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WO2006024585A1 - Source de lumiere laser, procede pour usiner des pieces au moyen d'un rayon laser pulse - Google Patents

Source de lumiere laser, procede pour usiner des pieces au moyen d'un rayon laser pulse Download PDF

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Publication number
WO2006024585A1
WO2006024585A1 PCT/EP2005/053723 EP2005053723W WO2006024585A1 WO 2006024585 A1 WO2006024585 A1 WO 2006024585A1 EP 2005053723 W EP2005053723 W EP 2005053723W WO 2006024585 A1 WO2006024585 A1 WO 2006024585A1
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WO
WIPO (PCT)
Prior art keywords
laser
light source
laser light
resonator
mirror
Prior art date
Application number
PCT/EP2005/053723
Other languages
German (de)
English (en)
Inventor
Hans Jürgen Mayer
Uwe Metka
Original Assignee
Hitachi Via Mechanics, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics, Ltd. filed Critical Hitachi Via Mechanics, Ltd.
Priority to JP2007528815A priority Critical patent/JP2008511975A/ja
Publication of WO2006024585A1 publication Critical patent/WO2006024585A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • H01S3/107—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using electro-optic devices, e.g. exhibiting Pockels or Kerr effect
    • H01S3/1075—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using electro-optic devices, e.g. exhibiting Pockels or Kerr effect for optical deflection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • H01S3/1068—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using an acousto-optical device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/163—Solid materials characterised by a crystal matrix
    • H01S3/164—Solid materials characterised by a crystal matrix garnet
    • H01S3/1643—YAG
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/163—Solid materials characterised by a crystal matrix
    • H01S3/1671—Solid materials characterised by a crystal matrix vanadate, niobate, tantalate
    • H01S3/1673—YVO4 [YVO]

