polymeric substrates in vacuum. Depending on the experimental conditions that are applied and on the properties of this surface layer, it is determined the activation of the polymeric surface and the adhesion properties between the interface of the polymeric substrate and the grown thin film. In overall, the methodology that has been developed can be used in-line for the monitoring and control of the various vacuum processes of the substrates on which the thin films will be grown, and for the growth process of transparent inorganic (oxides and nitrides) or and organic films, to finally result in the production of complete systems, with desirable properties. This is especially important for the control of production & manufacturing processes in real-time and for the minimization of the time needed for production control, of the losses and of the production cost.
Indication of the technique's advantages
Methods for the control in production line of thin films and coatings with priority in the properties of the surfaces, interfaces and layers or films that are related to the functional properties of the intermediate and final products are not available and do not represent existing technologies. The lack of control systems in production line for the modification and coating of polymeric surfaces and in combination with the fact that there is transfer of the quality control from the control of the final product to the control during production requires the improvement of production line performance. This is very important since the coating deposition processes is comprised of several stages (e.g. surface functionalization, inorganic or organic coating deposition). Therefore, an appropriate, smart and reliable control process must: (a)* control the technical requirements for coatings (e.g. good adhesion of the substrate) in new applications, (b) provide consumer materials and energy reduction and (c) remain the cost of combined processes low.
[1] "THIN FILMS HANDBOOK: Processing, Characterization and Properties" in "In-situ monitoring in thin films during growth with Spectroscopic Ellipsometry" S. Logothetidis, ed. by Hari Singh Nalwa (Academic Press, 2001). [2] "Optical and compositional studies of SiN thin films with conventional and synchrotron radiation ellipsometry"
S. Logothetidis, J. Petalas, A. Markwitz and R. L. Johnson J. Appl. Phys. 73, 8514 (1993).
[3] "Characterization of SiN thin films with spectroscopic ellipsometry"
J. Petalas, S. Logothetidis, A. Markwitz, E.G. Paloura, R.L. Johnson and D. Fuchs Physica 5185, 342 (1993).
[4] "TiNx thin films deposited by reactive magnetron sputtering: in-situ monitoring and effect of deposition parameters "
S. Logothetidis, and J. Alexandrou
J. Mechan. Behav. of Mater. 6, 33 (1995). [5] "New approach in the monitoring and characterization of titanium nitride thin films "
S. Logothetidis, E.I. Meletis, and G. Kourouklis
J. Mater. Res. 14, 436 (1999).
[6] "In situ and real-time ellipsometry diagnostic techniques towards the monitoring of the bonding structure and growth kinetics: silicon oxide coatings"
S. Logothetidis, A. Laskarakis, A. Gika, and P. Patsalas
Surf, and Coat. Technol. 151-152, 204 (2002). [7] G.E. Jellison, F.A. Modine, Appl. Phys. Lett. 69 (1996) 371.
Brief Description of the Drawings.
FIGURE 1. Schematic representation of the in-situ Fourier Transform IR Spectroscopic Ellipsometer (FTIRSE) adjusted in a Ultra High Vacuum Chamber.
FIGURE 2. Spectra of the imaginary part <ε2(E)> of the dielectric function during the surface treatment of the polymeric substrate Poly(Ethylene Terephthalate) (PET) with Nitrogen (N2) ion bombardment by Pulsed DC Plasma Etching.
FIGURE 3. Schematic representation of the ex-situ of Spectroscopic Ellipsometry unit of the near infrared (Near IR)-Visible-Far Ultraviolet (Visible - FUV) spectral region.
FIGURE 4. The <ε2(E)> spectra in real-time during SiO2 thin film growth on polymeric substrate PET, with e-beam evaporation technique and with the evaporation SiO2 material. The triangles correspond to the measured imaginary part <ε2(E)> of PET before the SiO2 deposition, while the circles correspond to the <ε2(E)> of SiO2.
FIGURE 5. The <ε2(E)> spectra in real-time during SiO thin film growth on polymeric substrate PET5 with e-beam evaporation technique and with the evaporation of SiO material. The triangles correspond to the measured imaginary part <ε2(E)> of PET before the SiO deposition, while the circles correspond to the <ε2(E)> of SiO.
