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WO2006116865A1 - Procede de fabrication de micromoules - Google Patents

Procede de fabrication de micromoules Download PDF

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Publication number
WO2006116865A1
WO2006116865A1 PCT/CA2006/000699 CA2006000699W WO2006116865A1 WO 2006116865 A1 WO2006116865 A1 WO 2006116865A1 CA 2006000699 W CA2006000699 W CA 2006000699W WO 2006116865 A1 WO2006116865 A1 WO 2006116865A1
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WO
WIPO (PCT)
Prior art keywords
master
mold
complementary
masters
replicate
Prior art date
Application number
PCT/CA2006/000699
Other languages
English (en)
Inventor
Christophe Py
Karim Faid
Original Assignee
National Research Council Of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council Of Canada filed Critical National Research Council Of Canada
Publication of WO2006116865A1 publication Critical patent/WO2006116865A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/009—Manufacturing the stamps or the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Definitions

  • This invention relates to the field of microfabrication, and in particular to a method of making three dimensional microstructures.
  • Microstructures are required for many applications, such as the fabrication of sensors in the chemical, pharmaceutical and biotechnical industries, displays, optical devices, or chips in the electronics industry. Different techniques have been tried in the fabrication of such structures.
  • microchannel printing where grooves are formed in the PDMS stamp: when the stamp is pressed in conformal contact with a substrate, the grooves form closed channels that can be filled with a given solution.
  • the solution either wets the substrate to form a thin layer, or is cured or cross-linked to keep the 3D shape of the channel.
  • PDMS or harder materials have also been used for embossing of polymers, and many other derivative methods have been reported.
  • Soft-lithography methods are particularly interesting in the area of organic semiconductor science: organic materials are typically not adapted to conventional lithographic methods, but soft-lithography methods can form polymers into patterned devices very simply.
  • optically-pumped lasers have been obtained by embossing highly photoluminescent polymers into distributed feedback gratings; patterned screens have been obtained by printing thin layers or monolayers on an electrode, either to form an insulator between that electrode and the active organic layers, or as an etching mask to pattern that electrode;
  • pixelated PLED displays have been obtained by embossing electroluminescent polymers;
  • conductive polymers have been directly printed on plastic to form flexible polymer electronics.
  • Roll-to-roll printing often cited as a possible breakthrough method of producing low-cost organic devices, has been demonstrated at the prototype level.
  • Chemical patterning, or the printing of chemically-active layers or self-assembled monolayers on flat surfaces, can also be used to fabricate sensors for the chemical, pharmaceutical and biotechnological industries.
  • the space-resolved chemical fictionalization of the surface of a wafer can be used for the selective adsorption of chemical or biological species, the presence, the nature of which (or the activity, in case of living cells) can be detected, identified or monitored by sensors fabricated under the surface of that wafer.
  • in- vitro living cells will preferentially bond to hydrophilic than hydrophobic surfaces, so chemically patterning hydrophilic pads on an hydrophobic surfaces results in controlled positioning of the cells, for example on top of electrodes monitoring their electrophysiological activity (Faid, Biomedical Microdevices, 2005.
  • microfluidics has been reported whereby microfluidic channels are fabricated on sheets of Si, glass of PDMS, then holes are drilled through them, and the sheets are assembled and fused. This type of mechanism is however not conducive to high-resolution and is generally limited to mm-size features.
  • 3 D molds can of assembled pseudo molds, which are either surface machined masters, or replicates of surface machined masters. They are generally made of an elastomer. However, since there is no commercially method of assembling them with sufficient precision, the assembled 3D molds can only be made with relatively low resolution [0009] These prior art techniques are discussed generally in the following references: Jo, "Three-dimensional micro-channel fabrication in PDMS elastomer", J.
  • the invention provides a method of making a three dimensional microfluidics mold for the fabrication of microstructures on a substrate, comprising micromachining two or more masters to create features in a surface thereof; bringing said two or more of said masters or their complementary replicates together in combination to form a cavity; and introducing a curable mold- forming liquid into said cavity to make said microfluidics mold or a precursor thereof.
  • the microfluids mold can also be considered as a form of microstamp that is applied to the surface on which the microstructure is to be formed.
  • the present invention permits the fabrication of relatively complex three dimensional microstructures to high resolution because at least a part of the mold, or all of it, is itself formed by molding. This enables much more complex three dimensional molds to be made than is possible by simply bringing together surface machined parts, or their replicates. Also, in practice some features are easier to make than their complementary features, and curable liquids, such as PDMS, not present the same sticking problems can be used to make the final mold, especially if the final mold has features or is made of a material that would be hard to peel off from silicon.