Definitions

  • Laser light source method for processing workpieces by means of pulsed laser radiation
  • the invention relates to a laser light source, particularly a laser light source for use in a Laserbearbei ⁇ processing machine for drilling and / or patterning of elektro ⁇ African circuit substrates by pulsed laser radiation.
  • the invention further relates to a method for processing workpieces by means of pulsed laser radiation using the said laser light source.
  • the drilling of electronic circuit substrates is usually carried out by means of pulsed laser radiation in special laser processing machines for the electronics sector.
  • Laser light sources are used, for example, as CO 2 lasers and solid-state lasers which emit laser radiation having a wavelength in the visible or also in the near ultraviolet spectral range by a frequency multiplication carried out in a known manner. Laser radiation in the ultraviolet spectral range is in particular for the precise removal of metallic layers of a multilayer printed circuit board suitable.
  • the quality of the drilled holes is determined inter alia by the following characteristic parameters of the laser light source used: pulse energy, pulse width, repetition frequency, transverse intensity distribution of the laser beam.
  • the invention has for its object to provide a laser light ⁇ source, which emits laser pulses, which ensures optimal material erosion for a variety of different materials.
  • the invention is also the
  • the device-related object is achieved by a laser light source having the features of the independent claim 1.
  • the laser light source according to the invention comprises a laser ⁇ resonator with a partially transmitting Auskoppelapt and an end mirror.
  • the laser light source further comprises an active laser medium and a beam switching device, both of which are arranged within the laser resonator.
  • the beam switching device and the laser resonator are set up such that a laser beam guided in the laser resonator can be switched between a first beam path and a second beam path, wherein the second beam path has a different length than the first beam path.
  • the invention is based on the recognition that the pulse ⁇ wide and varies the pulse duration of the generated laser pulses by changing the cavity length in a simple manner and can thus be adapted to various different materials, so that an optimum, that is both fast and a precise material removal can be achieved.
  • a precise material removal is characterized by the fact that between a region with eroded
  • Material and another area with unsprayed material is a sharp spatial boundary.
  • the physical reason for the dependence of the pulse duration on the resonator length can be explained simply by the fact that the propagation time of a light pulse, which requires a predetermined number of passes through the active laser medium to reduce an inversion in the active laser medium, is correspondingly longer with a larger resonator length , The length of a laser pulse thus depends on the transit time within the laser resonator.
  • the end mirror of the laser light source according to the invention preferably a mirror is capable with the highest possible reflection
  • the Endspie a partially transparent mirror can be ⁇ gel, so that by the inventive laser light source two laser beams be generated, wherein a laser beam, the laser light source from the output mirror and the other laser beam emerges from the partially transparent end mirror.
  • the invention itself will not ⁇ different to only two Strah ⁇ beam paths is limited within the laser resonator. May be present device depen ⁇ gig on the number of switching positions of Strahlumschalt ⁇ in principle any number of optical paths of different lengths. Instead of a
  • Beam switching device with a variety of under Kunststoff ⁇ union switch positions can also be several Strahlumlenkein ⁇ directions, each with a plurality of switching positions arranged one behind the other.
  • an end mirror is associated with each of the two beam paths, which can be selectively activated by the beam switching device.
  • Two beam paths are provided for the beam path between the beam switching device and the end mirror, depending on the position of the beam switching device, wherein exactly one of the two beam paths for guiding the laser beam within the laser resonator is determined by the beam switching device.
  • the exact length of a beam path and thus the resulting pulse duration can be set.
  • the lengths of all beam paths can be changed alike.
  • the laser light source according to claim 3 has two beam switching elements, which are arranged inside the laser resonator. Between the two beam switching elements, a beam guiding device is provided which, in conjunction with the two beam switching elements, effects a deflection and thus an extension of the current beam path in comparison to the beam path of the so-called zero beam.
  • the zero beam is defined by the beam path in the laser resonator, which results at a certain starting position of the beam switching elements.
  • any number of "bypass beam paths” are possible, so that the resulting pulse duration can be optimally adapted to a large number of different materials for material processing.
  • the beam guiding device has at least one reflector, which contributes to the fact that the laser beam deflected out of the beam path of the zero beam can be returned to the beam path of the zero beam.
  • the spatial arrangement of the reflector determines the extension of the beam path, so that the resulting pulse duration can be adjusted in a simple manner by a corresponding spatial arrangement of the reflector.
  • the laser beam guided in the laser resonator is emitted from the null beam by the first of the two beam switching elements. deflects and coupled ⁇ in a first end of an optical waveguide ⁇ . After passing through the optical waveguide, the light beam leaves the other end of the Lichtwellenlei ⁇ ters and is at a symmetrical switching position of the two beam switching over the second of the two
