WO2006019767A1 - Azeotrope spray cooling system - Google Patents
Azeotrope spray cooling system Download PDFInfo
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- WO2006019767A1 WO2006019767A1 PCT/US2005/024770 US2005024770W WO2006019767A1 WO 2006019767 A1 WO2006019767 A1 WO 2006019767A1 US 2005024770 W US2005024770 W US 2005024770W WO 2006019767 A1 WO2006019767 A1 WO 2006019767A1
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- WIPO (PCT)
- Prior art keywords
- thermal management
- azeotrope
- coolant
- management system
- phase thermal
- Prior art date
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- 238000001816 cooling Methods 0.000 title claims abstract description 89
- 239000007921 spray Substances 0.000 title claims abstract description 62
- 239000002826 coolant Substances 0.000 claims abstract description 69
- 239000012530 fluid Substances 0.000 claims description 82
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 19
- 238000009835 boiling Methods 0.000 claims description 18
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 6
- -1 methylsiloxane Chemical class 0.000 claims description 5
- 239000011552 falling film Substances 0.000 claims description 3
- KFUSEUYYWQURPO-OWOJBTEDSA-N trans-1,2-dichloroethene Chemical group Cl\C=C\Cl KFUSEUYYWQURPO-OWOJBTEDSA-N 0.000 claims description 3
- 125000003158 alcohol group Chemical group 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 43
- 239000007788 liquid Substances 0.000 description 16
- 230000008901 benefit Effects 0.000 description 15
- 239000012809 cooling fluid Substances 0.000 description 12
- 238000009834 vaporization Methods 0.000 description 9
- 230000008016 vaporization Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- 229920004449 Halon® Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001577 simple distillation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to liquid coolant for two-phase liquid cooling systems and more specifically, it relates to an azeotrope spray cooling system that utilizes an azeotrope coolant for improving the performance of a spray cooling system.
- Modern electronic devices e.g. microprocessors, circuit boards, power supplies, and other electronic devices
- thermal management requirements e.g.
- Conventional dry thermal management technology e.g. fans, vents
- Spray cooling technology is being adopted today as the most efficient option for thermally managing electronic systems.
- United States Patent No. 5,220,804 entitled High Heat Flux Evaporative Spray Cooling to Tilton et al. describes the earlier versions of spray technology, as applied to electronics cooling.
- United States Patent No. 6,108,201 entitled Fluid Control Apparatus and Method for Spray Cooling to Tilton et al. also describes the usage of spray technology to cool components on a printed circuit board. Spray cooling utilizes phase changing for thermally managing one or more electronic devices. Most spray cooling systems utilize a single component coolant.
- Spray cooling as used herein, may be a spot spray cooling system as described by '804 to Tilton, wherein the coolant is directed towards modules thermally attached to heat producing devices; or may be a global spray cooling system such as described us U.S. Patent No. 5,880,931 wherein the cooling fluid is directly applied to the electronics to be cooled.
- Spray cooling provides the possibility of removing high heat fluxes with electronic safe fluids that are not optimally suited for use in thermal management systems.
- the coolant typically used within a spray cooling system is a dielectric fluid (e.g. hydrofluorethers) having a low vaporization temperature at standard atmospheric pressure.
- dielectric fluid e.g. hydrofluorethers
- One common brand of dielectric coolant for two-phase thermal management s)fstems is manufactured by Minnesota Mining and Manufacturing Company (3M' £ ') under the federally registered trademark Fluorineri* ' .
- a dielectric fluid is required for use in global cooling systems, it is also suitable for spot cooling systems, as the fluid does not create the risk of system failures, as is the case with water utilizing systems.
- Fluorinert is useful for the thermal management of electronic devices, it unfortunately has some relatively poor fluid properties for this use.
- the thermal conductivity value (0.057 Wm -1 K “1 ) at standard atmospheric conditions limits its ability to conduct heat from a cooling surface of a heat-producing device.
- air has a thermal conductivity value of 0.0267 Wm -1 K "1 and water, being much more thermally conductive, has a typical value of 0.611 Wm -1 K "1 .