FIGURE 6. The <ε2(E)> spectra in real-time during SiOx thin film growth on polymeric substrate PET, with e-beam evaporation technique and with the evaporation mixed SiO and SiO2 material. The triangles correspond to the measured imaginary part <ε2(E)> of PET before the SiOx deposition, while the circles correspond to the <ε2(E)> of SiOx.
FIGURE 7. Time dependence of the thickness, the Penn gap E0 and the energy gap Eg of the SiOx thin film grown on the PET polymeric substrate. The results were obtained with the real-time analysis of the SE spectra measured by the FMWE unit. FIGURE 8. Time dependence of the thickness of the SiOx thin film grown on the PET polymeric substrate by electron beam evaporation of SiO. The results were obtained with, the real-time analysis of the SE spectra measured by the FMWE unit.
FIGURE 9.
Time dependence of the Penn gap Eo and the energy gap Eg of the SiOx thin film grown on the PET polymeric substrate by electron beam evaporation of SiO. The results were obtained with the real-time analysis of the SE spectra measured by the FMWE unit.
FIGURE 10. Correlation of the optical parameters E0 and n(E=0) of SiOx thin films that were grown with the e-beam evaporation technique in stable polymeric substrates. For comparison reasons reference data for stoichiometric SiO2 and SiO have been included.
FIGURE 11. Evolution of the thickness of SiO2, SiO and SiOx films during the first 50 s of their growth process.
FIGURE 12. Evolution of E0 Of SiO2, SiO and SiOx films during the first 50 s of their growth process.
FIGURE 13. Evolution of Eg Of SiO2, SiO and SiOx films during the first 50 s of their growth process.
FIGURE 14. Correlation of the optical properties E0, n (E=O) Of SiOx films and of the stoichiometry, composition and quality. -
Detailed description of at least one way of carrying out the Invention, with the use of examples, explaining the application of the invention.
A. General In this unit, is described the ^method for acquiring SE spectra in situ and real-time in the range of ms for the case of the following examples: a) surface treatment of PET polymeric substrate with the use of ion bombardment with N2 gas and b) growth of thin film oxides SiOx on polymeric substrate Poly(Ethylene Terephthalate) (PET) with the of e- beam evaporation technique or other Physical or Chemical Vapor Deposition techniques (PVD or CVD). This methodology can be generally applied in the case of monolayered and multilayered, transparent and non- transparent thin films, that can be comprised only of (or combination of) thin films of Silicon Oxide (SiOx), Titanium Oxide (TiOx), Silicon Nitride (SiNx), Titanium Nitride (TiNx), Zinc Oxide (ZnOx), Boron Nitride (BNx), Carbon Nitride (CNx), Aluminium Oxideυ (AlOx) for all the stoichiometry values x that are developed with the various Physical and Chemical Vapor Deposition growth techniques, such as magnetron sputtering (dc, rf or/and reactive), e-beam evaporation, ion beam sputtering, ion beam assisted deposition, CVD, Plasma Enhanced CVD, laser, ablation, laser deposition. Moreover, it can be applied for all polymeric substrates such as Poly(Ethylene Terephthalate) (PET), Poly(Ethylene Naphthalate) (PEN), Polyethylene Sulfate) (PES), PolyCarbonate (PC), Polyamide (PA), Polypropylene (PP), Polyvinyl Chloride (PVC), PolyTetraFluoroEthylene (PTFE), and/or a combination of them, amorphous, crystalline, oriented and non-oriented. Moreover, it can be applied and in all kinds of surface treatment with ion bombardment and with plasma, using all kinds of gases, such as Hydrogen (H2), Nitrogen (N2), Argon (Ar), Oxygen (O2), Methane (CH4) etc or a combination of them. The above apply for applications on static polymeric substrates and on large scale substrates for roll-to-roll and reel-to-reel applications.