  • the curable liquid is typically an organic polymer such as poly dimethyl siloxane, or a derivative thereof.
  • This resulting mold permits the mass production of high resolution three dimensional microstructures on a surface, such as the surface of a silicon substrate.
  • the invention provides a microfluidics mold comprising a mold body and a mold cavity, and wherein said mold body or a precursor thereof is a unitary part of polymeric material molded in a cavity defined by two or more micromachined masters or replicates thereof.
  • the molded precursor acts like a master if it is reused to make a subsequent mold.
  • An aspect of the invention is therefore that masters, or their replicates, can be assembled and the microcavities between those molds filled with a liquid that is then cured to form a true three-dimensional mold, rather than creating pseudo-3D molds separately then assembling them as in the prior art.
  • Masters by contrast, can be assembled with higher resolution so the resulting 3D mold formed by embodiments of the present invention can attain higher resolution than the prior art.
  • the micromachining may involve patterning substrates, for example, silicon substrates and then forming the mold by bringing together either the patterned substrates directly, or complementary replicas of the substrates made by flowing a curable liquid over the patterned substrate.
  • the masters can be microfabricated by conventional bulk or surface micromaching to have surface features.
  • the masters can be based on Si, glass or other suitable substrates and the features can be machined in the bulk of the substrate or patterned in photoresists (e.g. SU8, a very high-aspect ratio photosensitive epoxy well known in the field of MEMs, and distributed in North America by the company Microchem) or other polymeric or inorganic materials which are compatible with microfabrication techniques and have sufficient structural integrity for replication.
  • photoresists e.g. SU8, a very high-aspect ratio photosensitive epoxy well known in the field of MEMs, and distributed in North America by the company Microchem
  • other polymeric or inorganic materials which are compatible with microfabrication techniques and have sufficient structural integrity for replication.
  • the masters, or their replicates in PDMS or other materials are aligned in a conventional aligner retrofitted for that special use, and contacted such that some of the surface features are in contact with each other.
  • the empty space between the masters is filled with a filler material (for example, UV, heat or containing a curing agent, and again PDMS can be used) and cured.
  • the top master is removed, forming a mold with vertical connections between the top and the bottom where the surface features were in contact. The process can be repeated as many times as needed to form a sophisticated three dimensional microfluidic chip with high-resolution.
  • a high-resolution 3D process carried by aligning micro-machined masters or their replicates under an aligner and then filling the space with a curable polymer such as PDMS to form a 3D mold or a precursor thereof.
  • the resulting mold or stamp can be used for the parallel and self-aligned printing of mosaic patterns.
  • the use of a stamp is desirable because the mosaic patterns are printed in one single step, and it does not require any alignment between layers, since it is built in the mold. Since the alignment steps are critically time-consuming and have a large impact on yield in any microfabrication process, this is an important consideration.
  • Molds in accordance with the invention can be used to carry out the parallel printing of electroluminescent color displays. Additionally, the high-resolution 3D molding method can be applied to form various cost-effective microfluidic assays for biological chips. For example, it is useful in the development of synthetic neural networks and their integration with electrophysiological monitoring systems. In a synthetic neural network, cells have to be close enough for neurites to grow in between them and communication to take place. A suitable chip can be fabricated in PDMS by the proposed 3D molding process.
  • a method of making a three- dimensional ("3D") microfluidics mold comprising obtaining a first master or replicate thereof having surface features; obtaining a second master or replicate thereof having surface features adapted to align to the surface feature of the first master, such that when the two masters are aligned surface features of the first master touch surface features of the second master; aligning the first and second masters as described in step; and filling the empty space between the two aligned masters with a suitable curable liquid; curing the liquid, and removing at least one of the masters to expose a mold or a precursor thereof made of the cured liquid.
  • 3D three- dimensional
  • a method of fabricating a 3D microfluidics structure comprising the steps of obtaining masters which are microfabricated by conventional bulk or surface micromaching to have surface features, the masters being based on Si, glass or other suitable substrates and wherein the features can be machined in the bulk of the substrate or patterned in photoresists (e.g.
  • SU8 a very high- aspect ratio photosensitive epoxy well known in the field of MEMs or other polymeric or inorganic materials; making a complementary replicate in a rigid material of one or more than one of the masters by applying a layer of material such as a thick polymer on the substrate, cross linking it, or curing it, and peeling it off; aligning the masters, and/or their complementary replicates in a conventional aligner retrofitted for that special use, and contacted such that some of the surface features are touching; filling the empty space between the aligned complementary replicates and/or masters with a filler material (for example, UV, heat or containing a curing agent, and again PDMS can be used) and cured; removing at least one of the masters and or the complementary replicates and forming a mold where the surface features were touching; and repeating the process as many times as needed to form a sophisticated 3D microfluidic chip with a high-resolution.