- liquid thermal management systems have utilized a mixture of two different components, such as different varieties of Fluorinert, wherein the first component evaporates at a first temperature and a second component may or may not evaporate at a second temperature, wherein the first temperature and the second temperature are different from one another, often referred to as zeotropes. It is important to note that blends of the varieties of Fluorinert are not an azeotropic mixture since the components boil at different points.
- An azeotrope is a fluid mixture of two or more components that change phase at nearly the same pressure and temperature.
- an azeotrope maintains the same composition as it is boiled (i.e. the vapor has the same composition as the liquid).
- the components of an azeotrope therefore cannot be separated through simple distillation as with most liquid mixtures, particularly mixtures within the Fluorinert family of fluids.
- the component comprising the bulk of the azeotropic mixture is referred to as the base component.
- Azeotropes are a common byproduct when distilling ethanol, and have been widely used as cleaning fluids, such as a mixture of siloxane and alcohol (e.g. OS- 120 brand produced by DOW CORNING CORPORATION).
- azeotropes are pressure sensitive and some are pressure insensitive, meaning that they are only azeotropes for a limited range of pressures.
- Azeotropes can be positive or negative; boiling at a temperature above or below that of one of the constituents.
- the components can be completely miscible or entirely immiscible or anywhere in between. All known immiscible azeotropes are negative boiling.
- azeotropes are also commonly separated by adding material separating agents (MSAs) to the mixture. This is more commonly used for pressure insensitive azeotropes since for this case pressure swing distillation is ineffective. MSAs often bond to one of the components of the azeotrope to form intermediate azeotropes resulting in the ultimate separation of the initial azeotrope. Constituents can then be removed using common distillation techniques, but ultimately the MSA must be separated. Typically, this is done using filtration.
- MSAs material separating agents
- the present invention provides a new azeotrope two-phase liquid cooling system construction wherein the same can be implemented for utilizing an azeotrope coolant for improving the performance of a typical spray cooling system.
- the general purpose of the present invention is to provide a new azeotrope spray cooling system that has many of the advantages of the prior art spray cooling systems and many novel features that result in a new azeotrope spray cooling system which is not anticipated, rendered obvious, suggested, or even implied by any of the prior art spray cooling systems, either alone or in any combination thereof.
- the present invention generally comprises a two-phase thermal management system for thermally managing one or more heat producing devices and an azeotrope coolant within.
- the characteristics of the azeotrope coolant may be optimized above that of a pure component fluid and/or adjusted for various types of thermal management applications by altering the components of the azeotrope mixture.
- an azeotrope can be implemented to tailor the fluid properties at various points within the closed loop system.
- a primary object of the present invention is to provide an azeotrope spray cooling system that will overcome the shortcomings of the prior art devices.
- a second object is to provide an azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system.
- Another object is to provide an azeotrope spray cooling system that allows for the altering and improvement of liquid coolant properties such as but not limited to boiling points, heat of vaporization at boiling point, thermal conductivity, flammability, specific gravity, viscosity, density, latent heat of vaporization, specific heat, surface tension, and other properties.
- liquid coolant properties such as but not limited to boiling points, heat of vaporization at boiling point, thermal conductivity, flammability, specific gravity, viscosity, density, latent heat of vaporization, specific heat, surface tension, and other properties.
- An additional object is to provide an azeotrope spray cooling system that is capable of utilizing various azeotropes and or MSAs.
- a further object is to provide an azeotrope spray cooling system that is capable of tailoring the internal pressure to the surrounding atmospheric pressure.
- a still further object is to provide an azeotrope spray cooling system that implements an azeotrope that has fluid properties tailored to be an azeotrope at specific areas inside the closed loop system, and a zeotrope in other areas.
- a still further object is to provide an azeotrope spray cooling system that is capable of dynamically tailoring the azeotrope for properties specific to localized areas inside the closed loop system.
- FIG. 1 is a block diagram of an exemplary two-phase thermal management system for the present invention.
