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WO2007067924A2 - Système de stérilisation avec un générateur de plasma, le générateur de plasma comportant un ensemble d’électrodes comportant une matrice de capillaires dans lesquels le plasma est généré et dans lesquels du fluide est introduit - Google Patents

Système de stérilisation avec un générateur de plasma, le générateur de plasma comportant un ensemble d’électrodes comportant une matrice de capillaires dans lesquels le plasma est généré et dans lesquels du fluide est introduit Download PDF

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Publication number
WO2007067924A2
WO2007067924A2 PCT/US2006/061682 US2006061682W WO2007067924A2 WO 2007067924 A2 WO2007067924 A2 WO 2007067924A2 US 2006061682 W US2006061682 W US 2006061682W WO 2007067924 A2 WO2007067924 A2 WO 2007067924A2
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WIPO (PCT)
Prior art keywords
plasma
dielectric
electrode
electrodes
conductive element
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Application number
PCT/US2006/061682
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English (en)
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WO2007067924A3 (fr
Inventor
Edward J. Houston
Original Assignee
Stryker Corporation
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Publication date
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Publication of WO2007067924A2 publication Critical patent/WO2007067924A2/fr
Publication of WO2007067924A3 publication Critical patent/WO2007067924A3/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/14—Plasma, i.e. ionised gases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/24—Apparatus using programmed or automatic operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2245/00—Applications of plasma devices
    • H05H2245/30—Medical applications
    • H05H2245/36—Sterilisation of objects, liquids, volumes or surfaces

Definitions

  • the present invention is directed to a plasma generator comprising an electrode assembly that emits plasma in a controlled and efficient fashion for use in sterilization; more specifically, the sterilization of medical goods.
  • Two specific exemplary plasma emitting electrode assemblies include a bent planar electrode assembly and a capillary array electrode assembly. These two assemblies are of particular use in a plasma generator to create high density plasma with free radicals.
  • a "plasma” is a partially ionized gas composed of ions, electrons, and neutral species. This state of matter is produced by subjecting gas to relatively high temperatures or relatively strong electric fields either constant (DC) or time varying (e.g., AC, RF or microwave) electromagnetic fields. Discharged plasma is produced when free electrons are energized by electric fields in a background of neutral atoms/molecules. These electrons cause atom/molecule collisions which transfer energy to the atoms/molecules and form a variety of species which may include photons, metastables, atomic excited states, free radicals, molecular fragments, monomers, electrons, and ions. The neutral gas becomes partially or fully ionized and is able to conduct currents.
  • the plasma species are chemically active and/or can physically modify the surface of materials and may therefore serve to form new chemical compounds and/or modify existing compounds.
  • the free radicals produced as a result of the generation of a plasma discharge act as a destructive, sterilizing agent, on nearby microbial life, i.e. bacteria, viruses and fungi.
  • a plasma discharge can also produce useful amounts of optical radiation to be used for lighting. Many other uses for plasma discharge are available.
  • U.S. Patent No. 5,872,426, arc designed to include an upper electrode plate and a lower electrode plate displaced a predetermined distance therefrom to form a channel therebetween in which the plasma is generated.
  • One of the disadvantages of conventional plasma electrodes is that the cost of these types of electrodes is high due to the use and assembly of fabricated components, including typically, quartz tube and rod, soldered connections, ceramic insulators and high voltage.
  • another deficiency associated with conventional plasma electrodes is that the electrodes are fairly fragile in nature and therefore, require a high level of care, especially in the handling of these products. As a result of the level of care needed for the processing and handling of these devices, the cost of the plasma electrodes is high.
  • the present invention is directed to plasma electrode assemblies that solve the aforementioned problems associated with conventional plasma electrode assemblies and is particularly suited for use in a plasma generator device as described herein.
  • An electrode assembly for use in a plasma generator includes a dielectric substrate and at least one conductive element formed on the substrate according to a prescribed pattern.
  • the electrode assembly further includes an insulator in the form of a layer of material disposed over one face of the at least one conductive elements and substrate.
  • At least one conductive element is substantially contained in a single first plane and the substrate is contained in a second plane, with the first plane being different from the second plane.
  • the electrode assembly is a substantially planar electrode assembly that can be formed by a manufacturing method including the steps of: (a) providing a substrate formed of a dielectric material; (b) processing the substrate to form a plurality of conductor elements on an upper face of the substrate and according to a prescribed pattern; and (c) coating the conductor elements and the upper face of the substrate with a conformal dielectric material.
  • planar electrode assembly design and configuration according to the present invention offers a number of improvements and advantages over conventional plasma electrodes.
  • the present planar electrode can be manufactured according to much simpler and less costly process, namely, a blanket type process as practiced in the production of PCBs.
  • the stock materials used and the generation of plasma at a lower voltage allow the use of lower cost materials and lower cost and smaller power supplies.
  • a capillary array plasma emitter electrode assembly for use in a plasma generator that destroys microbial life.
  • the capillary array plasma emitter electrode assembly includes a first electrode and a first dielectric having a plurality of first holes formed therein.
  • the first dielectric has a first surface and an opposing second surface, with the first electrode being disposed on the first surface.
  • the capillary array plasma emitter electrode assembly further includes a second electrode including line conductor elements arranged according to a grid pattern, with each line conductor having a plurality of circular shaped conductor lines formed along a length of the line conductor.
  • a second dielectric having a plurality of second holes formed therein is provided where the second dielectric has a first surface on which the second conductive clement is disposed so as to position the second conductive clement between the first and second dielectrics.
  • Each circular shaped conductor line circumferentially surrounds corresponding matching first and second holes. Accordingly, the holes of each capillary electrode and dielectric are axially aligned with one another, creating multiple capillary paths for a liquid to flow therethrough.
  • a capillary array plasma emitter includes a first conductive element and a first dielectric having a plurality of first holes formed therein.
  • the first dielectric has a first surface and an opposing second surface, with the first conductive element being disposed on the first surface.
  • the capillary array plasma emitter includes a second conductive element including conductor elements arranged according to a predetermined pattern; and a second dielectric having a plurality of second holes formed therein.
  • the second dielectric has a first surface on which the second conductive element is disposed so as to position the second conductive element between the first and second dielectrics.
  • the first and second holes are axially aligned with one another and passing through interstices defined by the conductor elements.
