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WO2007088647A1 - Method of mounting electric part - Google Patents

Method of mounting electric part Download PDF

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Publication number
WO2007088647A1
WO2007088647A1 PCT/JP2006/314642 JP2006314642W WO2007088647A1 WO 2007088647 A1 WO2007088647 A1 WO 2007088647A1 JP 2006314642 W JP2006314642 W JP 2006314642W WO 2007088647 A1 WO2007088647 A1 WO 2007088647A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
wiring board
anisotropic conductive
conductive adhesive
adhesive
Prior art date
Application number
PCT/JP2006/314642
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Matsumura
Hisashi Ando
Shiyuki Kanisawa
Yasuhiro Suga
Kazuaki Suzuki
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006024586A external-priority patent/JP2006245554A/en
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to KR1020087019929A priority Critical patent/KR101271939B1/en
Publication of WO2007088647A1 publication Critical patent/WO2007088647A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H01L2224/75316—Elastomer inlay with retaining mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to a technique for mounting an electrical component such as a semiconductor chip or a flexible printed wiring board on a wiring board, and more particularly to a technology for mounting an electrical component using an adhesive.
  • COG COG ON GLASS
  • COF CHP ON FLEX
  • a predetermined glass substrate 101 provided with an LCD panel is provided.
  • An anisotropic conductive adhesive film 104 is placed in the mounting area 10 la, and an IC chip 105 or a flexible printed wiring board 106 is mounted thereon.
  • a flat crimping head (not shown) is used to place the IC chip 105.
  • Etc. are pressurized and heated to cure the anisotropic conductive adhesive film 104 and perform thermocompression mounting.
  • the area around the mounted IC chip 105 and flexible printed wiring board 106 is sealed with a sealing resin in order to prevent corrosion of the ITO electrode on the glass substrate 101. Yes.
  • the present invention has been made in order to solve the problems of the conventional technology, and provides a mounting method capable of efficiently mounting electrical components of different mounting methods using an adhesive. With the goal.
  • thermocompression bonding head having a compression bonding member made of a predetermined elastomer on the head body. Then, after the adhesive is entirely disposed in the mounting region on the wiring board, the thermocompression bonding is performed, in which electric components of different mounting methods are disposed in the mounting region, and the pressure bonding member has a size corresponding to the adhesive.
  • the method includes a step of collectively thermocompression bonding the electrical components using a head.
  • a COG type electrical component is used as the electrical component.
  • an FOG type electrical component is used as the electrical component.
  • an anisotropic conductive adhesive is used as the adhesive.
  • the wiring substrate is a glass substrate for a liquid crystal display device.
  • mounting may be performed by arranging a plurality of adhesives on the entire mounting region on the wiring board.
  • belt-shaped adhesive agent in the said invention, can also be used as said adhesive agent.
  • the present invention performs thermocompression bonding with an elastic pressure-bonding member having a predetermined elastomeric force.
  • a plurality of electrical components having different heights can be collectively packaged with high reliability. Therefore, after the adhesive is completely disposed in the mounting area on the wiring board, electric components of different mounting methods (for example, COG method, FOG method) are disposed in the mounting area and correspond to the adhesive.
  • COG method COG method
  • FOG method FOG method
  • the present invention it is also possible to provide a sealing function for, for example, an ITO electrode by curing the adhesive disposed entirely on the mounting region on the wiring board by thermocompression bonding.
  • the conventional sealing process can be omitted.
  • the number of steps can be greatly reduced, so that, for example, the efficiency of mounting using an anisotropic conductive adhesive when manufacturing a liquid crystal display device is greatly increased. It becomes possible to improve.
  • FIG. 1] (a) to (d) are partial cross-sectional explanatory views showing steps of an embodiment of the present invention.
  • FIG. 2 is a perspective view showing a main part of the present embodiment.
  • FIG. 3 is a partial cross-sectional explanatory view showing a main part of another embodiment of the present invention.
  • FIGS. 4 (a) and 4 (b) are partial cross-sectional explanatory views showing the main parts of another embodiment of the present invention.
  • FIG. 5 is a perspective view showing a main part of the same embodiment.
  • FIG. 6 (a) and (b) are perspective views showing an example of a conventional mounting method.
  • Anisotropic conductive adhesive film (Anisotropic conductive adhesive)
  • FIGS. L (a) to (d) are partial cross-sectional explanatory views showing the steps of the present embodiment, and FIG. 2 is a perspective view showing the main part of the same embodiment.
  • a glass substrate (wiring substrate) 1 on which an unillustrated wiring pattern is formed and an LCD panel 2 is provided is prepared.
  • the glass substrate 1 is placed on a base (not shown), and a heater 1 is provided in the base.
  • anisotropic conductive adhesive film (anisotropic conductive adhesive) 4 is stuck on the entire mounting region 3 of the glass substrate 1.
  • This anisotropic conductive adhesive film 4 is one in which conductive particles are dispersed in a binder resin.
  • the melt viscosity as the adhesive handled in the present invention is not affected by whether or not the conductive particles are dispersed.
  • an IC chip 5 which is a COG-type electrical component, for example, is mounted on a predetermined position of the anisotropic conductive adhesive film 4 and temporarily crimped.
  • the edge of one side of the anisotropic conductive adhesive film 4 is mounted with the edge of the flexible printed wiring board 6 that is, for example, an FOG type electric component. Decide the position and perform temporary crimping.
  • thermocompression bonding head 7 the IC chip 5 and the flexible printed wiring board 6 are collectively bonded together using the thermocompression bonding head 7.
  • thermocompression bonding head 7 has a head main body 8 made of a predetermined metal, and a heater for heating (not shown) is provided therein.
  • a concave portion 8a is provided in a portion of the head body 8 facing the glass substrate 1, and a crimp member 9 made of a plate-like elastomer is attached to the concave portion 8a so as to be in close contact with the inner wall of each concave portion 8a. It has been.
  • the crimping member 9 of the present embodiment is arranged so that the planar crimping surface 9a is horizontal. Then, the crimping surface 9a of the crimping member 9 is slightly larger than the size of the anisotropic conductive adhesive film 4, for example, so as to correspond to the size of the anisotropic conductive adhesive film 4 on the mounting region 3 of the glass substrate 1. It is structured as follows.
  • the thickness of the crimping member 9 has the largest thickness among the electrical components from the viewpoint of pressing the top of each electrical component and the fillet portion of the adhesive during thermocompression bonding with an optimum pressure.
  • U preferably set to be equal to or better than the ones.
  • the type of elastomer of the pressure-bonding member 9 is not particularly limited, but from the viewpoint of improving the connection reliability, one having a rubber hardness of 40 or more and 80 or less is used. It is preferable.