- Figure 2 is a chart showing different saturation curves for two different fluids.
- Figure 3 is a chart showing the change in activity coefficients for two components of a typical pressure dependent azeotrope.
- An azeotrope coolant is utilized within a two-phase thermal management system 10 for thermally managing one or more heat producing devices.
- the characteristics of the azeotrope coolant may be optimized above that available for a pure fluid and/or adjusted for various types of thermal management applications by altering the components of the azeotrope coolant. This may be done actively within the closed loop system, for example through the insertion and extraction of an MSA.
- Azeotrope coolant characteristics and properties that may be optimized and/or adjusted include but are not limited to boiling points, thermal conductivity, flammability, flashpoint, specific gravity, viscosities, density, latent heat of vaporization, specific heat, surface tension, dielectric strength, and other characteristics.
- Figure 1 illustrates a two-phase thermal management system 10 comprised of an exemplary closed loop spray cooling system.
- the two-phase thermal management system 10 may be comprised of various liquid thermal management systems that utilize phase changing to thermally manage one or more heat producing devices.
- suitable two-phase thermal management systems 10 for the present invention include but are not limited to spray cooling systems, pool boiling systems, flow boiling systems, jet impingement cooling systems, falling-film cooling systems, parallel forced convection systems, microchannel, mini-channel, and curved channel cooling systems, and capillary pumped loop systems.
- a two-phase thermal management system 10 will be utilized to discuss the design, manufacture, structure, functionality, operation and advantages of the present invention.
- the present invention is not limited in scope to a two-phase thermal management system 10 and the discussion of the same should not in any wa)/ limit the scope of the claims.
- a two-phase thermal management system 10 is typically comprised of at least one pump 20, at least one coolant reservoir 50 fluidly connected to the draw side of the pump 2O 5 at least one thermal management unit 30 fluidly connected to the pressure side of the pump 20, and at least one heat exchanger 40 fluidly connected between the thermal management unit 30 and the coolant reservoir 50.
- a return manifold may also be used for collecting the coolant from one or more thermal management units 30.
- the thermal management unit 30 may be comprised of at least one spray module that is in thermal communication with the heat producing device 12 (e.g. electronic device).
- U.S. Patent No. 6,857,283 illustrates an exemplary closed loop spray cooling system and is hereby incorporated by reference.
- a globally cooled system which is one that cools all of the electronics on a global level, such as is described by U.S. Patent No. 5,880,931, which illustrates an exemplary global spray cooling system and is hereby incorporated by reference.
- the individual electronics components processors, memory chips, resistors, capacitors, and other electronic components that make up an electronics circuit, as well as the circuit card on which they reside and communicate are all primarily contained within the two phase cooling system, and are wetted (or are not prevented from being wetted) by the cooling fluid.
- the coolant utilized in the present invention is comprised of an azeotropic mixture having a base component and at least one added component. More particularly, the azeotrope coolant is comprised of two or more components that change phase at approximately the same temperature and pressure. The phase change can be either evaporation or condensation.
- the user is able to form an azeotrope coolant that has improved properties over that of the base component resulting in a more effective cooling fluid.
- the boiling point, thermal conductivity, flammability, flashpoint, specific gravity, viscosities, density, latent heat of vaporization, specific heat, surface tension, and other properties can be altered for the specific thermal management application in which the azeotrope coolant will be used. Since most fluid properties vary with the state of the fluid, such as pressure and temperature, the properties above can be optimized and/or adjusted for a particular range of system operating conditions.
- the slope of a pressure-temperature curve that describes the phase change of a fluid can be flattened or made steeper using an azeotropic mixture, which can improve system performances across a range of system operating conditions.
- a typical single component fluid may have a saturation curve described by the dotted line.
- An azeotropic mixture, formed by the same base fluid, may behave as described by the solid line as shown in Figure 2.
- the solid line is steeper in the operating range of the cooling system.