The realization of measurements in such short time is in accordance with the one needed for the real-time control of thin films that are grown with deposition rate of ~5 A/s, such as the SiOx thin films growth on a PET polymeric substrate.
Initially, a detailed description of the experimental unit for the in situ and real-time monitoring processes of optical properties during the processes of surface treatment and growth of thin films on polymeric substrate, as described above, will be given. Following, measurements realized for the presentation and use of the proposed technique, will be described.
B. Experimental Part
Spectroscopic Ellipsometry- SE measurements (Figure 1) in the spectral region of Visible- Far Ultraviolet (Vis-FUV) were realised with a Fast MultiWavelength Ellipsometer (FMWE) unit that was developed in collaboration with Horiba/Jobin-Yvon, while the SE measurements in the spectra area of Infrared (IR) were realised with the Fourier Transform IR Spectroscopic Ellipsometer (FTIRSE) unit. Both units are adjusted on a ultra high vacuum chamber where the angle of incidence is 70°. Other angles, lower or higher, from 70° can also be used. The chamber is equipped with various Physical Vapor Deposition techniques (PVD) while for the thin films growth on polymeric substrates is used the e-beam evaporation technique. The substrate holder on which the substrate is adjusted is positioned horizontally on stable position and it has the capability to rotate around a vertical axis. The SE measurements are performed in the spectra are of the Visble- Far Ultraviolet (Vis-FUV) from 1.5 - 6.5 eV (190 - 830 nm), and in the spectra area of IR, 0.1 - 0.49 eV (900 - 4000 cm"1). The realization of the measurements in the spectra area of Vis-FUV are applied for the study of the material's optical properties (bulk materials and thin films), that are related to the electronic transmissions, their electronic structure and their thickness. The real-time measurement is performed with the simultaneous acquisition of 32 different wavelengths (32 simultaneously measured data points) that cover the energy range of 1.5 - 6.5 eV. The upper energy limit of SE spectra acquisition with the use of FMWE is 6.5 eV (190 nm), and with which can be performed the control of the polymeric membranes' and grown thin films optical properties. This is so, since the energy position of the maximum absorption is delated directly to the stoichiometry and the higher the upper measurement energy limit, the more accurate is the deteπnination of the absorption energy. The measurements in the IR spectral range are used for the study of the vibration modes and of the chemical bonding between atoms, that represent the materials studied, and of the thickness of the thin films that are formed either by the surface modification, either by their growth on the substrate. AU provide comparable information on the materials composition and stoichiometry.[6]
Moreover, the deposition rates of the oxide films, that have been referred are significantly lower in comparison to the ones in industrial scale, so the evaporation process on stable or moving substrate is more controllable and repeatable and the grown thin films show higher density values than the ones that are produced on moving substrates with the form of rolls (roll-to- roll) or in in-line roll-to-roll production on industrial scale, However, these processes can be applied in an in-line constant production and industrial scale.
C. Theory
The parameterization and analysis of the measured pseudo-dielectric function <ε(E)>=<εi(E)>+i<ε2(E)> has been performed with the use of a geometrical model consisted by three phases (air/thin film/polymeric substrate) in which the determination of the optical properties of each phase has been realized with the modified Tauc-Lorentz (TL) model.[l] In the case where the surface modification of the polymeric substrate is measured, the thin film represents the modified layer. In the TL model the imaginary part ε2(E) of the dielectric function is determined by multiplying the Tauc density of states with the ε2 that results from the Lorentz oscillator model. Therefore, the TL model provides the capability of determining the fundamental optical gap Eg of the interband transitions, the energy EO, the broadening C and the strength A of each oscillator. The EO of this model is correlated to the known Penn gap, the energy position where the strong electronic absorption of the material, mainly amorphous, takes place. The imaginary part E2(E) of the TL oscillator, for both amorphous and crystalline materials, is given by the following relations:
Figure imgf000012_0001
(2) and the real part εi(E) is i determined by Kramers-Kronig integration, by the relation: ε,(E) π (3)
Figure imgf000012_0002
whereas for E=O is
Figure imgf000013_0001
The basic information deduced by SE measurements/analyses concerns the film thickness, and the optical parameters and constants, which are strongly related to films' stoichiometry and quality. More specifically, it can be calculated:
The energy where the maximum electronic absorption takes place for the SiOx namely the Perm Gap, E0.