  • Elastomers with a rubber hardness of less than 40 have the disadvantage that the pressure on each electrical component is insufficient and the initial resistance and connection reliability are inferior.
  • Elastomers with a rubber hardness of more than 80 have a pressure on the fillet part. Inadequate, and voids are generated in the binder resin of the adhesive, resulting in inferior connection reliability.
  • JIS S 6050 describes the following method for measuring rubber hardness.
  • the measurement location of the test piece is divided into three equal parts, and each central part is measured one by one, and the median value is taken as the hardness of the test piece.
  • Remark 1 The height of the push needle is 2.54 ⁇ 0.02mm when the scale force is 0, and Omm when the scale is 100.
  • Remark 2 The scale force is related to the force of the needle (N). 0 0 0.54, 10 1. 32, 2 0 2. 2. 11, 25 2. 2. 50, 30 2. 89, 40 3. 68, 50 4.46, 60 0 5.25, 70 6.03, 75 6.42, 80 6.82, 90 7.60, 10:00 8. 39.
  • silicone rubber From the viewpoint of 1S heat resistance and pressure resistance, it is preferable to use silicone rubber.
  • thermocompression bonding head 7 Using such a thermocompression bonding head 7, the pressure bonding surface 9a of the thermocompression bonding head 7 is pressed against the tops of the IC chip 5 and the flexible printed wiring board 6 through a protective film (not shown), and the main compression bonding is performed under the following conditions. I do.
  • each electrical component side is kept at a predetermined temperature during the main crimping. It is preferable to heat the glass substrate 1 and heat the glass substrate 1 side at a temperature higher than the predetermined temperature described above.
  • the heater of the thermocompression bonding head 7 is controlled so that the temperature of the pressure bonding member 9 is about 100 ° C, and the temperature of the binder resin of the anisotropic conductive adhesive film is about 200 ° C.
  • the base heater is controlled so that
  • the adhesive anisotropic conductive adhesive film 4 has a melt viscosity of 1.
  • melt viscosity of the anisotropic conductive adhesive film 4 at the time of thermocompression bonding is less than 1.
  • OX 10 2 mPa-s there is a void with a large fluidity of the binder resin at the time of thermocompression bonding. If the melt viscosity is greater than 1.
  • OX 10 5 mPa's the binder resin cannot be completely removed at the connection part during thermocompression bonding, resulting in voids. Inferior initial resistance and connection reliability are disadvantageous.
  • the pressure at the time of final crimping is about 100N for each electrical component and about 15 seconds.
  • the top of the IC chip 5 and the flexible printed wiring board 6 is pressed against the glass substrate 1 with a predetermined pressure by applying pressure with the above-described pressure-bonding member 9 made of elastomer.
  • the adhesive fillet portion on the side of the IC chip 5 and the flexible printed wiring board 6 can be pressed with a pressure smaller than the pressure applied to the top portion, whereby the IC chip 5 and the flexible printed wiring board 6 and the glass can be pressed.
  • Board 1 While sufficient pressure can be applied to the connection portion, the fillet portions around the IC chip 5 and the flexible printed wiring board 6 can be pressurized so as not to generate voids.
  • each mounting process (adhesive placement, provisional pressure bonding, main pressure bonding), which has been conventionally performed for each IC chip 5 and flexible printed wiring board 6, can be performed at once. Become ⁇ .
  • the binding force of the anisotropic conductive adhesive film 4 disposed entirely on the mounting region 3 on the glass substrate 1 is cured by thermocompression bonding.
  • the number of steps can be greatly reduced, so that the efficiency of mounting using an anisotropic conductive adhesive in manufacturing a liquid crystal display device is greatly increased. Can be improved.
  • the other electrical components 10 are also temporarily crimped in the same manner as the IC chip 5 and the flexible printed wiring board 6 and are collectively crimped together under the same conditions as in the above embodiment.
  • FIG. 4 (a) and 4 (b) are explanatory views showing the main part of another embodiment of the present invention, and FIG. It is a perspective view which shows the principal part of a form,
  • symbol is attached
  • the anisotropic conductive adhesive a plurality (three in this example) of strip-shaped anisotropic conductive materials are used. Adhesive adhesive films 4a, 4b, and 4c are used, and these strip-like anisotropic conductive adhesive films 4a to 4c are adhered to the mounting region 3 of the glass substrate 1 over the entire surface.
  • the anisotropic conductive adhesive films 4a to 4c are arranged as close as possible. It is preferable.
  • each anisotropic conductive adhesive film 4a, 4b, 4c is not particularly limited, but the viewpoint power to improve the connection reliability depends on the optimum condition according to the electric component to be mounted. It is preferable to select one (binder material, conductive particle type, film size, thickness, etc.).
  • the pressure-bonding surface 9a of the thermocompression bonding head 7 corresponds to the overall size of the anisotropic conductive adhesive films 4a to 4c on the mounting region 3 of the glass substrate 1.
  • the size of the anisotropic conductive adhesive films 4a to 4c should be slightly larger than the size of the pasting area.
  • a plurality of IC chips 5 and other electrical components 10 are mounted side by side on the anisotropic conductive adhesive films 4a and 4b, and each is temporarily crimped. Mount the edge of the flexible printed wiring board 6 on the edge of the film 4c and perform temporary crimping. Thereafter, as in the above embodiment, the IC chip 5, other electrical components 10, and the flexible printed wiring board 6 are collectively pressure bonded together using the thermocompression bonding head 7.
  • the anisotropic conductivity under optimum conditions according to the electrical component to be mounted since mounting can be performed using the adhesive films 4a to 4c, connection reliability can be further improved. Since other configurations and operational effects are the same as those of the above-described embodiment, a detailed description thereof will be omitted.
  • a plurality of strip-shaped anisotropic conductive adhesive films are used. Although the case has been described as an example, the present invention is not limited to this, and a plurality of anisotropically conductive adhesive films having various shapes such as a square, a rectangle, and the like can also be used.
  • a strip-shaped anisotropic conductive adhesive film by using a strip-shaped anisotropic conductive adhesive film, a plurality of anisotropic conductive adhesive films can be arranged on the wiring board so as to avoid each alignment mark, so that mounting with higher accuracy is performed. be able to.
  • the pressure-bonding member of the thermocompression bonding head is not limited to the above-described embodiment, and various forms can be used.
  • one provided with a plurality of crimping members corresponding to the electrical component to be mounted can be used.
  • a frame or a protruding portion can be provided on the head main body, or a notch can be provided on the crimping member. Further, it is possible to adjust the pressing force by forming the gap by forming the crimping member with a plurality of blocks.