  • the beam switching device has a rotatably mounted mirror or a chopper device.
  • the beam path within the laser resonator can thus be realized via a mechanical movement of conventional optical components.
  • a greater period of time is at least rates of large repeat ⁇ required as the time interval between two consecutive laser pulses in the rule.
  • the resulting pulse length of the individual laser pulses can not be varied individually, but only for a sequence of a plurality of laser pulses.
  • the use of such mechanical beam switching devices is easy to implement and completely sufficient for a large number of applications, since as a rule a material having a multiplicity of successive laser pulses is processed with an unchanged pulse duration.
  • a chopper for example, is a rotatably mounted glass, which alternately transparent and mirrored areas, which are introduced into the beam path and thus alternately cause transmission and reflection.
  • a rotatably mounted mirror is particularly suitable a rotary mechanism in which the mirror between different, precisely defined angular positions can be switched.
  • the embodiment according to claim 7 has as Strahlumschalt ⁇ device on an electro-optical modulator or an acousto-optical modulator.
  • an electro-optic modulator of modu lator ⁇ causes rotation of the polarization of the light beam.
  • the spatial separation of the differently polarized laser beams then takes place with a polarization-sensitive reflector, for example a so-called Brewster window.
  • An acousto-optic modulator is, for example, a CdTe
  • Crystal which is excited with a frequency in the megahertz range to mechanical vibrations.
  • the stationary wave formed within the crystal represents a diffraction grating for an incident laser beam.
  • a beam switching with electroacoustic or with acousto-optical modulators has the advantage that the switching can be done very quickly, so even switching the laser resonator between different beam paths even at a laser pulse repetition rate in the range of several kHz in principle between two successive following laser pulses is possible.
  • Such targeted variation of the pulse duration of individual laser pulses results in a large number of new possibilities for optimal material processing.
  • the material processing can take place by means of a plurality of successive laser pulses at one and the same point, wherein the pulse duration of a laser pulse differs from the pulse duration of the laser pulse previously directed to the same location.
  • a deflection of the laser beam guided in the laser resonator can be carried out selectively into one of a multiplicity of radiation paths of different lengths, also by means of a series connection of a plurality of beam deflecting devices. In this case, several identical beam deflecting devices or even different types of Strahlumauch snappeen be combined.
  • the active laser medium is a solid material, preferably with ⁇ means of Nd: YAG, Nd: YVO 4 -, or Nd: YLF lasers realized which typically emit laser beams at a fundamental wavelength of 1064 nm ,
  • the pumping of the active laser medium takes place optically using semiconductor diodes. These are preferably arranged around the active laser medium, so that a corresponding diode-pumped laser, in particular a diode-pumped solid-state laser, can be realized in a compact design.
  • the laser light source in addition to an optically non-linear medium for frequency multiplication.
  • optically non-linear media which are generally known in laser technology, can be positioned both inside and outside the resonator.
  • any of the above types of laser with a fundamental wavelength of 1064 nm is frequency-multiplied radiation having wavelengths of 532 achieved nm, 355 nm and 266 nm.
  • Such a frequency multiplier in which the fundamental wavelength hal ⁇ beer, is divided into thirds or quarters is to be considered as exemplary only , A frequency multiplication by a factor of 5, 6 or more is particularly modern Lasersys ⁇ temen also conceivable.
  • the frequency multiplier has the advantage that in a simple manner cash laser radiation in the visible or ⁇ may also generate the ultraviolet spectral range, which are particularly well suited for the removal of metallic layers, such as copper.
  • a laser beam is generated by means of a laser light source, which laser pulses each having a specific pulse duration.
  • the generated laser beam is deflected two-dimensionally by means of a deflection unit and directed to predetermined target positions on the workpiece by means of imaging optics.
  • the pulse durations are selected depending on the material of the workpiece such that an optimal material removal is ensured.
  • a schnel ⁇ ler as well as a precise as possible material removal is hen To Hide ⁇ in this context. Precise material removal results in a sharp, well-defined spatial boundary between a region of abraded material and an area of uncut material.
  • the optimal pulse duration can be determined in advance of the real laser processing depending on the respective material to be processed by a few experiments.
  • a laser light source according to any one of claims 1 to 10 is used to generate the pulsed laser beam.
  • the beam switching device and thus the beam path of the laser beam within the laser resonator are adjusted such that the workpiece is subjected to laser pulses with the corresponding pulse duration.
  • the pulse durations can be optimized for each material to be processed. Since very high requirements with regard to the precision of material processing must be met in the electronics sector due to the increasing miniaturization of electronic assemblies, the invention can be used in particular for drilling or structuring electronic circuit carriers.
