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WO2006111097A1 - Procede de soudure de fils a ultrason et appareil de soudure - Google Patents

Procede de soudure de fils a ultrason et appareil de soudure Download PDF

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Publication number
WO2006111097A1
WO2006111097A1 PCT/CN2006/000748 CN2006000748W WO2006111097A1 WO 2006111097 A1 WO2006111097 A1 WO 2006111097A1 CN 2006000748 W CN2006000748 W CN 2006000748W WO 2006111097 A1 WO2006111097 A1 WO 2006111097A1
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WO
WIPO (PCT)
Prior art keywords
sets
positioning
wire
turrets
welding
Prior art date
Application number
PCT/CN2006/000748
Other languages
English (en)
Chinese (zh)
Inventor
Lokwan Chan
Original Assignee
Itm (Shenzhen) Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itm (Shenzhen) Limited filed Critical Itm (Shenzhen) Limited
Publication of WO2006111097A1 publication Critical patent/WO2006111097A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • This invention relates to a soldering method or apparatus suitable for use in semiconductors, solid devices or components thereof for conducting current-directed leads, and more particularly to an ultrasonic bonding wire method and wire bonding apparatus therefor.
  • Chip on Board The chip on board (Chip on Board) is widely used in computers such as computers, mobile phones, optical digital products, smart cards, and clocks. Consumer electronic information products such as toys.
  • the wire bond is the basic process of COB and requires ultrasonic wire bonding methods and corresponding equipment.
  • An existing automatic ultrasonic wire bonding machine for multi-wire IC chips or LEDs and corresponding pads on the PCB including a horn system, an XY table that can be moved horizontally, and an XY table a boring table that can be rotated in a horizontal direction, a jig for a wire bonding workpiece disposed on the turret, the burr system is provided with an optical optical system including an adjustable optical lens group and a camera for checking the quality of the bonding wire a Z table that can be moved in the vertical direction, a welding head including a transducer, a tip, a wire feed member, and a wire clip, which is located in the center of the X direction of the XY table, and the optical lens group and the welding head are fixed at The Z stage can be moved in a vertical direction, and the wire bonding workpiece is an LED or an IC chip and a PCB board.
  • the image optical system for checking the quality of the bonding wire pre-amplifies the relative position of the in-line welding wire workpiece in the X, ⁇ , and ⁇ directions, recognizes and controls the ⁇ - ⁇ table, the 'turning table movement and rotation, to compensate the error, and makes the fixture
  • the solder joint of the upper wire bond workpiece is first confirmed, that is, it is accurately positioned at the position below the tip, and then the wire is twisted.
  • To use the point-to-point positioning for LED bonding first confirm the two points on the PCB as the reference point, and then confirm the position of each point of the LED first, then the welding line, the time of confirming the position makes the machine wire efficient. Reduced, usually by nearly 50%.
  • the technical problem to be solved by the present invention is to overcome the deficiencies of the prior art described above, and to provide an ultrasonic bonding wire method for LED bonding wires which can improve the efficiency of wire bonding.
  • Another technical problem to be solved by the present invention is to overcome the deficiencies of the prior art described above, and propose a
  • An ultrasonic bonding wire method for an IC chip bonding wire which can increase a bonding wire area, improve wire bonding accuracy, and not reduce efficiency.
  • Still another technical problem to be solved by the present invention is to overcome the deficiencies of the prior art described above, and to provide an ultrasonic wire bonding apparatus using the above two ultrasonic wire bonding methods.
  • the ultrasonic welding wire method for the LED bonding wire adopts an ultrasonic welding wire device including a welding head system, an XY table which can be moved in the horizontal direction, and a ⁇ turntable which is arranged on the XY table and can be rotated in the horizontal direction.
  • the welding head system is provided with an image optical system for checking the quality of the bonding wire, including an adjustable optical lens group and a camera, a Z table movable in the vertical direction, including a transducer, a welding tip, and a wire feeding member.
  • a welding head of the wire clamp located in the center of the X direction of the XY table, wherein the optical lens group and the welding head are fixed on the Z table and can be moved in a vertical direction, and the wire bending table is provided with a clamp for the wire bonding workpiece.
  • the wire bonding workpiece is an LED and a PCB board.
  • the set of twirling tables that can be rotated in the horizontal direction on the XY table has two groups, and the two sets of turrets are provided Reciprocating the XY table in the horizontal direction can repeat the two working positions of the indexing and resetting.
  • the first working position the first group of the rotating table is located below the first group of positioning optical systems for positioning,
  • the two sets of turntables are located below the welding head system for the welding line.
  • the first set of turntables are located below the welding head system for the welding line, and the second set of the rotating table is located in the second set of positioning images.
  • Initial stock positioning The two sets of turntables are in the first working position, and the workpieces to be welded are placed in the fixtures on the first set of turntables, and the first set of positioning optical systems are used to treat the wire workpiece PCB boards and each LEDs for positioning;
  • the two sets of turrets are transposed: the two sets of turrets are in the second working position, and the workpieces to be welded are placed in the fixtures on the second set of turrets, and the second set of locating optical systems are used to treat the wire-bonded workpieces. Positioning with each LED, at the same time, the welding wire system is used to weld the workpieces to be welded on the first set of turrets;
  • the two sets of turrets are reset: the two sets of turrets are in the first working position, and the workpieces to be welded are replaced by the welded wire workpieces, placed in the fixtures on the first set of turrets, treated by the first set of positioning optical systems Wire bond workpiece PCB board and each LED are positioned, at the same time, by the horn system Performing a wire bonding on the workpiece to be welded on the second set of the turntable;
  • the ultrasonic bonding wire method for the IC chip bonding wire adopts a ⁇ - ⁇ table including a horn system, which can be moved in the horizontal direction, and an ultrasonic wave which is disposed on the ⁇ - ⁇ table and can be rotated in the horizontal direction.