  • the capillary array plasma electrode assembly provides a number of advantages that arc very difficult to achieve with conventional plasma electrode design.
  • the design of the capillary array plasma electrode permits printed circuit techniques to be used to form the conductive elements of the electrode on suitable substrates, e.g., quartz, glass, refractories, printed circuit board materials, etc., and therefore, it is possible to create a plasma with a much higher density of plasma species, e.g., electrons, ions, radicals, etc.
  • the capillary array plasma electrode assembly hereforth mentioned as the "capillary assembly," also remedies a shortcoming of the capillary assembly design where a second electrode opposing the perforated dielectric is required and thus confines the plasma to exist in the dead space between these two members.
  • Figure 1 is a cross-sectional view of an exemplary first embodiment of a planar electrode for use in plasma generating apparatus in accordance with the present invention
  • Figure 2 is a cross-sectional view of the planar electrode of Figure 1 in an alternative configuration
  • Figure 3 is cross-sectional top plan view of a plurality of bent electrodes arranged into a cylindrical shape
  • FIG. 4 is a schematic overview of a non-thermal plasma sterilization and decontamination system incorporating the electrode assemblies described herein, in accordance with the present invention
  • FIG. 5 is a perspective view of a multiple unit modular sterilization system incorporating the electrode assemblies described herein, in accordance with the present invention
  • Figure 6 is a perspective view of a capillary array plasma generator electrode assembly according to one exemplary embodiment of the present invention.
  • Figure 7 is a plan view of the second electrode that is disposed between the first and second capillary plates of the electrode assembly illustrated in Figure 6;
  • Figure 8 is perspective view of a plasma generator incorporating the electrode assembly of Figure 6;
  • Figure 9 is an exploded perspective view of the plasma generator of Figure 8 including the electrode assembly of Figure 6.
  • planar electrode assembly 8 is illustrated in Figures 1 and 2.
  • the planar electrode assembly 8 as illustrated in Figure 1 comprises a substrate base 10 angled at an axial point 14 of the substrate; creating an angle ⁇ l and ⁇ 2, which are inherently equivalent to one another, relative to the bottom of substrate 11 and a flat plane FP.
  • Each angle ⁇ l and ⁇ 2 is to further illustrate that the substrate 10 is bent, or angled, at predetermined angles, relative to a flat plane FP. The amount of this angle is directly proportional to the density of plasma created within the void space 16 between a first electrode 18a and second electrode 18b.
  • Each electrode 18a and 18b, disposed over the substrate 10, comprise of conductive elements 20 and 21, respectively, and a dielectric element 22, also known as an insulator, is disposed over and seamlessly coating the conductive elements 20 between the substrate 10 and the surrounding ambient
  • the substrate 10 provides support to the overall planar electrode assembly 8, while permitting the planar electrode assembly to be more robust and flexible as compared to the conventional designs of plasma electrodes.
  • the material of which the substrate 10 is formed need not be limiting and may be formed of any number of different materials so long as they are suitable for the present application.
  • One exemplary substrate 10 includes a printed circuit board (PCB) laminate structure.
  • PCB printed circuit board
  • FR means Flame Retardant (to UL94V-0)
  • Type "4" indicates woven glass reinforced epoxy resin.
  • FR4 laminate grades are produced by inserting continuous glass woven fabric impregnated with an epoxy resin binder while forming the sheet.
  • FR4 laminate grades have excellent dielectric loss properties and great electrical strength. More specifically, FR4 laminate grades have the following properties and/or characteristics: high dielectric strength, radiation resistant, high tensile strength, low cold flow or creep, chemically resistant, high flexural strength, dimensional stability, low moisture absorption, low dissipation factor, high impact strength and cryogenic serviceability.
  • FR-4 laminate grades are merely one exemplary type of material for making the base or substrate for the present planar electrode assembly 8;
  • the substrate 10 can be a Mylar or Kapton flexible circuit substrate.
  • the exemplar substrate 10 has a rectangular cross- section; however, this is merely illustrative in nature and other cross-sectional shapes can be used in the present electrode planar electrode assembly 8.
  • Substrate 10 can be part of plural spaced apart electrodes 18a and 18b.
  • Each conductive element 20 and 21 of electrodes 18a and 18b, respectively, is disposed on at least a portion of a top surface 24 of the substrate 10.
  • the conductive layers 20 and 21 arc typically formed of a metal material, having dimension different than the dimensions of the substrate 10 of which the conductive layers are disposed upon.
  • each conductive element 20 and 21 could have dimensions less than the substrate 10 so that the conductive layers do not entirely occupy, or encompass, the entire top surface 24 of the substrate 10.
  • the conductive elements 20 and 21 are preferably of planar construction within a single plane relative to each individual first and second electrode 18a and 18b, respectively. As can be seen in Figure 2, a single planar
  • construction of the conductive elements 20 and 21 is not detrimental to the overall ability of a planar electrode assembly to create a high density plasma between the void space of the first and second electrodes 18a and 18b, respectively.
  • each conductive element 20 and 21 may be formed of any number of types of material, including those conductive materials that are typically used in PCB applications.
  • each conductive element 20 and 21 can be a layer of stock metal, such as a copper clad.
  • Other conductive materials, such as gold, platinum and aluminum; or combinations thereof can be used as long as they are suitable for the intended use of the present invention.
  • the substrate 10 and conductive elements 20 and 21 are formed from a stock metal/insulator laminate structure that is common to electrical applications. Therefore, the laminate structure can be processed so as to form a pattern of discrete conductive areas across the top surface 24 of the substrate 10.
  • a chemical process such as a photochemical etching process or photolithography process, etc.
  • a chemical process can be used to form a discrete conductive pattern across the top surface 24 of substrate 10.
  • the conductive elements 20 and 21 are photochemical Iy etched to form a series of discrete conductors or line conductors or pathways similar to that found across a stand PCB surface.
  • the conductive elements 20 and 21 may processed, as by photochemically etching a stock metal, to form a plurality of conductors (line conductive elements), not illustrated, that are spaced apart from one another and are at least initially in the form of planar conductive elements, e.g., strips.
  • line conductive elements can be in the form of parallel line conductors that are spaced approximately 1 mm apart on the substrate 110.
  • the conductive elements of this embodiment can accordingly have a degree of flexibility, as does the substrate 10, to permit manipulation of the shape of the electrodes 18a and 18b.