  • the present invention can be applied not only when mounting electrical components on a glass substrate for a liquid crystal display device but also when mounting electrical components on various wiring substrates.
  • the present invention can improve the mounting efficiency by reducing the number of man-hours when mounting electrical parts on a glass substrate for a liquid crystal display device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method of mounting in which electric parts of different mounting systems can be efficiently mounted with an adhesive. There is provided a method of mounting an electric part on glass substrate (1) with the use of thermocompression bonding head (7) including head main body (8) and, disposed thereon, compression bonding member (9) of given elastomer. This method comprises the step of arranging anisotropic conductive adhesive film (4) on the entire surface of mounting region (3) of the upper surface of glass substrate (1), thereafter superimposing electric parts of different mounting systems on the mounting region (3) and carrying out collective thermocompression bonding of the electric parts by the use of compression bonding member (9) with a size corresponding to that of the anisotropic conductive adhesive film (4). COG system IC chip (5) and FOG system flexible printed wiring board (6) can be appropriately used as the electric parts.

Description

明 細 書  Specification
電気部品の実装方法  Mounting method of electrical parts
技術分野  Technical field
[0001] 本発明は、例えば半導体チップやフレキシブルプリント配線板等の電気部品を配 線基板上に実装する技術に関し、特に接着剤を用いて電気部品を実装する技術に 関する。  The present invention relates to a technique for mounting an electrical component such as a semiconductor chip or a flexible printed wiring board on a wiring board, and more particularly to a technology for mounting an electrical component using an adhesive.
背景技術  Background art
[0002] 従来、 LCD基板等の基板上に ICチップ (ベアチップ)やフレキシブルプリント配線 板を直接実装する方法として、バインダ中に導電粒子を分散させた異方導電性接着 フィルムを用いる方法が知られて 、る。  Conventionally, as a method of directly mounting an IC chip (bare chip) or a flexible printed wiring board on a substrate such as an LCD substrate, a method using an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder is known. And
[0003] このような COG (CHIP ON GLASS)、 COF (CHIP ON FLEX)方式の実装では、例 えば図 6 (a) (b)に示すように、 LCDパネルを設けたガラス基板 101の所定の実装領 域 10 laに異方導電性接着フィルム 104を配置し、その上に ICチップ 105又はフレキ シブルプリント配線板 106を搭載した後に、平坦な圧着ヘッド（図示せず)を用いて I Cチップ 105等を加圧 ·加熱して異方導電性接着フィルム 104を硬化させて熱圧着 実装を行う。  In such COG (CHIP ON GLASS) and COF (CHIP ON FLEX) system implementations, for example, as shown in FIGS. 6 (a) and 6 (b), a predetermined glass substrate 101 provided with an LCD panel is provided. An anisotropic conductive adhesive film 104 is placed in the mounting area 10 la, and an IC chip 105 or a flexible printed wiring board 106 is mounted thereon. Then, a flat crimping head (not shown) is used to place the IC chip 105. Etc. are pressurized and heated to cure the anisotropic conductive adhesive film 104 and perform thermocompression mounting.
[0004] さらに、実装した ICチップ 105及びフレキシブルプリント配線板 106の周囲の領域 は、ガラス基板 101上の ITO電極の腐食を防止するため、封止榭脂を用いて封止を 行うようにしている。  [0004] Further, the area around the mounted IC chip 105 and flexible printed wiring board 106 is sealed with a sealing resin in order to prevent corrosion of the ITO electrode on the glass substrate 101. Yes.
[0005] し力しながら、このような従来の実装方法では、 COG実装、 FOG実装、封止工程と いう 3つの別個独立した工程が必要であり、実装効率が悪く改善が望まれている。 発明の開示  [0005] However, in such a conventional mounting method, three independent processes of COG mounting, FOG mounting, and sealing process are necessary, and the mounting efficiency is low and improvement is desired. Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0006] 本発明は、このような従来の技術の課題を解決するためになされたもので、接着剤 を用いて異なる実装方式の電気部品を効率良く実装することができる実装方法を提 供することを目的とする。 [0006] The present invention has been made in order to solve the problems of the conventional technology, and provides a mounting method capable of efficiently mounting electrical components of different mounting methods using an adhesive. With the goal.
課題を解決するための手段 [0007] 上記目的を達成するためになされた本発明は、ヘッド本体に所定のエラストマ一か らなる圧着部材を有する熱圧着ヘッドを用いて配線基板上に電気部品を実装する実 装方法であって、前記配線基板上の実装領域に接着剤を全面的に配置した後、異 なる実装方式の電気部品を前記実装領域に配置し、前記接着剤に対応する大きさ の圧着部材を有する熱圧着ヘッドを用いて前記電気部品を一括して熱圧着するェ 程を有するものである。 Means for solving the problem The present invention made to achieve the above object is an implementation method for mounting an electrical component on a wiring board using a thermocompression bonding head having a compression bonding member made of a predetermined elastomer on the head body. Then, after the adhesive is entirely disposed in the mounting region on the wiring board, the thermocompression bonding is performed, in which electric components of different mounting methods are disposed in the mounting region, and the pressure bonding member has a size corresponding to the adhesive. The method includes a step of collectively thermocompression bonding the electrical components using a head.
本発明では、前記発明において、前記電気部品として COG方式の電気部品を用 いることちでさる。  In the present invention, in the above invention, a COG type electrical component is used as the electrical component.
本発明では、前記発明において、前記電気部品として FOG方式の電気部品を用 いることちでさる。  In the present invention, in the above invention, an FOG type electrical component is used as the electrical component.
本発明では、前記発明において、前記接着剤として、異方導電性接着剤を用いる ものである。  In the present invention, in the above invention, an anisotropic conductive adhesive is used as the adhesive.
本発明では、前記発明において、前記配線基板を液晶表示装置用のガラス基板と することちでさる。  In the present invention, in the above invention, the wiring substrate is a glass substrate for a liquid crystal display device.
本発明では、前記発明において、前記配線基板上の実装領域に複数の接着剤を 全面的に配置して実装を行うこともできる。  In the present invention, in the above invention, mounting may be performed by arranging a plurality of adhesives on the entire mounting region on the wiring board.
本発明では、前記発明において、前記接着剤として、帯状の接着剤を用いることも できる。  In this invention, in the said invention, a strip | belt-shaped adhesive agent can also be used as said adhesive agent.