The value of the refractive index at zero energy n(E=0) which is relative to its density.
The fundamental band gap Eg.
The damping factor of the absorption peak attributed to electronic absorption; the broadening C.
The strength of the absorption peak A.
The ε that measures the material strength and accounts the contribution of all electronic transitions, even those not taken into account in the modeling analysis, because they occur at high energies well above the experimental measured energy range, otherwise it is equal to unity.
Among the aforementioned calculated characteristic parameters the most important that are determined by the spectra analysis, are the Penn gap E0 and the refractive index n. The EO is directly related to films' stoichiometry, whereas the n(E=0) is related to both films' stoichiometry and quality; such as the existence of microvoids and defects (Si inclusions). All the others parameters, such as the Eg, provides indirect information for the quality, composition, and stoichiometry of the deposited materials and/or the modified layers and substrates.
The use of the three phase model (air/thin film/polymeric substrate) for the analysis of the SE spectra or the FMWE measured spectra, that is deduced during the oxide deposition, provides the capability of determination of the thickness d of the inorganic and organic film. With this analysis it can be checked the stability and the effectiveness of the deposition processes. D. Measurement and parameterization of the optical properties in real-time during the surface modification of polymeric membranes
Figure 2 shows the measurement of the optical properties by the use of FTIRSE in real-time, during the surface treatment of Poly(Ethylene Terephthalate) (PET) polymeric substrate with Nitrogen (N2) atoms using Pulsed DC Plasma Etching. The partial pressure of the chamber was ~30 mTorr and the gas flow remained constant at 40 seem, whereas the voltage applied on the substrate holder through the high voltage pulse modulator (Advanced Sparc-le V) was 700V with frequency of 100 Hz. The surface treatment process has duration of 20 min. In this figure the imaginary part <ε2(E)> is presented.
E. Measurement and parameterization of the optical properties in realtime during the growth of thin films onto polymeric membranes. Figure 4, 5 and 6 show the in-situ and real-time control of the optical properties during the growth of SiOx thin films onto PET polymeric substrate with electron beam evaporation of SiO2, SiO and mixed SiO and SiO2, for achievement of the indermediate stoichiometry, respectively. In these figures it is presented the imaginary part <ε2(E)>. The thin films growth has been realized in sequential layers with total time of 450 s and for the real-time SE measurements the Sampling Time (time between two sequential measurements) was ST=I s.
By the analysis of the SE spectra with the Eq. (l)-(4) in combination with the three phase model (air/thin film/polymeric substrate), the thickness d of the SiOx thin film deposited onto PET can be determined. Figure 7 shows an example of the determination of thickness d as a function of the deposition time during the sample rotation, form which we can evaluate and control in-line the deposition process stability and effectiveness. Thus, when the thickness d is constant with time, the deposition process does not occur, since the evaporated material transport is interrupted. When this transport is restored, we have an almost linear deposition rate (~1 θA/s) at the initial stages and a linear deposition rate for stable deposition conditions. The change of the deposition conditions affects the deposition rate of the SiOx thin films, as it can be seen at the points a, b, c and d in Figures 8 and 9. The information that is obtained from the analysis of the measured SE spectra, in-situ and real-time is very important for industrial scale. As already it has been reported, the Eo, Eg and the refractive index n(E=0) are related directly with the stoichiometry and the quality (which are basic intermediate properties). These, depend with other final functional properties of materials, such as for example with the barrier properties of thin films SiOx and SiNx.
The determination of these parameters in real-time is realized with the modelling process that was described above and it is shown in Figure 9. From this figure, we observe that for the first the 100 s, the optical properties of the grown thin film show higher divergences. This can be attributed in the instabilities of the deposition process since the evaporation material is the mixed (SiO2 + SiO). Also, in Figure 5 it can be seen the change of E0 and Eg parameters, as they were determined with analysis of the SE spectra in real-time. The stoichiometry shows changes with the deposition time due to corresponding changes in the growth conditions. Consequently, the characteristics and the quality of the grown films can be controlled in real- time with the suitable modifications in the applied experimental conditions.