  • the conductive elements 20 and 21 can be formed to have any number of different shapes, e.g., oval, round, square, rectangle, etc. Likewise, according to one embodiment, the conductive elements 20 and 21 are formed such that they have a rectangular cross- section and are defined by flat and parallel faces. The actual dimensions of the conductive elements 20 and 21 vary depending upon the precise application. In one exemplary embodiment, the conductive elements 20 and 21 have a thickness of less than about 50 micron and a width of less than about 10 mm. More particularly, the conductive elements 20 and 21 are formed to have a thickness of about 100 micron (0.004 inch) and a width of about lmm (0.040 inch) with flat and parallel faces. However, it will be understood that the above dimensions are merely exemplary in nature and not limiting. Thus, the conductive elements 20 and 21 can have dimensions that fall outside of the above ranges.
  • the conductive elements 20 and 21 each have a top surface 26 that faces away from the top surface 24 of the substrate 10.
  • Each conductive element 20 and 21 has a bottom surface 28 that faces and is disposed on the top surface 24 of substrate 10. It will also be understood that the dimensions of all the conductive elements 20 and 21 need not be the same and instead, one or more conductors 130 can have different dimensions compared to the others.
  • the dielectric element 22 is applied to the top surfaces 24 and 26 of the substrate 10 and the conductive elements, in a continuous technique. Consequent the technique used to apply the dielectric element 22; the sides of the conductive elements 20 and 21 are also coated with the dielectric element.
  • the dielectric element 22 can be formed of any number of different types of suitable dielectric materials, including but not limited to an epoxy or Teflon coating; and according to one embodiment, the dielectric element 22 is formed of a conformal dielectric material that is deposited onto the pattern of conductive elements 20 and 21. Thus, the dielectric material of dielectric element 22 is deposited onto the conductive elements 20 and 21 to produce the desired pattern.
  • the conductive elements 20 and 21 are covered with the deposited conformal dielectric element 22 of a thickness no greater than that of the conductive elements.
  • the thickness of the dielectric element 22 is less than about 50% of the thickness of the conductive elements 20 and 21; and more preferably is less than about 25% of the thickness of the conductive elements.
  • the electrodes 18a and 18b of the present planar electrode assembly 8 inventions are preferably arranged so that a dielectric discharge is used during the plasma generation process.
  • the planar electrode assembly 8 having electrodes 18a and 18b can be used as a plasma generator to produce a high density plasma.
  • high density plasma is understood to be one of which of which free radicals that have a destructive, sterilizing, effects on microbial life are formed.
  • one or more electrodes 18a are connected to a positive terminal of a power source.
  • One or more electrodes 18b are connected to a negative terminal of the power source. Consequently, a dielectric discharge is created when a positively connected electrode 18a is positioned proximate a negatively connected electrode 18b.
  • Inherent to the aforementioned configuration of positive and negative connections to the electrodes 18a and 18b, respectively; illustrated are only one each of electrodes 18a and 18b, but there maybe greater than one of each electrode 18a and 18b in a particular embodiment.
  • each electrode 18a and 18b Post formation as a planar unit, the substrate 10 supporting one or more electrodes may be bent.
  • a top surface 30a and 30b of each electrode 18a and 18b, respectively, is to be appreciated as the top of the dielectric element 22.
  • the top surface 30a of each electrode 18a can be positioned at a variety of different angles ⁇ relative to the top surface 30b of another electrode, electrode 18b. This is illustrated most elegantly in Figure 1.
  • electrodes 18a and 18b can be coplanar or they may be positioned at a predetermined angle to one another.
  • the top surface 30a of electrode 18a is angled at less than about 180 degrees to the top surface 30b of the electrode 18b.
  • their respective top surfaces 30a and 30b generally form a concave shape as shown in Figure 1.
  • the angle ⁇ between the top surfaces 30a and 30b can vary depending upon the application.
  • the angle between the top surfaces 30 and 30b is between about 90 degrees and about 180 degrees; or between about 45 degrees and about 90 degrees, etc.
  • coplanar electrodes 18a and 18b i.e. electrode 18a is above electrode 18b is a parallel fashion having a void space that is between the two electrodes, are the easiest to initiate because they require a relatively lower voltage to initiate the initial break down of charge between the electrodes but offer lesser of a discharge volume 150.
  • Figure 2 shows a planar electrode assembly 8 with three bends in its substrate 10; unlike the only one bend in the substrate 10 as shown in Figure 1.
  • the planar electrode assembly 8 of Figure 2 is identical to Figure 1, except for the extra two bends in the substrate 10, dielectric element 22 and conductive elements 20 and 21.
  • FIG. 2 illustrates a pair of electrodes 18c and 18d arranged according to another embodiment of which the electrode structures are formed on a flexible substrate 10, such as an FR-4 laminate.
  • the planar electrode assembly 8 of Figure 2 has two extra two bends, as compared to the planar electrode 8 of Figure 1, at axial points 14a and 14b.
  • Each axial point 14a and 14b corresponds to only one electrode 18c and 18d of which the corresponding substrate 10, conductive elements 20 and 21, and the dielectric element 22 are bent at a particular angle ⁇ 2 and ⁇ 3, respectively.
  • Each of the first and second faces 32a and 32b are preferably substantially planar in nature.
  • the bends of the planar electrode assembly 8 of Figure 2 at axial points 14, 14a, and 14b introduce an angle ⁇ l that directly corresponds to the amount of discharge volume 150 being produced between the electrodes 18a and 18b.
  • the electrodes 18a and 18b are separated at a predetermined distance D, which depends upon ⁇ l with other influence coming from ⁇ 2 and ⁇ 3, depending how each electrode 18a and 18b is bent. According to one exemplary embodiment, the distance D is less than or equal to about lmm. It will be appreciated that the size and extent of the discharge volume 150 can be altered by adjusting the relative angle ⁇ l between the two electrodes 18a and 18b as shown.
  • Figure 3 shows a cylindrical electrode assembly 9 where the electrodes 18c and 18d reside on a flexible substrate 10, such as an FR-4 laminate, that permits the electrode structure to be bent at multiple locations and then rolled into a cylindrical shape as shown.
  • a central void space 160 is formed between the rolled electrode structure to permit a solid or fluid (e.g., an additive, such as an active sterilizing species), to pass therethrough and be exposed to the dielectric discharge created by operation of the electrodes 18c and 18d as described below with reference to the electrodes being part of a plasma generator device.