  • Figure 1 show a laser processing machine having a laser light source ⁇ which different lengths of optical paths having within the laser resonator
  • Figure 2a, 2b and 2c a laser light source, are realized in the under ⁇ different length optical paths within the Laserre ⁇ sonators by a folding mirror and correspondingly positioned end mirrors,
  • Figure 3 ment a laser light source with a Strahlumschaltele ⁇ which a laser beam selectively to below ⁇ stanliche end mirror steers,
  • FIG. 4 shows a laser light source with two beam switching elements which can direct a laser beam into the region between the two beam switching elements on different beam paths, to each of which an optical waveguide is assigned,
  • Figure 5 shows a laser light source with two Strahlumschaltelemen ⁇ th, which can direct a laser beam in the area between the two beam switching on under Kunststoffli ⁇ che beam paths, each associated with a reflector
  • Figure 6 shows the structure of a beam switching element of an electro-optical modulator and a Brewster window.
  • the laser processing machine 100 shown in FIG. 1 comprises a laser light source 110, which is set up to emit a pulsed output laser beam 121.
  • the deflection unit 130 permits a two-dimensional deflection of the laser beam, which is directed onto the substrate 150 to be processed via an imaging optical system 140, for example an F-theta optical system.
  • the substrate 150 consists of a dielectric layer 151, which is covered by a metallic layer 152 on the upper side and underside, respectively.
  • the metallic layers 152 are structured in a manner not shown to form interconnects.
  • Microholes 153 a processing laser beam 141, which has emerged from the output laser beam 121 by a deflection by the deflection unit 130 and focusing by the imaging optics 140, each centered by a jump motion 155 to a drilling position 144 and then with a set on the imaging optics 140 spot size F in the region of the drilling position 154 in a circular movement, so that in each case a micro hole is generated.
  • the laser light source 110 comprises a Laserreso ⁇ nator which an output mirror 112 and a plurality of end mirror, having a first end mirror 114a, a second 114b Endspie ⁇ gel and a third end mirror 114c.
  • an active laser medium 111 is arranged, which is in particular a solid state material such as Nd: YAG or Nd: YVO 4 .
  • a Strahlumschaltelement 113 is further arranged which se a beam path 115 within the laser resonator alterna ⁇ in a beam path of the three beam paths, in a first Strah ⁇ 115a, transferred to a second optical path 115b or in a third optical path 115c.
  • one of the beam paths 115a, 115b or 115c is assigned an end mirror 114a, 114b or 114c.
  • the end mirrors 114a, 114b and 114c are arranged at different distances from the beam switching element 113, so that one of the beam paths 115a, 115b or 115c is activated depending on the control of the beam switching element 113.
  • the Strahlumschaltelement 113 may be a mechanical mirror ⁇ system or an electrically controllable modulator very quickly, for example an acousto-optical modulator or, in particular an electro-optical modulator to be.
  • an acousto-optical modulator or, in particular an electro-optical modulator to be A possible structure of a jet switching element will be described later with reference to FIG.
  • a reflector can additionally be connected downstream of the modulator. With a corresponding angular position of the reflector relative to the beam path of the deflected beam, the resulting deflection angle can thus be significantly increased in comparison to the usually very small deflection angles, which can be achieved with a modulator. Thus deflection angles in the range of 90 ° can be realized even when using an acousto-optical modulator.
  • the beam paths 115a, 115b and 115c have a different length.
  • the The effective resonator length can be set as a function of the position of the beam switching element 113 between three different lengths, so that, as a result, the pulse durations of the output laser beam 121 depend on the position of the beam switching element 113.
  • the dependence of the pulse duration on the resonator length can be explained by the fact that a laser pulse lasts until the inversion in the active laser medium 111 is degraded. This means that the majority of the excited atoms or molecules in the active laser medium 111 are again in their ground state. Since a certain number of passes of a light pulse through the active medium 111 is required for reducing the inversion, there is no need to further explain that the total time required for a light pulse for this number of passes depends on the resonator length .
  • FIGS. 2 a, 2 b and 2 c show a further exemplary embodiment of the invention, in which the jet switching element is realized by means of a rotatably mounted mirror 213.
  • the laser light source which emits a pulsed output laser beam 221 via a coupling-out mirror 212, has as active laser medium 211 a solid-state material, in particular Nd: YAG or Nd: YVO 4 .
  • the laser resonator is gebil ⁇ det only by the Auskoppelapt 212 and serving as the first end mirror 214a mirror 213.
  • the laser beam thus extends only on a beam path 215 which is delimited by the rotatable mirror 213 serving as the first end mirror 214a and the outcoupling mirror 212.
  • a laser beam in the beam path 215 by a reflection on the mirror 213 to a stationary second end mirror 214, so that the laser beam within the laser resonator along the beam paths 215 and 215 b extends.
  • the resonator length is thus lengthened by the length of the beam path 215b compared with the resonator length shown in FIG. 2a.
  • the beam path illustrated in FIG. 2c results within the laser resonator.
