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WO2006019035A1 - Plaque d’alliage de cuivre pour pièces électriques et électroniques pouvant être travaillées en torsion - Google Patents

Plaque d’alliage de cuivre pour pièces électriques et électroniques pouvant être travaillées en torsion Download PDF

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Publication number
WO2006019035A1
WO2006019035A1 PCT/JP2005/014753 JP2005014753W WO2006019035A1 WO 2006019035 A1 WO2006019035 A1 WO 2006019035A1 JP 2005014753 W JP2005014753 W JP 2005014753W WO 2006019035 A1 WO2006019035 A1 WO 2006019035A1
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WIPO (PCT)
Prior art keywords
copper alloy
orientation
alloy plate
strength
conductivity
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PCT/JP2005/014753
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English (en)
Japanese (ja)
Inventor
Yasuhiro Aruga
Katsura Kajihara
Original Assignee
Kabushiki Kaisha Kobe Seiko Sho
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Filing date
Publication date
Application filed by Kabushiki Kaisha Kobe Seiko Sho filed Critical Kabushiki Kaisha Kobe Seiko Sho
Priority to EP05770465.2A priority Critical patent/EP1803829B1/fr
Priority to KR1020077002825A priority patent/KR100876051B1/ko
Priority to US11/573,041 priority patent/US8715431B2/en
Publication of WO2006019035A1 publication Critical patent/WO2006019035A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Definitions

  • the present invention relates to a copper alloy having high strength, high conductivity, and excellent bending workability, for example, a copper alloy suitable as a material for a lead frame for a semiconductor device.
  • the copper alloy of the present invention can be used for various other semiconductor parts, electrical and electronic parts materials such as printed wiring boards, switch parts, busbars, terminal parts, and other mechanical parts.
  • electrical and electronic parts materials such as printed wiring boards, switch parts, busbars, terminal parts, and other mechanical parts.
  • description will be made focusing on the case where it is used for a lead frame which is a semiconductor component as a typical application example.
  • Cu—Fe—P based copper alloy containing Fe and P As a copper alloy for a semiconductor lead frame, a Cu—Fe—P based copper alloy containing Fe and P has been generally used.
  • these Cu-Fe-P-based copper alloys include, for example, a copper alloy containing Fe: 0.05 to 0.15% and P: 0.025 to 0.040% (C19210 alloy), Fe: 2.
  • An example is a copper alloy (CDA194 alloy) containing 1 to 2.6%, P: 0.015 to 0.15%, and Zn: 0.05 to 0.20%.
  • CDA194 alloy copper alloy
  • These Cu-Fe-P-based copper alloys are superior in strength, conductivity and thermal conductivity among copper alloys when an intermetallic compound such as Fe or Fe-P is precipitated in the copper matrix. Therefore, it is widely used as an international standard alloy.
  • lead frames used in semiconductor devices have become smaller in cross-sectional area, resulting in greater strength, conductivity, Thermal conductivity is required.
  • copper alloy parts used in lead frames used in these semiconductor devices are required to have higher strength, higher conductivity, and thermal conductivity.
  • the strength of the copper alloy plate is required to be 150Hv or more in hardness and the conductivity should be 75% IACS or more. It is done.
  • These increases in strength and conductivity are not only for lead frames but also for copper components used in conductive parts such as connectors, terminals, switches and relays in other electrical and electronic parts. The same applies to money.
  • the Cu-Fe-P-based copper alloy is characterized by high electrical conductivity.
  • the content of Fe and P is increased, or Sn, Mg, Ca Or other third elements.
  • increasing the amount of these elements increases the strength, but inevitably decreases the conductivity.
  • the component composition in the copper alloy there is a good balance between the increase in conductivity and the increase in strength required as the above-mentioned semiconductor device has a larger capacity, a smaller size, and a higher function, or these It was difficult to realize a Cu-Fe-P-based copper alloy that achieved both properties.
  • the adhesion bending may occur depending on the structure control means such as crystal grain refinement and dispersion control of crystals and precipitates in Patent Documents 1, 2, and 3 Or, the bending strength cannot be improved sufficiently for severe bending forces such as 90 ° bending after notching.