  • a solid or fluid e.g., an additive, such as an active sterilizing species
  • the electrodes 18c and 18d can be hooked up to the power source in any number of different ways so long as the electrodes are arranged to form a sufficient dielectric discharge volume 150 therebetween.
  • One preferred arrangement, as illustrated in Figure 3, is for there to be an alternating pattern of positively connected electrodes 18c and negatively connected electrodes 18d since this permits a sufficient dielectric discharge volume 150 circumfer
  • the ends of the electrodes can be sealed so as to seal the central void space 160, thus permitting the solid or fluid (e.g., an additive, such as an active sterilizing species) that is present therein to be exposed to the dielectric
  • the electrodes 18a, 18b or 18c, 1 Bd are arranged such that their respective conductive elements 20 and 21 face inwardly toward one another, while the substrate 10 represents the outermost members of the cylindrically shaped structure.
  • the plasma generated as a result of the dielectric discharge volume 150 diffuses in direction away from the surfaces of the conductive elements 20 and 21.
  • a chemically active species e.g., active sterilizing species
  • a secondary electrode 170 can be disposed within the central void space 160.
  • the secondary electrode 170 represents a central concentric biasing electrode in the form of an elongated conductive member 175 with an insulator 180 being formed circumferentially around the conductive member.
  • the insulator 180 faces the dielectric element 22 that is disposed over the conductive elements 20 and 21.
  • the secondary electrode 170 can function as a bias electrode with respect to the other surrounding electrodes 18a, 18b or 18c, 18d, with the longitudinal length of the secondary electrode 170 extending in the same direction as the longitudinal length of the cylindrical electrode assembly 9.
  • the bias electrode 170 can be operatively connected to the power source so that it has either a positive or negative charge and it serves to draw the generated plasma out toward the center of the central void space 160 and away from the conductive elements 20 and 21 of the electrodes 18a, 18b or 18c, 18d.
  • the shape of the secondary electrode 170 is not critical. Accordingly, while the illustrated secondary electrode 170 has a cylindrical shape, the electrode 170 can have other shapes, including but not limited to a square, a rectangular, a triangle, an oval, etc.
  • the electrode design and configurations according to the present invention offer a number of improvements and advantages over conventional plasma electrodes.
  • the present planar electrode and cylindrical electrode assemblies 8 and 9, respectively can be manufactured according to much simpler and less costly process, namely, a blanket type process as practiced in the production of PCBs.
  • the stock materials used and the generation of plasma at a lower voltage allow for the use of lower cost materials and smaller power supplies.
  • the electrodes 18a, 18b or 18c, 18d can be used in a vast number of different plasma generation applications, including any number of different plasma reactor schemes that utilize an electrode assembly having the properties and capabilities of the present electrode assembly.
  • the following examples are merely illustrative and not limiting to the scope of the present invention.
  • the plasma generating electrode assemblies disclosed herein can be used in any of the plasma reactors disclosed in the patent applications/patents that have been expressly incorporated herein by reference.
  • FIG. 4 is an exemplary schematic flow diagram of a plasma sterilization and decontamination system in accordance with the present invention.
  • a source of contaminated fluid 200 e.g., a liquid and/or a gas, to be treated may contain pathogens (e.g., viruses, spores, microbial life) and/or undesirable chemical compounds (e.g., benzene, toluene).
  • the contaminated fluid 200 passes through a decontamination or sterilization device 210 that includes a non-thermal plasma discharge device 220 and a suspension media 230.
  • the non-thermal plasma discharge device 220 is of a dielectric plasma discharge design and utilizes an arrangement of the electrodes 18a, 18b or 18c, 18d as illustrated in Figures 1-3.
  • a thermal plasma discharge device may be employed but will yield a less efficient rate of sterilization.
  • Energy is supplied to the non-thermal plasma discharge device 220 by a high voltage power supply, for example, a direct current, alternating current, high frequency, radio frequency, microwave, pulsed power supply, depending on the desired plasma discharge configuration.
  • a high voltage power supply for example, a direct current, alternating current, high frequency, radio frequency, microwave, pulsed power supply, depending on the desired plasma discharge configuration.
  • the contaminated fluid 200 While passing through the non-thermal plasma discharge device 220, the contaminated fluid 200 is exposed to the plasma as well as to an active sterilizing species such as organic radicals and/or ion clusters created as a byproduct during the generation of the plasma. Exposure of the contaminated fluid to the plasma generated active sterilizing species substantially deactivates the pathogens and reduces
  • reaction mechanisms that contribute to the plasma enhanced chemistry responsible for formation of the active sterilizing species will now be described. Common to all four reaction mechanisms is that of electron impact dissociation and ionization to form reactive radicals.
  • the four reaction mechanisms include:
  • Oxidation e.g., conversion of CH 4 to CO 2 and H 2 O
  • Electron induced decomposition e.g., electron attachment to CCLj
  • an additive, free or carrier fluid 240 e.g., an alcohol such as ethanol or methanol
  • an additive, free or carrier fluid 240 may be injected into the non-thermal plasma discharge device 220 to enhance the sterilization effect or overall plasma chemistry.
  • the additive, free or carrier fluid increases the concentration of plasma generated active sterilizing species while reducing the generation of undesirable byproducts (e.g., ozone pollutants).
  • employing an additive, free or carrier fluid can advantageously be used to tailor the chemistry of the plasma generated active sterilizing species.
  • organic/air mixtures are used as an additive, feed or carrier gas, the following chemical reaction chains are instrumental in the generation of additional active sterilizing species. Illustrative examples are provided with respect to each chemical reaction chain.
  • Hydronium ion clusters can protonate ethyl alcohol when present in the feed gas, as shown by the following illustrative example:
  • Ion clusters such as EtOH 2 + (H 2 O)H increase sterilization efficiency as a result of their reasonably long life time. Accordingly, ion clusters arc able to survive the transport to the targeted object to be sterilized and provide an Et group for replacement of a hydrogen atom in bacterial DNAs which will lead to deactivation of the targeted microorganisms.
  • Organic ions such as C 2 H 4 OH + , C 2 H 3 OH + , CH 2 OH + , CHOH + , CH 3 OH + , C 2 H 5 + are also formed when an additive, free or carrier fluid is employed and may improve sterilization depending on their lifetime and chemical activity.