  • a filler material for example, UV, heat or containing a
  • a method of making a three-dimensional ("3D") microfluidics structure comprising obtaining a first master having surface features; obtaining a second master having surface features and being complementary to the first master, such that when the two masters are aligned surface features the first master touch surface features of the second master; aligning the first and second masters as described in step (b); filling the empty space between the two aligned masters with a suitable material; and removing the first and the second master to leave behind a structure.
  • 3D three-dimensional
  • At least one master produced using a Si or glass substrate.
  • at least one master may be formed by bulk machining of and/or photo resist patterning on the substrate.
  • one or more replicas of a master is made and the replica is used in steps c, d and e instead of the master, hi some instances it will be desirable to employ a transparent master (or a transparent replica of a master) to facilitate alignment.
  • the surface features are features whose extension away from the wafer is significant compared to its lateral extent, such that by aligning several such features and filling the space in between, a self-supported mold can eventually be obtained.
  • the surface feature are indentation into the wafer such that when filled with filling material it creates a complement replicate and becomes an extension away from the wafer which is significant compared to its lateral extent, such that by aligning several such features and filling the space in between, a self-supported mold can eventually be obtained.
  • the surface features include inverted pyramids, towers, walls and channels.
  • the master is covered by a non sticking layer before it is filled with the filling material.
  • a method of making a 3D stamp comprising the steps of; obtaining a substrate; making a first master by etching inverted pyramids in said substrate; obtaining a second substrate; making a second master by etching elongated channel in said second substrate; obtaining a third substrate; making a third master by etching a reservoir in said third substrate; making complementary replicates of first, second and third masters; aligning said first and second complementary replicates such that said pyramids align with said elongated channels; filing the empty space with said filling material to create a first structure; removing said first master; aligning said third complementary replicate with said first structure such that the reservoir will flow into said elongated channels; and filling the empty space with said filling material to create a stamp.
  • a method of making a PDMS neurochip comprising the steps of obtaining a substrate; making a first master by etching inverted pyramids in said substrate; making a first complementary replicate of the first master; obtaining a second substrate; making a second master by patterning towers and walls in said second substrate; aligning said comlementary replicate with said towers; filing the empty space with said filling material to make a first structure; removing said first and second master; making a second complementary replicate of said second master; and aligning said second complementary replicate with said first structure to create said neurochip.
  • the invention also provides a method of producing a patterned substrate, said method comprising obtaining a film on a first side of a substantially inert backing; creating microholes in the film; bonding the second side of the backing to a carrier; obtaining a mask in the first side of the backing and creating windows in the thin film mask, said windows being aligned so as to connect to a microhole; etching the backing through the windows in the mask, to create an inverted pyramid structure resulting in a membrane including the micro-hole; obtaining a second chip defining channels; bonding the second chip to the backing such that a channel is positioned over a microhole in substantially sealing engagement; releasing the backing from the carrier; applying a pattern region on the first side of the membrane in alignment with micro-holes such that a micro-hole is located at the bottom of a well and the well is connected to other wells via trenches; and optionally coating the resulting product with a bio-compatible, electrically insulating plastic so as not to plug the micro-hole,
  • Figure 1 is a perspective view of part a prior art color display
  • Figure 2 illustrates the steps in the fabrication of a color display using a mold made in accordance with an embodiment of the invention
  • Figure 3 is a schemactic illustration of the application of electroluminescent polymer through a single funnel network
  • Figure 4 is a schematic view of a mold with three funnel networks for the respective primary colors of the display
  • Figure 5 shows the steps involved in making a mold according to a first embodiment of the invention
  • Figure 6 is a micrograph showing the funnels and channels
  • Figure 7 shows a synthetic cell/network interface
  • Figure 8 shows the steps involved in making a mold according to a second embodiment of the invention.
  • Figure 9 shows the steps of making the mold in accordance with the second embodiment in plan view.
  • Figure 1 shows a typical color flat-panel display display, which comprises bars 11 , 12, and 13 of electroluminescent material representing the three primary colours (blue, red and green, represented here by different grey levels) on a substrate 10.
  • the three primary colors are arranged in sequence.
  • a color pixel is the result of the combination of those 3 color sub-pixels addressed by independent electrical means. Any color of the visible spectrum can be displayed by modulating the light output of the primary colors.