  • Patent Document 4 (20 The ratio of the X-ray diffraction intensity I (200) of the (0) plane to the X-ray diffraction intensity I (220) of the (220) plane, I (200) / 1 (220) being 0.5 or more and 10 or less
  • Cube orientation density: D (Cube orientation) is 1 or more and 50 or less
  • Patent Document 5 the sum of the X-ray diffraction intensity 1 (200) of the (200) plane and the X-ray diffraction intensity 1 (311) of the (311) plane of the copper alloy plate and the X of the (220) plane It has been proposed that the ratio [1 (200) +1 (311)] / 1 (220) to the line diffraction intensity 1 (220) is 0.4 or more.
  • Patent Document 1 Japanese Patent Laid-Open No. 2000-178670 (Claims)
  • Patent Document 2 JP-A-6-235035 (Claims)
  • Patent Document 3 Japanese Patent Laid-Open No. 2001-279347 (Claims)
  • Patent Document 4 Japanese Patent Laid-Open No. 2002-339028 (Claims, paragraphs 0020 to 0030)
  • Patent Document 5 Japanese Patent Laid-Open No. 2000-328157 (Claims, Examples)
  • the improved copper alloy plate of Patent Document 4 has the strength and conductivity of the copper alloy plate, the hardness of the copper alloy plate is about 150Hv at maximum and the conductivity is about 65% IACS at maximum. If the strength of the copper alloy plate is increased to 150 Hv or more, the conductivity, especially the bending force resistance, also decreases. In other words, there is a big limit in the texture control in Patent Document 4, especially the bending workability of Cu-Fe-P-based high-strength materials (copper alloy sheet hardness 150Hv or higher, conductivity 75% IACS or higher). For I can't make it up.
  • the conductivity of the example with the maximum tensile strength of 520 MPa is as low as about 35% IACS.
  • the maximum tensile strength is 480 MPa, which is a little over 15 OHv in the hardness of the copper alloy sheet. For this reason, either strength or electrical conductivity is sacrificed, and the texture control of Patent Document 5 cannot improve the bending workability of Cu-Fe-P-based high-strength materials.
  • the present invention has been made to solve these problems, and provides a Cu-Fe-P-based copper alloy sheet that achieves both high strength, high conductivity, and excellent bending workability. It is to be. Means for solving the problem
  • the gist of the copper alloy plate for electric and electronic parts having bending workability of the present invention is mass%, Fe: 0.01-3. 0%, P: 0 01-0.
  • a copper alloy sheet containing 3% each, and the texture of which is the orientation distribution density of Brass orientation is 20 or less, and the sum of orientation distribution densities of Brass orientation, S orientation and Copper orientation Is 10 or more and 50 or less.
  • the present invention is applied to improve the bending workability of a high strength, high conductivity copper alloy plate for electric and electronic parts having a strength of 150 Hv or more in hardness and a conductivity of 75% IACS or more. This is preferred.
  • the copper alloy sheet of the present invention further includes a mass.
  • %: Sn: 0.001 to 0.5% may be contained.
  • the copper alloy plate of the present invention can be applied to various electric and electronic parts, but is particularly preferably used for a semiconductor lead frame which is a semiconductor part.
  • B orientation copper orientation
  • Cu orientation copper orientation
  • S orientation S orientation
  • any deviation within ⁇ 10 ° from these crystal planes belongs to the same crystal plane.
  • the B orientation, Cu orientation, and S orientation exist in a fiber texture (j8-fiber) that varies continuously between orientations.
  • the bending cacheability is improved by controlling the orientation density of the Cube orientation (hereinafter also referred to as D (Cube)) within an appropriate range in this texture. And trying to achieve stability. This is intended to be uniformly deformed during deformation during a bending stroke such as a stamping force in a semiconductor lead frame application.
  • D Cube orientation
  • the orientation distribution density of the Brass orientation (B orientation) is lowered.
  • the sum of the orientation distribution densities of the B, S, and Cu orientations is controlled within a specific range.
  • the orientation distribution density of the B orientation and further, the orientation of the B orientation, the S orientation, and the Cu orientation Distribution density greatly affects strength.
  • the orientation distribution density of the B orientation is reduced or the sum of the orientation distribution densities of the B, S, and Cu orientations is reduced, the crystal orientation is randomized and the strength is lowered, and the bending workability is reduced. improves.
  • the orientation distribution density in the B direction is reduced and B It is effective to control the sum of the orientation distribution density of the orientation, S orientation, and Cu orientation to a specific range.
  • the orientation distribution density of the B orientation and the sum of the orientation distribution densities of the B orientation, the S orientation, and the Cu orientation can be measured using a normal X-ray diffraction method.
