WO2007010595A1

WO2007010595A1 - Semiconductor device and method for manufacturing same

Info

Publication number: WO2007010595A1
Application number: PCT/JP2005/013238
Authority: WO
Inventors: Hirotaka Nishizawa; Tamaki Wada; Junichiro Osako
Original assignee: Renesas Technology Corp.
Priority date: 2005-07-19
Filing date: 2005-07-19
Publication date: 2007-01-25
Also published as: JPWO2007010595A1

Abstract

A technology for efficiently manufacturing an IC card having a nonvolatile memory chip mounted thereon. A nonvolatile memory chip is mounted on a module substrate (1) on a nonvolatile memory manufacturing line, and the memory chip is sealed with a resin (6). Then, the module substrate (1) is separated into each piece. At this time, the module substrate (1) is provided with a holding section (7), and after electrical characteristic inspection is performed, the module substrate (1) is connected to a tape board (13) by using the holding section (7). Then, the module substrates (1) integrated in a tape-shape are shipped to the IC card manufacturing line. On the IC card manufacturing line, the IC cards are manufactured by using the module substrates (1) integrated in the tape-shape.

Description

Specification

Semiconductor device and manufacturing method thereof

Technical field

TECHNICAL FIELD [0001] The present invention relates to a semiconductor device and a manufacturing technique thereof, and particularly to a technique effective when applied to the manufacture of an IC card.

Background art

[0002] Card-type information media such as IC cards and memory cards are small, thin, and lightweight, and thus are excellent in portability, portability, and convenience, and are widely used in various fields.

[0003] An IC card is a card-type information medium in which an IC card chip is embedded in a cash card-sized plastic thin plate and information can be recorded, and is excellent in authenticity and tamper resistance. For this reason, IC cards are, for example, credit cards, cash cards, ETC (Electronic Toll Collection system) system cards, commuter passes, mobile phone card or authentication cards, etc., such as finance, transportation, communication, distribution and authentication. It is becoming increasingly popular in fields where high security is required.

Regarding the IC card, for example, FIG. 9 of Japanese Patent Laid-Open No. 2001-357376 (Patent Document 1) has a configuration in which a SIM (Subscriber Identify Module) type card is fixed by providing a bridge at the opening of the frame card. It is disclosed.

[0005] On the other hand, a memory card is a card type information medium that employs a non-volatile memory (EEPROM, flash memory, etc.) as a storage medium, and is smaller than an IC card and writes large-capacity information at high speed. Can be read. For this reason, memory cards are widely used as recording media for portable information devices that require portability such as digital cameras, notebook personal computers, portable music players, and portable telephones. Typical memory card standards include SD (Secure Digital) memory cards (standardized by the SD card association), miniSD, MMC (registered trademark of Multi Media Card, Infineon Technologies AG), RS — MMC (Reduced Size MMC).

[0006] A memory card is described in, for example, International Publication No. 02Z099742A1 (Patent Document 2). For the purpose of improving security, a nonvolatile memory chip and a security card are described. A configuration of a memory card is disclosed that includes an IC card chip that can execute processing and a controller chip that controls the circuit operation of these chips.

Patent Document 1: Japanese Patent Laid-Open No. 2001-357376

Patent Document 2: Pamphlet of International Publication No. 02Z099742A1

Disclosure of the invention

Problems to be solved by the invention

Here, the present inventors have studied to improve the function of the IC card by mounting a nonvolatile memory chip on the IC card. As a result, the present inventors have found that how to efficiently manufacture an IC card is an important issue in the manufacturing process of an IC force loaded with a non-volatile memory chip! .

[0008] An object of the present invention is to provide a technique capable of efficiently manufacturing an IC card on which a nonvolatile memory chip is mounted.

[0009] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

Means for solving the problem

[0010] Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

[0011] A method of manufacturing a semiconductor device according to the present invention includes: (a) preparing a sheet-like multilayer printed circuit board (Print Circuit Board) in which a plurality of module boards are integrated; and (b) A step of mounting a semiconductor chip on a module substrate, (c) a step of electrically connecting the module substrate and the semiconductor chip, and (d) an individual module including the sheet-like laminated printed wiring board And a step of dividing the substrate into individual pieces. The step (d) is characterized in that the module substrate force is divided into pieces including the protruding holding portion.

[0012] Further, according to need, (e) the module substrate divided into pieces is held on a tape substrate.

[0013] Further, a semiconductor device according to the present invention includes (a) a module substrate, (b) a semiconductor chip mounted on the module substrate, and (c) a holding portion protruding from the module substrate cover. It is what

[0014] Further, if necessary, the semiconductor chips mounted on the module substrate are connected in a tape shape.

The invention's effect

[0015] The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

[0016] An IC card equipped with a nonvolatile memory chip can be efficiently manufactured.

Brief Description of Drawings

FIG. 1 is a plan view showing a manufacturing process of an IC card mounted with a nonvolatile memory chip in an embodiment of the present invention.