  • the welding head system is provided with an optical optical system including a focusable optical lens group and a camera for checking the quality of the bonding wire, a boring table movable in a vertical direction, including a transducer, a tip a welding head for sending the wire member and the wire clamp, located at the center of the X-direction of the ⁇ - ⁇ table, wherein the optical lens group and the welding head are fixed on the ⁇ table and can be moved in a vertical direction, and the turret is provided There is a jig for a wire bonding workpiece, and the wire bonding workpiece is an IC chip and a PCB board.
  • the set of twisting tables which can be rotated in the horizontal direction on the ⁇ - ⁇ table has two groups, and the two sets of turrets Having a reciprocating movement in the horizontal direction, the ⁇ - ⁇ table can be repeatedly repositioned and reset.
  • the first working position the first set of turrets is located below the first set of positioning optical systems.
  • the second set of turrets is located below the horn system for wire bonding.
  • the first set of turrets is located below the horn system for wire bonding, and the second set of turrets is located second.
  • Positioning is performed under the image optical system for group positioning;
  • Initial stock positioning The two sets of turntables are in the first working position, and the workpieces to be welded are placed in the fixtures on the first set of turntables, treated by the first set of positioning optical systems; 1: Early workpiece PCB The board and the IC chip are positioned, and the position of the bonding wire on the IC chip and the PCB board is calculated; the two sets of turrets are transposed: the two sets of turrets are in the second working position, and the workpieces to be welded are placed in the second group ⁇ In the fixture on the turntable, the second set of positioning optical systems for positioning the wire workpiece PCB board and the IC chip are positioned, and the position of the bonding wire on the IC chip and the PCB board is calculated, and at the same time, the welding head system will The first set of the workpiece to be welded on the turntable is welded; the two sets of the turntable are reset: the two sets of the turntable are in the first working position, and the workpiece to be welded is replaced with
  • the X-Y table that can be moved in the horizontal direction is one or two groups;
  • the turret that can be rotated in the horizontal direction on the X-Y table is two sets of turrets in a group of X-Y tables, or two sets of turrets in two sets of X-Y tables.
  • the two groups include an adjustable optical lens group and a positioning optical system for positioning the camera, which are equidistantly located on both sides of the welding head system;
  • the X-Y table that can be moved in the horizontal direction is a set, and the distance between the rotation centers of the two sets of turrets is equal to the distance between the central axes of the two sets of positioning optical systems and the central axis of the horn system. Reciprocating the XY table in the horizontal direction, so that the two working positions of the two sets of turrets are repeatedly indexed and reset, so that a set of workpieces to be welded can be positioned, and another set of workpieces to be welded can be welded at the same time. line.
  • the set of turntables that can be rotated in the horizontal direction on the X-Y table has two groups, and the two sets of turntables
  • the first working position the first group of turrets are located under the first group of positioning optical systems for positioning.
  • the second set of turrets is located below the horn system for wire bonding.
  • the first set of turrets is located below the horn system for the weld line, and the second set of turrets is located at the second set of positions.
  • the X-Y table that can be moved in the horizontal direction is one or two groups;
  • the turret that can be rotated in the horizontal direction on the X-Y table is two sets of turrets in a group of X-Y tables, or two sets of turrets in two sets of X-Y tables.
  • the two groups include an adjustable optical lens group and a positioning optical system for positioning the camera, which are equidistantly located on both sides of the welding head system;
  • the X-Y table that can be moved in the horizontal direction is a set, and the distance between the rotation centers of the two sets of turrets is equal to the distance between the central axes of the two sets of positioning optical systems and the central axis of the horn system.
  • microcontroller with identification and control functions for initial positioning of the material, transposition of the two sets of turns, and automatic resetting of the two sets of turntables.
  • the Z table passes the position signal fed back by the independent Z positioning sensor, and the micro-step motor driving board sends an action command from the micro-controller servo board, and then the micro-step motor driving board controls the micro-step motor to drive the ball screw according to the instruction. , the Z table is moved vertically and reciprocally along the linear guide rail, and the welding head of the welding head system is moved vertically to the precise welding position.
  • the XY table passes the position signal fed back by the independent X and Y positioning sensors, and the micro-step motor driving board sends an action instruction from the micro-step servo driving board, and then the micro-step motor driving board controls the micro-step motor driving according to the instruction.
  • the ball screw moves the XY table horizontally along the linear guide to move the turret horizontally to the precise welding position.
  • the turret turns the position signal fed back by the independent ⁇ positioning sensor, and the micro-step motor drive plate is driven by the micro-step motor driving board by the micro-step motor driving board, and then the micro-step motor driving board controls the micro-step motor driving according to the instruction.
  • the gear of the heart thrust ball bearing makes the turret rotating horizontally in the forward and reverse directions, and drives the workpiece to be welded in the fixture on the turret to the precise welding position.
  • the jigs for loading and clamping the workpiece to be welded are standard wire bonding jigs, tablet-type jigs, and vacuum jigs.
  • the ultrasonic welding wire method for the LED welding wire of the present invention is compared with the existing ultrasonic welding wire method using a set of twisting tables, and the efficiency of the LED bonding wire is improved by 100%, and the ultrasonic bonding wire method for the IC chip bonding wire is adopted and adopted.
  • the existing ultrasonic wire bonding method of the group turntable it is possible to perform the pull confirmation of each wire bonding area on the IC chip like the LED bonding wire, and the edge of the welding wire is pre-positioned.
  • the ultrasonic wire bonding device of the invention can be widely applied to digital electronic tubes, dot matrix boards, integrated circuit soft packages, thick film integrated circuits in consumer electronic information products such as computers, mobile phones, optical digital products, smart cards, watches, toys, and the like. , soldering of leads in transistor semiconductor devices.