[0008] 本発明は、所定のエラストマ一力 なる弾性の圧着部材によって熱圧着を行うもの で、例えば高さの異なる電気部品に対し複数個一括して信頼性の高い熱圧着実装 を行うことができるから、配線基板上の実装領域に接着剤を全面的に配置した後、異 なる実装方式 (例えば、 COG方式、 FOG方式)の電気部品をこの実装領域に配置し 、前記接着剤に対応する大きさの熱圧着ヘッドを用いてこれら電気部品を一括して 熱圧着することによって、従来各実装方式の電気部品毎に行っていた各実装工程（ 接着剤の配置、仮圧着、本圧着)を一度で行うことが可能になる。  [0008] The present invention performs thermocompression bonding with an elastic pressure-bonding member having a predetermined elastomeric force. For example, a plurality of electrical components having different heights can be collectively packaged with high reliability. Therefore, after the adhesive is completely disposed in the mounting area on the wiring board, electric components of different mounting methods (for example, COG method, FOG method) are disposed in the mounting area and correspond to the adhesive. By using a large thermocompression bonding head to thermally bond these electrical components together, each mounting process (adhesive placement, temporary crimping, and final crimping) previously performed for each electrical component of each mounting system is performed. It can be done at once.
[0009] し力も、本発明においては、配線基板上の実装領域に全面的に配置した接着剤を 熱圧着により硬化させることによって、例えば ITO電極に対する封止機能を持たせる ことができ、その結果、従来の封止工程を省略することが可能になる。 [0010] このように、本発明によれば、工程数を大幅に削減することができるので、例えば液 晶表示装置の製造の際における異方導電性接着剤を用いた実装の効率を大幅に 向上させることが可能になる。 [0009] In the present invention, it is also possible to provide a sealing function for, for example, an ITO electrode by curing the adhesive disposed entirely on the mounting region on the wiring board by thermocompression bonding. The conventional sealing process can be omitted. [0010] Thus, according to the present invention, the number of steps can be greatly reduced, so that, for example, the efficiency of mounting using an anisotropic conductive adhesive when manufacturing a liquid crystal display device is greatly increased. It becomes possible to improve.
[0011] さらに、本発明において、配線基板上の実装領域に例えば帯状の複数の接着剤を 全面的に配置して実装を行うようにすれば、実装する電気部品に応じて最適の条件 の接着剤を用いて実装を行うことができるので、接続信頼性をより向上させることが可 會 になる。  [0011] Furthermore, in the present invention, if mounting is performed by arranging a plurality of, for example, a plurality of strip-like adhesives over the entire mounting area on the wiring board, adhesion under optimum conditions according to the electrical components to be mounted. Since mounting can be performed using an agent, connection reliability can be further improved.
発明の効果  The invention's effect
[0012] 本発明によれば、接着剤を用いて異なる実装方式の電気部品を効率良く実装する ことができる。  [0012] According to the present invention, it is possible to efficiently mount electrical components of different mounting methods using an adhesive.
図面の簡単な説明  Brief Description of Drawings
[0013] [図 l] (a)〜(d)：本発明の実施の形態の工程を示す部分断面説明図である。  [0013] [FIG. 1] (a) to (d) are partial cross-sectional explanatory views showing steps of an embodiment of the present invention.
[図 2]本実施の形態の要部を示す斜視図である。  FIG. 2 is a perspective view showing a main part of the present embodiment.
[図 3]本発明の他の実施の形態の要部を示す部分断面説明図である。  FIG. 3 is a partial cross-sectional explanatory view showing a main part of another embodiment of the present invention.
[図 4] (a) (b)：本発明の他の実施の形態を要部を示す部分断面説明図である。  FIGS. 4 (a) and 4 (b) are partial cross-sectional explanatory views showing the main parts of another embodiment of the present invention.
[図 5]同実施の形態の要部を示す斜視図である。  FIG. 5 is a perspective view showing a main part of the same embodiment.
[図 6] (a) (b)：従来の実装方法の例を示す斜視図である。  [FIG. 6] (a) and (b) are perspective views showing an example of a conventional mounting method.
符号の説明  Explanation of symbols
[0014] 1 · ·… ·ガラス基板 (配線基板） [0014] 1 · · · · Glass substrate (wiring substrate)
2…… LCDパネル 2  2 …… LCD panel 2
3……実装領域  3 …… Mounting area
4……異方導電性接着フィルム (異方導電性接着剤）  4 …… Anisotropic conductive adhesive film (Anisotropic conductive adhesive)
5…… ICチップ (電気部品）  5 …… IC chip (electrical part)
6……フレキシブルプリント配線板 (電気部品）  6 …… Flexible printed circuit board (electrical parts)
7……熱圧着ヘッド  7 …… Thermo-compression head
8 ヘッド本体  8 Head body
9……圧着部材  9 …… Crimping member
9a…圧着面 発明を実施するための最良の形態 9a… crimp surface BEST MODE FOR CARRYING OUT THE INVENTION
[0015] 以下、本発明に係る電気部品の実装方法の実施の形態を図面を参照して詳細に 説明する。  Hereinafter, an embodiment of an electrical component mounting method according to the present invention will be described in detail with reference to the drawings.
図 l (a)〜(d)は、本実施の形態の工程を示す部分断面説明図、図 2は、同実施の 形態の要部を示す斜視図である。  FIGS. L (a) to (d) are partial cross-sectional explanatory views showing the steps of the present embodiment, and FIG. 2 is a perspective view showing the main part of the same embodiment.
[0016] 図 1 (a)に示すように、本実施の形態においては、まず、図示しない配線パターンが 形成され LCDパネル 2が設けられたガラス基板 (配線基板） 1を用意する。 As shown in FIG. 1 (a), in the present embodiment, first, a glass substrate (wiring substrate) 1 on which an unillustrated wiring pattern is formed and an LCD panel 2 is provided is prepared.
[0017] ここで、ガラス基板 1は図示しない基台上に載置されており、この基台内にはヒータ 一が設けられている。 Here, the glass substrate 1 is placed on a base (not shown), and a heater 1 is provided in the base.
[0018] そして、このガラス基板 1の実装領域 3上に異方導電性接着フィルム (異方導電性 接着剤) 4を全面的に貼りつける。  [0018] Then, an anisotropic conductive adhesive film (anisotropic conductive adhesive) 4 is stuck on the entire mounting region 3 of the glass substrate 1.
[0019] この異方導電性接着フィルム 4は、結着榭脂中に導電粒子が分散されたものである This anisotropic conductive adhesive film 4 is one in which conductive particles are dispersed in a binder resin.
(詳細図示せず)。なお、結着榭脂中に分散させる導電粒子の量は少量であれば、 本発明で扱う接着剤としての溶融粘度は、導電粒子の分散の有無によって影響を及 ぼすことはない。  (Detail not shown). If the amount of the conductive particles dispersed in the binder resin is small, the melt viscosity as the adhesive handled in the present invention is not affected by whether or not the conductive particles are dispersed.