- This type of scenario can provide system improvements such as to minimize the thermal effects of pressure drop in the return side of the two-phase liquid cooling system (between thermal management unit 30 and heat exchanger 40).
- the temperature of the fluid determines the pressure inside (point A).
- the present invention is not limited to such.
- fluid properties do affect performance of individual sub-systems and components.
- the size and momentum of the droplets affect system performance. Too small of droplets, or too little momentum of the droplets can cause dispensed droplets to be entrained by the escaping vapor of the cooling surface, and thus not reach the cooling surface. Too large, or too much momentum of the droplets can create system inefficiencies and poor cooling performance due to splashing at the cooling surface.
- azeotropic mixture may be optimized for droplet size and momentum, above that of the pure base fluid, for use in a spray cooling system, and for a given nozzle geometry.
- Fluid properties that affect the spray are at least surface tension, density, and viscosity.
- Droplet size and momentum also play a role in the ability to entrain vapor into the main flow of a side spray-narrow gap spray configuration such as is described in US Patent Application 10/096,340, which is hereby incorporated by reference.
- a droplet size of approximately 20-3 O ⁇ m has been shown to be particularly effective in vapor re-entrainment in this configuration. What has been discovered is that as the quality of fluid increases (i.e. ratio of vapor to liquid) at the entrance to the narrow gap the heat transfer coefficient also increases.
- azeotropes offer is the ability, not only to potentially form smaller droplets through a given atomizer geometry, but in the case of a pressure dependent azeotrope, to tailor the fluid to be an azeotrope at a pressure as measured inside the condenser (Point A, Figure 3), and in the same system be a zeotropic mixture as the fluids are circulated to the spray module, where a significant pressure increase is realized (Point B, Figure 3). It then becomes easily possible to entrain vapor due to the now zeotropic mixture at the spray module pressure (Point B, Figure 3).
- By incorporating an azeotrope with one component that flashes as the spray expands is still another way to increase the initial fluid quality.
- a still further method of increasing the sprayed vapor quality is to utilize an azeotrope that releases dissolved gasses (e.g. air, CO 2 , Nitrogen, Helium, etc.) as it is sprayed.
- azeotrope cooling fluids provide the means of optimizing the interaction of spray with vapor and gases within thermal management systems.
- Not all fluid properties of an azeotropic mixture may have positive effects on two-phase cooling.
- the contributions of each fluid property can be grossly positive or negative, with the goal of the resulting fluid being net positively optimized.
- a fluid wets out (spreads to form a thin layer) on a surface if the surface energy of the cooling surface is greater than the surface tension of the fluid. If the surface tension of the fluid is greater than the surface energy of the material of the cooling surface then the fluid will have a contact angle and create drops on the cooling surface.
- azeotrope cooling fluids provide the means of optimizing performances of individual components, sub-systems and areas of thermal management systems.
- Yet another method of tailoring a fluid for a particular application is in relation to system pressures at a given environmental operating temperature and pressure. Because the system will have either a positive or a negative pressure within, in comparison to standard atmospheric pressure, it is possible to have fluid leak or permeate from the system, or to have outside fluids such as air enter the closed loop cooling sj'stems. Both cases are undesirable. With azeotropic mixtures, and baturation curve optimization, it is possible t ⁇ create a fluid that resultb in reduced pressure differentials between parts of the cooling system and the environment of the system. The result is reduced leakage rates and permeation.
- a pure fluid may change phase at a pressure of 18psia at 50°C.
- the result is a difference in pressure between the system and the environment of 3.6psia.
- the same base fluid can have its boiling point altered so that the new fluid changes phase at a pressure of 14.6psia with a temperature of 5O 0 C.
- the new difference in pressure between the system and environment would be negligible resulting in less fluid loss and permeation.
- Other benefits can result with reduced system pressure differences such as weight savings due to reduced structural requirements of the system components. It is more practical to create a fluid mixture having optimal fluid properties than try to engineer a single component fluid.
- azeotrope cooling fluids provide the means of optimizing pressures within one or more areas of thermal management systems.