  • FIG. 1 is a perspective view showing the components of a specific embodiment of an ultrasonic wire bonding apparatus according to the present invention.
  • Figure 2 is a perspective view of the arrangement of related components in a working position of the turret in the embodiment of Figure 1.
  • Fig. 3 is a schematic view showing the arrangement of related components in the other working position of the turret in the embodiment of Fig. 1.
  • the rotary automatic ultrasonic wire bonding machine includes a welding head system 2, an XY table 7 that can be moved in the horizontal direction, and a set of XY table 7 that can be rotated in the horizontal direction.
  • the turret 4, 5, the horn system 2 is provided with an optical optical system including a focusable optical lens group and a camera for inspecting the quality of the bonding wire, a Z table movable in the vertical direction, including a transducer , the welding tip 6, the welding wire component and the welding head of the wire clamp are located in the center of the X direction of the XY table 7, and the optical lens group and the welding head are fixed on the Z table to be movable in the vertical direction,
  • a wire clamp jig 8 is provided on the turntables 4, 5.
  • optical imaging systems 1 and 3 for positioning including an adjustable focus optical lens group and a camera;
  • the first set of turntables 4 are positioned below the first set of positioning optical systems 1 for positioning, and the second set of turntables 5 are located below the welding head system 2, The welding line is carried out.
  • the first set of turntables 4 are located below the welding head system 2 to perform the welding line, and the second set of the turntables 5 are located in the second set of positioning. Under the image optical system 3, positioning is performed.
  • a microcontroller with identification and control functions.
  • the Z table passes the position signal fed back by the independent Z positioning sensor, and the micro-step motor driving board sends an action command from the micro-controller servo board, and then the micro-step motor driving board controls the micro-step motor to drive the ball screw according to the instruction. , the Z table is moved vertically and reciprocally along the linear guide rail, and the welding nozzle 6 of the welding head system is driven to move vertically to the precise welding position.
  • the XY table 7 passes the position signals fed back by the independent X and Y positioning sensors, and the micro-step motor drive board sends an action command from the microcontroller servo board, and then the micro-step motor drive board controls the micro-step motor according to the instruction.
  • the ball screw is driven to move the ⁇ - ⁇ table 7 horizontally along the linear guide rail, and the turret 4, 5 is moved horizontally to the precise welding position.
  • the turrets 4 and 5 pass the position signals fed back by the independent ⁇ positioning sensors, and the micro-step motor driving board drives the board with the action command, and the micro-step motor driving board controls the micro-step motor driving according to the instruction.
  • the gears of the radial thrust ball bearing are arranged to rotate the turrets 4 and 5 in the forward and reverse directions, and the workpieces to be welded in the clamps on the turrets 4 and 5 are brought to the precise welding position.
  • the jigs for loading and clamping the workpiece to be welded are standard wire bonding jigs, tablet-type jigs, and vacuum jigs.
  • This rotary automatic ultrasonic wire bonding machine when used for LED and PCB board bonding, has the following steps:
  • Initial stock positioning The two sets of turntables 4, 5 are in the first working position, and the workpieces to be welded are placed in the fixture 8 on the first set of turntables 4, which are held by the first set of positioning optical systems 1 Wire bonding workpiece PCB board and each LED for positioning;
  • the two sets of turrets are transposed: the two sets of turrets 4, 5 are in the second working position, and the workpieces to be welded are placed in the jig 8 on the second set of turrets 5, and the second set of positioning optical systems 3 Positioning the wire bonding workpiece PCB board and each LED, and at the same time, the welding head system 2 performs the bonding wire on the workpiece to be welded on the first group of the turntable 4;
  • the two sets of turrets are reset: the two sets of turrets 4, 5 are in the first working position, and the workpieces to be welded are replaced with the welded wire workpieces, placed in the jig 8 on the first set of turrets 4, by the first set of positioning
  • the wire workpiece PCB board and each LED are to be positioned by the image optical system 1 , and at the same time, the workpiece to be welded on the second group of the turntable 5 is welded by the welding head system 2;
  • This rotary automatic ultrasonic wire bonding machine when used for the bonding of IC chips and PCB boards, has the following steps: Initial stock positioning: The two sets of turntables 4, 5 are in the first working position, and the workpiece to be welded is placed in the clamp 8 on the set of turntables 4, and is to be welded by the first set of positioning optical systems 1 The wire workpiece PCB board and the IC chip are positioned, and the position of the bonding wire on the IC chip and the PCB board is calculated;
  • the two sets of turrets are transposed: the two sets of turrets 4, 5 are in the second working position, and the workpieces to be welded are placed in the jig 8 on the second set of turrets 5, and the second set of positioning optical systems 3 Positioning the bonding wire workpiece PCB board and the IC chip, and calculating the position of the bonding wire on the IC chip and the PCB board, and at the same time, the workpiece to be welded on the first group of the turntable 4 is positioned by the welding head system 2 Conducting wire bonding;
  • the two sets of turrets are reset: the two sets of turrets 4, 5 are in the first working position, and the workpieces to be welded are replaced with the welded wire workpieces, placed in the jig 8 on the first set of turrets 4, by the first set of positioning Positioning the wire bonding workpiece PCB board and the IC chip with the image optical system 1 and calculating the position of the bonding wire on the IC chip and the PCB board, and at the same time, the second group of the turntable 5 is positioned by the welding head system 2 The wire to be welded to the workpiece;
  • the above-mentioned bonding wire is generated by the ultrasonic wave from the ultrasonic generator through the transducer to generate high-frequency vibration, and transmitted to the welding tip 6 through the horn, when the boring tool tip 6 moves vertically and the lead wire and the wire to be welded directly under it
  • the metal surface of the lead and the workpiece to be welded is brought into close contact to achieve the atomic distance, thereby firmly connecting the lead to the workpiece to be welded.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