FIG. 2 is a plan view showing the manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 1.

FIG. 3 is a plan view showing the manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 2.

FIG. 4 is a plan view showing the manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 3.

FIG. 5 is a plan view showing a module substrate provided with a holding portion.

FIG. 6A is a plan view showing one surface of a module substrate provided with a holding portion, and FIG. 6B is a plan view showing the other surface of the module substrate provided with a holding portion.

FIG. 7 is a perspective view showing a module substrate provided with a holding portion.

FIG. 8 is a plan view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted in the embodiment.

FIG. 9 is a perspective view showing the manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 8.

FIG. 10 is a perspective view showing the manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 9.

FIG. 11 is a perspective view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 10. FIG. 12 is a perspective view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 11.

FIG. 13 is a perspective view showing the manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 12.

FIG. 14 is a plan view showing one surface of an IC card on which a nonvolatile memory chip is mounted.

FIG. 15 is a plan view showing the other surface of the IC card on which the nonvolatile memory chip is mounted.

FIG. 16 is a diagram showing an example of a circuit configuration of an IC card chip.

FIG. 17 is a diagram showing an example of a circuit configuration of a controller chip.

FIG. 18 is a diagram for explaining an example in which the method for connecting the separated module substrate and the tape substrate is changed.

FIG. 19 is a diagram illustrating an example in which the shape of the holding portion provided on the separated module substrate is a T-shape.

FIG. 20 is a cross-sectional view showing a cross section taken along line AA in FIG.

FIG. 21 (a) is a cross-sectional view showing one process for realizing the connection shown in FIG. 19, and (b) is a cross-sectional view showing a process following (a).

FIG. 22 is a perspective view showing an example in which a step (offset) is provided in the holding portion of the tape substrate.

FIG. 23 is a perspective view showing another connection method of the module substrate holding unit and the tape substrate holding unit.

BEST MODE FOR CARRYING OUT THE INVENTION

[0018] In the following embodiment, when necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not independent of each other unless otherwise specified. One is related to some or all of the other modification, details, supplementary explanation, etc.

[0019] In the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), it is particularly limited to a specific number when clearly indicated and in principle. Except in some cases, the number is not limited to the specific number, and may be a specific number or more.

[0020] Furthermore, in the following embodiments, the components (including element steps and the like) are special features. Needless to say, this is not absolutely necessary except in cases where it is clearly stated in principle and where it is clearly considered essential in principle.

[0021] Similarly, in the following embodiments, when referring to the shape, positional relationship, and the like of components, etc., unless specifically stated or otherwise considered to be clearly not in principle, Those substantially including or similar to the shape or the like are included. The same applies to the above numerical values and ranges.

Embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. In order to make the figure easier to see, even a plan view may be hatched.

A method for manufacturing an IC card (semiconductor device) in the present embodiment will be described with reference to the drawings.

First, as shown in FIG. 1, a rigid substrate 2 is prepared in which a plurality of module substrates 1 (hatched /!) Are integrated. In the present embodiment, a laminated printed circuit board is referred to as a rigid board. The rigid substrate 2 is excellent in the formation of multilayer wiring and fine wiring, and is formed of, for example, glass epoxy resin.

Subsequently, as shown in FIG. 2, the nonvolatile memory chip 3 and the controller chip 4 are stacked and mounted on the individual module substrates 1 formed on the rigid substrate 2. The non-volatile memory chip 3 is formed with a rewritable non-volatile memory such as a flash memory, and the controller chip 4 is formed with a circuit for controlling a write operation and a read operation of the non-volatile memory. Yes. The nonvolatile memory chip 3 and the controller chip 4 are mounted at a position according to one side of the module substrate 1 that is not in the center of the module substrate 1. This is because the IC card chip is also efficiently mounted on the module substrate 1 as described later. For example, as shown in FIG. 2, the nonvolatile memory chip 3 and the controller chip 4 are mounted in a region opposite to the region where the corner portion chamfered with respect to the center of the module substrate 1 is provided. The area for mounting the IC card chip is secured on the top. By securing an area for mounting an IC card chip in this way, a large-sized nonvolatile memory chip can be efficiently arranged. Next, as shown in FIG. 3, the nonvolatile memory chip 3 and the module substrate 1 are electrically connected using a bonding wire 5. Similarly, the controller chip 4 and the module substrate 1 are electrically connected using the bonding wires 5. Furthermore, if necessary, the nonvolatile memory chip 3 and the controller chip 4 are electrically connected using bonding wires 5. Here, although not shown, bonding pads are formed on the non-volatile memory chip 3, the controller chip 4 and the module substrate 1, and the bonding wires 5 are connected to these bonding pads. . Of the stacked non-volatile memory chip 3 and controller chip 4, the non-volatile memory chip 3 disposed in the lower layer does not use the bonding wire 5 but uses, for example, a bump substrate to form the module substrate 1 You may make it electrically connect with. The bonding wire 5 is made of, for example, a gold wire.