  • the orientation density of each orientation is determined by measuring the complete pole figure (Pole Figure) of (100), (110), and (111), and then using the orientation distribution function (ODF). It is obtained by calculating the ratio of the intensity peak of each specific orientation (Cu orientation, B orientation, S orientation) to the sum of the intensity peak values of each orientation.
  • ODF orientation distribution function
  • the orientation density of each of these orientations is determined by electron beam diffraction using TEM, SEM (Scanning Electron Microscopy)-ECP (Electron Channeling Pattern), or SEM-EBSP (Electron Back Scattering (Scattered) It can also be obtained by obtaining the orientation density using the crystal orientation distribution function based on the data measured using Pattern or EBSD (Diflfraction).
  • the development of the rolling texture is determined in a specific direction. adjust.
  • the orientation distribution density of the B orientation is 20 or less, and the sum of orientation distribution densities of the B orientation, S orientation, and Cu orientation is specified to be 10 or more and 50 or less.
  • the orientation distribution density of the B orientation exceeds 20, or when the sum of orientation distribution densities of the B orientation, the S orientation, and the Cu orientation exceeds 50, the embodiment described later As described above, the bending workability cannot be improved at the high strength. Accordingly, in the present invention, the orientation distribution density of the B orientation is set to 20 or less, and the sum of orientation distribution densities of the B orientation, the S orientation, and the Cu orientation is set to 50 or less. This makes it possible to improve the bending workability while maintaining the high strength as in the examples described later.
  • the Fe content is 0.01 to 3% by mass.
  • a basic composition consisting of the balance Cu and unavoidable impurities, in the range of 0% and the P content in the range of 0.01-0.3%.
  • Zn and Sn may be further contained within the following range.
  • other selectively added elements and impurity elements are allowed to be contained within a range not impairing these characteristics.
  • the display of the following content is all the mass%.
  • Fe is a main element that precipitates as Fe or Fe-based intermetallic compounds and improves the strength and heat resistance of the copper alloy. If the Fe content is less than 0.01%, depending on the production conditions, although the improvement in conductivity is satisfied with a small amount of precipitate particles, the contribution to strength is insufficient and the strength is insufficient. On the other hand, if the Fe content exceeds 3.0%, the conductivity will decrease, and if the amount of precipitation is increased to increase the conductivity forcibly, conversely, the growth and coarsening of the precipitated particles will occur. Strength and bending workability are reduced. Therefore, the Fe content should be in the range of 0.01 to 3.0%.
  • P has a deoxidizing effect and forms a compound with Fe to increase the strength of the copper alloy. It is prime. If the P content is less than 0.01%, the desired strength cannot be obtained because the compound is not sufficiently precipitated depending on the production conditions. On the other hand, if the P content exceeds 0.3%, the hot workability decreases as well as the decrease in conductivity. Therefore, the P content should be in the range of 0.01 to 0.3%.
  • Zn improves the heat-resistant peelability of copper alloy solder and Sn plating required for lead frames. If the Zn content is less than 0.005%, the desired effect cannot be obtained. On the other hand, if it exceeds 3.0%, not only the solder wettability but also the decrease in conductivity becomes large. Therefore, the Zn content when selectively contained is 0.005 to 3.0%.
  • Sn contributes to improving the strength of the copper alloy. If the Sn content is less than 0.001%, it will not contribute to increasing the strength. On the other hand, when the Sn content is increased, the effect is saturated, and conversely, the conductivity is lowered and the bending workability is also deteriorated.
  • Sn is selectively contained in the range of 0.001 to 0.5% in order to make the strength of the copper alloy sheet 150Hv or more in hardness and 75% IACS or more in conductivity. Also, in order to increase the strength of the copper alloy sheet to 190Hv or higher with a hardness of 50% IACS or higher, select Sn in the range of more than 0.5% and less than 5.0%. To be included. As described above, the Sn content is selected as a whole in the range of 0.001 to 5.0% depending on the balance of strength (hardness) and conductivity required for the application. .
  • Mn, Mg, and Ca contribute to the improvement of hot workability of the copper alloy, they are selectively contained when these effects are required. If the content of one or more of Mn, Mg, and Ca is less than 0.0001% in total, the desired effect cannot be obtained. On the other hand, if the total content exceeds 1.0%, coarse crystallized materials and acid oxides are generated, and the decrease in conductivity is severe as well as the bending workability is lowered. Accordingly, the total content of these elements is selectively contained in the range of 0.0001 to 1.0%.