  • the portion of the flat-panel color display is made with a microfluidics mold or stamp as shown in Figure 2.
  • the stamp with internal cavities forming channels 21 complementary to the bars 11, 12, and 13 is applied to the surface of the silicon substrate 10.
  • the channels are then filled with a curable electroluminescent material in liquid form, which is then allowed to cure to form the bars 11, 12, and 13.
  • Figure 3 shows the funnels 30 through which the liquid flows into the channels 21.
  • the layout of the mold is shown in more detail in Figure 4.
  • Three sets of funnels 30, 31, and 32 are provided corresponding to the three primary colors.
  • the funnels open at their narrow end into channels which form the color bars 12, 13, 14, and at their wide end into reservoirs 40, 41, 42, which contain the curable electrolumiscent liquid used to make the color bars.
  • the sets of funnels are offset and the funnels of each set supply every third channel, so that, for example, the funnels 30 might supply the red bars, the funnels 31 might supply the green bars, and the funnels 32 might supply the blue bars.
  • the mold is itself made out of a molded material formed from surface machined mold components.
  • microfluidics mold shown in Figure 2 can also print chemical agents imparting different surface properties on the substrate. This allows, for example, the selective implantation of different types of cells on a chip, resulting in a multi-cell network chip. It could also be used for the selective recognition of different types of chemical or biological species for multi-analyte detectors.
  • step a an SiO 2 thin film mask is first deposited on the surface of a first Si substrate with a (100) crystalline orientation to create three arrays of windows about 900 ⁇ m square in the thin film mask with a 1.2mm pitch. Each array is laterally shifted by 400 ⁇ m with respect to the next and with a vertical pitch of lcm.
  • the first Si substrate is etched (step b) in a KOH solution to reveal (111) crystalline facets creating inverted pyramid with a square bottom approximately 300 ⁇ m in size.
  • An SiO 2 thin film mask (step c) is formed on the surface of a second Si substrate to create an array of elongated windows with a 300 ⁇ m width and separated by lOO ⁇ m, for a pitch of 400 ⁇ m. Channels are etched in the Si substrate through the windows by either KOH or other wet or dry echting methods known in the art.
  • An SiO 2 thin film mask is deposited on the surface of a third Si substrate with a (100) crystalline orientation to create three large square windows in the thin film mask, with a vertical pitch of lcm. Deep reservoirs are then etched (step d) through the windows using KOH.
  • the features of the first and second Si substrates are replicated (step e) by applying a thick coat of a PDMS prepolymer to each substrate, and then curing it, typically by cross-linking, and peeling off the PDMS replicate, thereby creating pyramids in the replicate of the first Si substrate and walls in the replicate of the second Si substrate corresponding to the channels.
  • anti-stick treatments can be applied to the two PDMS replicates.
  • the two PDMS replicates are then aligned such that each wall is in contact with the narrow base of the pyramid, every third wall being aligned with a pyramid from the same array, approaching the two replicates until the narrow base of each pyramid is in contact with one wall, filling the space in between the two replicates with a PDMS prepolymer, curing the PDMS, thereby creating in a PDMS-I thick layer a first interim mold comprising an array of channels, each connected to a funnel, every third channel being connected to a funnel from the same array.
  • the first Si substrate replicate is then peeled off from the PDMS-I thick layer.
  • the features of the third Si substrate are replicated in complementary form by applying a thick coat of a PDMS prepolymer, curing it and peeling off the PDMS replicate to obtain three large mesas.
  • Optionally anti-stick treatments are applied to this PDMS replicate but not to the thick layer PDMS-I .
  • This third Si PDMS substrate replicate is then aligned to the PDMS-I replicate and second Si substrate replicate assembly to form a second interim mold such that each array of funnels is in contact with only one mesa and no fluid can penetrate the funnels.
  • the empty space between the third Si substrate replicate and the PDMS-I thick layer is filled with a PDMS prepolymer, which is then cured to form a second thick layer PDMS-2 bonded to the first thick layer PDMS-I (step f).
  • step g is peeled from the top and the second Si substrate replicate is peeled from the bottom to form the final microfiuidics stamp or mold.
  • the mold can then be applied on a substrate where forming strips of polymers of three different primary colors is desirable as shown in Figure 2.
  • the three reservoirs are filled each with a polymer of a different primary color.
  • the polymers will flow from each reservoir to every third channel through the funnels and the excess will flow out of the end of the channels, either by natural flow or by being pumped by external means.
  • Figure 6 is a micrograph showing the channels and funnels.
