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WO2007010527A3 - Method and apparatus for cooling electronic or other devices - Google Patents

Method and apparatus for cooling electronic or other devices Download PDF

Info

Publication number
WO2007010527A3
WO2007010527A3 PCT/IL2006/000822 IL2006000822W WO2007010527A3 WO 2007010527 A3 WO2007010527 A3 WO 2007010527A3 IL 2006000822 W IL2006000822 W IL 2006000822W WO 2007010527 A3 WO2007010527 A3 WO 2007010527A3
Authority
WO
WIPO (PCT)
Prior art keywords
jets
cold plate
liquid
liquid coolant
contact
Prior art date
Application number
PCT/IL2006/000822
Other languages
French (fr)
Other versions
WO2007010527A2 (en
Inventor
Yehoshua Sheinman
Original Assignee
Pulsacool Ltd
Yehoshua Sheinman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pulsacool Ltd, Yehoshua Sheinman filed Critical Pulsacool Ltd
Priority to US11/988,685 priority Critical patent/US20090120621A1/en
Publication of WO2007010527A2 publication Critical patent/WO2007010527A2/en
Publication of WO2007010527A3 publication Critical patent/WO2007010527A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A method and apparatus for cooling eletronic or other devices (CD) by bringing the device to be cooled into contact with one face of a cold plate (30) having high thermal conductivity; and applying a plurality of liquid jets of a liquid coolant to the opposite face of the cold plate peipendicular thereto and at spaced location thereon. The plurality of liquid jets are applied in pulses as pulsatile jets. The liquid coolant is also circulated in a pulsative manner as a planar flow liquid in contact with and parallel to the opposite face of the cold plate, such that the plurality of pulsatile jets of the liquid coolant flow as immersed jet streams through the planar flow liquid coolant circulated in contact with and parallel to the opposite face of the cold plate.
PCT/IL2006/000822 2005-07-15 2006-07-13 Method and apparatus for cooling electronic or other devices WO2007010527A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/988,685 US20090120621A1 (en) 2005-07-15 2006-07-13 Method and apparatus for cooling electronic or other devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69937205P 2005-07-15 2005-07-15
US60/699,372 2005-07-15

Publications (2)

Publication Number Publication Date
WO2007010527A2 WO2007010527A2 (en) 2007-01-25
WO2007010527A3 true WO2007010527A3 (en) 2009-01-08

Family

ID=37669227

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2006/000822 WO2007010527A2 (en) 2005-07-15 2006-07-13 Method and apparatus for cooling electronic or other devices

Country Status (2)

Country Link
US (1) US20090120621A1 (en)
WO (1) WO2007010527A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
CN108323112B (en) * 2018-02-10 2023-09-15 中国电子科技集团公司第十六研究所 Synthetic jet liquid cooling device
US12089374B2 (en) 2018-08-10 2024-09-10 Frore Systems Inc. MEMS-based active cooling systems
US11464140B2 (en) 2019-12-06 2022-10-04 Frore Systems Inc. Centrally anchored MEMS-based active cooling systems
US10788034B2 (en) 2018-08-10 2020-09-29 Frore Systems Inc. Mobile phone and other compute device cooling architecture
US11901264B2 (en) * 2018-10-31 2024-02-13 Sk Hynix Nand Product Solutions Corp. Choked flow cooling
KR102677216B1 (en) 2019-10-30 2024-06-24 프로리 시스템스 인코포레이티드 MEMS-based airflow system
US12193192B2 (en) 2019-12-06 2025-01-07 Frore Systems Inc. Cavities for center-pinned actuator cooling systems
US11796262B2 (en) 2019-12-06 2023-10-24 Frore Systems Inc. Top chamber cavities for center-pinned actuators
US11510341B2 (en) 2019-12-06 2022-11-22 Frore Systems Inc. Engineered actuators usable in MEMs active cooling devices
US12033917B2 (en) 2019-12-17 2024-07-09 Frore Systems Inc. Airflow control in active cooling systems
CN113661568A (en) 2019-12-17 2021-11-16 福珞尔系统公司 MEMS-based cooling system for closed and open devices
US11483947B2 (en) * 2020-09-16 2022-10-25 Motivair Corporation Cooling apparatus with expanding fluid jets
CN116325139A (en) 2020-10-02 2023-06-23 福珞尔系统公司 Active heat sink
CN116234227A (en) * 2021-12-06 2023-06-06 华为技术有限公司 Equipment node and liquid cooling rack

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2906103A (en) * 1957-06-10 1959-09-29 Alvin R Saltzman Chassis design for inert carrier gasliquid thermal diffusion cooling system
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6612120B2 (en) * 2001-02-22 2003-09-02 Hewlett-Packard Development Company, L.P. Spray cooling with local control of nozzles
US6650542B1 (en) * 2003-01-06 2003-11-18 Intel Corporation Piezoelectric actuated jet impingement cooling
US20050039883A1 (en) * 2003-06-12 2005-02-24 Kramer Gary W. High flux heat removal system using liquid ice

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3788393A (en) * 1972-05-01 1974-01-29 Us Navy Heat exchange system
US5576932A (en) * 1995-08-31 1996-11-19 At&T Global Information Solutions Company Method and apparatus for cooling a heat source
US6055154A (en) * 1998-07-17 2000-04-25 Lucent Technologies Inc. In-board chip cooling system
US6349760B1 (en) * 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
US6952346B2 (en) * 2004-02-24 2005-10-04 Isothermal Systems Research, Inc Etched open microchannel spray cooling
US20060060331A1 (en) * 2004-08-20 2006-03-23 Ari Glezer Apparatus and method for enhanced heat transfer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2906103A (en) * 1957-06-10 1959-09-29 Alvin R Saltzman Chassis design for inert carrier gasliquid thermal diffusion cooling system
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6612120B2 (en) * 2001-02-22 2003-09-02 Hewlett-Packard Development Company, L.P. Spray cooling with local control of nozzles
US6650542B1 (en) * 2003-01-06 2003-11-18 Intel Corporation Piezoelectric actuated jet impingement cooling
US20050039883A1 (en) * 2003-06-12 2005-02-24 Kramer Gary W. High flux heat removal system using liquid ice

Also Published As

Publication number Publication date
WO2007010527A2 (en) 2007-01-25
US20090120621A1 (en) 2009-05-14

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