Correlation between the optical and the intermediate and final functional properties.
The Penn gap Eo exhibits a monotonic increase and an almost linear correlation with the stoichiometry (e.g. SiOx). In the case of silicon monoxide SiO (having an x=l) it is Eø=5.6 eV, whereas for silicon dioxide SiO2 (having an x=2) it is E0= 12 eV. In the literature there are two available values of B0 for SiO2 depending on its amorphous or crystalline microstructure that is 10.5 and 12 eV, respectively. In a first approximation the E0 is correlated to stoichiometry depending on the amorphous or crystalline microstructure of the films is given by the following relations: E0 amorphous (x)= 5.6 + (x-l)-4.9 eV , (4)
Eocrystalline(χ) = ^6 + ^y6 A Qγ _ (5)
In Figure 10 are shown the points that correspond in determined parameters E0 and n(E=0) of representative SiOx thin films with the points that correspond to the stoichiometric materials SiO2 and SiO. According to the above relations (4) and (5), the stoichiometry of a thin film that is characterized by specific E0 and n(E=0) values will be found in some point of the straight line that links the corresponding points. Thus, with the determination of Eo from the analysis of the SE spectra that was described above, we can calculate the stoichiometry x of the grown thin films. This methodology provides accurate results, rendering suitable for the characterization and the control of the properties and the quality of thin transparent films, inorganic and organic materials that are developed in polymeric substrates or other transparent substrates. The final functional properties of the thin films do not depend only on the stoichiometry but also on their quality, which can be evaluated by the refractive indices values, (n(E=0)), which depend on stoichiometry and on other structural and compositional properties such as microvoids, surface roughness, cracks or inclusions.
Figure 11 shows the comparative results from the real-time analysis of SE spectra in the Vis - FUV spectral region, from three SiGx thin films that were deposited onto polymeric substrate (PET) by electron beam evaporation of three different materials SiO2, SiO, and SiOx (mixed SiO + SiO2). From this figure we observe the dependence of thickness as a function of deposition time from which we conclude that in small thicknesses the nucleation and coalescence stages take place, which are followed by the homogenous growth stage. From this dependence we can determine the deposition rate of the each film (6.4, 3.7 and 2.8 A/s, for SiO2, SiO and SiOx, respectively).
Figures 12 and 13 show the evolution of the Eo and Eg parameters with the deposition time, as determined with the above methodology. The determination of the barrier properties for gases and water vapours of the SiOx/PET system is accomplished with the correlation the optical and other properties of system, that were measured in real-time with the above methodology (e.g. stoichiometry x), with the penetrability measurements for oxygen (OTR) and water vapours (WVTR). For the deduction of accurate conclusions, we use the refractive index n(E=0) and the Penn gap E0, otherwise it is difficult to correlate the optical and the final functional properties. These are shown in Figure 14.
Consequently, the in-situ and real-time determination of the optical properties and the quality is particularly important and leads to direct determination of final functional properties of these systems (inorganic thin films on polymeric substrates) at their growth, something that it is impossible to become with other techniques. Also, with this methodology becomes possible, with the tuning and adjustment of the experimental growth conditions, the growth of materials on polymeric substrates with the desirable functional properties that are essential for the each application. The knowledge of final functional properties in real-time at the growth of these systems, as it is affected by the change of the deposition conditions is very important in industry, particularly since it can be used in moved substrates and in in-line production, making this methodology essential for use in industrial scale.

Claims

Claims
1. A method for real-time determination of the thickness, optical properties and the quality of thin films of transparent inorganic and organic materials during their growth process. For the real-time calculation of the optical and other properties, during the growth of a transparent film on a transparent substrate, as well as in pretreatment processes of polymeric substrates for the activation or modification of their surfaces, on which later are grown transparent thin films takes place the acquisition of experimental data of the dielectric function. The determination of the properties is characterized of: (a) cover of the necessary energy range with extension of the energy range to the Far Ultraviolet,
(b) collection of experimental data with the simultaneous measurement of at least 32 different wavelengths, that represents a dielectric function spectra, where the acquisition of each spectra is realised in short time in the range of ms.