  • Presence of organics and oxygen in plasma will also promote the formation of other organic radicals such as peroxy RO 2 , alkoxy RO, acyl peroxyacyl RC(O)OO and byproducts, such as hydroperoxides (ROOH), peroxynitrates (RO 2 NO 2 ), organic nitrates (RONO 2 ), peroxyacids ( RC(O)OOH), carboxylic acids (RC(O)OH) and peroxyacyl nitrates RC(O)O 2 NO 2 .
  • ROOH hydroperoxides
  • RO 2 NO 2 peroxynitrates
  • RONO 2 organic nitrates
  • RC(O)OOH peroxyacids
  • carboxylic acids RC(O)OH
  • peroxyacyl nitrates RC(O)O 2 NO 2 peroxyacyl nitrates
  • the contaminated fluid 200 after being exposed to the generated plasma passes through a suspension media 230 (e.g., a filter, electrostatic precipitator, carbon bed or any other conventional device used to remove particulate material from fluid streams) disposed downstream of the plasma discharge device 220.
  • a suspension media 230 e.g., a filter, electrostatic precipitator, carbon bed or any other conventional device used to remove particulate material from fluid streams
  • Residual pathogens that have not been entirely neutralized or deactivated when exposed to the plasma discharge in the plasma discharge device are collected in the suspension media 230.
  • These collected contaminants are treated upon contact with the suspension media 230 by the radicals and ions created by the generated plasma as part of the fluid stream.
  • the plasma treated fluid may be exposed to a catalyst media 250 (e.g., an ozone catalyst) or additional suspension media disposed downstream of the suspension media 230 to further reduce concentrations of residual undesirable compounds such as ozone and/or pathogens.
  • a catalyst media 250 e.g., an ozone catalyst
  • additional suspension media disposed downstream of the suspension media 230 to further reduce concentrations of residual undesirable compounds such as ozone and/or pathogens.
  • the electrodes 18a, 18b or 18c, 18d are incorporated into the non-thermal plasma discharge device 220 which is adapted to produce a weakly ionized gas, e.g. plasma therein.
  • a weakly ionized gas is a partially ionized gas composed of ions, electrons, and neutral species. This state of matter is produced by relatively high temperatures and/or relatively strong electric fields either constant (DC) or time varying (e.g., AC) electric fields.
  • the weakly ionized gas is produced when free electrons are energized by electric fields in a
  • the neutral gas becomes partially or fully ionized and is able to conduct electric currents.
  • the species are chemically active and/or able to physically modify the surface of materials and may therefore serve to form new chemical compounds and/or modify existing compounds.
  • an organic based reagent may be introduced into the plasma or weakly ionized gas, as described in detail in the pending application entitled "System and Method for Injection of an Organic Based Reagent in Weakly Ionized Gas to Generate Chemically Active Species", U.S. Patent Application Serial No. 10/407,141, U.S. Patent Pub. No. US2004/0050684A1 (which claims the benefit of U.S. Provisional Application No. 60/369,654, filed April 2, 2002) (having the same assignee as the present invention), said application being incorporated by reference in its entirety.
  • the organic based reagent may be a combination of an organic additive (e.g., an alcohol or ethylene) mixed with an oxidizer (e.g., oxygen) prior to being introduced in the weakly ionized gas.
  • an organic additive e.g., an alcohol or ethylene
  • an oxidizer e.g., oxygen
  • the organic based reagent may be the injection of an organic additive alone in the weakly ionized gas while in the presence of air (non vacuum chamber) that inherently contains oxygen and serves as the oxidizer.
  • the organic based reagent may comprise an organic additive that itself includes an oxidizing component such as ethanol.
  • the oxidizing component of the organic component when injected into the weakly ionized gas forms hydroxyl radicals, atomic oxygen or other oxidizing species that may be sufficient to eliminate the need for a supplemental oxidizer.
  • the organic additive reacts with the oxidizer while in the presence of weakly ionized gas to initiate the production of chemically active species.
  • the modular sterilizer may be adapted to be connected to a supply source for receiving the organic based reagent into the device.
  • the planar and cylindrical electrode assemblies 8 and 9, respectively, are incorporated into a system 90 for sterilizing an object, such as a piece of medical equipment, etc.
  • a sterilization system 90 which can be modular or grid-like in nature, for destroying microbial life, sterilizing, disinfecting or decontamination, of objects, such as medical instruments by utilizing non-thermal plasma and associated chemical methods, as described in U.S. Serial No. 11/042,359, filed on January 24, 2005 U.S. Patent Pub. No. US2005/0196315A1 which claims the benefit of U.S. Provisional Application No.
  • the sterilization system 90 can be used in other applications employing sterilization techniques such as, but not limited to, the handling of food.
  • the disclosed modular sterilization system is configured to hold and accommodate any number of one or more units 94 (the term "units" is genetically used to describe any closablc container such a tray with a lid, a closable box or a closable bag).
  • Each unit 94, or sterilizing chamber may be adapted in size and shape based on the size and shape of the particular objects being treated.
  • the sterilization system 90 is designed with one or more compartments 92 adapted in size and shape to preferably receive only one unit 94.
  • the capacity of the sterilization system 90 is limited by the number of compartments 92.
  • the sterilization system 90 as shown in Figure 5, has six compartments 92 capable of accommodating six or less units 94; one compartment 92 being adapted to receive a single unit.
  • a power source 98 is adapted to connect to a control module 96 that can vary the electrical parameters, i.e. AC or DC, to and vary the parameters for each of the individual units 94, though it is not a necessity to control the electrical parameters with the control module 96.
  • the control module 96 may independently control the type and quantity of an organic based reagent introduced therein, the period for sterilization, the sterilization cycles, and/or power level for each unit 94.
  • control module 96 monitors one or more parameters or conditions such as time of operation or unit status.
  • Each unit in turn, may be further divided or subdivided into nested compartments or sub compartments the sterilization parameters or conditions for each which again may be independently and individually controlled by the control module 96.
  • each unit 94 is adapted to produce a weakly ionized gas, e.g. plasma therein.
  • the generation of the weakly ionized gas requires the application of an electric field to an electrode, which in this case, is preferably a configuration of planar or cylindrical electrode assemblies 8 and 9, respectively, such as the embodiments that have been previously discussed and illustrated in Figures 1-3.