Subsequently, as shown in FIG. 4, the nonvolatile memory chip 3 and the controller chip 4 mounted on the module substrate 1 are sealed with a resin 6. At this time, the minimum area required for sealing the nonvolatile memory chip 3, the controller chip 4 and the bonding wire 5 is not limited to forming the resin 6 so as to cover the entire module substrate 1. Sealed with 6. That is, the module substrate 1 is partially sealed by the resin 6. As will be described later, components different from the nonvolatile memory chip 3 and the controller chip 4 such as an IC card chip are mounted on the module substrate 1, so that the IC card chip mounting area is sealed with the resin 6. This is because it is necessary to ensure it. In the present embodiment, an IC card chip is exemplified as a component different from the nonvolatile memory chip 3 and the controller chip 4. However, the present invention is not limited to this, and a passive element such as a capacitor may be provided as appropriate.

Next, a plurality of module substrates 1 formed integrally with the rigid substrate 2 are separated into individual module substrates 1. When the module substrate 1 is separated into pieces, each module substrate 1 is cut so that the protruding holding portions 7 remain. As described above, in the present embodiment, one feature is that the module board 1 is separated into pieces including the projecting holding portions 7 at the upper and lower portions of the module board 1 rather than the individual module board 1 alone. is there.

[0029] Conventionally, an IC card has only been equipped with an IC card chip. There is an increasing demand for higher functionality and multifunction. For this reason, in addition to the IC card chip, mounting a large-capacity nonvolatile memory chip on the IC card is being studied. Thus, in order to manufacture an IC card on which an IC card chip and a nonvolatile memory chip are mounted, it is necessary to mount the nonvolatile memory chip and the IC card chip on a module substrate.

[0030] Here, it is conceivable to newly build a production line in which the nonvolatile memory chip and the IC card chip are mounted on the module substrate. However, creating such a new production line is costly and inefficient. In other words, by using an existing production line as much as possible, an IC card equipped with a nonvolatile memory chip can be produced efficiently. In addition, the non-volatile memory and the IC card are different products, so there is a need to manufacture them by different manufacturers. Therefore, from the viewpoint of using an existing production line, it is efficient to produce IC cards by dividing the work of IC cards equipped with non-volatile memory chips by different manufacturers. However, when IC cards are manufactured separately by different manufacturers, the product form of products delivered between manufacturers becomes a problem. In other words, first, in the production line of a manufacturing company that manufactures non-volatile memory, a rigid substrate with an integrated module substrate is used. And after mounting a non-volatile memory chip on each module substrate of a rigid substrate, it seals and separates into each module substrate. The separated module board is shipped as a product to the IC card manufacturer. In this way, when using the existing non-volatile memory production line, it is desirable to ship individual module boards.

[0031] On the other hand, in a manufacturing line of a manufacturing company that manufactures an IC card, an IC card is manufactured using a tape-shaped substrate. In other words, the IC card production line has a COT (Chip On Tape) structure in which an IC card chip is mounted on the continuous tape substrate. For this reason, in the existing IC card production line, even if an individual module board is carried in, an IC card chip cannot be mounted on the individual module board. In other words, it is desirable not to divide the module board into individual IC card production lines. Thus, the product form of the product delivered between the manufacturing companies becomes a problem.

Therefore, in the present embodiment, when the module substrate 1 on which the nonvolatile memory chip 3 is mounted is separated, the module substrate 1 including the protruding holding portions 7 at the upper and lower portions is separated. Like to do. By doing so, as will be described later, it is possible to solve the problem of the product form of the product delivered between the manufacturing companies. For this reason, it is possible to efficiently manufacture an IC card equipped with the nonvolatile memory chip 3 using an existing manufacturing line at each manufacturing company.

FIG. 6 is a diagram showing the external appearance of the module substrate 1 that is separated into pieces including the holding unit 7. Fig 6

(a) is a view of the surface of the module substrate 1 in the present embodiment. As shown in FIG. 6 (a), on the surface of the module substrate 1 in the present embodiment, a mold region covered with a resin 6 and an electrode (IC card chip mounting pattern) 8 are formed. IC card chip mounting area. FIG. 6B is a view of the back surface of the module substrate 1 in the present embodiment. As shown in FIG. 6B, an IC card back electrode (ISO electrode 9) connected to the electrode 8 is formed on the back surface of the module substrate 1 in the present embodiment. Further, an extended electrode 10 connected to the nonvolatile memory chip 3 and the controller chip 4 covered with the resin 6 is formed. FIG. 7 is a perspective view showing the module substrate 1 singulated including the holding unit 7. As shown in FIG. 7, a non-volatile memory chip 3 is mounted on the module substrate 1, and a controller chip 4 is mounted on the non-volatile memory chip 3. The nonvolatile memory chip 3 and the controller chip 4 are connected to the module substrate 1 via bonding wires 5. A resin 6 is formed so as to cover the nonvolatile memory chip 3 and the controller chip 4. On the other hand, an electrode 8 is formed in a region not covered with the resin 6. An IC card chip mounting area 11 is formed between the electrodes 8. Also, a conductor pattern 12 made of a conductor film is formed on the holding portion 7 on the IC card chip mounting area 11 side. The conductor pattern 12 is formed of, for example, a gold film, and is formed to improve the releasability of the resin formed on the gate when the IC card chip described later is molded. Further, the conductor pattern 12 is provided so as to extend to the inner side (center side of the module substrate 1) than the outer periphery of the module substrate 1 excluding the holding portion 7. By forming the conductor pattern 12 in this way, the above-described exfoliation of the resin can be further prevented.