(c) application of the appropriate analysis model of the multi wavelengths experimental spectra for the deduction of the optical parameters and constants of the grown transparent films.
2. Method according to claim 1, characterized by the fact that the real-time calculation of the thickness, optical and other properties are deducted with Spectroscopic Ellipsometry
3. Method according to claim 1, characterized by the fact that measurements are realized with a Fast Multiwavelength Ellipsometer
(FMWE) unit that is adapted in an Ultra High Vacuum Chamber where the angle of incidence is 70°
4. Method according to claim 3, characterized by the fact that the measurements are performed in the spectral range in the Visible-far
Ultraviolet (Vis-fUV) from 1.5-6.5 eV or 190-830 nm, and in the spectral range in the IR5 0.1 - 0.49 eV or 900 - 4000 cm"1.
5. Method according to claim 1, characterized by the fact that the parameterization and analysis of the measured dielectric function is performed with the use of a geometrical three phase model (air/thin film/polymeric substrate), providing the ability to determinate the thickness and deposition rate of transparent film.
6. Method according to claim 5, characterized by the fact that the optical properties of each layer were calculated by using the modified Tauc-
Lorentz model (TL).
7. Method according to claim 5, characterized by the fact that it determines and calculates with high accuracy the thickness and deposition rate of transparent inorganic (oxides, nitrides) as well as organic films, their optical constants and properties.
8. Method according to claim 7, characterized by the fact that it calculates the Perm gap or mean gap E0 that is related to the stoichiometry x (of oxides, nitrides), and the refractive index n (E=O), that is related to the stoichiometry, composition and quality of thin films and substrates.
9. Method according to claim 1, characterized by the fact that it determines the barrier properties in gases and vapors of the system thin film/polymeric substrate that result from the correlation between the optical and other properties of the system (e.g. stoichiometry x) with Oxygen (OTR) and Water Vapor Transmission measurements (WVTR).
10. Method according to claim 9, characterized by the fact that for the exact correlation among optical and final functional properties there is use of the refractive index n (E=O) and of the Penn gap E0.
11. Method according to claim 1, characterized by the fact that it determines the thickness of the surface layer that is formed with the ion bombardment or plasma treatment of the polymeric substrates in vacuum and depending on the experimental conditions that are applied and on the properties of this surface layer, it is determined the activation of the polymeric surface and the adhesion properties between the interface of the polymeric substrate and the grown thin film.
12. In a similar way, this method according to claim 1, is characterized by the fact that it determines the thickness of the surface layer and the modification and activation of the polymeric membranes and the deposition of organic materials and films on them, also in air.
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102507875A (en) * 2011-11-09 2012-06-20 复旦大学 Method for quickly and nondestructively measuring thickness and band structure of graphene film
CN103323403A (en) * 2013-05-27 2013-09-25 浙江大学 Optical parameter detection method of low-radiation coated glass
US9371577B2 (en) 2013-12-31 2016-06-21 Halliburton Energy Services, Inc. Fabrication of integrated computational elements using substrate support shaped to match spatial profile of deposition plume
US9395721B2 (en) 2013-12-24 2016-07-19 Halliburton Energy Services, Inc. In-situ monitoring of fabrication of integrated computational elements
US9495505B2 (en) 2013-12-24 2016-11-15 Halliburton Energy Services, Inc. Adjusting fabrication of integrated computational elements
US9523786B2 (en) 2014-03-21 2016-12-20 Halliburton Energy Services, Inc. Monolithic band-limited integrated computational elements
