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WO2006008519A1 - Fabrication d'electrode - Google Patents

Fabrication d'electrode Download PDF

Info

Publication number
WO2006008519A1
WO2006008519A1 PCT/GB2005/002840 GB2005002840W WO2006008519A1 WO 2006008519 A1 WO2006008519 A1 WO 2006008519A1 GB 2005002840 W GB2005002840 W GB 2005002840W WO 2006008519 A1 WO2006008519 A1 WO 2006008519A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrode
ink
formation
substrate according
Prior art date
Application number
PCT/GB2005/002840
Other languages
English (en)
Inventor
Robert Andrew Porter
Original Assignee
Inverness Medical Switzerland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inverness Medical Switzerland Gmbh filed Critical Inverness Medical Switzerland Gmbh
Publication of WO2006008519A1 publication Critical patent/WO2006008519A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/308—Electrodes, e.g. test electrodes; Half-cells at least partially made of carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Definitions

  • the present invention relates to a method of making a structure, to a microelectrode structure having a substrate and to a substrate having at least an electrode structure.
  • Macroelectrodes find uses in many fields of electrochemistry. They are conductors of electricity and may be fabricated in a variety of ways. Examples are cutting metal foil or wires, deposition of metal-containing inks (subsequently dried) by printing methods. In the main these are mature technologies, which can result in batches of electrodes of repeatable, well- characterised surface areas.
  • Microelectrodes are used for a wide variety of analytical purposes due to their properties. Their size provides certain advantages over conventional macroelectrodes. Microelectrodes can have various geometries, e.g., hemispheres, disks, bands, tubes, rings, and cylinders and generally have one or more dimension on the order of 0.1 to 20 micrometers. The efficiency of diffusion of species to the electrode surface rises with reduction in electrode area. The ideal hemispherical diffusion profile of a microelectrode induces an improved mass transfer compared to that of macro-electrodes which results in a high current density and an improved electrochemistry.
  • microelectrode arrays typically consist of an array of identical microelectrodes that may be used in a similar fashion to one or more macroelectrodes.
  • a photo-ablation technique is used to create apertures in a layer of electrically insulating material and allow electrically conducting material exposed through the apertures to create the microelectrodes.
  • Photolithographic techniques may also be employed to create microelectrodes.
  • US6110354 discloses such a technique to produce a microband electrode array.
  • Known ways of making macroelectrodes include printing methods such as screen- printing, using an ink or like material forced through a screen, as disclosed by US5437999.
  • printing methods such as screen- printing, using an ink or like material forced through a screen, as disclosed by US5437999.
  • screen printing techniques yield microelectrodes having insufficiently good edge definition due to the inherent inaccuracy of the screen-printing process which results in variation in the electrode areas.
  • screen printing techniques only allow for the reliable formation of structures and patterns having a length or width dimension of approximately 70 ⁇ m or greater. Since the current obtained at the electrode surface is proportional to the electrode area it is essential that the electrode is well defined.
  • ink-jet printing methods are not capable of producing microelectrodes of the required accuracy.
  • the curable ink may be electroconductive, whereby the structure is an electrode.
  • the invention provides a substrate having an electrode structure comprising a formation containing cured ink.
  • One or more formations may be arranged to define a fluidic network of elements.
  • the formation may penetrate though a further outer surface of the substrate such as a hole through the substrate. This further exposed surface might provide the basis for the active electrode surface.
  • Formations acting as microelectrode structure may be chosen from a variety of shapes and designs. Examples of such are microband arrays, interdigitated combs, arrays of concentric circles, micro disks, micro ring-disk electrodes, micro-dot electrodes, and spiral shaped electrode configurations. Where a plurality of electrodes are provided, adjacent electrodes may be configured so as to be capable of being driven with the same or of a different polarity. Individual microdot electrodes may be round in shape, triangular, square, rectangular and so on.
  • the process of the invention can be such as to provide dimensions of individual electrodes in the width dimension down to lOOnm or less, for example in the case of a microband array.
  • width dimension down to lOOnm or less
  • a lower limit of width may be typically lOOnm.
  • the diameter could be chosen to be from between lOOnm to 200 ⁇ m , although smaller sizes are also envisaged.
  • the electrodes may be of the same shape and size or of differing shapes and/or sizes.
  • the method comprises applying conductive material to at least a portion of said sheet and cleaning the sheet to remove conductive material outside said formations.
  • the electrode structure has a surface that is substantially flush with an outer surface of the substrate.
  • the conductive ink may be provided such that it partially fills the volume defined by the formation.
  • the outer surface of the electrode (after curing) may be flat or have a degree of convexion or concavity.
  • One advantage of the invention is that embodiments are simple to effect and can provide electrodes having good edge definition and reproducible electrode areas. Another advantage is that electrodes may be formed flush with a substrate to provide virtually no effect on liquid movement across the surface.
  • a microelectrode array is produced by preparing a laser ablated structure in a plastic sheet whose depth defines the depth of the electrode layers.
  • the plastic sheet for example polyester or polypropylene may then be laminated to a lower metallic surface which acts as an electrode connector.
  • An ink such as a carbon ink may then be pushed or forced into the substrate formation by printing or by other means such as with a squeegee blade. Residual ink is then removed from the surface to provide a microelectrode array.
  • the thickness of the sheet could vary and may be typically between lOO ⁇ m and lmm. The shape the individual electrodes, the number of them per unit area and the resulting shape of the array would depend upon the laser pattern.
  • Electrodes and electrode arrays embodying the invention are suitable for a variety of analytical techniques. These include, for example only, anodic stripping voltammetry (or polarography) with a potential scan which may be linear, cyclic, square-wave, normal pulse or differential pulse, or with a superimposed sinusoidal voltage, may be used. Alternatively, anodic stripping chronopotentiometry may be used.
  • ion exchange voltammetry adsorptive cathodic stripping voltammetry (or polarography) with a scan which may be linear, cyclic, square-wave, normal pulse or differential pulse, or with a superimposed sinusoidal voltage, or clironoamperometry, chronocoulometry or linear, cyclic, square-wave, normal pulse or differential pulse voltammetry (or polarography) or voltammetry (or polarography) with a superimposed sinusoidal voltage.
  • Figure 1 shows a side elevation of a part of a device for performing a method embodying the invention
  • Figure 2 shows a perspective view of the drum of Figure 1;
  • Figure 6 shows a lateral cross section through the structure of Figure 4, taken along the line VI-VI';
  • Figure 7 shows the structure of Figure 4 with dielectric screening material applied;
  • Figure 9 shows a close-up of a portion of the electrode structure of Figure 8.
  • Figure 10 shows a close-up of the terminal of the electrode structure of Figure 8;
  • Figure 11 shows the formation of gold 10 micron track and gap microelectrodes;
  • Figure 14 shows dielectric insulating the gold tracks;
  • Figure 15 shows a hand made finished gold microelectrode;
  • Figure 17 shows an end cross-section and partial perspective view of a second channel in a substrate.
  • a UV curable ink 20 from a reservoir 21 is applied using a duct 22 to the underpart of the drum onto a polished glass surface 23 so that the ink is caused to flow under the drum 10 while the drum is being rotated.
  • the UV curable ink 20 is conductive in some embodiments; in others it is semiconductive. In yet others it is insulating, and in those embodiments, the ink may later be treated to make it conductive or semiconductive.
  • a UV source 30 irradiates the ink 20 with UV light 31 as it flows under the drum to cure it.
  • a cured web 24 emerges from the drum having formations 25 corresponding to the desired microfiuidic features impressed into it.
  • the sheet 24 was placed on a relatively inflexible substrate 50, and ink or paste 40 was placed over the sheet 24 in the vicinity of the formations.
  • a flexible blade 51 e.g. of rubber, was moved across the surface of the plastic sheet to force the ink, or respectively paste, into the formations 25. Any excess ink was then polished off the surface to leave only ink or paste in the formations 25.
  • Figure 16 shows an end cross-section and partial perspective view of a channel in a substrate 100, the channel 101 having a narrow upper section 102 and a wider lower section 103.
  • the dimensions of the channel are such that ink when applied to the channel would flow along the lower channel section 102 (by capillary action) but not fill the upper channel section 101.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