  • an electrode which in this case, is preferably a configuration of planar or cylindrical electrode assemblies 8 and 9, respectively, such as the embodiments that have been previously discussed and illustrated in Figures 1-3.
  • a sterilization system 90 adapted to sterilize objects in situ by exposure to a gas discharge requires that each compartment 92 be electrically connected to receive energy from the control module 96 or power source 98 in order to initiate and generate the electric field required between the electrodes to create a plasma between the electrodes.
  • the plasma in turn is a sterilant generator.
  • each unit also contains electronic circuitry connected to each electrode 18a, 18b or 18c, 18d.
  • an interface or adapter for example, complementary male and female connectors or plugs, are provided on the respective unit 94 and corresponding compartment 92 so that when the unit is inserted into a compartment the male and female connectors automatically align to complete the connection.
  • a cable may extend from the compartment to be manually connected to a complementary port or outlet of the unit 94.
  • the unit 94 can be configured as an assembled tray and complementary lid. The lid can be fabricated from a variety of materials, i.e. metallic, non- metallic, etc, and is form fit to a mating tray.
  • a negative fit device typically a gasket, is preferably employed to form a seal, keeping the transient biocide within each of the unit 94 to ensure sterility of the contents therein after the process is complete and the unit removed from the sterilization system 90.
  • a gas discharge generator for producing a weakly ionized gas is disposed to generate the transient biocide in the interior of the unit.
  • the generator is of a dielectric discharge type as described above.
  • the generator preferably incorporates the gas discharge generator in the top or lid of the unit. Positioning of the gas discharge generator may be modified so long as the weakly ionized gas is emitted into the interior of the unit with the object to be treated directly exposed to the discharge or emission.
  • a capillary array plasma generator electrode assembly 68 is provided and is adapted to function as an atmospheric pressure non-thermal plasma emitter apparatus.
  • atmospheric pressure non-thermal plasma emitter apparatuses including but not limited to, a capillary-in-ring discharge, a slit discharge, a micro-hollow cathode discharge, a capillary discharge, dielectric barrier discharge, corona discharge, etc.
  • the aforementioned plasma designs lack the ability to emit a high density plasma beyond the confines of the electrodes.
  • the CAPGEA 68 according to the present invention is designed and constructed to overcome the above deficiencies associated with conventional plasma electrode assembly emitter designs and is capable of emitting or generating a plasma of a greater density than was otherwise possible with conventional plasma electrode assembly emitter designs. In other words, the CAPGEA 68 according to the present invention generates a higher density plasma beyond the confines of the electrodes.
  • the CAPGEA 68 is formed of a number of elements that are arranged relative to one another. More specifically, the CAPGEA 68 comprises a first and second electrode 70a and 70b, respectively, and a first and second capillary plate 72a and 72b, respectively. Each of first and second electrodes 70a and 70b, and first and second capillary plates 72a and 72b are provided as a predetermined shape and configuration.
  • each of the electrodes 70a, 70b and capillary plates 72a, 72b have a pluralits of rows and columns of openings, perforations, or holes 74a, 74b, 74c, and 74d, respectively, therethrough, corresponding to a predetermined pattern 75 that is identical to one another.
  • the holes 74a, 74b, 74c, and 74d of each electrode and capillary plate are axially aligned with one another. These axially aligned holes form a single capillary path through the plasma generator.
  • the first electrode 70a is substantially circular in shape comprising a conductive element, preferably a metallic element such as a metal film, having a particular shape, and thickness with holes 74a being arranged to the predetermined pattern 75.
  • the metallic element used as the first electrode 70a has a reduced thickness and therefore has a high degree of flexibility, etc.
  • the metallic element used as the first electrode 70a has a reduced thickness and therefore has a high degree of flexibility, etc.
  • predetermined pattern 75 of holes 74a may consist of a hexagonal shape, though this is not to be limiting.
  • the holes 74a pass completely through the first electrode 70a.
  • the capillaries can be formed to have any other type of predetermined pattern since a particular pattern is not critical to the practice of the invention.
  • the first electrode 70a has a first and second face 76a and 76b, respectively. Though only first face 76a is visible in Figure 6, it is to be appreciated that the opposite side of the first electrode 70a lies the second face 76b.
  • the first electrode 70a When the first electrode 70a does not consist of a metallic film as its conductive element, it can be formed by printed circuit board techniques. More particularly, it can be formed by disposing a metal stock material on the first face 76a and then using standard processing techniques, such as a photochemical etching process or a photolithography process, to form discrete micro sized features, such as holes 74a, on the first electrode 70a and to tailor the precise locations of the conductive material.
  • standard processing techniques such as a photochemical etching process or a photolithography process
  • the first capillary plate 72a of the preferable embodiment of CAPGEA 68 comprises a shape complimentary to the shape of the first electrode 70a. This is preferable due to the fact that the second face 76b of the first electrode 70a is applied to a first face 78a of the first capillary plate 72a. Likewise, it is to be appreciated that a second face 78b is of complimentary shape to the second electrode 70b, as it will be applied to the second electrode 70b, of which will be described in more detail below. Also, though it cannot be seen in Figure 6, the second face 78b is of the opposite side that the first face 78a resides on capillary plate 72a.
  • the first capillary plate 72a consists of the same perforations, holes 74b corresponding to the predetermined pattern 75.
  • the holes 74a of the first electrode are axially aligned with the holes 74b to form a common capillary path.
  • the predetermined pattern 75 of the holes 74a, 74b, 74c, and 74d, respectively are preferably identical on each first and second electrode 70a and 70b, respectively, and on each first and second capillary plate, 72a and 72b, respectively.
  • the first capillary plate 72a serves as a dielectric and therefore is formed from any number of different types of dielectric materials.
  • the first capillary plate 72a comprising dielectric material, can be formed of glass, quartz, ceramic, or a printed circuit board material.
  • the first capillary plate 72a is formed either of a flexible or inflexible printed circuit board material, such as a woven glass reinforced epoxy resin (e.g., FR4 laminate grades), Mylar, or Kapton.
  • the first capillary plate 72a can be formed as a two layer circuit board substrate structure. It will thus be understood that the first capillary plate 72a can be formed of any number of dielectric materials that are suitable for the intended application.
