WO2006043000A3 - Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere - Google Patents
Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere Download PDFInfo
- Publication number
- WO2006043000A3 WO2006043000A3 PCT/FR2005/050863 FR2005050863W WO2006043000A3 WO 2006043000 A3 WO2006043000 A3 WO 2006043000A3 FR 2005050863 W FR2005050863 W FR 2005050863W WO 2006043000 A3 WO2006043000 A3 WO 2006043000A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- handle
- micrometer
- transferring
- millimetre
- face
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Micromachines (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Die Bonding (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05815527A EP1803152A2 (fr) | 2004-10-21 | 2005-10-18 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere |
US11/576,136 US20080020547A1 (en) | 2004-10-21 | 2005-10-18 | Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle |
JP2007537349A JP2008517474A (ja) | 2004-10-21 | 2005-10-18 | ポリマーハンドルを用いてマイクロメートル級またはミリメートル級のサイズの少なくとも1つの対象物を運搬するための方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0452393 | 2004-10-21 | ||
FR0452393A FR2877142B1 (fr) | 2004-10-21 | 2004-10-21 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006043000A2 WO2006043000A2 (fr) | 2006-04-27 |
WO2006043000A3 true WO2006043000A3 (fr) | 2006-12-21 |
Family
ID=34949788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2005/050863 WO2006043000A2 (fr) | 2004-10-21 | 2005-10-18 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080020547A1 (fr) |
EP (1) | EP1803152A2 (fr) |
JP (1) | JP2008517474A (fr) |
FR (1) | FR2877142B1 (fr) |
WO (1) | WO2006043000A2 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
WO2006121906A1 (fr) * | 2005-05-10 | 2006-11-16 | Dow Corning Corporation | Lithographie par transfert de décalcomanies submicroniques |
US8030132B2 (en) * | 2005-05-31 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device including peeling step |
FR2925221B1 (fr) * | 2007-12-17 | 2010-02-19 | Commissariat Energie Atomique | Procede de transfert d'une couche mince |
FR2947098A1 (fr) * | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince |
FR2975985B1 (fr) * | 2011-05-30 | 2016-02-12 | Univ Paris Sud 11 | Procede pour la realisation de supports fonctionnels souples. |
FR2993096B1 (fr) | 2012-07-03 | 2015-03-27 | Commissariat Energie Atomique | Dispositif et procede de support individuel de composants |
DE102014014422A1 (de) | 2014-09-29 | 2016-03-31 | Siltectra Gmbh | Kombiniertes Waferherstellungsverfahren mit einer Löcher aufweisenden Aufnahmeschicht |
KR101723436B1 (ko) * | 2015-01-13 | 2017-04-05 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치의 제조방법 |
US10755981B2 (en) | 2017-01-05 | 2020-08-25 | Lg Innotek Co., Ltd. | Display device manufacturing method |
US20190186041A1 (en) | 2017-12-20 | 2019-06-20 | International Business Machines Corporation | Three-dimensionally stretchable single crystalline semiconductor membrane |
KR102113200B1 (ko) | 2017-12-22 | 2020-06-03 | 엘씨스퀘어(주) | 변형필름을 이용한 전사방법 |
CN108376838A (zh) * | 2018-04-11 | 2018-08-07 | 中北大学 | 基于pdms封装技术的微流体超材料结构 |
FR3102888B1 (fr) * | 2019-11-06 | 2023-04-14 | Commissariat Energie Atomique | Procédé de fabrication d'un dispositif photonique intégré |
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JPH0346242A (ja) * | 1989-07-13 | 1991-02-27 | Fujitsu Ltd | 半導体装置の製造方法 |
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US20030109072A1 (en) * | 2001-11-29 | 2003-06-12 | Thorsten Meyer | Process for producing a component module |
EP1463105A2 (fr) * | 2003-03-20 | 2004-09-29 | Sharp Kabushiki Kaisha | Dispositif à semi-conducteur et procede de fabrication associe par la technique de transfert |
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JPS5617029A (en) * | 1979-07-20 | 1981-02-18 | Toshiba Corp | Installation of semiconductor pellet |
JPS5752143A (en) * | 1980-09-16 | 1982-03-27 | Toshiba Corp | Mounting method and device for semiconductor pellet |
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DE68925922T2 (de) * | 1988-05-30 | 1996-09-05 | Canon Kk | Elektrischer Schaltungsapparat |
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JP4675451B2 (ja) * | 2000-04-14 | 2011-04-20 | 株式会社ディスコ | 切削装置 |
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FR2837620B1 (fr) * | 2002-03-25 | 2005-04-29 | Commissariat Energie Atomique | Procede de transfert d'elements de substrat a substrat |
US6805809B2 (en) * | 2002-08-28 | 2004-10-19 | Board Of Trustees Of University Of Illinois | Decal transfer microfabrication |
JP2004126153A (ja) * | 2002-10-01 | 2004-04-22 | Seiko Epson Corp | フラットパネルディスプレイおよび電子機器 |
DE10394148T5 (de) * | 2003-02-24 | 2006-02-09 | Infineon Technologies Ag | Verbessertes Verfahren und verbesserte Vorrichtung zum Positionieren von integrierten Schaltungen auf Plättchenkontaktflächen |
-
2004
- 2004-10-21 FR FR0452393A patent/FR2877142B1/fr not_active Expired - Fee Related
-
2005
- 2005-10-18 EP EP05815527A patent/EP1803152A2/fr not_active Ceased
- 2005-10-18 WO PCT/FR2005/050863 patent/WO2006043000A2/fr active Application Filing
- 2005-10-18 US US11/576,136 patent/US20080020547A1/en not_active Abandoned
- 2005-10-18 JP JP2007537349A patent/JP2008517474A/ja not_active Ceased
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US3708870A (en) * | 1970-05-21 | 1973-01-09 | Lucas Industries Ltd | Method of manufacturing semi-conductor devices |
JPH0346242A (ja) * | 1989-07-13 | 1991-02-27 | Fujitsu Ltd | 半導体装置の製造方法 |
US6214733B1 (en) * | 1999-11-17 | 2001-04-10 | Elo Technologies, Inc. | Process for lift off and handling of thin film materials |
US20030109072A1 (en) * | 2001-11-29 | 2003-06-12 | Thorsten Meyer | Process for producing a component module |
EP1463105A2 (fr) * | 2003-03-20 | 2004-09-29 | Sharp Kabushiki Kaisha | Dispositif à semi-conducteur et procede de fabrication associe par la technique de transfert |
Also Published As
Publication number | Publication date |
---|---|
US20080020547A1 (en) | 2008-01-24 |
JP2008517474A (ja) | 2008-05-22 |
WO2006043000A2 (fr) | 2006-04-27 |
EP1803152A2 (fr) | 2007-07-04 |
FR2877142A1 (fr) | 2006-04-28 |
FR2877142B1 (fr) | 2007-05-11 |
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