WO2006122780A3 - Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules - Google Patents
Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules Download PDFInfo
- Publication number
- WO2006122780A3 WO2006122780A3 PCT/EP2006/004671 EP2006004671W WO2006122780A3 WO 2006122780 A3 WO2006122780 A3 WO 2006122780A3 EP 2006004671 W EP2006004671 W EP 2006004671W WO 2006122780 A3 WO2006122780 A3 WO 2006122780A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- measuring device
- field measuring
- measurement
- producing
- measurement module
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/0206—Three-component magnetometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
The invention relates to a field measuring device with a measurement module that is connected to a base plate, said measurement module having a first field sensor chip located in a first plane, and a second field sensor chip located in a second plane and disposed to the first plane at an angle 0° < α< 180°. The first field sensor chip is located above the base plate and the second field sensor chip is located between the first field sensor chip and the base plate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005023591.3 | 2005-05-18 | ||
DE102005023591A DE102005023591A1 (en) | 2005-05-18 | 2005-05-18 | Field measuring device, measuring module for a field measuring device and method of production for a plurality of measuring modules |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006122780A2 WO2006122780A2 (en) | 2006-11-23 |
WO2006122780A3 true WO2006122780A3 (en) | 2007-03-01 |
Family
ID=36716941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/004671 WO2006122780A2 (en) | 2005-05-18 | 2006-05-17 | Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102005023591A1 (en) |
WO (1) | WO2006122780A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7237437B1 (en) * | 2005-10-27 | 2007-07-03 | Honeywell International Inc. | MEMS sensor systems and methods |
FR2903812B1 (en) * | 2006-07-13 | 2008-10-31 | Commissariat Energie Atomique | INTEGRATED CIRCUIT DISTRIBUTED TO AT LEAST TWO NON-PARALLEL PLANS AND METHOD FOR PRODUCING THE SAME |
DE102008045360B4 (en) | 2008-07-16 | 2010-11-18 | Dernedde, Niels, Dipl.-Wirtsch. Ing. | Surface probe for alternating electrical fields in the vicinity of a magnetic field sensor |
US9995600B2 (en) * | 2015-09-01 | 2018-06-12 | General Electric Company | Multi-axis magneto-resistance sensor package |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9113744U1 (en) * | 1991-11-05 | 1992-01-16 | SMT & Hybrid GmbH, O-8012 Dresden | Three-dimensional micromechanical acceleration sensor with integrated electronics |
DE19610554A1 (en) * | 1995-04-19 | 1996-10-24 | Smiths Industries Plc | Inertial sensor assembly, such as planar array silicon chips |
US5672967A (en) * | 1995-09-19 | 1997-09-30 | Southwest Research Institute | Compact tri-axial fluxgate magnetometer and housing with unitary orthogonal sensor substrate |
-
2005
- 2005-05-18 DE DE102005023591A patent/DE102005023591A1/en not_active Ceased
-
2006
- 2006-05-17 WO PCT/EP2006/004671 patent/WO2006122780A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9113744U1 (en) * | 1991-11-05 | 1992-01-16 | SMT & Hybrid GmbH, O-8012 Dresden | Three-dimensional micromechanical acceleration sensor with integrated electronics |
DE19610554A1 (en) * | 1995-04-19 | 1996-10-24 | Smiths Industries Plc | Inertial sensor assembly, such as planar array silicon chips |
US5672967A (en) * | 1995-09-19 | 1997-09-30 | Southwest Research Institute | Compact tri-axial fluxgate magnetometer and housing with unitary orthogonal sensor substrate |
Also Published As
Publication number | Publication date |
---|---|
DE102005023591A1 (en) | 2006-11-30 |
WO2006122780A2 (en) | 2006-11-23 |
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