  • the CAPGEA 68 further includes the second electrode 70b that is disposed adjacent and in contact with the second face 78b of the first capillary plate 70a and a first face 82a of the second capillary plate 72b; in effect, being sandwiched between the first and second capillaries plates. It is therefore desirable to make the second electrode 70b as thin as possible so as to make it possible to seal the second electrode between the first and second capillary plates 72a and 72b, respectively.
  • the term "seal” refers to the fact that access to the second electrode 70b is prevented when it is disposed between the first and second capillary plates 72a and 72b, respectively, once the first and second capillary plates are attached to one another. In other words, the outer peripheral edge of the second electrode 70b is not accessible when the first and second capillary plates 72a and 72b, respectively, are attached to one another during assembly of the
  • a via or the like can be formed through the second capillary plate 72b to provide access to the sealed second electrode 70b so that it can be operatively connected to a terminal of a power source, i.e. a positive or negative terminal.
  • the second electrode 70b is formed of a conductive material, such as copper, a discrete metallic film, or patterned metallic element, and functions as a "ring electrode" for each of the holes 74c disposed on the second electrode.
  • the specific metal used as the conductive element as well as the predetermined pattern 75 of the holes 74c which in effect form the "ring electrode” is not to be limiting whereas other suitable conductive elements or structures that yield the desired electrical properties and conductive pattern to the CAPGEA 68 are well within the scope of the present invention.
  • the second electrode 70b is complementary to the shapes of the other electrode and capillary plate elements. Accordingly, as illustrated in the preferred embodiment, the second electrode 70b has a substantially circular shape.
  • the second electrode 70b provides a discrete conductive pattern that is made up of first and second conductive elements 100a and 100b, such as line conductors, that arc formed around the holes 74c preferably corresponding to the predetermined pattern 75 of the second electrode 70b.
  • the conductive lines are thus routed across the second electrode 70b according to a precise predetermined pattern 75.
  • the first conductive elements 100a are defined by a first set of conductive lines that are parallel to one another and extend across the film in one direction.
  • the second conductive elements 100b are parallel to one another and extend across the metallic film, or second electrode 70b, in a direction different than that of the first conductive elements 100a.
  • the first conductive elements 100a and second conductive elements 100b intersect across the second electrode 70b.
  • the first and second conductive elements 100a and 100b, respectively are not parallel to one another but instead form a grid-like pattern defining a plurality of interstices between the conductive lines.
  • the second electrode 70b preferably has more than a simple grid design in that the first and second conductive elements 100a and 100b, respectively, can include a series of circular conductive elements 102 that are spaced along the length of the first and second conductive elements 100a and 100b, preferably identical to the predetermined pattern 75.
  • these circular conductive elements 102 are intended to be positioned relative to the holes 74c so that they surround and arc disposed within the holes 74c. In other words, the holes 74c arc centrally located within the openings of the circular conductive elements 102.
  • the second electrode 70b can be in the form of a discrete film that is applied to the second capillary plate 72b or it can be in the form of discrete conductive elements, such as line conductors or strips, that are formed on the first face 82a of the second capillary plate 72b using conventional techniques. These techniques comprise especially printed circuit board techniques, including but not limited to a photochemical etching process, a photolithography process, etc.
  • a stock metal layer is first disposed on the face of the second capillary plate 72b and then this layer is processed (e.g.,
  • the holes 74b and 74d of the first and second capillary plates 72a and 72b, respectively, can be formed using any number of suitable techniques that are designed to form discrete, defined openings in dielectric materials.
  • the holes 74b and 74d arc formed using a laser apparatus which permits well defined micro sized, holes 74b and 74d through the body of the first and second capillary plates 72a and 72b, respectively.
  • other techniques can equally be used to form the holes 74b and 74d.
  • the first electrode 70a is disposed on and securely attached to the first face 78a of the first capillary plate 72a by using any number of suitable techniques that result in the thin first electrode being properly positioned and securely attached to the first capillary plate.
  • the thin first electrode 70a can be bonded to the first face 78a using suitable chemical and mechanical bonding techniques or it can be bonded to the first face 78a using an adhesive, etc.
  • the thin first electrode 70a is bonded to the first face 78a through the use of a laser.
  • the first electrode 70a can be evaporated onto the first face 78a using known evaporating techniques which result in the first electrode 70a, a metallic film or element, being securely attached to the first face 78a of the first capillary plate 72a when dried.
  • the first and second capillary plates 72a and 72b, respectively, can be attached to one another using any number of conventional techniques, including the use of adhesives, such as a glue or cement, or by chemical bonding, mechanical fit, etc.
  • the second electrode 70b can thus be characterized as being an embedded electrode so as to prevent exposure of the second electrode to plasma and. thus, this is why it is desirable for the thin second electrode 70b to be between the first and second capillary plates 72 a and 72b, respectively.
  • the thin first and second electrodes 70a and 70b have a thickness less than or equal to 1.5 microns.
  • the second capillary plate 72b is preferably a mirror image of the first capillary plate 72a.
  • the second capillary plate 72b includes the first face 82a that faces and contacts the face 80b of the second electrode 70b and an opposing second face 82b that faces away from the second electrode 70b.
  • the second capillary plate 72b serves as a dielectric and therefore, it is formed of any number of different types of dielectric materials, including but not limited to, glass, quartz, ceramic, or a printed circuit board material, e.g., flexible or inflexible printed circuit board material, such as a woven glass reinforced epoxy resin (e.g., FR4 laminate grades), Mylar, or
  • first and second capillary plates 72a and 72b, respectively, are identical with respect to one another.
  • the second capillary plate 72b includes the plurality of holes 74d formed therethrough according to the predetermined pattern 75.
  • the predetermined pattern 75 of the holes 74d on the second capillary plate 72b is preferably the same as the predetermined pattern 75 on the first capillary plate 72a. Therefore, in the illustrated embodiment, the predetermined pattern 75 for each is a series of capillary rows formed across the film to define a discrete pattern, e.g., a hexagonal shaped pattern of capillaries.
  • the holes 74d of the second capillary plate 72b can be formed to have any other type of pattern since a particular pattern is not critical to the practice of the present invention.
  • the holes 774a, 74b, 74c, and 74d of each element are axially aligned with one another with the second electrode 70b functioning as a "ring electrode" for each capillary path.