  • these components have the effect of improving the strength of the copper alloy, these effects are necessary.
  • Optionally contained If the content of one or more of these components is less than 0.001% in total, the desired effect cannot be obtained. On the other hand, if the content exceeds 1.0% in total, it is not preferable because coarse crystallized materials and acid oxides are generated and the bending workability is lowered and the electrical conductivity is severely lowered. Therefore, the content of these elements is selectively contained in the range of 0.001 to 1.0% in total. When these components are contained together with the above Mn, Mg, and Ca, the total content of these elements is 1.0% or less.
  • These components are impurity elements, and when the total content of these elements exceeds 0.1%, coarse crystallized substances and oxides are formed and bending workability is lowered. Therefore, the total content of these elements is preferably 0.1% or less.
  • the copper alloy sheet of the present invention greatly increases the normal manufacturing process itself, except for preferred conditions such as the processing rate (cold rolling ratio) in the final cold rolling (low rolling ratio) and low-temperature annealing in order to obtain the above-described structure of the present invention. There is no need to change it, and it can be manufactured in the same process as a conventional method.
  • a molten copper alloy adjusted to the preferred component composition is prepared. Then, after chamfering the ingot, it is heated or homogenized and then hot-rolled, and the hot-rolled plate is water-cooled
  • the first cold rolling which is said to be intermediate, is annealed, washed, and then finished (final).
  • Cold rolled, low-temperature annealed final annealing, final annealing
  • a copper alloy sheet with a product thickness And so on.
  • the product plate thickness is about 0.1 to 0.3 mm.
  • a solution treatment of the copper alloy plate and a quenching treatment by water cooling may be performed prior to the primary cold rolling.
  • the solution treatment temperature is selected from a range of 750 to 1000 ° C., for example.
  • the orientation distribution density of the B orientation is 20 or less and the sum of the orientation distribution densities of the B orientation, the S orientation, and the Cu orientation is 10 or more and 50 or less, 1 Pa It is effective to perform the above-mentioned final cold rolling at a cold rolling rate of 10 to 50% per second, and then to perform the above final annealing at a low temperature of 0.2 to 300 minutes at 100 to 400 ° C. .
  • the present invention also increases the amount of work hardening due to the strong work of the final cold rolling (high deposition of introduced dislocations by the Orowan mechanism) To do.
  • the cold rolling rate per pass of the final cold rolling is 10 to 50% so that the rolling texture does not develop too much.
  • the number of final cold rolling passes is preferably 3 to 4 times as usual, avoiding too few or too many passes.
  • the annealing temperature is lower than 100 ° C!
  • the temperature and the annealing time are less than 0.2 minutes, and under the conditions where the low temperature annealing is not performed, the structure 'property of the copper alloy sheet is It is likely that the state force after the final cold rolling will hardly change. For this reason, the orientation distribution density in the B direction exceeds 20 There is a high possibility that each orientation density will not be controlled within the above range. For example, the sum of orientation distribution density of B orientation, S orientation and Cu orientation will increase to more than 50. Conversely, if annealing is performed at temperatures exceeding 400 ° C or annealing times exceeding 300 minutes, recrystallization occurs, dislocation rearrangement and recovery occur excessively, and precipitates become coarse. Therefore, there is a high possibility that the strength will decrease.
  • the total amount is in the range of 0.001 to 1.0% by mass, and the total amount of these elements is also 1.0% by mass. It was as follows.
  • Tables 1 and 2 show the cold rolling rate (%) per pass of the final cold rolling and the temperature and time (° C x min) in the final annealing, respectively.
  • the above press formability test is intended to confirm whether the press formability, which is one of the characteristics required for the lead frame material, is reduced due to the improvement of the bending strength. is there
  • the normal pole figure of (100), (110), and (111) was obtained by the usual X-ray diffraction method using Cu as the target, tube voltage 50KV, tube current 200mA. was measured. From this measurement result, using the crystal orientation distribution function (Orientation Distribution Function: ODF), the ratio of the intensity peak in each specific direction to the sum of the intensity peak values in each direction is calculated. The sum of the orientation distribution density of the B, S, and Cu orientations was obtained.
  • ODF Crystal orientation distribution function
  • the hardness of the copper alloy plate sample was measured with a micro Vickers hardness tester at a load of 0.5 kg at four locations, and the hardness was the average value of them.