Dans l’invention, un procédé de soudure à ultrasons et un appareil de soudure sont fournis avec deux ensembles de système optique vidéo pour le positionnement qui comprennent des ensembles à lentille optique et caméra pour la focalisation ; deux tables rotatives thêta fournies sur la table X-Y et rotatives en direction horizontale. Les tables rotatives thêta ont deux positions de travail pour changer et rétablir de manière répétée des positions en déplaçant les tables X-Y de manière répétée en direction horizontale. Dans la première position de travail, la première table rotative thêta identifie la position en dessous du premier système optique vidéo pour le positionnement ; et la deuxième table rotative thêta identifie la position en dessous de la tête de soudure pour souder le fil. Tandis que dans la deuxième position de travail, la première table rotative thêta se trouve en position en dessous de la tête de soudure pour souder le fil et la deuxième table rotative thêta est en position en dessous du système optique vidéo pour le positionnement. La séquence prévoit les phases suivantes: chargement et positionnement préliminaires ; changement de positions et rétablissement de positions entre les deux tables rotatives thêta ; répétition de la phase susmentionnée de changement et rétablissement des positions. Grâce à l’invention, l’efficacité de la soudure de fils dans des diodes électroluminescentes peut être améliorée de 100%, et chaque zone de soudure dans les puces de circuit intégré passe de 50*50 mm à 100*100 mm tandis que l’efficacité n’est pas réduite.
PCT/CN2006/000748 2005-04-20 2006-04-20 Procede de soudure de fils a ultrason et appareil de soudure WO2006111097A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200510034175.5 2005-04-20
CNB2005100341755A CN100355525C (zh) 2005-04-20 2005-04-20 超声波焊线方法及其焊线装置