  • the laser resonator is formed by the Auskoppel ⁇ mirror 212 and the third end mirror 214c, which is spaced from the mirror 213 farther than the second end mirror 214b.
  • the resulting resonator length is therefore composed of the length of the beam path 215 and the length of the third beam path 215c.
  • the resonator length of the laser light source 210 can thus be varied in a simple manner and thus the resulting pulse length of the laser pulses of the output laser ⁇ beam 221 can be optimally adapted to the respective material to be machined.
  • Embodiment in that instead of the rotatably mounted mirror 213, an electrically controllable Strahlumschaltele ⁇ ment 313 is provided. This transferred the optional len réellen of four Strah ⁇ between the Strahlumschaltelement 313 and the output mirror 212 ver ⁇ current beam path 315 in a, which are provided with the reference numerals 315a, 315b, 315c or 315d.
  • the beam paths 315a, 315b, 315c and 315d are each an end mirror 314a, 314b, 314c and 314d associated with the four end mirrors are arranged at different distances from the beam switching element 313.
  • the laser light source 410 shown in FIG. 4 differs from the laser light source 310 in that only one end mirror 414 is provided which, together with the outcoupling mirror 412, forms the laser resonator of the laser light source 410.
  • a first 413a and a second Strahlumschaltelement Strahlum ⁇ are arranged switching element 413b.
  • a guided within the laser resonator laser ⁇ beam runs between the two modulators selectively in one of four beam paths, which are provided with the reference numerals 415a, 415b, 415c or 415d.
  • the beam paths 415b, 415c and 415d respectively extend over an optical waveguide 416b, 416c and 416d, which have a different length to one another.
  • the resulting resonator length of the laser light source 410 changed such that the laser pulses of the output laser beam 421 can be optimally adjusted in terms of their pulse duration to the respective material to be processed.
  • the laser light source shown in FIG 5510 under failed ⁇ det from the laser light source 410 in that is provided in place of the three optical waveguide 416b, 416c and 416d, respectively, a stationary reflector 517b, 517c or 517d.
  • the laser beam within the laser resonator can thus be guided selectively onto the beam path 515a or onto one of the deflected beam paths 515b, 515c or 515d.
  • FIG. 6 shows the construction of a beam switching element 613, which has an electro-optical modulator 660 and a Brewster window 663.
  • the incident laser beam 615 is linearly polarized.
  • the polarization direction of an emerging from the modulator 660 laser beam 662 along the direction of rotation 661 can be varied so that the laser beam 662 in a first position of the electro-optical modulator 660 parallel to the plane of the drawing and in a second position is polarized perpendicular to the plane of the drawing.
  • the Brewster window 663 is arranged in the beam path of the laser beam 662 in a Brewster geometry familiar to the person skilled in the art, so that in the first position of the electro-optical modulator 660 the laser beam 662 has a parallel offset into the beam path 615b determined by the thickness and the refractive index of the Brewster window 663 is transferred. In the second position of the electro-optical modulator 660, the laser beam 662, which is polarized perpendicular to the plane of the drawing, is transferred into the beam path 615a. By a corresponding control of the electro-optical modulator 660, the input laser beam 615 can thus be selectively converted into one of the two beam paths 615a and 615b.
  • a plurality of beam switching elements 613 can be connected in series in a cascade.
  • the invention provides a laser light source 110 with a
  • the beam switching device 113 can be realized by means of a mechanical mirror system 213.
  • the beam switching device 113 can also be realized by means of an electro-optical or acousto-optical modulator, so that the beam switching can take place very quickly. This makes it possible to switch over even with a high pulse repetition rate
  • the invention further provides a method for machining workpieces 150 by means of pulsed laser radiation, wherein a laser beam is deflected two-dimensionally by means of a deflection unit 130 and is directed onto the workpiece 150 via imaging optics 140.
  • the pulse duration of the laser pulses is adjusted in particular by a choice of the beam path within the laser resonator such that an optimal material removal is ensured.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une source de lumière laser (110) comportant un résonateur laser dont la longueur peut être modifiée au moyen d'un dispositif de commutation de rayon (113) de façon à permettre le réglage de la durée d'impulsion du rayon laser émis en fonction de la longueur de résonateur réglée. Le dispositif de commutation de rayon (113) peut être réalisé au moyen d'un système de miroirs mécanique (213). Le dispositif de commutation de rayon (113) peut également être réalisé au moyen d'un modulateur électrooptique ou acoustooptique, de façon à permettre une commutation très rapide du rayon. Ceci permet, même à un taux élevé de répétition des impulsions, une commutation de la longueur de résonateur entre deux impulsions laser successives. L'invention concerne également un procédé pour usiner des pièces (150) au moyen d'un rayon laser pulsé, selon lequel un rayon laser est dévié de manière bidimensionnelle au moyen d'une unité de déviation (130) et orienté sur la pièce (150) par l'intermédiaire d'un dispositif optique d'imagerie (140). La durée des impulsions laser est ajustée notamment par sélection du trajet du rayon à l'intérieur du résonateur laser de façon à assurer un enlèvement de matière optimal.
PCT/EP2005/053723 2004-09-02 2005-07-29 Source de lumiere laser, procede pour usiner des pieces au moyen d'un rayon laser pulse WO2006024585A1 (fr)