  • the electrical conductivity of the copper alloy sheet sample was calculated by the average cross-sectional area method by processing a strip-shaped test piece of width 10 mm x length 300 mm by milling, measuring the electrical resistance with a double bridge type resistance measuring device. .
  • the bending test of the copper alloy sheet sample was performed according to the Japan Copper and Brass Association technical standard. A specimen of width 10mm and length 30mm was taken from each sample, bent Bad Way (BW: bending axis is parallel to the rolling direction), and the ratio of the minimum bending radius R and the sample thickness t where no cracks occurred. Evaluated with RZt.
  • RZt value force ⁇ it means that 180 ° tight bending with the minimum bending radius R force ⁇ is possible. It can be said that the smaller the RZt value, the better the bendability, and an RZt of 1.0 or less has a bendability that can cope with close-contact bending or 90 ° bending after notching in an actual lead frame.
  • a 0.3 mm wide lead was punched out of a copper alloy sheet sample by a mechanical press, the flash height of the punched lead was measured, and the pressability was evaluated.
  • the burr height was measured by a method of observing the burr surfaces of 10 leads with a scanning electron microscope, and was taken as the average value of each maximum burr height. If the burr height is 3 m or less, the press formability is excellent. Yes, the burr height is 3 to 6 ⁇ m, ⁇ , and the burr height is over 6 ⁇ m. And X, respectively.
  • Invention Examples 1 to 7 which are copper alloys within the composition of the present invention, have a cold rolling ratio (%) per: L pass of the final cold rolling, and the temperature in the final annealing. Manufacturing methods such as time (° CX minutes) are also manufactured within preferable conditions. Therefore, in the textures of Invention Examples 1 to 7, the orientation distribution density in the B direction is 20 or less, and the sum of the orientation distribution densities of the B, S, and Cu orientations is 10 or more and 50 or less.
  • Invention Examples 1 to 7 have a high strength and a high conductivity of 150 Hv or more in hardness, 75% IACS or more in conductivity, and excellent bending resistance. This also reduces the press moldability, which is another important characteristic.
  • the copper alloy of Comparative Example 8 has an Fe content of 0.006%, which is outside the lower limit of 0.01%. Since the manufacturing methods such as final cold rolling and final annealing are manufactured within preferable conditions, the texture is within the scope of the invention and the bending workability is excellent. However, high strength and high electrical conductivity are not achieved with low hardness and low electrical conductivity.
  • the copper alloy of Comparative Example 9 has an Fe content of 4.5%, which is out of the upper limit of 3.0%.
  • the copper alloy of Comparative Example 10 has a P content of 0.007%, which is slightly lower than the lower limit of 0.01%. Since the manufacturing methods such as final cold rolling and final annealing are manufactured within preferable conditions, the texture is within the scope of the invention and the bending workability is excellent. However, high strength and high conductivity with low hardness and low conductivity have not been achieved.
  • the copper alloy of Comparative Example 11 has a P content of 0.35%, which is far from the upper limit of 0.3%.
  • the texture is within the scope of the invention, and the hardness is high, but the bendability is extremely low and the conductivity is inferior.
  • the copper alloy of Comparative Example 12 is a copper alloy within the composition of the present invention, and although the final cold rolling is also performed under preferable conditions, it is not finally annealed. For this reason, in the texture, the orientation distribution density of the B orientation is too high, and the sum of the orientation distribution densities of the B orientation, the S orientation, and the Cu orientation is too high. As a result, although the strength level is low, bending workability and electrical conductivity are remarkably inferior.
  • This Comparative Example 12 corresponds to Invention Example 3 of Patent Document 4 in that the rolling conditions such as final cold rolling are slightly different, but the copper alloy composition and the final annealing are not performed.
  • the copper alloy of Comparative Example 13 is a copper alloy within the composition of the present invention.
  • the temperature in the final annealing is too low and the time is too long. For this reason, although the hardness is high, the conductivity is remarkably low.
  • the texture also has an orientation distribution density in the B direction that is too high, and the sum of orientation distribution densities in the B, S, and Cu orientations is too high. As a result, bending workability is remarkably inferior.
  • Comparative Example 14 is a copper alloy within the composition of the present invention, and although the final cold rolling is manufactured under preferable conditions, the temperature in the final annealing is too high. For this reason, the hardness is extremely low at 120 Hv. The texture also has good bendability because the sum of the orientation distribution density of the B, S, and Cu orientations is too low and the hardness is extremely low.