- a major advantage of two-phase cooling systems such as spray cooling over that of single phase cooling systems such as described by US Patent No. 5,731,954 is that of energy efficiency. Wherein single-phase water based systems may require a flow rate of over a liter per minute per 100 watt processor, spray cooling systems by Isothermal Systems Research, Inc. are able to provide the same level or better cooling of 100 watt processors with a flow rate of less than 80 milliliters/min of flow. The spray cooling systems require much less energy to operate and provide significant system advantages for applications such as datacenters.
- azeotropic mixtures provide system efficiency advantages over that of zeotropes.
- Implementing mixtures with two distinct boiling points results in the first component removing heat via vaporization (i.e. efficient two-phase mode of cooling), and the other component providing cooling by means of the less efficient single phase cooling, as it does not reach a state creating evaporation, or if it does, it does so at an elevated temperature.
- Azeotropic mixtures are ideal for most applications — zeotropic mixtures may be suitable for some applications and less than ideal in others.
- azeotropes may be ideal for most cooling system components (pumps, condensers, atomizers, heat extraction, etc.) whereas zeotropic mixtures may be suitable for some components and less than ideal for others and particularly in the system condenser.
- azeotrope cooling fluids provide the means of optimizing the efficiencies of thermal management systems.
- Suitable base components for use in the azeotrope coolant include but are not limited to methylsiloxane, siloxane (e.g. OS-IO brand siloxane manufactured by DOW CORNING CORPORATION), hydrofluorocarbons, and water.
- Suitable added components for use in the azeotrope coolant include but are not limited to alcohol, isopropyl alcohol, ethanol, methanol, trans- 1,2-dichloroethylene, or benzene.
- a known example of a suitable azeotropic mixture is comprised of >60% hexamethylsiloxane and 10-30% of an alcohol.
- This azeotropic mixture is commercially available from DOW CORNING CORPORATION under the "OS-120" trademark.
- the base component is hexamethylsiloxane, which can be directly utilized as a coolant in a two-phase thermal management system 10.
- the added component comprised of an alcohol combined with the hexamethylsiloxane creates a new fluid that has improved latent heat of vaporization values, which is known to be desirable in certain two-phase thermal management systems 10.
- the net effect of latent heat of vaporization is that less fluid mass is required to remove a given amount heat.
- OS-120 is particularly well suited for use with thermal management systems such as those used to cool the electronic systems found in hybrid electric and full electric vehicles.
- thermal management systems such as those used to cool the electronic systems found in hybrid electric and full electric vehicles.
- motor electronics and power conversion/control electronics in electric vehicles have significant thermal challenges.
- the closed loop two-phase thermal management system 10 may be configured to thermally manage one or more electrical devices of an electrically powered vehicle. Power electronics cooled by spray cooling are able to be smaller, less expensive, require fewer materials, provide improved efficiencies, and have longer lives. Unlike the fluids that are used in computing type applications, datacenters for example, automotive applications are more tolerant of fluids having flashpoints.
- a non-oxidizing gas is inserted into the spray chamber, such as CO 2 , nitrogen, helium, or argon for example, which keeps the fluid from flashing in the case of an electronics failure.
- a non-oxidizing gas such as CO 2 , nitrogen, helium, or argon for example, which keeps the fluid from flashing in the case of an electronics failure.
- Fluorinert systems which do not have a flashpoint and thus can acceptably contain air within the spray chamber, some fluids and azeotropic mixtures may be acceptable for certain applications by use of a non-oxidizing displacement gas. Because some gases are soluble in the cooling fluid and thus cause increased system pressures, it may be desirable to remove air and/or gases from the cooling fluid prior to use with a spray cooling system. Dry nitrogen, for example, can then be inserted into the spray chamber providing both system safety and increasing system pressures just enough to keep the pump(s) from cavitating.
- azeotropic mixture may be comprised of a hydrofluorocarbon fluid along with another component such as isopropyl alcohol, ethanol, methanol or trans- 1 ,2-dichloroethylene.