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JP2007528815A JP2008511975A (ja) 2004-09-02 2005-07-29 レーザ光源、被加工品をパルスレーザ放射によって加工するための方法

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DE102004042556.6 2004-09-02
DE102004042556A DE102004042556B4 (de) 2004-09-02 2004-09-02 Laserlichtquelle, Verfahren zum Bearbeiten von Werkstücken mittels gepulster Laserstrahlung

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JP (1) JP2008511975A (fr)
KR (1) KR20070047241A (fr)
CN (1) CN1969433A (fr)
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WO (1) WO2006024585A1 (fr)

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EP2489458A1 (fr) * 2011-02-16 2012-08-22 Ewag AG Dispositif de traitement laser doté d'un agencement laser commutable et procédé de traitement laser

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JP5104914B2 (ja) * 2010-06-30 2012-12-19 三星ダイヤモンド工業株式会社 除去装置
DE102011078825B4 (de) 2011-07-07 2018-07-19 Sauer Gmbh Lasertec Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks
US10946479B2 (en) * 2016-04-14 2021-03-16 GM Global Technology Operations LLC Laser spot welding of overlapping aluminum workpieces
CN106425126B (zh) * 2016-11-11 2017-12-29 盐城工学院 一种多层印刷电路板飞秒激光打孔装置及其打孔方法
CN106785845A (zh) * 2017-01-22 2017-05-31 昆山华辰光电科技有限公司 可变脉宽调q光纤激光器
KR102025773B1 (ko) * 2018-02-27 2019-09-26 (주)옵틱라인즈 플로우 튜브의 홀 가공용 픽스쳐 및 이를 이용한 플로우 튜브의 제조방법
CN110492340A (zh) * 2019-08-21 2019-11-22 山东大学 一种可调谐中红外双频激光系统

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Publication number Priority date Publication date Assignee Title
EP2489458A1 (fr) * 2011-02-16 2012-08-22 Ewag AG Dispositif de traitement laser doté d'un agencement laser commutable et procédé de traitement laser
US8916798B2 (en) 2011-02-16 2014-12-23 Ewag Ag Laser machining apparatus with switchable laser system and laser machining method

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DE102004042556A1 (de) 2006-04-20
JP2008511975A (ja) 2008-04-17
DE102004042556B4 (de) 2008-05-08
CN1969433A (zh) 2007-05-23
KR20070047241A (ko) 2007-05-04

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