  • Comparative Example 15 is a copper alloy having the composition of the present invention, and the final cold rolling is also performed under preferable conditions, but the final annealing is not performed. For this reason, in the texture, the orientation distribution density in the B direction is too high, and the sum of the orientation distribution densities in the B, S, and Cu orientations is too high. As a result, bending workability and electrical conductivity are remarkably inferior.
  • the comparative example 15 and the comparative example 12 were In addition, an example in which the final annealing is not performed in this way can be said to be a representative example of a manufacturing method in which a normal (ordinary) final annealing is not performed. Therefore, the significance of texture control by low temperature annealing in the present invention can be understood.
  • Comparative Example 16 is a copper alloy within the composition of the present invention, but the cold rolling rate per pass of the final cold rolling is too low. For this reason, the hardness is remarkably low at 138 Hv.
  • the texture also has good bending properties because the sum of orientation distribution density of B, S and Cu orientations is too low and the hardness is extremely low.
  • Comparative Example 17 is a copper alloy within the composition of the present invention, but the cold rolling rate per pass of the final cold rolling is too high.
  • the orientation distribution density of the B orientation is too high, and the sum of the orientation distribution densities of the B orientation, the S orientation, and the Cu orientation is within the range, but the bending cacheability is extremely poor.
  • This comparative example 17 can be said to be a typical example of this type of conventional high-strength copper alloy plate that obtains high strength by so-called cold-rolling strong working.
  • Invention Examples 18 to 20 which contain a selective additive element and are a copper alloy within the composition of the present invention, also had a cold rolling rate (%) per pass of final cold rolling. And manufacturing methods such as temperature and time (° CX min) in the final annealing are also preferred, and are manufactured within the conditions! Therefore, in the textures of Invention Examples 18 to 20, the orientation distribution density in the B direction is 20 or less, and the sum of the orientation distribution densities of the B, S, and Cu orientations is 10 or more and 50 or less.
  • the inventive examples 18 to 20 also have high strength and high conductivity of 150 Hv or more in hardness, 75% IACS or more in conductivity, and excellent bending cacheability.
  • the pressing force is another important characteristic that can reduce the press formability.
  • Inventive examples 21 to 24 in Table 2 are copper alloys within the composition of the present invention, but show a case where the Sn content is relatively high.
  • Invention Examples 21 to 24 are preferably manufactured within the conditions, and the manufacturing methods such as the cold rolling rate (%) per pass of the final cold rolling and the temperature and time (° CX minutes) in the final annealing are also preferred. .
  • the orientation distribution density in the B direction is 20 or less, and the sum of the orientation distribution densities in the B, S, and Cu orientations is 10 or more and 50 or less.
  • Invention Examples Invention Examples 21 to 24 have a high strength of 190Hv or higher, an electrical conductivity of 50% IACS or higher, and excellent bending resistance. This also reduces the press formability, which is another important characteristic.
  • the copper alloy of Comparative Example 25 has a P content that is outside the upper limit of 0.3%. Since the manufacturing methods such as final cold rolling and final annealing are manufactured within preferable conditions, the texture is within the scope of the invention, but the electrical conductivity is remarkably low for the hardness but the bending caloe property is also inferior. .
  • the Fe content is outside the upper limit of 3.0%. Since the manufacturing methods such as final cold rolling and final annealing are manufactured within preferable conditions, the texture is within the scope of the invention, but the electrical conductivity is remarkably low for the hardness but the bending calorie is also inferior. .
  • the copper alloy of Comparative Example 27 is a copper alloy within the composition of the present invention. Similar to Comparative Example 13, the temperature in the final annealing is too low and the time is too long. For this reason, the conductivity is extremely low for the hardness.
  • the texture also has an orientation distribution density in the B orientation that is too high, and the sum of orientation distribution densities in the B, S, and Cu orientations is too high. As a result, bending workability is remarkably inferior.
  • Comparative Example 28 is a copper alloy having the composition of the present invention, and the final cold rolling is also performed under preferable conditions. However, as in Comparative Examples 12 and 15, the final annealing is not performed. For this reason, in the aggregate structure, the orientation distribution density of the B orientation is too high, and the sum of the orientation distribution densities of the B orientation, the S orientation, and the Cu orientation is too high. As a result, the hardness is low and the bending workability is poor.