  • the holes 74c are positioned within the interstices defined by the first and second conductive elements 100a and 100b, respectively. In this way, the first and second conductive elements 100a, 100b do not impede the flow of fluid through the holes 74b and 74d defined through the first and second capillary plates 72a and 72b,
  • the holes 74a of the first electrode 70a are axially aligned with the holes 74b and 74d of the first and second capillary plates 72a and 72b, respectively, and the holes 74c of the second electrode 70b.
  • a sealing member such as a gasket is disposed between the opposed faces of the first capillary plate and the second electrode.
  • This seal is formed with a number of through ports. Each seal through port is in registration with and located between holes 74b of the first capillary plate and the complementary holes 74c of the second electrode.
  • this seal element ensures fluid flow through which first capillary plate holes 74b goes through and only through the associated second electrode holes 74c.
  • the plasma is still initiated in the holes 74b of the first capillary plate 72a and discharged through holes 74d of the second capillary plate 72b.
  • the plasma contacts another added fluid, such as an additive, e.g., an active sterilizing species, in a different manner than when the holes of the first electrode 70a are present.
  • an additive e.g., an active sterilizing species
  • the additive is introduced to the emitted plasma at a location proximate the bottom openings of the holes 74d on the second face 82b of the second capillary plate 72b in a cross flow which permits the additive to contact the generated plasma.
  • the individual members comprising the first and second electrodes 70a and 70, respectively, and first and second capillary plates 72a and 72b, respectively, are properly oriented with respect to one another such that the discrete features thereof are all properly oriented with respect to one another and the
  • the CAPGEA 68 has a substantially circular shape, the CAPGEA 68 can include a flat edge 84 or planar segment formed along an outer, or peripheral, edge of the CAPGEA 68. This flat 84 is formed on each of the individual members that are combined to form the
  • CAPGEA 68 permits the individual components to be easily oriented relative to one another by simply aligning the flats 84 with respect to one another. This allows all the holes 74a, 74b, 74c, and 74d of each individual member, as well as the other micro sized features, to be properly orientated relative to one another, and in this manner, the plurality of flats 84 act as locating features.
  • the plasma is initiated inside the holes 74b of the first capillary plate 72a.
  • the plasma is emitted out through the holes 74d of the second capillary plate 72b into a conduit, filter, space, surface, or sterilization system 90.
  • the emitted plasma destroys microbial life on or around medical equipment that is present in the sterilization system 90.
  • the entire CAPGEA 68 is constructed to optimize the size of the CAPGEA and in particular, make the CAPGEA as thin as possible in order to achieve the desired electrical and plasma generating properties.
  • the thickness of each of the first and second capillary plates 72a and 72b, respectively is about 0.5mm.
  • the diameter of the holes 74b and 74d disposed on each of the first and second capillary plates 72a and 72b, respectively are about 300 micron.
  • these values are only illustrative and not limiting.
  • the CAPGEA 68 provides a number of advantages that can not be achieved or are very difficult to achieve with conventional plasma electrode design.
  • the CAPGEA 68 design permits printed circuit techniques to be used to form the conductive elements of the electrode on suitable substrates, e.g., quartz, glass, refractories, printed circuit board materials, etc., and therefore, it is possible to create a plasma with a much higher density of plasma species, e.g., electrons, ions, radicals, etc.
  • the CAPGEA 68 also remedies a shortcoming of the capillary plasma design where a second electrode opposing the perforated dielectric is required and thus confines the plasma to exist in the dead space between these two members.
  • FIGS 8-9 illustrate an embodiment in which the CAPGEA 68 is incorporated into a plasma generator device 120, such as one of the plasma generators that has been described herein and/or disclosed in one or more of the patents/patent applications incorporated herein by reference.
  • the illustrated plasma generator 120 is made up of a number of parts that cooperate and mate with one another to form a reactor.
  • the plasma generator 120 has a first end 122 and an opposing second end 124, with an aperture 126 being formed at the first end 122 in which the CAPGEA 68 is disposed.
  • the plasma generator 120 includes a central conduit, or hollow passage way, 128 that extends from the open second end 124 to the CAPGEA 68 so that fluid that passes through the central conduit 128 and flows through the holes 74a, 74b, 74c, and 74d, which collectively, create the capillary paths of the CAPGEA 68.
  • the CAPGEA 68 can be incorporated into a portable plasma generator, similar to those previously discussed, and in which case, the gas that is introduced into the plasma generator to produce the sterilizing fluid can be supplied on a small scale, such as in a small gas cartridge which permits the entire system to be truly portable in nature.
  • the CAPGEA 68 can be part of a
  • the self-contained plasma generator unit that can be detached from the gas source canister or the like.
  • the gas canister is simply replaced and a full one is then operatively connected to the generator for generation of additional sterilizing fluid.
  • the CAPGEA 68 is incorporated into the plasma generator device illustrated in Figure 4.
  • the non-thermal plasma discharge device 220 incorporates the CAPGEA 68 therein and operates in the manner previously discussed and as set forth in one or more of the incorporated patent applications/patents.
  • Example 5
  • the CAPGEA 68 is incorporated into the system 90 for sterilizing an object, and in particular, the CAPGEA 68 can be incorporated directly into the unit 94, as seen in Figure 5, such as in the top or lid of the unit 94.
  • each unit 94 incorporates the CAPGEA 68 therein and operates in the manner previously discussed and as set forth in one or more of the incorporated patent applications/patents.
  • the CAPGEA 68 is incorporated into a portable plasma generator device as described in detail in the above Example 3.

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  • Physics & Mathematics (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Epidemiology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
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Abstract

Le dispositif selon l’invention comporte divers ensembles d’électrodes de forme planaire, cylindrique et capillaire, chacun comportant des premières et secondes électrodes avec des diélectriques disposés sur ou autour des électrodes. Les ensembles d’électrodes générant un plasma, le plasma agit comme agent stérilisant destructeur. Les ensembles d’électrodes et le plasma produit par les ensembles d’électrodes font partie d’un système de stérilisation qui stérilise de l'équipement médical et divers autres objets.
PCT/US2006/061682 2005-12-07 2006-12-06 Système de stérilisation avec un générateur de plasma, le générateur de plasma comportant un ensemble d’électrodes comportant une matrice de capillaires dans lesquels le plasma est généré et dans lesquels du fluide est introduit WO2007067924A2 (fr)

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