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WO2006018267A3 - Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung - Google Patents

Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung Download PDF

Info

Publication number
WO2006018267A3
WO2006018267A3 PCT/EP2005/008853 EP2005008853W WO2006018267A3 WO 2006018267 A3 WO2006018267 A3 WO 2006018267A3 EP 2005008853 W EP2005008853 W EP 2005008853W WO 2006018267 A3 WO2006018267 A3 WO 2006018267A3
Authority
WO
WIPO (PCT)
Prior art keywords
rectifier circuit
power dissipation
coupling capacitor
optimized high
frequency coupling
Prior art date
Application number
PCT/EP2005/008853
Other languages
English (en)
French (fr)
Other versions
WO2006018267A2 (de
Inventor
Martin Fischer
Original Assignee
Atmel Germany Gmbh
Martin Fischer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Germany Gmbh, Martin Fischer filed Critical Atmel Germany Gmbh
Priority to EP05774668A priority Critical patent/EP1779414A2/de
Publication of WO2006018267A2 publication Critical patent/WO2006018267A2/de
Publication of WO2006018267A3 publication Critical patent/WO2006018267A3/de
Priority to US11/707,996 priority patent/US20070145528A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/206—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of combinations of capacitors and resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Rectifiers (AREA)

Abstract

Die Erfindung betrifft einen verlustleistungsoptimierten Hochfrequenz-Koppelkondensator fur eine Gleichrichterschaltung sowie eine verlustleistungsoptimierte Hochfrequenz-Gleichrichterschaltung. Bei der erfindungsgemaRen Hochfrequenz-Gleichrichterschaltung sind die Elemente der Gleichrichterstufen derart platzoptimiert angeordnet, dass die Koppelkapazitaten unter Berücksichtigung der Anschlussleitungen jeweils direkt an der Kontaktfläche für den Antennenanschluss angeschlossen sind und um die Kontaktfläche herum angeordnet sind.
PCT/EP2005/008853 2004-08-19 2005-08-16 Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung WO2006018267A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05774668A EP1779414A2 (de) 2004-08-19 2005-08-16 Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung
US11/707,996 US20070145528A1 (en) 2004-08-19 2007-02-20 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004040182 2004-08-19
DE102004040182.9 2004-08-19
DE102005035346A DE102005035346A1 (de) 2004-08-19 2005-07-28 Verlustleistungsoptimierter Hochfrequenz-Koppelkondensator und Gleichrichterschaltung
DE102005035346.0 2005-07-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/707,996 Continuation US20070145528A1 (en) 2004-08-19 2007-02-20 Power dissipation-optimized high-frequency coupling capacitor and rectifier circuit

Publications (2)

Publication Number Publication Date
WO2006018267A2 WO2006018267A2 (de) 2006-02-23
WO2006018267A3 true WO2006018267A3 (de) 2006-04-27

Family

ID=35482316

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/008853 WO2006018267A2 (de) 2004-08-19 2005-08-16 Verlustleistungsoptimierter hochfrequenz-koppelkondensator und gleichrichterschaltung

Country Status (4)

Country Link
US (1) US20070145528A1 (de)
EP (1) EP1779414A2 (de)
DE (1) DE102005035346A1 (de)
WO (1) WO2006018267A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152496A1 (ja) * 2010-06-04 2011-12-08 コニカミノルタホールディングス株式会社 照明装置
FR3080948B1 (fr) * 2018-05-02 2025-01-17 St Microelectronics Rousset Circuit integre comprenant un element capacitif, et procede de fabrication
CN112563030B (zh) * 2020-12-01 2022-02-15 上海上电电容器有限公司 无感均压阻尼分压电容器
WO2025000834A1 (zh) * 2023-06-30 2025-01-02 广东美的厨房电器制造有限公司 电路板、变压器、微波发生设备和家用电器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786512A (ja) * 1993-09-10 1995-03-31 Toshiba Corp 半導体装置
US5854480A (en) * 1995-07-18 1998-12-29 Oki Electric Indusry Co., Ltd. Tag with IC capacitively coupled to antenna
JP2002009574A (ja) * 2000-06-23 2002-01-11 Matsushita Electric Ind Co Ltd 移相器
US6400274B1 (en) * 1995-08-31 2002-06-04 Intermec Ip Corp. High-performance mobile power antennas
US6472942B1 (en) * 2000-08-21 2002-10-29 Em (Us) Design, Inc. Parasitically compensated resistor for integrated circuits
US20030085447A1 (en) * 1999-01-04 2003-05-08 International Business Machines Corporation Beol decoupling capacitor
US20040065899A1 (en) * 2002-09-13 2004-04-08 Yasutaka Takabayashi Semiconductor device
EP1437816A2 (de) * 2003-01-10 2004-07-14 ATMEL Germany GmbH Schaltungsanordnung zur Bereitstellung elektrischer Leistung aus einem elektromagnetischen Feld