[0034] Next, electrical property inspection of the nonvolatile memory chip 3 and the controller chip 4 is performed on the module substrate 1 thus configured. Electrical characteristics test The dredging is performed using the extended electrode 10 shown in FIG. 6 (b). The separated module substrate 1 is easy to determine, sort and distribute in the electrical characteristic inspection of the nonvolatile memory chip 3 and the controller chip 4 which have a long test time and many test items. The electrical characteristics of the nonvolatile memory chip 3 and the like are inspected by placing the singulated module substrate 1 into a test socket. Since a plurality of test sockets are arranged in parallel and a plurality of separated module substrates 1 can be processed in parallel, the efficiency of electrical property inspection can be improved. In other words, the electrical characteristic inspection of the nonvolatile memory chip 3 and the like takes a long test time, but by processing a plurality of separated module substrates 1 in parallel, the non-defective product or defective product is selected. This improves the efficiency of the inspection of physical characteristics.

[0035] In the present embodiment, the holding unit 7 is provided on the singulated module substrate 1. However, the holding unit 7 is provided, and an existing characteristic test for inspecting the electrical characteristics of the module substrate is performed. In the production line, the electrical characteristics of the module substrate 1 provided with the holding portion 7 can be inspected by using a handler or test socket for transferring the module substrate in common or by making small changes. For this reason, the electrical property inspection can be efficiently performed using the existing production line.

Next, as shown in FIG. 8, a heat-resistant tape substrate 13 such as stainless steel is prepared. The tape substrate 13 is provided with a plurality of module substrate mounting areas, for example, by punching a hoop material to provide a space. A holding portion 14 is provided so as to protrude into the module substrate mounting area of the tape substrate 13. As shown in FIG. 9, the separated module substrate 1 is connected to the tape substrate 13 configured as described above. For example, as shown in FIG. 9, the holding portion 7 provided on the module substrate 1 is disposed on the holding portion 14 provided on the tape substrate 13, and the holding portion 14 is bent (see FIG. 9). The holding part 7 and the holding part 14 are mechanically connected by caulking. As a result, a plurality of individual module substrates 1 can be connected to the tape substrate 13. In this way, a plurality of individual module substrates 1 can be mounted on one tape substrate 13. That is, by providing the holding portion 7 on the module substrate 1 that has been separated, the module substrate 1 that has been separated once can be easily mounted on the tape substrate 13 again. [0037] The steps up to here are performed on a manufacturing line of a manufacturing company that manufactures a nonvolatile memory. In a production line in which the nonvolatile memory chip 3 is mounted on the module substrate 1, the module substrate 1 is separated into individual pieces, and then the module is mounted on the tape substrate 13 again using the holding portion 7 provided on the module substrate 1. Board 1 is connected. By mounting the module substrate 1 on the tape substrate 13 in this manner, the module substrate 1 can be shipped in the form of a tape to the production line of the manufacturer that manufactures the IC card. As a result, the problem of the product form of the product delivered between the manufacturing companies can be solved.

Here, in the non-volatile memory production line, the module substrate 1 is connected to the tape substrate 13 so that the module substrate 1 is separated into individual pieces and then shipped again in a tape form. Therefore, in the nonvolatile memory production line, it is conceivable that the module substrate 1 is not separated into individual pieces, but is shipped after the process is performed integrally with the rigid substrate 2. However, the following inconvenience arises if the module substrate 1 is not separated. That is, the electrical characteristic inspection of the nonvolatile memory basically has many test items and a long test time. For this reason, the module substrate 1 is separated into pieces, and a plurality of nonvolatile memories are simultaneously inspected in parallel. According to this method, when a defective product is found, the defective product is removed at that time, and a new module substrate 1 can be set in the vacant test socket by removing the defective product. For this reason, the electrical characteristic inspection can be performed efficiently.