  • This second example is a process flow for the fabrication of a synthetic cell shown in Figure 7 for a network/chip interface of the type disclosed in the US patent no. 601,568,220, IPSO, May 6, 2004, Geoff Mealing, NRC.
  • This technique adapts molding to an aligner so as to allow 3D features formed on wafers by conventional micromachining (and in some cases by replication) to be assembled and contacted, and the space in between them to be filled with a curable polymer.
  • the method has been demonstrated with epoxy glues and PDMS as the materials of the final 3D mold, but the use of other materials within the skill of one skilled in the art is also contemplated.
  • a SiN thin film mask 40 (step a) is formed on the surface of a Si wafer 41 with a (100) crystalline orientation to create (preferably about 75-125 ⁇ m), more preferably about 100 ⁇ m square windows in the thin film mask, with a 200 ⁇ m pitch.
  • the Si wafer 41 is etched with a KOH solution to reveal (111) crystalline facets 42 creating an inverted pyramid (step b).
  • the complementary feature of a pyramid is the formed in steps c(i) and C(ii) by applying a thick polymer 44, on top of the Si wafer and curing it, for example by cross-linking, then peeling it off the Si wafer.
  • a tower-and-wall pattern with a 200 ⁇ m pitch step (d) in Figure 8 and step (d) in Figure 9 is created on a second substrate, for example, using an SU8 photoresist on a Si wafer patterned by conventional optical lithography.
  • anti-stick treatments can be applied to the two patterned substrates.
  • This tower-and-wall pattern 45, 46 also shown in Figure 9 (step d) creates a complementary well 48 and trench 49 pattern in the final mold.
  • the tower-and-wall pattern is aligned with the pyramid pattern (step e) and the space between filled with a curable polymer 51.
  • the contact area between the apex of the pyramids and the towers form, in complementary molding, a microhole 50, the size of which can be controlled by the elasticity of the materials employed and the pressure applied.
  • the polymer is cured and the two substrates are removed to obtain a PDMS chip defining channels 46 with a 200 ⁇ m pitch.
  • the PDMS chip 52 is then inverted and fused to an Si chip 53 (step g) such that a channel is positioned over a microhole 50 in substantially sealing engagement with the funnels facing the microchannels 57.
  • the entire chip is optionally coated with parylene and/or polylysine or other thin-films known to promote the implantation of different types of cells.
  • Table III sets out steps for the production and fusing of two PDMS chips.
  • gl Litho 3 in SU8-50 on second Si wafer to walls as complement of channels.
  • the inverted pyramids can be bulk micro-machined in Si, and then replicated a first time.
  • a pattern of towers and walls patterns ie, the complement of wells and trenches
  • Those two patterns are then be aligned and contacted and the void filled with PDMS or another curable polymer.
  • PDMS is elastomeric and reports have suggested that small apertures may collapse.
  • the 3D molding process has been successful with harder UV curable epoxies such 1191 -M epoxy provided by Dymax Corp. and commonly used as a medical device adhesive that shouldn't have that issue. In that case, the towers and walls pattern would have to be treated (e.g. thin PDMS film) to avoid sticking.
  • a third pattern is fabricated in SU8 on a Si or glass chip or etched in its bulk with the complement of microfluidic channels features, then replicated in PDMS or another curable polymer. The two parts are then aligned and fused.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
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Abstract

L'invention concerne un procédé de fabrication d'un moule microfluidique tridimensionnel permettant la formation de microstructures sur un substrat. Au moins deux prototypes sont micro-usinés pour obtenir la formation de détails sur leur surface. Ces deux prototypes au moins ou leurs copies complémentaires sont combinés pour former une cavité, et un liquide de formation de moule durcissable est introduit dans la cavité pour former le moule microfluidique selon l'invention ou un précurseur de celui-ci.
PCT/CA2006/000699 2005-05-05 2006-05-03 Procede de fabrication de micromoules WO2006116865A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011053390B4 (de) * 2010-11-30 2014-07-24 Infineon Technologies Ag Verfahren zum Prozessieren eines Substrats

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645432B1 (en) * 2000-05-25 2003-11-11 President & Fellows Of Harvard College Microfluidic systems including three-dimensionally arrayed channel networks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645432B1 (en) * 2000-05-25 2003-11-11 President & Fellows Of Harvard College Microfluidic systems including three-dimensionally arrayed channel networks

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011053390B4 (de) * 2010-11-30 2014-07-24 Infineon Technologies Ag Verfahren zum Prozessieren eines Substrats
US9034233B2 (en) 2010-11-30 2015-05-19 Infineon Technologies Ag Method of processing a substrate

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