[0020] 次いで、図 1 (b)に示すように、この異方導電性接着フィルム 4の所定の位置に例え ば COG方式の電気部品である ICチップ 5を搭載して仮圧着を行う。  Next, as shown in FIG. 1 (b), an IC chip 5, which is a COG-type electrical component, for example, is mounted on a predetermined position of the anisotropic conductive adhesive film 4 and temporarily crimped.
[0021] そして、図 1 (c)に示すように、異方導電性接着フィルム 4の一方の端部側の縁部に 例えば FOG方式の電気部品であるフレキシブルプリント配線板 6の縁部を搭載し位 置決めして仮圧着を行う。 Then, as shown in FIG. 1 (c), the edge of one side of the anisotropic conductive adhesive film 4 is mounted with the edge of the flexible printed wiring board 6 that is, for example, an FOG type electric component. Decide the position and perform temporary crimping.
[0022] さらに、図 1 (d)及び図 2に示すように、熱圧着ヘッド 7を用いて ICチップ 5及びフレ キシブルプリント配線板 6の本圧着を一括して行う。 Furthermore, as shown in FIGS. 1D and 2, the IC chip 5 and the flexible printed wiring board 6 are collectively bonded together using the thermocompression bonding head 7.
[0023] ここで、熱圧着ヘッド 7は、所定の金属からなるヘッド本体 8を有し、その内部に、図 示しな 、加熱用のヒーターが設けられて 、る。 Here, the thermocompression bonding head 7 has a head main body 8 made of a predetermined metal, and a heater for heating (not shown) is provided therein.
[0024] また、ヘッド本体 8のガラス基板 1と対向する部分に凹部 8aが設けられ、この凹部 8a に、プレート状のエラストマ一からなる圧着部材 9が各凹部 8aの内壁に密着するよう に取り付けられている。 [0024] Further, a concave portion 8a is provided in a portion of the head body 8 facing the glass substrate 1, and a crimp member 9 made of a plate-like elastomer is attached to the concave portion 8a so as to be in close contact with the inner wall of each concave portion 8a. It has been.
[0025] 本実施の形態の圧着部材 9は、平面状の圧着面 9aが水平となるように配置される。 そして、圧着部材 9の圧着面 9aは、ガラス基板 1の実装領域 3上の異方導電性接着 フィルム 4の大きさに対応するように、例えば異方導電性接着フィルム 4の大きさより 若干大きくなるように構成されて 、る。 [0025] The crimping member 9 of the present embodiment is arranged so that the planar crimping surface 9a is horizontal. Then, the crimping surface 9a of the crimping member 9 is slightly larger than the size of the anisotropic conductive adhesive film 4, for example, so as to correspond to the size of the anisotropic conductive adhesive film 4 on the mounting region 3 of the glass substrate 1. It is structured as follows.
[0026] また、圧着部材 9の厚さは、各電気部品の頂部及び熱圧着時の接着剤のフィレット 部分に対して最適の圧力で加圧する観点から、電気部品のうち最大の厚さを有する ものと同等以上となるように設定することが好ま U、。 [0026] Further, the thickness of the crimping member 9 has the largest thickness among the electrical components from the viewpoint of pressing the top of each electrical component and the fillet portion of the adhesive during thermocompression bonding with an optimum pressure. U, preferably set to be equal to or better than the ones.
[0027] 一方、本発明の場合、圧着部材 9のエラストマ一の種類は特に限定されることはな いが、接続信頼性を向上させる観点からは、ゴム硬度が 40以上 80以下のものを用い ることが好ましい。 [0027] On the other hand, in the case of the present invention, the type of elastomer of the pressure-bonding member 9 is not particularly limited, but from the viewpoint of improving the connection reliability, one having a rubber hardness of 40 or more and 80 or less is used. It is preferable.
[0028] ゴム硬度が 40未満のエラストマ一は、各電気部品に対する圧力が不十分で初期抵 抗及び接続信頼性が劣るという不都合があり、ゴム硬度が 80より大きいエラストマ一 は、フィレット部分に対する圧力が不十分で接着剤の結着樹脂にボイドが発生して接 続信頼性が劣るという不都合がある。  [0028] Elastomers with a rubber hardness of less than 40 have the disadvantage that the pressure on each electrical component is insufficient and the initial resistance and connection reliability are inferior. Elastomers with a rubber hardness of more than 80 have a pressure on the fillet part. Inadequate, and voids are generated in the binder resin of the adhesive, resulting in inferior connection reliability.
[0029] なお、本明細書では、ゴム硬度として、 JIS S 6050に準拠する規格を適用するもの とする（温度条件は室温： 5〜35°C)。 [0029] In this specification, a standard conforming to JIS S 6050 is applied as the rubber hardness (temperature condition is room temperature: 5 to 35 ° C).
[0030] ここで、 JIS S 6050には、ゴム硬度の測定方法として、次のように記載されている。 [0030] Here, JIS S 6050 describes the following method for measuring rubber hardness.
すなわち、押針形状が直径 5. 08±0. 02mmの半球状のスプリング硬さ試験機を 用い、水平に保持した試験片の表面に、試験機の押針が鉛直になるようにして加圧 面を接触させ、直ちに目盛を正数で読み取る。  In other words, using a hemispherical spring hardness tester with a diameter of 5.08 ± 0.02mm, press the surface of the test piece held horizontally so that the push needle of the tester is vertical. Touch the surface and immediately read the scale with a positive number.
なお、試験片の測定箇所は表面の全体を 3等分しそれぞれの中央部分を 1か所ず つ測定して、その中央値を試験片の硬さとする。  In addition, the measurement location of the test piece is divided into three equal parts, and each central part is measured one by one, and the median value is taken as the hardness of the test piece.
備考 1 :押針の高さは、目盛力 のときに 2. 54±0. 02mm, 100のとき Ommである 備考 2 :目盛とば、ねの力（N)との関係は、目盛り力 ^0のとき 0. 54、 10のとき 1. 32、 2 0のとさ 2. 11、 25のとさ 2. 50、 30のとさ 2. 89、 40のとさ 3. 68、 50のとさ 4. 46、 6 0のとさ 5. 25、 70のとさ 6. 03、 75のとさ 6. 42、 80のとさ 6. 82、 90のとさ 7. 60、 1 00のとき 8. 39である。  Remark 1: The height of the push needle is 2.54 ± 0.02mm when the scale force is 0, and Omm when the scale is 100. Remark 2: The scale force is related to the force of the needle (N). 0 0 0.54, 10 1. 32, 2 0 2. 2. 11, 25 2. 2. 50, 30 2. 89, 40 3. 68, 50 4.46, 60 0 5.25, 70 6.03, 75 6.42, 80 6.82, 90 7.60, 10:00 8. 39.