Publications (1)

Publication Number Publication Date
WO2006111097A1 true WO2006111097A1 (fr) 2006-10-26

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WO (1) WO2006111097A1 (fr)

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US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN114566456A (zh) * 2022-04-29 2022-05-31 深圳市铨天科技有限公司 一种多层堆叠存储芯片的封装设备

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US20070181645A1 (en) * 2006-01-13 2007-08-09 Ho Wing Cheung J Wire bonding method and apparatus
CN101774078A (zh) * 2010-03-19 2010-07-14 周志坚 一种超声波金丝球焊机
CN101774077A (zh) * 2010-03-19 2010-07-14 周志坚 数控旋转型三维超声波金丝球焊机
CN103753044B (zh) * 2014-01-22 2016-04-06 深圳西龙同辉技术股份有限公司 一种上线机
CN106425212B (zh) * 2016-09-19 2018-05-08 武汉锐泽科技发展有限公司 摄像头焊接载条及载具
DE102017204657A1 (de) * 2017-03-21 2018-09-27 Schunk Sonosystems Gmbh Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe
JP2018181931A (ja) * 2017-04-05 2018-11-15 株式会社ディスコ 切削装置
CN107138846B (zh) * 2017-06-27 2022-12-06 哈尔滨工业大学深圳研究生院 应用于rfid磁卡金属铜线的超声微焊接方法及其装置
CN110640382A (zh) * 2019-11-02 2020-01-03 深圳小象鸿业机电有限公司 一种盘式电机定子绕组焊接装置及其使用方法
CN117438326B (zh) * 2023-10-30 2024-07-16 广东工业大学 一种焊线机焊头协同键合方法和焊线机

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