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WO2006068325A3 - Procede de fabrication d'alliage semiconducteur thermoelectrique, module de conversion thermoelectrique et generateur de courant thermoelectrique - Google Patents

Procede de fabrication d'alliage semiconducteur thermoelectrique, module de conversion thermoelectrique et generateur de courant thermoelectrique Download PDF

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Publication number
WO2006068325A3
WO2006068325A3 PCT/JP2005/024186 JP2005024186W WO2006068325A3 WO 2006068325 A3 WO2006068325 A3 WO 2006068325A3 JP 2005024186 W JP2005024186 W JP 2005024186W WO 2006068325 A3 WO2006068325 A3 WO 2006068325A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermoelectric
generating device
power generating
production method
conversion module
Prior art date
Application number
PCT/JP2005/024186
Other languages
English (en)
Other versions
WO2006068325A2 (fr
Inventor
Kenichiro Nakajima
Original Assignee
Showa Denko Kk
Kenichiro Nakajima
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Kenichiro Nakajima filed Critical Showa Denko Kk
Priority to CN2005800426075A priority Critical patent/CN101080506B/zh
Priority to EP05822572A priority patent/EP1831418A2/fr
Priority to US11/793,439 priority patent/US7849909B2/en
Publication of WO2006068325A2 publication Critical patent/WO2006068325A2/fr
Publication of WO2006068325A3 publication Critical patent/WO2006068325A3/fr
Priority to US12/941,790 priority patent/US7997325B2/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/10—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying using centrifugal force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/047—Making non-ferrous alloys by powder metallurgy comprising intermetallic compounds
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Silicon Compounds (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un alliage demi-Heusler consistant à solidifier par refroidissement rapide un alliage fondu à une vitesse de refroidissement de 1 x 102 à 1 x 103 °C/sec afin de produire un alliage de Heusler représenté par la formule ABC (dans laquelle A et B sont chacun au moins un élément choisi parmi des métaux de transition tels que Fe, Co, Ni, Ti, V, Cr, Zr, Hf, Nb, Mo, Ta et W, et C est au moins un élément choisi parmi des éléments des groupes 13 et 14, tels que Al, Ga, In, Si, Ge et Sn). L'invention concerne également un générateur de courant thermoélectrique haute performance faisant intervenir ledit alliage semiconducteur thermoélectrique.
PCT/JP2005/024186 2004-12-24 2005-12-22 Procede de fabrication d'alliage semiconducteur thermoelectrique, module de conversion thermoelectrique et generateur de courant thermoelectrique WO2006068325A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2005800426075A CN101080506B (zh) 2004-12-24 2005-12-22 热电半导体合金的制造方法、热电转换模块以及热电发电设备
EP05822572A EP1831418A2 (fr) 2004-12-24 2005-12-22 Procede de fabrication d'alliage semiconducteur thermoelectrique, module de conversion thermoelectrique et generateur de courant thermoelectrique
US11/793,439 US7849909B2 (en) 2004-12-24 2005-12-22 Production method of thermoelectric semiconductor alloy, thermoelectric conversion module and thermoelectric power generating device
US12/941,790 US7997325B2 (en) 2004-12-24 2010-11-08 Production method of thermoelectric semiconductor alloy, thermoelectric conversion module and thermoelectric power generating device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004-374218 2004-12-24
JP2004374218 2004-12-24
US64024205P 2005-01-03 2005-01-03
US60/640,242 2005-01-03

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US11/793,439 A-371-Of-International US7849909B2 (en) 2004-12-24 2005-12-22 Production method of thermoelectric semiconductor alloy, thermoelectric conversion module and thermoelectric power generating device
US12/941,790 Division US7997325B2 (en) 2004-12-24 2010-11-08 Production method of thermoelectric semiconductor alloy, thermoelectric conversion module and thermoelectric power generating device

Publications (2)

Publication Number Publication Date
WO2006068325A2 WO2006068325A2 (fr) 2006-06-29
WO2006068325A3 true WO2006068325A3 (fr) 2007-07-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/024186 WO2006068325A2 (fr) 2004-12-24 2005-12-22 Procede de fabrication d'alliage semiconducteur thermoelectrique, module de conversion thermoelectrique et generateur de courant thermoelectrique

Country Status (6)

Country Link
US (2) US7849909B2 (fr)
EP (1) EP1831418A2 (fr)
JP (1) JP2006203186A (fr)
CN (1) CN101080506B (fr)
RU (1) RU2364643C2 (fr)
WO (1) WO2006068325A2 (fr)

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US7997325B2 (en) 2011-08-16
CN101080506A (zh) 2007-11-28
CN101080506B (zh) 2012-06-13
US20080092940A1 (en) 2008-04-24
JP2006203186A (ja) 2006-08-03
RU2364643C2 (ru) 2009-08-20
WO2006068325A2 (fr) 2006-06-29
US20110048590A1 (en) 2011-03-03
EP1831418A2 (fr) 2007-09-12
US7849909B2 (en) 2010-12-14

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