なお、本発明者等の実験によれば、圧着部材 9を室温から 240°Cまで加熱した場 合に、そのエラストマ一のゴム硬度は殆ど変化しないことが確認されている（± 2程度According to the experiments by the present inventors, when the crimping member 9 is heated from room temperature to 240 ° C. In addition, it has been confirmed that the rubber hardness of the elastomer hardly changes (about ± 2
) o ) o
[0031] このようなエラストマ一としては、天然ゴム、合成ゴムのいずれも用いることができる [0031] As such an elastomer, either natural rubber or synthetic rubber can be used.
1S 耐熱性、耐圧性の観点からは、シリコーンゴムを用いることが好ましい。 From the viewpoint of 1S heat resistance and pressure resistance, it is preferable to use silicone rubber.
[0032] このような熱圧着ヘッド 7を用い、図示しない保護フィルムを介して ICチップ 5及びフ レキシブルプリント配線板 6の頂部に熱圧着ヘッド 7の圧着面 9aを押し付けて以下の 条件で本圧着を行う。  [0032] Using such a thermocompression bonding head 7, the pressure bonding surface 9a of the thermocompression bonding head 7 is pressed against the tops of the IC chip 5 and the flexible printed wiring board 6 through a protective film (not shown), and the main compression bonding is performed under the following conditions. I do.
[0033] 本発明の場合、各電気部品の周囲のフィレット部に対して十分に加熱してボイドの 発生を確実に防止する観点からは、本圧着の際に、各電気部品側を所定温度でカロ 熱するとともに、ガラス基板 1側を上述の所定温度より高い温度で加熱することが好ま しい。  [0033] In the case of the present invention, from the viewpoint of surely preventing the generation of voids by sufficiently heating the fillet portions around each electrical component, each electrical component side is kept at a predetermined temperature during the main crimping. It is preferable to heat the glass substrate 1 and heat the glass substrate 1 side at a temperature higher than the predetermined temperature described above.
[0034] 具体的には、圧着部材 9の温度が 100°C程度となるように熱圧着ヘッド 7のヒーター を制御し、異方導電性接着フィルムの結着樹脂の温度が 200°C程度になるように基 台のヒーターを制御する。  [0034] Specifically, the heater of the thermocompression bonding head 7 is controlled so that the temperature of the pressure bonding member 9 is about 100 ° C, and the temperature of the binder resin of the anisotropic conductive adhesive film is about 200 ° C. The base heater is controlled so that
[0035] これにより、当該熱圧着の際、接着剤異方導電性接着フィルム 4を、溶融粘度が 1.  [0035] Thereby, during the thermocompression bonding, the adhesive anisotropic conductive adhesive film 4 has a melt viscosity of 1.
O X 102mPa' s以上 1. O X 105mPa' s以下となるように加熱する。 OX 10 2 mPa 's or more 1. Heat to OX 10 5 mPa' s or less.
[0036] ここで、熱圧着の際の異方導電性接着フィルム 4の溶融粘度が 1. O X 102mPa- s 未満の場合は、熱圧着時の結着樹脂の流動性が大きぐボイドが発生して初期抵抗 及び接続信頼性が劣るという不都合があり、溶融粘度が 1. O X 105mPa' sより大きい 場合は、熱圧着時に接続部分において結着樹脂が排除しきれず、ボイドが発生して 初期抵抗及び接続信頼性が劣ると ヽぅ不都合がある。 [0036] Here, when the melt viscosity of the anisotropic conductive adhesive film 4 at the time of thermocompression bonding is less than 1. OX 10 2 mPa-s, there is a void with a large fluidity of the binder resin at the time of thermocompression bonding. If the melt viscosity is greater than 1. OX 10 5 mPa's, the binder resin cannot be completely removed at the connection part during thermocompression bonding, resulting in voids. Inferior initial resistance and connection reliability are disadvantageous.
なお、本圧着時の圧力は、各電気部品について、 1個当たり 100N程度で 15秒程 度とする。  The pressure at the time of final crimping is about 100N for each electrical component and about 15 seconds.
[0037] 本実施の形態においては、上述したエラストマ一からなる圧着部材 9によって加圧 を行うことによって、 ICチップ 5及びフレキシブルプリント配線板 6の頂部をガラス基板 1に対して所定の圧力で押圧する一方、 ICチップ 5及びフレキシブルプリント配線板 6の側部の接着剤フィレット部を上記頂部に対する圧力より小さい圧力で押圧するこ とができ、これにより、 ICチップ 5及びフレキシブルプリント配線板 6とガラス基板 1の 接続部分に対して十分な圧力を加えることができる一方で、 ICチップ 5及びフレキシ ブルプリント配線板 6の周囲のフィレット部に対してもボイドの生じないように加圧する ことができる。 In the present embodiment, the top of the IC chip 5 and the flexible printed wiring board 6 is pressed against the glass substrate 1 with a predetermined pressure by applying pressure with the above-described pressure-bonding member 9 made of elastomer. On the other hand, the adhesive fillet portion on the side of the IC chip 5 and the flexible printed wiring board 6 can be pressed with a pressure smaller than the pressure applied to the top portion, whereby the IC chip 5 and the flexible printed wiring board 6 and the glass can be pressed. Board 1 While sufficient pressure can be applied to the connection portion, the fillet portions around the IC chip 5 and the flexible printed wiring board 6 can be pressurized so as not to generate voids.
[0038] その結果、本実施の形態によれば、異なる実装方式の ICチップ 5及びフレキシブル プリント配線板 6に対し、異方導電性接着フィルム 4を用いて高信頼性の接続を行うこ とがでさる。  As a result, according to the present embodiment, it is possible to connect the IC chip 5 and the flexible printed wiring board 6 of different mounting methods with high reliability using the anisotropic conductive adhesive film 4. I'll do it.
[0039] そして、本実施の形態によれば、従来 ICチップ 5及びフレキシブルプリント配線板 6 毎に行っていた各実装工程 (接着剤の配置、仮圧着、本圧着)を一度で行うことが可 會 になる。  [0039] Then, according to the present embodiment, each mounting process (adhesive placement, provisional pressure bonding, main pressure bonding), which has been conventionally performed for each IC chip 5 and flexible printed wiring board 6, can be performed at once. Become 會.