L'invention porte sur un procédé de fabrication d'une structure d'électrode. Selon ce procédé, un substrat présente au moins une formation, cette formation correspondant à une forme d'électrode désirée. Une encre durcissable est appliquée sur la formation et l'encre durcissable durcit. L'encre durcissable peut être électro-conductrice. L'invention concerne également une structure d'électrode.
PCT/GB2005/002840 2004-07-20 2005-07-20 Fabrication d'electrode WO2006008519A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0416209.5 2004-07-20
GB0416209A GB0416209D0 (en) 2004-07-20 2004-07-20 Electrode manufacture

Publications (1)

Publication Number Publication Date
WO2006008519A1 true WO2006008519A1 (fr) 2006-01-26

Family

ID=32922512

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2005/002840 WO2006008519A1 (fr) 2004-07-20 2005-07-20 Fabrication d'electrode

Country Status (2)

Country Link
GB (1) GB0416209D0 (fr)
WO (1) WO2006008519A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009074765A1 (fr) * 2007-12-13 2009-06-18 Eastman Kodak Company Procédé de formation de motifs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2110162A (en) * 1981-11-17 1983-06-15 Bosch Gmbh Robert A method of producing electrically conductive areas
US6103033A (en) * 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
JP2001243944A (ja) * 2000-02-25 2001-09-07 Sony Corp 電極製造装置、電極及び電池の製造方法
WO2004039600A2 (fr) * 2002-10-30 2004-05-13 Inverness Medical Limited Humidification du poste d'impression enzymatique lors d'un procede continu de production de capteurs electrochimiques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2110162A (en) * 1981-11-17 1983-06-15 Bosch Gmbh Robert A method of producing electrically conductive areas
US6103033A (en) * 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
JP2001243944A (ja) * 2000-02-25 2001-09-07 Sony Corp 電極製造装置、電極及び電池の製造方法
WO2004039600A2 (fr) * 2002-10-30 2004-05-13 Inverness Medical Limited Humidification du poste d'impression enzymatique lors d'un procede continu de production de capteurs electrochimiques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 26 1 July 2002 (2002-07-01) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009074765A1 (fr) * 2007-12-13 2009-06-18 Eastman Kodak Company Procédé de formation de motifs

Also Published As

Publication number Publication date
GB0416209D0 (en) 2004-08-25

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