US9708908B2 (en) 2014-06-13 2017-07-18 Halliburton Energy Services, Inc. Integrated computational element with multiple frequency selective surfaces
US9727052B2 (en) 2014-02-14 2017-08-08 Halliburton Energy Services, Inc. In-situ spectroscopy for monitoring fabrication of integrated computational elements
US10247662B2 (en) 2013-07-09 2019-04-02 Halliburton Energy Services, Inc. Integrated computational elements with frequency selective surface
US10496776B2 (en) 2013-12-24 2019-12-03 Halliburton Energy Services, Inc. Fabrication of critical layers of integrated computational elements
US10718881B2 (en) 2013-07-09 2020-07-21 Halliburton Energy Services, Inc. Integrated computational elements with laterally-distributed spectral filters
US10914863B2 (en) 2013-12-24 2021-02-09 Halliburton Energy Services, Inc. Real-time monitoring of fabrication of integrated computational elements
CN114018820A (en) * 2021-09-14 2022-02-08 深圳市埃芯半导体科技有限公司 Optical measurement method, device, system and storage medium
US11274365B2 (en) 2013-12-30 2022-03-15 Halliburton Energy Services, Inc. Determining temperature dependence of complex refractive indices of layer materials during fabrication of integrated computational elements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5131752A (en) * 1990-06-28 1992-07-21 Tamarack Scientific Co., Inc. Method for film thickness endpoint control
US5277747A (en) * 1992-09-15 1994-01-11 Bell Communications Research, Inc. Extraction of spatially varying dielectric function from ellipsometric data
US6781692B1 (en) * 2000-08-28 2004-08-24 Therma-Wave, Inc. Method of monitoring the fabrication of thin film layers forming a DWDM filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5131752A (en) * 1990-06-28 1992-07-21 Tamarack Scientific Co., Inc. Method for film thickness endpoint control
US5277747A (en) * 1992-09-15 1994-01-11 Bell Communications Research, Inc. Extraction of spatially varying dielectric function from ellipsometric data
US6781692B1 (en) * 2000-08-28 2004-08-24 Therma-Wave, Inc. Method of monitoring the fabrication of thin film layers forming a DWDM filter

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
GIOTI M ET AL: "IR-FUV ellipsometry studies on the optical, electronic and vibrational properties of polymeric membranes", PREPARATION AND CHARACTERIZATION, ELSEVIER SEQUOIA, NL, vol. 455-456, 1 May 2004 (2004-05-01), pages 283 - 287, XP004504795, ISSN: 0040-6090 *
KECHAGIAS V G ET AL: "'Real-time' multiwavelength ellipsometry diagnostics for monitoring dry etching of Si and TiNx deposition", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 364, no. 1-2, March 2000 (2000-03-01), pages 213 - 219, XP004195098, ISSN: 0040-6090 *
LASKARAKIS A ET AL: "FTIR and Vis-FUV real time spectroscopic ellipsometry studies of polymer surface modifications during ion beam bombardment", NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH, SECTION - B: BEAM INTERACTIONS WITH MATERIALS AND ATOMS, ELSEVIER, AMSTERDAM, NL, vol. 216, February 2004 (2004-02-01), pages 131 - 136, XP004489491, ISSN: 0168-583X *
LOGOTHETIDIS S ET AL: "In situ and real-time ellipsometry diagnostic techniques towards the monitoring of the bonding structure and growth kinetics: silicon oxide coatings", SURFACE & COATINGS TECHNOLOGY ELSEVIER SWITZERLAND, vol. 151-152, 1 March 2002 (2002-03-01), pages 204 - 208, XP008069343, ISSN: 0257-8972 *
LOGOTHETIDIS S ET AL: "Real-time monitoring, growth kinetics and properties of carbon based materials deposited by sputtering", DIAMOND AND RELATED MATERIALS, ELSEVIER SCIENCE PUBLISHERS, AMSTERDAM, NL, vol. 10, no. 2, February 2001 (2001-02-01), pages 117 - 124, XP004322348, ISSN: 0925-9635 *

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US10247662B2 (en) 2013-07-09 2019-04-02 Halliburton Energy Services, Inc. Integrated computational elements with frequency selective surface
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US11274365B2 (en) 2013-12-30 2022-03-15 Halliburton Energy Services, Inc. Determining temperature dependence of complex refractive indices of layer materials during fabrication of integrated computational elements
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