[0040] し力も、本実施の形態においては、ガラス基板 1上の実装領域 3に全面的に配置し た異方導電性接着フィルム 4の結着榭脂を熱圧着により硬化させることによって、これ に ITO電極に対する封止機能を持たせることができ、その結果、従来の封止工程を 省略することが可能になる。  [0040] In the present embodiment, the binding force of the anisotropic conductive adhesive film 4 disposed entirely on the mounting region 3 on the glass substrate 1 is cured by thermocompression bonding. Can have a sealing function for the ITO electrode, and as a result, the conventional sealing process can be omitted.
[0041] このように、本実施の形態によれば、工程数を大幅に削減することができるので、液 晶表示装置の製造の際における異方導電性接着剤を用いた実装の効率を大幅に 向上させることが可能になる。  As described above, according to the present embodiment, the number of steps can be greatly reduced, so that the efficiency of mounting using an anisotropic conductive adhesive in manufacturing a liquid crystal display device is greatly increased. Can be improved.
[0042] なお、本発明は上述の実施の形態に限られることなぐ種々の変更を行うことができ る。  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made.
[0043] 例えば、上述の実施の形態においては、 ICチップ 5及びフレキシブルプリント配線 板 6という 2つの電気部品を実装する場合を例にとって説明したが、本発明はこれに 限られず、 3つ以上の電気部品の実装する場合に適用することも可能である。  [0043] For example, in the above-described embodiment, the case where two electrical components such as the IC chip 5 and the flexible printed wiring board 6 are mounted has been described as an example. However, the present invention is not limited to this, and three or more electrical components are mounted. It is also possible to apply when mounting electrical parts.
[0044] また、例えば、図 3に示すように、 ICチップ 5及びフレキシブルプリント配線板 6に加 えて、例えば COG方式の抵抗器やコンデンサ等の他の電気部品 10を一括して熱圧 着することも可能である。  Further, for example, as shown in FIG. 3, in addition to the IC chip 5 and the flexible printed wiring board 6, other electrical components 10 such as a COG resistor and a capacitor are thermally bonded together. It is also possible.
[0045] この場合、他の電気部品 10についても、 ICチップ 5及びフレキシブルプリント配線 板 6と同様に仮圧着を行い、上記実施の形態と同様の条件で、これらを一括して本 圧着する。  In this case, the other electrical components 10 are also temporarily crimped in the same manner as the IC chip 5 and the flexible printed wiring board 6 and are collectively crimped together under the same conditions as in the above embodiment.
[0046] 図 4 (a) (b)は、本発明の他の実施の形態の要部を示す説明図、図 5は、同実施の 形態の要部を示す斜視図であり、以下、上記実施の形態と共通する部分については 同一の符号を付しその詳細な説明を省略する。 4 (a) and 4 (b) are explanatory views showing the main part of another embodiment of the present invention, and FIG. It is a perspective view which shows the principal part of a form, Hereinafter, about the part which is common in the said embodiment, the same code | symbol is attached | subjected and the detailed description is abbreviate | omitted.
[0047] 図 4 (a) (b)及び図 5に示すように、本実施の形態においては、異方導電性接着剤 として、複数 (本例の場合は三本)の帯状の異方導電性接着フィルム 4a、 4b、 4cを用 い、これら帯状の異方導電性接着フィルム 4a〜4cを、ガラス基板 1の実装領域 3上に 全面的に貼りつける。  [0047] As shown in Figs. 4 (a), (b) and Fig. 5, in the present embodiment, as the anisotropic conductive adhesive, a plurality (three in this example) of strip-shaped anisotropic conductive materials are used. Adhesive adhesive films 4a, 4b, and 4c are used, and these strip-like anisotropic conductive adhesive films 4a to 4c are adhered to the mounting region 3 of the glass substrate 1 over the entire surface.
[0048] 本発明の場合、特に限定されることはないが、 ITO電極に対する封止機能を向上さ せる観点からは、各異方導電性接着フィルム 4a〜4cを、できるだけ近接して配列す ることが好ましい。  In the present invention, although not particularly limited, from the viewpoint of improving the sealing function for the ITO electrode, the anisotropic conductive adhesive films 4a to 4c are arranged as close as possible. It is preferable.
[0049] また、各異方導電性接着フィルム 4a、 4b、 4cについては、特に限定されることはな いが、接続信頼性を向上させる観点力 は、実装する電気部品に応じて最適の条件 (バインダー材料、導電粒子の種類、フィルムの大きさ、厚さ等）のものを選択すること が好ましい。  [0049] Further, each anisotropic conductive adhesive film 4a, 4b, 4c is not particularly limited, but the viewpoint power to improve the connection reliability depends on the optimum condition according to the electric component to be mounted. It is preferable to select one (binder material, conductive particle type, film size, thickness, etc.).
[0050] そして、本実施の形態においても、熱圧着ヘッド 7の圧着面 9aが、ガラス基板 1の実 装領域 3上の異方導電性接着フィルム 4a〜4c全体の大きさに対応するように、例え ば異方導電性接着フィルム 4a〜4c全体の貼付領域の大きさより若干大きくなるよう にする。  [0050] Also in the present embodiment, the pressure-bonding surface 9a of the thermocompression bonding head 7 corresponds to the overall size of the anisotropic conductive adhesive films 4a to 4c on the mounting region 3 of the glass substrate 1. For example, the size of the anisotropic conductive adhesive films 4a to 4c should be slightly larger than the size of the pasting area.
[0051] 本実施の形態では、異方導電性接着フィルム 4a、 4b上に、複数の ICチップ 5、他 の電気部品 10を並べて搭載してそれぞれ仮圧着を行い、さらに、異方導電性接着フ イルム 4cの縁部にフレキシブルプリント配線板 6の縁部を搭載して仮圧着を行う。 その後、上記実施の形態と同様、熱圧着ヘッド 7を用いて ICチップ 5、他の電気部 品 10及びフレキシブルプリント配線板 6を一括して本圧着する。  [0051] In the present embodiment, a plurality of IC chips 5 and other electrical components 10 are mounted side by side on the anisotropic conductive adhesive films 4a and 4b, and each is temporarily crimped. Mount the edge of the flexible printed wiring board 6 on the edge of the film 4c and perform temporary crimping. Thereafter, as in the above embodiment, the IC chip 5, other electrical components 10, and the flexible printed wiring board 6 are collectively pressure bonded together using the thermocompression bonding head 7.