[0039] On the other hand, in the state where the module substrate 1 is integrated with the rigid substrate 2, the electrical characteristics can be inspected only in series for the nonvolatile memories arranged in a tape shape. Inefficient with memory. In addition, even if a defective product is found as a result of the electrical characteristic inspection, it cannot be removed from the integrated rigid board 2, and the defective product is shipped as a connected product. . Furthermore, in the existing production line, the electrical property inspection is performed in the state of the individual module substrate 1! /, So the electrical property inspection is performed in the state of the integrated rigid substrate 2. To implement it, it is necessary to change the configuration to be different from the existing production line. For this reason, it is necessary to divide the module substrate 1 into pieces in the nonvolatile memory production line. Therefore, make an IC card In order to make the product form of the product delivered to the manufacturing company into a tape shape, as described in the present embodiment, using the holding part 7 of the separated module substrate 1, the tape is again formed. It is necessary to mount the module substrate 1 singulated on the circuit board 13.

[0040] In the present embodiment, an example in which the material of the tape substrate 13 is made of stainless steel is shown. However, the present invention is not limited to this. For example, the structure of a heat-resistant resin sheet or heat-resistant paper paper is used. You may do it. Heat resistance is required for the material of the tape substrate 13 because the tape substrate 13 must withstand the heating when sealing the IC card chip mounted on the module substrate 1 in the IC card manufacturing line described later. There is also some power. Therefore, the material of the tape substrate 13 is required to have heat resistance enough to withstand the heating when sealing the IC card chip. Here, when a resin sheet, heat-resistant paper or non-woven cloth is used as the tape substrate 13, the connection between the tape substrate 13 and the separated module substrate 1 is not a mechanical connection. For example, an adhesive is used. It can be a connection. Further, instead of an adhesive, a tape-like substrate can be fused and connected.

Next, a process for manufacturing an IC card using the tape substrate 13 to which a plurality of module substrates 1 are connected will be described. This powerful process is carried out on the production line of the manufacturer that manufactures IC cards.

As shown in FIG. 10, IC force chip 15 is mounted on each module substrate 1 connected to tape substrate 13. The IC card chip 15 is mounted in the IC card chip mounting area of the module substrate 1. Then, as shown in FIG. 11, the IC card chip 15 and the electrode 8 are electrically connected using a bonding wire 16. The bonding wire 16 is made of, for example, a gold wire.

Next, as shown in FIG. 12, the IC card chip 15 and the bonding wire 16 are sealed with a resin 17. Sealing with the resin 17 can use, for example, a transfer molding method. At this time, the runner Z gate portion into which the resin 17 flows can be formed in the holding portion 7 of the module substrate 1. As shown in FIG. 7, since the conductor pattern 12 made of a gold film is formed on the holding portion 7, the releasability of the resin 17 formed on the runner Z gate portion of the holding portion 7 is improved. Can do. The resin 17 is, for example, injected into the runner Z gate portion formed in the holding portion 7 from the upper direction of the module substrate 1. It is formed so as to cover the IC card chip 15 mounted on the module substrate 1 from the cover part cover.

Subsequently, as shown in FIG. 13, the individual module substrates 1 are separated from the tape substrate 13 to which the module substrate 1 is connected. At this time, the module substrate 1 is cut at the connection portion between the holding unit 7 and the module substrate 1. As a cutting method for cutting both the module substrate 1 and the resin 17, for example, a method using a mold, a water jet method, or a cutting method using a diamond saw can be used.

Next, an IC card as shown in FIGS. 14 and 15 can be manufactured by embedding the module substrate 1 singulated into a plastic card substrate 18. FIG. 14 is a view showing one side of the completed IC card, and FIG. 15 is a view showing the side opposite to FIG.

In the module structure of the present embodiment, the sealing portion in the region where the nonvolatile memory chip and its controller are mounted is separated from the sealing portion in the region where the IC card chip is mounted. Thereby, it has the characteristic that the softness | flexibility with respect to the bending of a card | curd can be improved.

[0047] According to the present embodiment, a nonvolatile memory chip is mounted on a module substrate on a nonvolatile memory production line, and the module substrate is separated into pieces. At this time, the module substrate is provided with a holding portion, and after the electrical characteristic inspection is performed, the module substrate is connected to the tape substrate using the holding portion. Then, the module board integrated in a tape shape is shipped to the IC card production line. After that, in the IC card production line, the IC card is manufactured using a module substrate integrated in a tape shape. Therefore, since existing facilities can be used in both the nonvolatile memory production line and the IC card production line, an IC card equipped with the nonvolatile memory can be efficiently produced. Ie

In the existing nonvolatile memory production line, individual module boards are shipped, and in the existing IC card production line, a module board integrated in a tape shape is used. IC card is manufactured. At this time, when transferring the module substrate from the nonvolatile memory production line to the IC card production line, it is desirable to deliver the module substrate with a tape substrate in which the module substrate is integrated, but the module substrate is separated into pieces. Because It becomes a problem. However, in the present embodiment, the separated module substrate is integrated with the tape substrate by the holding portion. Therefore, after performing the process by the non-volatile memory production line, a plurality of module substrates are provided. The module board can be delivered to the IC card production line in a tape-like state.