  • the component composition of the copper alloy sheet of the present invention the critical significance of the texture, and the texture in order to increase the strength and conductivity and to improve the bending workability.
  • the significance of preferable production conditions for obtaining the above is supported.
  • a Cu-Fe-P-based copper alloy that achieves both high strength and high electrical conductivity and excellent bending workability without reducing other properties such as press formability.
  • Board can be provided.
  • lead frames for electrical and electronic parts that have been reduced in size and weight, in addition to lead frames for semiconductor devices, lead frames, connectors, terminals, switches, relays, etc. have high strength and high electrical conductivity, and strict bending is required. It can be applied to applications that require high performance.

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Abstract

L’invention porte sur une plaque d’alliage de cuivre contenant en % de masse, 0,01 à 3,0 % de Fe et 0,01 à 0,3 % de P, présentant une texture cristallographique où une densité de répartition d’orientation du laiton est inférieure ou égale à 20 et la somme des densités de répartition d’orientation du laiton, d’orientation S et d’orientation du cuivre est comprise entre 10 et 50. La plaque d’alliage de cuivre est un alliage à base de Cu-Fe-P, ayant une résistance élevée, une électroconductivité importante et une excellente capacité à être travaillé en torsion.
PCT/JP2005/014753 2004-08-17 2005-08-11 Plaque d’alliage de cuivre pour pièces électriques et électroniques pouvant être travaillées en torsion WO2006019035A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP05770465.2A EP1803829B1 (fr) 2004-08-17 2005-08-11 Plaque d'alliage de cuivre pour pièces électriques et électroniques avec aptitude au pliage
KR1020077002825A KR100876051B1 (ko) 2004-08-17 2005-08-11 굽힘 가공성을 구비한 전기 전자 부품용 구리 합금판
US11/573,041 US8715431B2 (en) 2004-08-17 2005-08-11 Copper alloy plate for electric and electronic parts having bending workability

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JP2004-237490 2004-08-17
JP2004237490 2004-08-17

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MY (1) MY138950A (fr)
TW (1) TWI297733B (fr)
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US20120039743A1 (en) * 2006-10-02 2012-02-16 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy sheet for electric and electronic parts
US20120288401A1 (en) * 2011-05-11 2012-11-15 Alcoma, Ltd. Copper-phosphorus-strontium brazing alloy

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EP2045344A1 (fr) * 2006-07-21 2009-04-08 Kabushiki Kaisha Kobe Seiko Sho Tôle d'alliage de cuivre pour pièces électriques et électroniques
EP2045344A4 (fr) * 2006-07-21 2009-09-30 Kobe Steel Ltd Tôle d'alliage de cuivre pour pièces électriques et électroniques
EP2339038A3 (fr) * 2006-07-21 2014-01-22 Kabushiki Kaisha Kobe Seiko Sho Feuille d'alliage de cuivre pour pièce électrique et électronique
EP2339039A3 (fr) * 2006-07-21 2014-01-22 Kabushiki Kaisha Kobe Seiko Sho Feuille d'alliage de cuivre pour pièce électrique et électronique
US9631260B2 (en) 2006-07-21 2017-04-25 Kobe Steel, Ltd. Copper alloy sheets for electrical/electronic part
US9644250B2 (en) 2006-07-21 2017-05-09 Kobe Steel, Ltd. Copper alloy sheet for electric and electronic part
US20120039743A1 (en) * 2006-10-02 2012-02-16 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy sheet for electric and electronic parts
US20120288401A1 (en) * 2011-05-11 2012-11-15 Alcoma, Ltd. Copper-phosphorus-strontium brazing alloy
US8603390B2 (en) * 2011-05-11 2013-12-10 Alcoma, Ltd. Copper-phosphorus-strontium brazing alloy

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TW200617186A (en) 2006-06-01
TWI297733B (en) 2008-06-11
KR100876051B1 (ko) 2008-12-26
US8715431B2 (en) 2014-05-06
CN100510131C (zh) 2009-07-08
EP1803829A4 (fr) 2009-09-30
KR20070031438A (ko) 2007-03-19
US20090010797A1 (en) 2009-01-08
EP1803829A1 (fr) 2007-07-04
CN101001965A (zh) 2007-07-18
MY138950A (en) 2009-08-28
EP1803829B1 (fr) 2013-05-22

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