[0052] このような本実施の形態によれば、上記実施の形態と同様に実装効率を大幅に向 上させることができることに加え、実装する電気部品に応じて最適の条件の異方導電 性接着フィルム 4a〜4cを用いて実装を行うことができるので、接続信頼性をより向上 させることができる。その他の構成及び作用効果については上述の実施の形態と同 一であるのでその詳細な説明を省略する。  [0052] According to the present embodiment as described above, in addition to being able to greatly improve the mounting efficiency as in the above-described embodiment, the anisotropic conductivity under optimum conditions according to the electrical component to be mounted. Since mounting can be performed using the adhesive films 4a to 4c, connection reliability can be further improved. Since other configurations and operational effects are the same as those of the above-described embodiment, a detailed description thereof will be omitted.
[0053] なお、本実施の形態にぉ 、ては、複数の帯状の異方導電性接着フィルムを用いた 場合を例にとって説明したが、本発明はこれに限られず、正方形、長方形、その他種 々の形状の複数の異方導電性接着フィルムを用いることも可能である。 [0053] In the present embodiment, a plurality of strip-shaped anisotropic conductive adhesive films are used. Although the case has been described as an example, the present invention is not limited to this, and a plurality of anisotropically conductive adhesive films having various shapes such as a square, a rectangle, and the like can also be used.
ただし、配線基板上に実装する電気部品 1個につきァライメントマークがそれぞれ 設けられて ヽる場合には、本実施の形態のように帯状の異方導電性接着フィルムを 用いることが好ましい。  However, when an alignment mark is provided for each electrical component mounted on the wiring board, it is preferable to use a strip-shaped anisotropic conductive adhesive film as in this embodiment.
すなわち、帯状の異方導電性接着フィルムを用いることにより、各ァライメントマーク を避けるように配線基板上に複数の異方導電性接着フィルムを配置することができる ので、より精度の高い実装を行うことができる。  That is, by using a strip-shaped anisotropic conductive adhesive film, a plurality of anisotropic conductive adhesive films can be arranged on the wiring board so as to avoid each alignment mark, so that mounting with higher accuracy is performed. be able to.
[0054] また、上述の実施の形態にお!ヽては、異方導電性接着フィルムを用いて電気部品 を実装する場合を例にとって説明したが、ペースト状の異方導電性接着剤を用いるこ とも可能であり、さらに、導電粒子を含有しない接着剤を用いることも可能である。  [0054] Also, in the above-described embodiment, the case where an electrical component is mounted using an anisotropic conductive adhesive film has been described as an example, but a paste-like anisotropic conductive adhesive is used. It is also possible to use an adhesive that does not contain conductive particles.
[0055] さらにまた、上述の実施の形態においては、熱圧着ヘッドの圧着部材についても、 上記実施の形態のものに限られず、種々の態様のものを用いることができる。  [0055] Furthermore, in the above-described embodiment, the pressure-bonding member of the thermocompression bonding head is not limited to the above-described embodiment, and various forms can be used.
例えば、実装する電気部品に対応して複数の圧着部材を設けたものを用いることも できる。  For example, one provided with a plurality of crimping members corresponding to the electrical component to be mounted can be used.
[0056] また、電気部品に対する押圧力を調整するため、ヘッド本体に枠又は突起状の部 分を設けたり、圧着部材に切り込み部を設けることもできる。さらには、圧着部材を複 数のブロックで構成して隙間を形成することによって押圧力を調整することも可能で ある。  [0056] Further, in order to adjust the pressing force with respect to the electrical component, a frame or a protruding portion can be provided on the head main body, or a notch can be provided on the crimping member. Further, it is possible to adjust the pressing force by forming the gap by forming the crimping member with a plurality of blocks.
[0057] 加えて、本発明は液晶表示装置用のガラス基板上に電気部品を実装する場合の みならず、種々の配線基板上に電気部品を実装する場合に適用することができる。 ただし、本発明は液晶表示装置用のガラス基板上に電気部品を実装する場合に特 に工数を削減して実装効率を向上させることができるものである。  In addition, the present invention can be applied not only when mounting electrical components on a glass substrate for a liquid crystal display device but also when mounting electrical components on various wiring substrates. However, the present invention can improve the mounting efficiency by reducing the number of man-hours when mounting electrical parts on a glass substrate for a liquid crystal display device.

Claims

請求の範囲 The scope of the claims
[1] ヘッド本体に所定のエラストマ一力 なる圧着部材を有する熱圧着ヘッドを用いて 配線基板上に電気部品を実装する実装方法であって、  [1] A mounting method in which an electrical component is mounted on a wiring board using a thermocompression bonding head having a pressure-bonding member having a predetermined elastomer strength on the head body,
前記配線基板上の実装領域に接着剤を全面的に配置した後、異なる実装方式の 電気部品を前記実装領域に配置し、前記接着剤に対応する大きさの圧着部材を有 する熱圧着ヘッドを用いて前記電気部品を一括して熱圧着する工程を有する実装方 法。  After the adhesive is entirely disposed in the mounting area on the wiring board, electrical components of different mounting methods are disposed in the mounting area, and a thermocompression bonding head having a crimping member having a size corresponding to the adhesive is provided. A mounting method comprising a step of using and thermocompression bonding the electrical components together.
[2] 前記電気部品として COG方式の電気部品を用いる請求項 1記載の実装方法。  2. The mounting method according to claim 1, wherein a COG-type electrical component is used as the electrical component.
[3] 前記電気部品として FOG方式の電気部品を用いる請求項 1記載の実装方法。 [3] The mounting method according to [1], wherein an FOG electrical component is used as the electrical component.
[4] 前記接着剤として、異方導電性接着剤を用いる請求項 1記載の実装方法。 4. The mounting method according to claim 1, wherein an anisotropic conductive adhesive is used as the adhesive.
[5] 前記配線基板が液晶表示装置用のガラス基板である請求項 1記載の実装方法。 5. The mounting method according to claim 1, wherein the wiring board is a glass substrate for a liquid crystal display device.
[6] 前記配線基板上の実装領域に複数の接着剤を全面的に配置して実装を行う請求 項 1記載の実装方法。 [6] The mounting method according to [1], wherein mounting is performed by arranging a plurality of adhesives over the entire mounting area on the wiring board.
[7] 前記接着剤として、帯状の接着剤を用いる請求項 6記載の実装方法。 7. The mounting method according to claim 6, wherein a strip-shaped adhesive is used as the adhesive.
PCT/JP2006/314642 2006-02-01 2006-07-25 Method of mounting electric part WO2007088647A1 (en)

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WO2011043097A1 (en) * 2009-10-05 2011-04-14 シャープ株式会社 Substrate mounting structure, display device equipped therewith, and substrate mounting method
CN102346319A (en) * 2010-08-03 2012-02-08 株式会社日立高新技术 AFC pasting device of FPD assembly

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