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE124829T1 (de) * 1987-11-18 1995-07-15 Univ Western Australia Transponder.
US5445974A (en) * 1993-03-31 1995-08-29 Siemens Components, Inc. Method of fabricating a high-voltage, vertical-trench semiconductor device
US5622886A (en) * 1994-03-31 1997-04-22 Atmel Corporation Method of making a high voltage rectifier for an integrated circuit chip
US6347121B1 (en) * 1997-03-11 2002-02-12 Erkka Sointula Transmitting and receiving radio signals
US6054925A (en) * 1997-08-27 2000-04-25 Data Investments Limited High impedance transponder with improved backscatter modulator for electronic identification system
DE59913632D1 (de) * 1999-01-08 2006-08-10 Anatoli Stobbe Sicherungssystem, Transponder und Empfangsvorrichtung
US6650226B1 (en) * 1999-04-07 2003-11-18 Stmicroelectronics S.A. Detection, by an electromagnetic transponder reader, of the distance separating it from a transponder
JP2002290246A (ja) * 2001-03-28 2002-10-04 Hitachi Kokusai Electric Inc 送受信機
KR100505658B1 (ko) * 2002-12-11 2005-08-03 삼성전자주식회사 ＭＩＭ(Ｍｅｔａｌ-Ｉｎｓｕｌａｔｏｒ-Ｍｅｔａｌ)커패시터를 갖는 반도체 소자
DE10301451A1 (de) * 2003-01-10 2004-07-22 Atmel Germany Gmbh Verfahren sowie Sende- und Empfangseinrichtung zur drahtlosen Datenübertragung und Modulationseinrichtung
DE10306689A1 (de) * 2003-02-11 2004-08-19 Atmel Germany Gmbh Schaltungsanordnung zur Signaldetektion
DE10322888A1 (de) * 2003-05-21 2004-12-16 Atmel Germany Gmbh Intergrierter Schaltkreis mit Transponder
DE10356259B4 (de) * 2003-12-03 2010-07-22 Atmel Automotive Gmbh Verfahren und Schaltungsanordnung zum Vergrößern einer Funktionsreichweite bei einer aus einem elektromagnetischen Feld mit Energie versorgten Vorrichtung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786512A (ja) * 1993-09-10 1995-03-31 Toshiba Corp 半導体装置
US5854480A (en) * 1995-07-18 1998-12-29 Oki Electric Indusry Co., Ltd. Tag with IC capacitively coupled to antenna
US6400274B1 (en) * 1995-08-31 2002-06-04 Intermec Ip Corp. High-performance mobile power antennas
US20030085447A1 (en) * 1999-01-04 2003-05-08 International Business Machines Corporation Beol decoupling capacitor
JP2002009574A (ja) * 2000-06-23 2002-01-11 Matsushita Electric Ind Co Ltd 移相器
US6472942B1 (en) * 2000-08-21 2002-10-29 Em (Us) Design, Inc. Parasitically compensated resistor for integrated circuits
US20040065899A1 (en) * 2002-09-13 2004-04-08 Yasutaka Takabayashi Semiconductor device
EP1437816A2 (de) * 2003-01-10 2004-07-14 ATMEL Germany GmbH Schaltungsanordnung zur Bereitstellung elektrischer Leistung aus einem elektromagnetischen Feld

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06 31 July 1995 (1995-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03) *

Also Published As

Publication number Publication date
US20070145528A1 (en) 2007-06-28
WO2006018267A2 (de) 2006-02-23
DE102005035346A1 (de) 2006-03-09
EP1779414A2 (de) 2007-05-02

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