- a suitable hydrofluorocarbon fluid is manufactured and sold under the registered trademark VERTREL® by E.I. DU PONT DE NEMOURS AND COMPANY, INC. Vertrel, which is very similar to OS-IO and OS-120, is marketed and used primarily as a solvent for use as a circuit board cleaning solvent.
- Non-dielectric base components may also be utilized within the azeotrope coolant.
- water may be utilized as the base component with benzene added for lowering the boiling point or as another example; ethanol may be mixed with water and used as the coolant.
- the azeotrope coolant is adjusted depending upon the desired coolant properties for a specific two-phase thermal management application.
- the OS-120 azeotropic mixture may be suitable for a first application, but not suitable for a second application where the boiling point has to be increased or decreased.
- One or more of the added components are thereby adjusted to achieve a concentration that achieves the desired coolant properties.
- Other coolant properties may be altered and improved such as but not limited to thermal conductivity, flammability, specific gravity, viscosities, density, latent heat of vaporization, specific heat, surface tension, electrical conductivity and other properties.
- FIG 1 illustrates an exemplary two-phase thermal management unit that has a pump 20 fluidly connected between a coolant reservoir 50 and a thermal management unit 30 along with a heat exchanger 40 fluidly positioned between the thermal management unit 30 and the coolant reservoir 50 to form a closed loop.
- the thermal management unit 30 may utilize various two-phase thermal management technology such as but not limited to spray cooling, pool boiling, flow boiling, jet impingement cooling, falling-film cooling, parallel force convection, curved channel cooling and capillary pumped loops.
- the thermal management unit 30 is in thermal communication with a heat producing device 12 for thermally managing the same as further shown in Figure 1.
- a portion of the azeotrope coolant is phased changed to a vapor within the thermal management unit 30.
- the base component and the added component(s) within the azeotrope coolant evaporate at approximately the same temperature thereby retaining the same concentration of the added components(s) within the base component.
- the vaporized azeotrope coolant is comprised of the base component and the added component(s) at approximately the same concentration as azeotrope coolant in the liquid state.
- the vaporized azeotrope coolant enters the heat exchanger 40 which changes the phase of the vaporized azeotrope coolant to a liquid state.
- the azeotrope coolant enters the coolant reservoir 50 or is directly drawn into the pump 20, and continues back through the closed loop.
- the user of the thermal management system may optimize the concentration of azeotropic mixtures by field adding fluid components into the two-phase thermal management system 10, it is anticipated that azeotropic mixtures will be mixed for a given application and then supplied to the field. It is also possible that an MSA will be field added or separated thereby altering the azeotrope as designed and used in the system. This may be done by the end user or designed to be done actively within the two-phase thermal management system 10.
- fluid may be routed through a filtration system (not shown) to remove an MSA, or an MSA may be injected from a reservoir (not shown) into the fluid loop of the two-phase thermal management system 10 to disrupt or change the already present azeotrope.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002572629A CA2572629A1 (en) | 2004-07-15 | 2005-07-15 | Azeotrope spray cooling system |
EP05773675A EP1766305A4 (en) | 2004-07-15 | 2005-07-15 | Azeotrope spray cooling system |
JP2007521588A JP2008507136A (en) | 2004-07-15 | 2005-07-15 | Azeotropic cooling system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58886204P | 2004-07-15 | 2004-07-15 | |
US60/588,862 | 2004-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006019767A1 true WO2006019767A1 (en) | 2006-02-23 |
Family
ID=35907706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/024770 WO2006019767A1 (en) | 2004-07-15 | 2005-07-15 | Azeotrope spray cooling system |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1766305A4 (en) |