[0048] In the present embodiment, it is described that the process up to the step of connecting the module substrate to the tape substrate by the holding unit in the production line of the nonvolatile memory is described. However, in the non-volatile memory production line, the electrical characteristics of the non-volatile memory are also inspected, and the process of connecting the separated module board to the tape board with the holding part is performed on the IC card production line. You may rub. This non-volatile memory electrical characteristic test can be omitted if necessary.

[0049] Next, IC card chip 20 (corresponding to IC card chip 15 in FIG. 10), nonvolatile memory chip 21 (corresponding to nonvolatile memory chip 3 in FIG. 7), and controller chip 22 (controller chip in FIG. 7) 4) will be described.

On the main surface of the nonvolatile memory chip 21, for example, a nonvolatile memory circuit such as a flash memory capable of electrically erasing and writing data is formed. The storage capacity of the nonvolatile memory chip 21 is larger than that of the memory parts of the other IC card chip 20 and controller chip 22. The bonding node on the main surface of the nonvolatile memory chip 21 is electrically connected to the module substrate through bonding wires. The bonding wire also has, for example, gold (Au) fine wire equal force. A plurality of memory cells constituting the memory circuit of the non-volatile memory chip 21 increase the threshold voltage when electrons are injected into, for example, the floating gate of the memory cell, and also pull out the electrons at the floating gate. And the threshold voltage is lowered. The memory cell stores information corresponding to the level of the threshold voltage with respect to the word line voltage for reading data. Although not particularly limited, for example, the threshold voltage of the memory cell transistor is low, the state is the erase state, and the state is the high state.

[0051] On the main surface of the IC card chip 20, for example, an IC card microcomputer circuit is formed. This IC card microcomputer circuit has a function as a security controller. For example, it is an ISOZIEC 15408 evaluation / certification body that can be used for electronic payment services. Authenticated function by is realized. This IC card microcomputer circuit is, for example, CPU (Central Processing Unit), Mask ROM (Read Only Memory), RAM (Random Access Memory), EEPROM (Electrically Erasable Programmable ROM) and other arithmetic circuits It has the integrated circuit like. The mask ROM stores, for example, execution programs and encryption algorithms. The RAM has a function as a memory for data processing, for example. The EEPROM also functions as a data storage memory. When an authentication request is received from the host, the IC card on which this IC card chip 20 is mounted sends a predetermined authentication certificate stored in the EEPROM and is subject to subsequent authentication on the condition that authentication is obtained. Communication processing is now possible. Such a security processing operation program is owned by Mask ROM!

FIG. 16 shows an example of an IC card microcomputer circuit in the IC card chip 20. IC card microcomputer circuit is CPU20a, RAM20b as work RAM, timer 20c, EEPRO M20d, coprocessor unit 20e, mask ROM20f, system control logic 20g, I / O port (IZO port) 20h, data bus 20i and address bus 20j have.

The mask ROM 20f is used to store an operation program (encryption program, decryption program, interface control program, etc.) and data of the CPU 20a. The RAM 20b is a work area of the CPU 20a or a temporary storage area for data, and is composed of, for example, SRAM or DRAM. When an IC card command is supplied to the IZO port 20h, the system control logic 20g decodes this and causes the CPU 20a to execute a processing program necessary for executing the command. That is, the CPU 20a fetches an instruction by accessing the mask ROM 20f at an address instructed by the system control logic 20g, decodes the fetched instruction, and performs operand fetch and data operation based on the decoding result. The coprocessor unit 20e performs a remainder calculation process in RSA or elliptic curve cryptography according to the control of the CPU 20a.

[0054] The IZO port 20h has a 1-bit input / output terminal IZO, and is also used for data input / output and external interrupt signal input. The I / O port 20h is coupled to the data bus 20i and is connected to the data bus 20i. CPU 20a, RAM 20b, timer 20c, EEPROM 20d and coprocessor The subunit 20e etc. are electrically connected.

[0055] The system control logic 20g controls the operation mode and interrupt of the IC card microcomputer circuit, and further includes a random number generation logic used to generate an encryption key. When the reset operation is instructed by the reset signal ZRES, the IC card microcomputer circuit is initialized, and the CPU 20a starts executing the instruction from the start address of the program in the EEPROM 20d. The IC card microcomputer circuit operates in synchronization with the clock signal CLK.

The EEPROM 20d is electrically erasable and writable, and is used as an area for storing data such as ID (Identification) information and an authentication certificate used for identifying an individual. A flash memory or a ferroelectric memory may be used instead of the EEPRPM20d. The IC card microcomputer circuit supports a contact interface that uses an external terminal to interface with the outside.

Next, for example, an interface controller circuit is formed on the main surface of the controller chip 22. The interface controller circuit has a function of controlling an external interface operation and a memory interface operation in accordance with a control mode according to an instruction from the outside or a setting determined in advance inside. The function of the interface controller circuit recognizes the memory card interface control mode according to the state of commands and buses exchanged with external devices via the external connection terminals. It also switches the bus width according to the recognized memory card interface control mode and converts the data format according to the recognized memory card interface control mode. Furthermore, it performs a power-on reset function, interface control with the IC card microcomputer circuit in the IC card chip 20, interface control with the memory circuit in the nonvolatile memory chip 21, power supply voltage conversion, and the like. These operations may be performed in whole or in part depending on the purpose of use.