JP (1) | JP2008507136A (en) |
CA (1) | CA2572629A1 (en) |
WO (1) | WO2006019767A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11252847B2 (en) | 2017-06-30 | 2022-02-15 | General Electric Company | Heat dissipation system and an associated method thereof |
Citations (8)
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US3965971A (en) * | 1974-06-27 | 1976-06-29 | Eaton Corporation | Cooling system for semiconductors |
US4552910A (en) * | 1983-03-11 | 1985-11-12 | Wacker-Chemie Gmbh | Aqueous compositions containing an organosilicon compound |
US5089070A (en) * | 1989-12-07 | 1992-02-18 | Pac Polymers Inc. | Poly(propylene carbonate)-containing ceramic tape formulations and the green tapes resulting therefrom |
US5349831A (en) * | 1991-11-08 | 1994-09-27 | Hitachi, Ltd. | Apparatus for cooling heat generating members |
US6215682B1 (en) * | 1998-09-18 | 2001-04-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor power converter and its applied apparatus |
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US20020064642A1 (en) * | 2000-04-06 | 2002-05-30 | Albert Donald F. | Organic, open cell foam materials, their carbonized derivatives, and methods for producing same |
Family Cites Families (8)
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WO1983000496A1 (en) * | 1981-07-29 | 1983-02-17 | Veltwisch, Dieter | Refrigerator and/or heat pump working fluids |
JPS6114282A (en) * | 1984-06-29 | 1986-01-22 | Mitsubishi Heavy Ind Ltd | Medium for absorption type refrigerator |
JP2933014B2 (en) * | 1996-01-23 | 1999-08-09 | ダイキン工業株式会社 | Azeotropic mixture of pentafluoropropane and hydrogen fluoride and method for separation and purification of pentafluoropropane |
US6152215A (en) * | 1998-12-23 | 2000-11-28 | Sundstrand Corporation | High intensity cooler |
JP2000252671A (en) * | 1999-02-26 | 2000-09-14 | Sony Corp | Cooler and electronic apparatus |
US20020009585A1 (en) * | 2000-04-06 | 2002-01-24 | Albert Donald F. | Organic, low density microcellular materials, their carbonized derivatives, and methods for producing same |
US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
US7000691B1 (en) * | 2002-07-11 | 2006-02-21 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
-
2005
- 2005-07-15 JP JP2007521588A patent/JP2008507136A/en active Pending
- 2005-07-15 EP EP05773675A patent/EP1766305A4/en not_active Withdrawn
- 2005-07-15 CA CA002572629A patent/CA2572629A1/en not_active Abandoned
- 2005-07-15 WO PCT/US2005/024770 patent/WO2006019767A1/en not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US3965971A (en) * | 1974-06-27 | 1976-06-29 | Eaton Corporation | Cooling system for semiconductors |
US4552910A (en) * | 1983-03-11 | 1985-11-12 | Wacker-Chemie Gmbh | Aqueous compositions containing an organosilicon compound |
US5089070A (en) * | 1989-12-07 | 1992-02-18 | Pac Polymers Inc. | Poly(propylene carbonate)-containing ceramic tape formulations and the green tapes resulting therefrom |
US5349831A (en) * | 1991-11-08 | 1994-09-27 | Hitachi, Ltd. | Apparatus for cooling heat generating members |
US6215682B1 (en) * | 1998-09-18 | 2001-04-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor power converter and its applied apparatus |
US6334311B1 (en) * | 1999-03-05 | 2002-01-01 | Samsung Electronics Co., Ltd. | Thermoelectric-cooling temperature control apparatus for semiconductor device fabrication facility |
US20020064642A1 (en) * | 2000-04-06 | 2002-05-30 | Albert Donald F. | Organic, open cell foam materials, their carbonized derivatives, and methods for producing same |
US6366462B1 (en) * | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11252847B2 (en) | 2017-06-30 | 2022-02-15 | General Electric Company | Heat dissipation system and an associated method thereof |
US11997839B2 (en) | 2017-06-30 | 2024-05-28 | Ge Grid Solutions Llc | Heat dissipation system and an associated method thereof |
Also Published As
Publication number | Publication date |
---|---|
CA2572629A1 (en) | 2006-02-23 |
EP1766305A1 (en) | 2007-03-28 |
EP1766305A4 (en) | 2010-01-13 |
JP2008507136A (en) | 2008-03-06 |
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