FIG. 17 shows an example of the interface controller circuit 22. A memory circuit 21a in FIG. 17 indicates a memory circuit formed in the nonvolatile memory chip 21.

[0059] The interface controller circuit 22 has a host interface circuit 22a, a micro computer 22b, a flash controller 22c, a buffer controller 22d, a buffer memory 22e, and an IC card interface circuit 22f. The buffer memory 22e is composed of DRAM or SRAM. IC card interface circuit 22f has IC card microcomputer Circuit 20 is electrically connected. The microcomputer 22b has a CPU (central processing unit) 2 2b 1, a program memory (PGM) 22b2 that holds an operation program for the CPU 22bl, a work memory (WRAM) 22b3 used for a work area of the CPU 22bl, and the like.

[0060] When the host interface circuit 22a detects the issuance of a memory card initialize command or the like, the host interface circuit 22a makes it possible to execute an interface control mode control program corresponding to the microcomputer 22b by an interrupt. The microcomputer 22b controls the external interface operation by the host interface circuit 22a by executing its control program. It also controls access (write, erase and read operations) and data management to the memory circuit 21a by the flash controller 22c, and the data format specific to the memory card by the buffer controller 22d and the common data format for the memory. Controls format conversion between. The data read from the memory circuit 21a or the data written to the memory circuit 21a is temporarily stored in the nother memory 22e. The flash controller 22c can operate the memory circuit 21a as a hard disk compatible file memory and manage data in units of sectors. The flash controller 22c includes an ECC circuit (not shown), adds an ECC code when storing data in the memory circuit 21a, and performs error detection and correction processing using the ECC code on the read data. It is also possible to omit the IC card interface 22f according to the purpose of use.

Next, a modification of the present embodiment will be described.

FIG. 18 is a diagram for explaining an example in which the method of connecting the separated module substrate 1 and the tape substrate 13 is changed. FIG. 9 shows an example in which the holding portion 7 provided on the module substrate 1 is connected to the upper portion of the holding portion 14 provided on the tape substrate 13. On the other hand, in FIG. 18, the holding part 7 provided on the module substrate 1 is connected so as to be covered with the holding part 14 provided on the tape substrate 13. By connecting in this way, when the IC card chip mounted on the module substrate 1 is sealed with a resin, a runner Z gate into which the resin flows can be formed in a horizontal direction along the tape substrate 13. it can. Since the tape substrate 13 is made of a metal material such as stainless steel, for example, it is possible to prevent grease leakage even if a runner Z-gate is formed on the tape substrate 13 with high processing accuracy. It is. Note that, since the holding portion 7 formed on the module substrate 1 is made of, for example, a resin, the variation in the thickness becomes large. For this reason, when sealing with grease, it is necessary to prevent leakage of grease by suppressing it with a movable plate that absorbs variations in thickness from the back side of the holding portion 7.

FIG. 19 is a diagram for explaining an example in which the shape of the holding portion 7 provided on the separated module substrate 1 is a letter shape. As shown in FIG. 19, through-holes 26 are provided in a T-shaped holding portion 7, and individual module substrates 1 are connected by passing connection members 27 through the through-holes 26. Even with this configuration, it is possible to force the module substrate 1 together. The configuration shown in FIG. 19 has an advantage that it is not necessary to prepare a new tape substrate because the holding unit 7 itself has a role as a tape substrate in which the holding unit 7 is integrated. The connecting member 27 can also constitute a metal material force, for example. In addition to the through hole 26 described above, the holding portion 7 is provided with a transport hole 26a.

FIG. 20 is a cross-sectional view showing a cross section taken along line AA in FIG. As shown in FIG. 20, it can be seen that the connecting member 27 is inserted into the through hole 26 provided in the holding portion 7 and is pressed. A method of connecting the holding portion 7 provided with the through hole 26 with the connecting member 27 will be described with reference to FIG. As shown in FIG. 21 (a), a U-shaped connecting member 27 is inserted into through holes 26 formed in different holding portions 7. Then, as shown in FIG. 21 (b), the upper part of the inserted connecting member 27 is bent to caulk the connecting member 27. In this way, a plurality of module substrates can be connected using the T-shaped holding portion 7.

FIG. 22 is a view showing an example in which a step (offset) 28 is provided in the holding portion 14 of the tape substrate 13. As shown in FIG. 22, when the holding portion 14 is provided with a step 28, the step 28 increases the thickness of the holding portion of the module substrate when the holding portion of the module substrate and the holding portion 14 of the tape substrate 13 are connected. Since absorption is possible, the surface of the module substrate and the height of the tape substrate 13 can be aligned.

FIG. 23 is a diagram showing another method of connecting the holding unit 7 of the module substrate 1 and the holding unit 14 of the tape substrate 13. As shown in FIG. 23, a through hole 29 is provided in the holding portion 7 provided in the module substrate 1. Then, the protruding holding portion 14 is inserted into the through hole 29. Then, the holding part 7 and the holding part 14 are connected by bending. With this configuration, a plurality of module substrates 1 can be connected to the tape substrate 13.

[0067] While the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. There's nothing wrong!

In the above-described embodiment, an example in which a non-volatile memory production line and an IC card production line in another company are used has been described. For example, a non-volatile memory production line and an IC card in the same company are used. The present invention can also be applied when using a production line. Industrial applicability

[0069] The present invention can be widely used in the manufacturing industry for manufacturing IC cards equipped with nonvolatile memory chips.

Claims

The scope of the claims

[I] (a) preparing a wiring board in which a plurality of module boards are integrated;

(b) mounting a semiconductor chip on each of the module substrates;

(c) electrically connecting the module substrate and the semiconductor chip;

(d) a step of dividing the module substrate into individual pieces of the module substrate, and the step (d) is divided into pieces including the module substrate force and the holding portion protruding. A method for manufacturing a semiconductor device.

2. The method for manufacturing a semiconductor device according to claim 1, further comprising a step of sealing the semiconductor chip.

[3] The method for manufacturing a semiconductor device according to [1], further comprising a step of performing an electrical characteristic inspection of the semiconductor chip mounted on the individual module substrate.

[4] The semiconductor device according to claim 1, further comprising a step of connecting a plurality of the module substrates to a tape substrate using the holding portion in the module substrate separated into pieces. Production method.

5. The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate is provided with a space in a mounting region of the module substrate by punching a hoop material.

6. The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate is used in an IC card manufacturing process.

7. The method for manufacturing a semiconductor device according to claim 4, wherein the tape substrate has heat resistance.

8. The method for manufacturing a semiconductor device according to claim 4, wherein the module substrate and the tape substrate are mechanically connected.

9. The method of manufacturing a semiconductor device according to claim 4, wherein the module substrate and the tape substrate are connected by an adhesive or fusion.

10. The method for manufacturing a semiconductor device according to claim 4, wherein the tape substrate is made of metal.

[II] The tape substrate according to claim 4, wherein the tape substrate comprises a resin sheet. Semiconductor device manufacturing method.

12. The method for manufacturing a semiconductor device according to claim 4, wherein the tape substrate is made of heat-resistant paper or non-woven cloth.

13. The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor chip includes a nonvolatile memory chip and a controller chip that controls the nonvolatile memory chip.

14. The method for manufacturing a semiconductor device according to claim 2, wherein the module substrate is partially sealed.

15. The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor chip is mounted at a position according to one side of the module substrate.

[16] One corner of the module substrate is chamfered, and the semiconductor chip is a region opposite to a region where the corner is chamfered with respect to the center of the module substrate. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the method is mounted on a semiconductor device.

17. The method for manufacturing a semiconductor device according to claim 1, wherein an area for mounting an IC card chip different from the semiconductor chip is secured on the module substrate.

18. The method for manufacturing a semiconductor device according to claim 17, wherein a pattern for mounting the IC card chip is formed on the module substrate.

19. The method for manufacturing a semiconductor device according to claim 1, wherein a conductor pattern is formed in the holding portion.

20. The method for manufacturing a semiconductor device according to claim 19, wherein the conductor pattern is formed of a gold film.

21. The semiconductor device according to claim 4, further comprising a step of mounting an IC card chip different from the semiconductor chip on the module substrate in a state where a plurality of the module substrates are connected to the tape substrate. Manufacturing method.

22. The method for manufacturing a semiconductor device according to claim 21, further comprising a step of sealing the IC card chip with a resin.

[23] The module substrate is separated into pieces by cutting between the module substrate and the holding portion. 23. The method of manufacturing a semiconductor device according to claim 22, further comprising a step of:

24. The semiconductor device according to claim 23, wherein a cutting method using a mold, a water jet method, or a cutting method using a diamond saw is used for cutting the module substrate and the holding portion. Manufacturing method.

[25] (a) a module substrate;

(b) a semiconductor chip mounted on the module substrate;

(c) A semiconductor device comprising a holding portion protruding from the module substrate force.

26. The semiconductor device according to claim 25, wherein the semiconductor chip is sealed.

27. The semiconductor device according to claim 26, wherein the semiconductor chip includes a non-volatile memory chip and a controller chip that controls the non-volatile memory chip.

28. The semiconductor device according to claim 25, wherein the holding portion is formed with a through hole.

29. The semiconductor device according to claim 28, wherein the holding portion has a T shape.

[30] The semiconductor device further includes:

26. The semiconductor device according to claim 25, further comprising: an IC chip mounted on the module substrate in a region different from a region where the semiconductor chip is mounted.